TWI512756B - 關於存取記憶體單元之分散式子區塊的裝置及方法 - Google Patents
關於存取記憶體單元之分散式子區塊的裝置及方法 Download PDFInfo
- Publication number
- TWI512756B TWI512756B TW102129342A TW102129342A TWI512756B TW I512756 B TWI512756 B TW I512756B TW 102129342 A TW102129342 A TW 102129342A TW 102129342 A TW102129342 A TW 102129342A TW I512756 B TWI512756 B TW I512756B
- Authority
- TW
- Taiwan
- Prior art keywords
- sub
- block
- blocks
- memory
- memory unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 31
- 238000003491 array Methods 0.000 claims description 27
- 230000004044 response Effects 0.000 claims description 3
- 210000004027 cell Anatomy 0.000 description 47
- 238000009792 diffusion process Methods 0.000 description 16
- 239000000758 substrate Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 10
- 230000000295 complement effect Effects 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 210000000352 storage cell Anatomy 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/10—Decoders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/408—Address circuits
- G11C11/4087—Address decoders, e.g. bit - or word line decoders; Multiple line decoders
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/003—Cell access
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/02—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/12—Group selection circuits, e.g. for memory block selection, chip selection, array selection
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/16—Multiple access memory array, e.g. addressing one storage element via at least two independent addressing line groups
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/18—Address timing or clocking circuits; Address control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3418—Disturbance prevention or evaluation; Refreshing of disturbed memory data
- G11C16/3427—Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dram (AREA)
- Read Only Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/590,926 US8891305B2 (en) | 2012-08-21 | 2012-08-21 | Apparatuses and methods involving accessing distributed sub-blocks of memory cells |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201419302A TW201419302A (zh) | 2014-05-16 |
| TWI512756B true TWI512756B (zh) | 2015-12-11 |
Family
ID=50147891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102129342A TWI512756B (zh) | 2012-08-21 | 2013-08-15 | 關於存取記憶體單元之分散式子區塊的裝置及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US8891305B2 (enExample) |
| EP (2) | EP3686890A1 (enExample) |
| JP (1) | JP6321650B2 (enExample) |
| KR (1) | KR102214272B1 (enExample) |
| CN (1) | CN104685569B (enExample) |
| TW (1) | TWI512756B (enExample) |
| WO (1) | WO2014031624A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107689377A (zh) * | 2016-08-06 | 2018-02-13 | 厦门海存艾匹科技有限公司 | 含有分离地址/数据转换器的三维一次电编程存储器 |
| US8891305B2 (en) | 2012-08-21 | 2014-11-18 | Micron Technology, Inc. | Apparatuses and methods involving accessing distributed sub-blocks of memory cells |
| US9312005B2 (en) * | 2013-09-10 | 2016-04-12 | Micron Technology, Inc. | Accessing memory cells in parallel in a cross-point array |
| WO2019178545A1 (en) | 2018-03-16 | 2019-09-19 | Micron Technology, Inc | Nand data placement schema |
| CN112074816B (zh) | 2018-03-16 | 2025-02-21 | 美光科技公司 | Nand数据放置模式的集群奇偶校验 |
| US11271002B2 (en) | 2019-04-12 | 2022-03-08 | Micron Technology, Inc. | Methods used in forming a memory array comprising strings of memory cells |
| US12483804B2 (en) * | 2023-12-08 | 2025-11-25 | Varjo Technologies Oy | Subsampling and wobulation in colour filter arrays having smallest repeating units with different sub-units |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030142544A1 (en) * | 2002-01-31 | 2003-07-31 | Eduardo Maayan | Mass storage array and methods for operation thereof |
| CN101315612A (zh) * | 2007-05-28 | 2008-12-03 | 创见资讯股份有限公司 | 非易失性存储器装置与数据的存取电路及其方法 |
| US20090292944A1 (en) * | 2003-12-30 | 2009-11-26 | Gonzalez Carlos J | Adaptive Deterministic Grouping of Blocks into Multi-Block Units |
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| US5204842A (en) * | 1987-08-05 | 1993-04-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory with memory unit comprising a plurality of memory blocks |
| US5367655A (en) | 1991-12-23 | 1994-11-22 | Motorola, Inc. | Memory and associated method including an operating mode for simultaneously selecting multiple rows of cells |
| US6098145A (en) * | 1998-02-18 | 2000-08-01 | Winbond Electronics Corporation | Pulsed Y-decoders for improving bitline precharging in memories |
| JP3707943B2 (ja) * | 1998-12-24 | 2005-10-19 | 株式会社東芝 | 半導体記憶装置 |
| JP4458584B2 (ja) * | 1999-09-07 | 2010-04-28 | 株式会社ルネサステクノロジ | 半導体記憶装置 |
| US7177181B1 (en) | 2001-03-21 | 2007-02-13 | Sandisk 3D Llc | Current sensing method and apparatus particularly useful for a memory array of cells having diode-like characteristics |
