JP2013515379A5 - - Google Patents

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Publication number
JP2013515379A5
JP2013515379A5 JP2012546101A JP2012546101A JP2013515379A5 JP 2013515379 A5 JP2013515379 A5 JP 2013515379A5 JP 2012546101 A JP2012546101 A JP 2012546101A JP 2012546101 A JP2012546101 A JP 2012546101A JP 2013515379 A5 JP2013515379 A5 JP 2013515379A5
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Japan
Prior art keywords
layer
composition
polishing
porous
radiation curable
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JP2012546101A
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English (en)
Japanese (ja)
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JP2013515379A (ja
JP5728026B2 (ja
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Priority claimed from PCT/US2010/061199 external-priority patent/WO2011087737A2/en
Publication of JP2013515379A publication Critical patent/JP2013515379A/ja
Publication of JP2013515379A5 publication Critical patent/JP2013515379A5/ja
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JP2012546101A 2009-12-22 2010-12-20 研磨パッド及びこれの製造方法 Active JP5728026B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US28898209P 2009-12-22 2009-12-22
US61/288,982 2009-12-22
US42244210P 2010-12-13 2010-12-13
US61/422,442 2010-12-13
PCT/US2010/061199 WO2011087737A2 (en) 2009-12-22 2010-12-20 Polishing pad and method of making the same

Publications (3)

Publication Number Publication Date
JP2013515379A JP2013515379A (ja) 2013-05-02
JP2013515379A5 true JP2013515379A5 (enExample) 2014-02-13
JP5728026B2 JP5728026B2 (ja) 2015-06-03

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Family Applications (1)

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JP2012546101A Active JP5728026B2 (ja) 2009-12-22 2010-12-20 研磨パッド及びこれの製造方法

Country Status (6)

