TWI511822B - 加工控制裝置、雷射加工裝置及加工控制方法 - Google Patents

加工控制裝置、雷射加工裝置及加工控制方法 Download PDF

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Publication number
TWI511822B
TWI511822B TW102148130A TW102148130A TWI511822B TW I511822 B TWI511822 B TW I511822B TW 102148130 A TW102148130 A TW 102148130A TW 102148130 A TW102148130 A TW 102148130A TW I511822 B TWI511822 B TW I511822B
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TW
Taiwan
Prior art keywords
processing
area
stage
region
laser
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Application number
TW102148130A
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English (en)
Chinese (zh)
Other versions
TW201436912A (zh
Inventor
Atsushi Ikemi
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW201436912A publication Critical patent/TW201436912A/zh
Application granted granted Critical
Publication of TWI511822B publication Critical patent/TWI511822B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Numerical Control (AREA)
TW102148130A 2013-01-04 2013-12-25 加工控制裝置、雷射加工裝置及加工控制方法 TWI511822B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013000178 2013-01-04
PCT/JP2013/081303 WO2014106919A1 (ja) 2013-01-04 2013-11-20 加工制御装置、レーザ加工装置および加工制御方法

Publications (2)

Publication Number Publication Date
TW201436912A TW201436912A (zh) 2014-10-01
TWI511822B true TWI511822B (zh) 2015-12-11

Family

ID=51062241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102148130A TWI511822B (zh) 2013-01-04 2013-12-25 加工控制裝置、雷射加工裝置及加工控制方法

Country Status (5)

Country Link
JP (1) JP5622973B1 (ko)
KR (1) KR101511483B1 (ko)
CN (1) CN104203482B (ko)
TW (1) TWI511822B (ko)
WO (1) WO2014106919A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6647888B2 (ja) * 2016-01-29 2020-02-14 ビアメカニクス株式会社 レーザ加工方法及びレーザ加工装置
JP6035461B1 (ja) * 2016-04-28 2016-11-30 武井電機工業株式会社 レーザー加工方法及びレーザー加工装置
CN110662625A (zh) * 2017-05-29 2020-01-07 Acs运动控制有限公司 用于加工多个较大工件的系统及方法
CN108608120A (zh) * 2018-04-25 2018-10-02 大族激光科技产业集团股份有限公司 芯片衬底的激光剥离系统和方法
JP7348109B2 (ja) * 2020-03-11 2023-09-20 住友重機械工業株式会社 レーザ加工装置の制御装置、レーザ加工装置、及びレーザ加工方法
CN111505992B (zh) * 2020-05-06 2021-05-18 清华大学 一种具有多种连接方式的多通道激光振镜运动控制系统
CN112630983A (zh) * 2020-12-24 2021-04-09 中国工程物理研究院激光聚变研究中心 一种激光系统、激光诱导损伤测试系统及方法
JP2023122989A (ja) * 2022-02-24 2023-09-05 オムロン株式会社 制御システム、制御方法および制御装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817243A (en) * 1996-10-30 1998-10-06 Shaffer; Wayne K. Method for applying decorative contrast designs to automotive and motorcycle parts using lasers
JP2000100608A (ja) * 1998-09-21 2000-04-07 Mitsubishi Electric Corp レーザ加工装置
TW200518867A (en) * 2003-05-19 2005-06-16 Mitsubishi Electric Corp Laser processing apparatus
TW200726563A (en) * 2006-01-06 2007-07-16 Mitsubishi Electric Corp Laser processing device, program preparation device, and laser processing method
TW200902207A (en) * 2007-05-28 2009-01-16 Mitsubishi Electric Corp Laser processing apparatus
TW200936285A (en) * 2007-12-27 2009-09-01 Mitsubishi Electric Corp Laser processing apparatus and control device for laser processing
TW201008062A (en) * 2008-05-23 2010-02-16 Mitsubishi Electric Corp Laser processing controlling device and laser processing device
JP2011140057A (ja) * 2010-01-08 2011-07-21 Mitsubishi Electric Corp 加工制御装置、レーザ加工装置および加工制御方法
JP2012006039A (ja) * 2010-06-24 2012-01-12 Toshiba Mach Co Ltd パルスレーザ加工方法およびパルスレーザ加工用データ作成方法
TW201217093A (en) * 2010-06-24 2012-05-01 Toshiba Machine Co Ltd Dicing methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5026455B2 (ja) * 2009-03-18 2012-09-12 住友重機械工業株式会社 Ｘｙステージ装置、半導体検査装置、及び半導体露光装置
JP2011121093A (ja) * 2009-12-10 2011-06-23 Mitsubishi Materials Corp レーザ加工装置およびこれを用いた工具のレーザ加工方法
CN101870039B (zh) * 2010-06-12 2014-01-22 中国电子科技集团公司第四十五研究所 双工作台驱动激光加工机及其加工方法
JP2012187620A (ja) * 2011-03-11 2012-10-04 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工計画方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817243A (en) * 1996-10-30 1998-10-06 Shaffer; Wayne K. Method for applying decorative contrast designs to automotive and motorcycle parts using lasers
JP2000100608A (ja) * 1998-09-21 2000-04-07 Mitsubishi Electric Corp レーザ加工装置
TW200518867A (en) * 2003-05-19 2005-06-16 Mitsubishi Electric Corp Laser processing apparatus
TW200726563A (en) * 2006-01-06 2007-07-16 Mitsubishi Electric Corp Laser processing device, program preparation device, and laser processing method
TW200902207A (en) * 2007-05-28 2009-01-16 Mitsubishi Electric Corp Laser processing apparatus
TW200936285A (en) * 2007-12-27 2009-09-01 Mitsubishi Electric Corp Laser processing apparatus and control device for laser processing
TW201008062A (en) * 2008-05-23 2010-02-16 Mitsubishi Electric Corp Laser processing controlling device and laser processing device
JP2011140057A (ja) * 2010-01-08 2011-07-21 Mitsubishi Electric Corp 加工制御装置、レーザ加工装置および加工制御方法
JP2012006039A (ja) * 2010-06-24 2012-01-12 Toshiba Mach Co Ltd パルスレーザ加工方法およびパルスレーザ加工用データ作成方法
TW201217093A (en) * 2010-06-24 2012-05-01 Toshiba Machine Co Ltd Dicing methods

Also Published As

Publication number Publication date
TW201436912A (zh) 2014-10-01
KR20140114465A (ko) 2014-09-26
KR101511483B1 (ko) 2015-04-10
CN104203482A (zh) 2014-12-10
WO2014106919A1 (ja) 2014-07-10
JP5622973B1 (ja) 2014-11-12
JPWO2014106919A1 (ja) 2017-01-19
CN104203482B (zh) 2015-07-22

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