TWI513767B - 硬化性樹脂組成物及硬化物 - Google Patents

硬化性樹脂組成物及硬化物 Download PDF

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Publication number
TWI513767B
TWI513767B TW100140055A TW100140055A TWI513767B TW I513767 B TWI513767 B TW I513767B TW 100140055 A TW100140055 A TW 100140055A TW 100140055 A TW100140055 A TW 100140055A TW I513767 B TWI513767 B TW I513767B
Authority
TW
Taiwan
Prior art keywords
group
resin composition
curable resin
carbon
stepped
Prior art date
Application number
TW100140055A
Other languages
English (en)
Chinese (zh)
Other versions
TW201224061A (en
Inventor
井上慶三
禿惠明
Original Assignee
大賽璐股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 大賽璐股份有限公司 filed Critical 大賽璐股份有限公司
Publication of TW201224061A publication Critical patent/TW201224061A/zh
Application granted granted Critical
Publication of TWI513767B publication Critical patent/TWI513767B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW100140055A 2010-11-04 2011-11-03 硬化性樹脂組成物及硬化物 TWI513767B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010247655A JP2012097225A (ja) 2010-11-04 2010-11-04 硬化性樹脂組成物及び硬化物

Publications (2)

Publication Number Publication Date
TW201224061A TW201224061A (en) 2012-06-16
TWI513767B true TWI513767B (zh) 2015-12-21

Family

ID=46024436

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100140055A TWI513767B (zh) 2010-11-04 2011-11-03 硬化性樹脂組成物及硬化物

Country Status (8)

Country Link
US (1) US8871890B2 (https=)
EP (1) EP2636706A4 (https=)
JP (1) JP2012097225A (https=)
KR (1) KR20140006769A (https=)
CN (1) CN103003367B (https=)
MY (1) MY161328A (https=)
TW (1) TWI513767B (https=)
WO (1) WO2012060322A1 (https=)

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JP5937798B2 (ja) * 2011-09-07 2016-06-22 株式会社ダイセル ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
KR101545111B1 (ko) * 2012-05-25 2015-08-17 주식회사 다이셀 경화성 수지 조성물 및 그의 경화물, 밀봉제, 및 광반도체 장치
JP6021605B2 (ja) * 2012-11-19 2016-11-09 新日鉄住金化学株式会社 かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物
JP6059010B2 (ja) * 2012-12-28 2017-01-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
MY162427A (en) * 2013-02-14 2017-06-15 Daicel Corp Curable resin composition and cured product thereof, encapsulant, and semiconductor device
JP5895958B2 (ja) * 2014-02-20 2016-03-30 横浜ゴム株式会社 偏波保持光ファイバー用接着剤組成物
JP6803842B2 (ja) * 2015-04-13 2020-12-23 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． オプトエレクトロニクス用途のためのポリシロキサン製剤及びコーティング
CN104893310A (zh) * 2015-06-29 2015-09-09 山东东岳有机硅材料有限公司 含聚倍半硅氧烷的led封装用液体硅橡胶及其制备方法
CN106609030B (zh) * 2015-10-21 2018-12-25 广东生益科技股份有限公司 一种聚苯醚树脂组合物及其在高频电路基板中的应用
EP3423271A4 (en) * 2016-04-05 2019-01-23 Adaptive Surface Technologies, Inc. HARDENABLE POLYSILOXANE COMPOSITIONS AND ARTICULATING AGENTS, AND COATINGS AND ARTICLES PRODUCED THEREFROM
CN110746783A (zh) * 2019-10-25 2020-02-04 湖南国芯半导体科技有限公司 一种耐高温加成型有机硅凝胶及其制备方法
CN113448157B (zh) * 2020-03-24 2023-09-05 台达电子工业股份有限公司 波长转换装置
JP7704152B2 (ja) * 2020-11-20 2025-07-08 Jnc株式会社 オルガノポリシロキサンとその製造方法、ならびに、オルガノポリシロキサンを分散剤として含む分散液
KR102587608B1 (ko) * 2022-08-02 2023-10-12 주식회사 크레파머티리얼즈 내스크레치성이 우수한 고경도 코팅조성물

Citations (1)

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TW200801121A (en) * 2006-03-27 2008-01-01 Nippon Steel Chemical Co Curable resin, curable resin compositions and moldings thereof

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CN1105678A (zh) * 1994-01-21 1995-07-26 中国科学院化学研究所 显示非线性光学效应和液晶性的梯形聚硅氧烷及功能膜
JP3615784B2 (ja) * 1994-04-21 2005-02-02 ダウ コーニング アジア株式会社 光学素子用樹脂組成物及び光学素子
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JP2002348473A (ja) * 2001-05-23 2002-12-04 Asahi Denka Kogyo Kk 硬化性組成物
JP5225528B2 (ja) * 2001-05-30 2013-07-03 株式会社Ａｄｅｋａ ケイ素含有重合体の製造方法
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
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JP2005162859A (ja) 2003-12-02 2005-06-23 Dow Corning Toray Silicone Co Ltd 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP5132027B2 (ja) * 2004-05-12 2013-01-30 株式会社Ａｄｅｋａ ケイ素含有硬化性組成物、及びこれを熱硬化させた硬化物
JP2006206721A (ja) 2005-01-27 2006-08-10 Kansai Electric Power Co Inc:The 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP4826160B2 (ja) 2005-07-28 2011-11-30 ナガセケムテックス株式会社 光素子封止用樹脂組成物
US20110129689A2 (en) * 2007-11-30 2011-06-02 Showa Denko K.K. Curable composition for transfer materials and method for forming micropattern using the curable composition
JP5707607B2 (ja) * 2009-04-24 2015-04-30 Jnc株式会社 有機ケイ素化合物及びそれを含む熱硬化性樹脂組成物
JP5770975B2 (ja) * 2010-03-26 2015-08-26 国立大学法人群馬大学 ポリシルセスキオキサン化合物、光素子封止材及びその用途

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Also Published As

Publication number Publication date
US8871890B2 (en) 2014-10-28
KR20140006769A (ko) 2014-01-16
EP2636706A4 (en) 2016-01-20
CN103003367B (zh) 2015-09-30
WO2012060322A1 (ja) 2012-05-10
MY161328A (en) 2017-04-14
CN103003367A (zh) 2013-03-27
TW201224061A (en) 2012-06-16
US20130131265A1 (en) 2013-05-23
JP2012097225A (ja) 2012-05-24
EP2636706A1 (en) 2013-09-11

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