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US (1) US20130012108A1 (enExample)
JP (1) JP5728026B2 (enExample)
KR (1) KR101855073B1 (enExample)
SG (1) SG181890A1 (enExample)
TW (1) TWI517975B (enExample)
WO (1) WO2011087737A2 (enExample)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110183583A1 (en) * 2008-07-18 2011-07-28 Joseph William D Polishing Pad with Floating Elements and Method of Making and Using the Same
WO2012093006A1 (de) * 2011-01-04 2012-07-12 Evonik Degussa Gmbh Composite-halbzeuge und daraus hergestellte formteile sowie direkt hergestellte formteile auf basis von hydroxyfunktionalisierten (meth) acrylaten, die mittels uretdionen duroplastisch vernetzt werden
US20120302148A1 (en) * 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
SG10201508090WA (en) * 2011-11-29 2015-10-29 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
KR101847619B1 (ko) * 2012-01-12 2018-04-11 엠.씨.케이(주) 고함량의 연마제 성분을 포함한 연마패드 및 그 연마패드 제조방법
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
TWI590918B (zh) * 2013-08-16 2017-07-11 三芳化學工業股份有限公司 硏磨墊、硏磨裝置及製造硏磨墊之方法
US9421666B2 (en) * 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
TWI580524B (zh) * 2014-02-18 2017-05-01 中國砂輪企業股份有限公司 高性能化學機械研磨修整器及其製作方法
JP6365869B2 (ja) * 2014-03-19 2018-08-01 Dic株式会社 ウレタン組成物及び研磨材
JP6315246B2 (ja) * 2014-03-31 2018-04-25 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR20160147700A (ko) * 2014-05-01 2016-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 가요성 연마 물품 및 이의 사용 방법
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
TWI548481B (zh) * 2014-11-17 2016-09-11 三芳化學工業股份有限公司 拋光墊及其製造方法
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
US10010106B2 (en) * 2015-04-30 2018-07-03 Frito-Lay North America, Inc. Method and apparatus for removing a portion of a food product with an abrasive stream
KR101600393B1 (ko) * 2015-05-20 2016-03-07 에프엔에스테크 주식회사 연마 패드 및 이의 제조 방법
US10005172B2 (en) * 2015-06-26 2018-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-porosity method for forming polishing pad
CN105150120B (zh) * 2015-09-01 2018-03-30 河南科技学院 一种Roll‑to‑Roll化学机械抛光机用固结磨料抛光辊的刚性层及其制备方法
TWI769988B (zh) * 2015-10-07 2022-07-11 美商3M新設資產公司 拋光墊與系統及其製造與使用方法
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN113146464A (zh) * 2016-01-19 2021-07-23 应用材料公司 多孔化学机械抛光垫
JP6320660B1 (ja) * 2016-05-23 2018-05-09 タツタ電線株式会社 導電性接着剤組成物
KR101894071B1 (ko) * 2016-11-03 2018-08-31 에스케이씨 주식회사 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법
WO2018187220A1 (en) * 2017-04-03 2018-10-11 Jl Darling Llc Coating for recyclable paper
US11524390B2 (en) * 2017-05-01 2022-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Methods of making chemical mechanical polishing layers having improved uniformity
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) * 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
JP7089905B2 (ja) * 2018-03-02 2022-06-23 富士紡ホールディングス株式会社 研磨パッド
JP7373503B2 (ja) 2018-05-07 2023-11-02 アプライド マテリアルズ インコーポレイテッド 親水性及びゼータ電位の調節可能な化学機械研磨パッド
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US20200171623A1 (en) * 2018-11-30 2020-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
JP2022528401A (ja) * 2019-04-05 2022-06-10 ディディピー スペシャルティ エレクトロニック マテリアルズ ユーエス，エルエルシー ポリウレタン系熱界面材料
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR102718259B1 (ko) * 2019-07-23 2024-10-16 케이피엑스케미칼 주식회사 탄성 패드 및 그 제조 방법
KR102270392B1 (ko) * 2019-10-01 2021-06-30 에스케이실트론 주식회사 웨이퍼 연마 헤드, 웨이퍼 연마 헤드의 제조방법 및 그를 구비한 웨이퍼 연마 장치
TWI741753B (zh) * 2019-10-29 2021-10-01 南韓商Ｓｋｃ索密思股份有限公司 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法
KR102293765B1 (ko) * 2019-11-21 2021-08-26 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
KR102293801B1 (ko) * 2019-11-28 2021-08-25 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11638979B2 (en) 2020-06-09 2023-05-02 Applied Materials, Inc. Additive manufacturing of polishing pads
US11612978B2 (en) 2020-06-09 2023-03-28 Applied Materials, Inc. Additive manufacturing of polishing pads
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
TWI851930B (zh) * 2020-10-19 2024-08-11 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之可uv固化樹脂
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
KR102538440B1 (ko) * 2021-05-26 2023-05-30 에스케이엔펄스 주식회사 연마 시스템, 연마 패드 및 반도체 소자의 제조방법
CN117677465A (zh) * 2021-07-06 2024-03-08 应用材料公司 用于化学机械抛光的包含声学窗口的抛光垫
TWI788017B (zh) * 2021-09-16 2022-12-21 美商帕拉萊斯集團國際有限責任公司 墊體及其製法
JP7441916B2 (ja) * 2021-10-12 2024-03-01 エスケー エンパルス カンパニー リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
TW202419495A (zh) * 2022-06-15 2024-05-16 美商Ｃｍｃ材料有限責任公司 用於化學機械拋光墊之uv可固化樹脂
US20230405765A1 (en) * 2022-06-15 2023-12-21 Cmc Materials Llc Dual-cure resin for preparing chemical mechanical polishing pads
US20240227120A1 (en) * 2022-12-22 2024-07-11 Applied Materials, Inc. Uv curable printable formulations for high performance 3d printed cmp pads

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6077601A (en) * 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
KR100905266B1 (ko) * 2000-12-01 2009-06-29 도요 고무 고교 가부시키가이샤 연마 패드
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
WO2004028744A1 (en) * 2002-09-25 2004-04-08 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
KR20040093402A (ko) * 2003-04-22 2004-11-05 제이에스알 가부시끼가이샤 연마 패드 및 반도체 웨이퍼의 연마 방법
JP2006114666A (ja) * 2004-10-14 2006-04-27 Asahi Kasei Electronics Co Ltd 研磨パッド、その製造方法、およびそれを用いた研磨方法
DE102006035726A1 (de) * 2006-07-28 2008-01-31 Evonik Röhm Gmbh Verfahren zur Herstellung von ABA-Triblockcopolymeren auf (Meth)acrylatbasis

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