| US6724665B2 (en) * | 2001-08-31 | 2004-04-20 | Matrix Semiconductor, Inc. | Memory device and method for selectable sub-array activation |
| US6879505B2 (en) | 2003-03-31 | 2005-04-12 | Matrix Semiconductor, Inc. | Word line arrangement having multi-layer word line segments for three-dimensional memory array |
| US7286439B2 (en) | 2004-12-30 | 2007-10-23 | Sandisk 3D Llc | Apparatus and method for hierarchical decoding of dense memory arrays using multiple levels of multiple-headed decoders |
| US7889571B2 (en) * | 2008-01-09 | 2011-02-15 | Unity Semiconductor Corporation | Buffering systems methods for accessing multiple layers of memory in integrated circuits |
| US7359279B2 (en) * | 2005-03-31 | 2008-04-15 | Sandisk 3D Llc | Integrated circuit memory array configuration including decoding compatibility with partial implementation of multiple memory layers |
| JP2007095222A (ja) | 2005-09-30 | 2007-04-12 | Eastman Kodak Co | 半導体メモリ及びそのメモリコントローラ |
| US7649788B2 (en) | 2006-01-30 | 2010-01-19 | Unity Semiconductor Corporation | Buffering systems for accessing multiple layers of memory in integrated circuits |
| US7505328B1 (en) * | 2006-08-14 | 2009-03-17 | Spansion Llc | Method and architecture for fast flash memory programming |
| US8139432B2 (en) * | 2006-12-27 | 2012-03-20 | Samsung Electronics Co., Ltd. | Variable resistance memory device and system thereof |
| WO2009105362A1 (en) * | 2008-02-19 | 2009-08-27 | Rambus Inc. | Multi-bank flash memory architecture with assignable resources |
| KR20090095003A (ko) * | 2008-03-04 | 2009-09-09 | 삼성전자주식회사 | 적층형 반도체 메모리 장치 |
| US8332580B2 (en) | 2008-04-02 | 2012-12-11 | Zikbit Ltd. | System, method and apparatus for memory with embedded associative section for computations |
| JP4806046B2 (ja) * | 2009-03-16 | 2011-11-02 | 株式会社東芝 | 半導体記憶装置 |
| US7940554B2 (en) | 2009-04-24 | 2011-05-10 | Sandisk 3D Llc | Reduced complexity array line drivers for 3D matrix arrays |
| JP2011165298A (ja) | 2010-01-18 | 2011-08-25 | Elpida Memory Inc | 半導体記憶装置及びこれを備えた情報処理システム |
| US9263102B2 (en) * | 2010-09-28 | 2016-02-16 | SanDisk Technologies, Inc. | Apparatus, system, and method for data transformations within a data storage device |
| US8273610B2 (en) * | 2010-11-18 | 2012-09-25 | Monolithic 3D Inc. | Method of constructing a semiconductor device and structure |
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| KR101772951B1 (ko) * | 2011-03-10 | 2017-09-13 | 삼성전자주식회사 | 불 휘발성 메모리 장치 및 그것의 읽기 방법 |
| US8760957B2 (en) * | 2012-03-27 | 2014-06-24 | SanDisk Technologies, Inc. | Non-volatile memory and method having a memory array with a high-speed, short bit-line portion |
| US8891305B2 (en) | 2012-08-21 | 2014-11-18 | Micron Technology, Inc. | Apparatuses and methods involving accessing distributed sub-blocks of memory cells |
-
2012
- 2012-08-21 US US13/590,926 patent/US8891305B2/en active Active
-
2013
- 2013-08-15 TW TW102129342A patent/TWI512756B/zh active
- 2013-08-20 KR KR1020157007295A patent/KR102214272B1/ko active Active
- 2013-08-20 EP EP20162028.3A patent/EP3686890A1/en active Pending
- 2013-08-20 EP EP13830579.2A patent/EP2888740B1/en active Active
- 2013-08-20 JP JP2015528581A patent/JP6321650B2/ja active Active
- 2013-08-20 CN CN201380049356.8A patent/CN104685569B/zh active Active
- 2013-08-20 WO PCT/US2013/055767 patent/WO2014031624A1/en not_active Ceased
-
2014
- 2014-11-14 US US14/542,244 patent/US9779791B2/en active Active
-
2017
- 2017-09-29 US US15/720,960 patent/US10170169B2/en active Active
-
2018
- 2018-12-31 US US16/237,346 patent/US10734049B2/en active Active
-
2020
- 2020-08-03 US US16/983,604 patent/US11282556B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030142544A1 (en) * | 2002-01-31 | 2003-07-31 | Eduardo Maayan | Mass storage array and methods for operation thereof |
| US20090292944A1 (en) * | 2003-12-30 | 2009-11-26 | Gonzalez Carlos J | Adaptive Deterministic Grouping of Blocks into Multi-Block Units |
| CN101315612A (zh) * | 2007-05-28 | 2008-12-03 | 创见资讯股份有限公司 | 非易失性存储器装置与数据的存取电路及其方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2888740A4 (en) | 2016-04-13 |
| KR102214272B1 (ko) | 2021-02-10 |
| WO2014031624A1 (en) | 2014-02-27 |
| US10170169B2 (en) | 2019-01-01 |
| EP2888740A1 (en) | 2015-07-01 |
| TW201419302A (zh) | 2014-05-16 |
| US11282556B2 (en) | 2022-03-22 |
| US20210020214A1 (en) | 2021-01-21 |
| US9779791B2 (en) | 2017-10-03 |
| US20140056070A1 (en) | 2014-02-27 |
| US20180122443A1 (en) | 2018-05-03 |
| JP6321650B2 (ja) | 2018-05-09 |
| EP2888740B1 (en) | 2020-03-11 |
| KR20150047568A (ko) | 2015-05-04 |
| US8891305B2 (en) | 2014-11-18 |
| US20190279695A1 (en) | 2019-09-12 |
| JP2015529929A (ja) | 2015-10-08 |
| EP3686890A1 (en) | 2020-07-29 |
| US10734049B2 (en) | 2020-08-04 |
| CN104685569B (zh) | 2016-07-06 |
| CN104685569A (zh) | 2015-06-03 |
| US20150063022A1 (en) | 2015-03-05 |
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