TWI511822B - Processing control device, laser processing device and processing control method - Google Patents

Description

Processing control device, laser processing device and processing control method

The present invention relates to a machining control device, a laser processing device, and a machining control method for laser processing of a workpiece.

In a device for processing a workpiece (processing object) such as a printed substrate, there is a laser processing apparatus (micro laser processing for performing laser processing on a workpiece by irradiating laser light). machine). Such a laser processing apparatus moves an XY table (XY table) carrying a workpiece and stops the galvanometer scanner after scanning to perform a galvano area of the galvano area. Laser processing inside (step method). This stepping method is repeated in the workpiece surface: the XY stage is moved and then stopped, and after the laser processing in the scanning area of the galvanometer scanner is completed, the XY stage is moved to the next galvanometer scanning. The scan area is then processed. Therefore, the workpiece cannot be subjected to laser processing during the movement of the XY stage, which causes the so-called loss time of the laser processing.

Therefore, in the laser processing methods described in Patent Documents 1 and 2, the XY stage is synchronized with the galvanometer scanner, and the galvano scanner is scanned while the XY stage is still being operated. Coordinated control of laser processing.

[Previous Technical Literature] (Patent Literature)

(Patent Document 1) Japanese Patent Laid-Open Publication No. 2000-100608

(Patent Document 2) Japanese Patent Laid-Open Publication No. 2011-140057

However, the above prior art has an algorithm for calculating the positioning data of the galvanometer scanner side (computer aided manufacturing: CAM (Computer Aided Manufacturing) data), which is complicated in order to realize coordinated control. It takes a lot of time to develop the development.

The present invention has been made in view of the above problems, and an object thereof is to provide a processing control device, a laser processing device, and a processing control method that can easily perform efficient laser processing.

In order to solve the above problems, the object of the present invention is to provide a control unit for controlling an XY table and a galvanometer scanner, and the XY stage is processed. The object moves in a plane parallel to the main surface of the workpiece, that is, in the XY plane, and the galvanometer scanner causes the laser light emitted from the laser source to be in the galvano area of the galvano area. The inner portion is positioned to irradiate the laser beam onto the workpiece, and the control unit controls the XY stage so as to be set on the workpiece when laser processing is performed on the workpiece. The processing area is sequentially moved to the galvanometer scanner scanning area, and the aforementioned galvanometer scanner is controlled to Positioning the laser light relative to each of the processing regions that are moved to the scanning area of the galvanometer scanner, and moving the aforementioned processing region toward the galvanometer scanner scanning region when the processing region enters When the moving target coordinate has a predetermined distance within the in position range, the XY stage is moved while the XY stage is not stopped, so that the laser light is in the galvanometer scanner. a first coordinated control of positioning in the scanning area, and the first coordination in the processing area is performed by performing the first coordinated control until the processing area reaches the galvanometer scanner scanning area and the XY stage stops The control area receives the laser processing, and when the processing area reaches the galvanometer scanner scanning area and the XY stage stops, the remaining processing area in the processing area is accepted while the XY stage is stopped. Laser processing.

According to the present invention, an effect of efficiently performing efficient laser processing is produced.

1‧‧‧ galvanometer scanner controller

2‧‧‧XY slide controller

3‧‧‧Processing Program Memory

4‧‧‧Processing Instructions Department

6‧‧‧Laser oscillator

9‧‧‧XY slide

10-1 to 10-N, 82‧‧‧Processing area

11, 21‧‧‧XY slide position information input section

12‧‧‧ galvanometer scanner control unit

22‧‧‧Slide Control Department

40-2 to 40-6, 41-2 to 41-6‧‧‧ coordinated control area

51A‧‧‧Remaining distance

52A‧‧‧Information in place

53A‧‧‧Irradiation timing information

81‧‧‧ galvanometer scanner scanning area

83A, 83B‧‧‧ in-range range

84A to 84C‧‧‧ coordinated control area

100‧‧‧ Laser processing equipment

200‧‧‧Control device

W‧‧‧Workpiece

Fig. 1 is a view showing the configuration of a laser processing apparatus in the first embodiment.

Fig. 2 is a block diagram showing the configuration of the control device.

Fig. 3 is a view for explaining the order of the processing regions set on the workpiece.

Fig. 4 is a view for explaining the processing procedure of the laser processing in the first embodiment.

Figure 5-1 shows a graph of the moving speed of the XY stage.

Figure 5-2 is a diagram for explaining the relationship between the distance to the target coordinates of the processing area and the in-position range.

Fig. 6-1 is a view showing a processing procedure of a conventional laser processing.

Fig. 6-2 is a view showing a processing procedure of the laser processing in the first embodiment.

Fig. 7 is a view showing an example of setting characteristics of the XY stage.

Fig. 8 is a view for explaining the vibration of the XY slide when it is stopped.

Fig. 9 is a diagram for explaining the relationship between the amplitude at the time of stop of the remaining distance information and the in-position range.

Fig. 10 is a view for explaining the processing procedure of the laser processing in the second embodiment.

Fig. 11 is a view for explaining the processing procedure of the laser processing in the second embodiment.

Fig. 12 is a view for explaining the processing procedure of the laser processing in the third embodiment.

Fig. 13 is a view for explaining the processing procedure of the laser processing in the fourth embodiment.

Fig. 14 is a view showing the moving speed of the XY stage.

Fig. 15 is a view showing the processing procedure of the laser processing in the fourth embodiment.

Hereinafter, the machining control device, the laser machining device, and the machining control method according to the embodiment of the present invention will be described in detail based on the drawings. However, the invention is not limited by the embodiments.

Embodiment 1.

Fig. 1 is a view showing the configuration of a laser processing apparatus in the first embodiment. mine The injection processing apparatus 100 is a device for performing hole processing such as a through hole for forming a printed wiring board on a workpiece (subject to be processed) W to be described later. The laser processing apparatus 100 of the present embodiment moves the XY stage 9 in a stepwise manner, and when the XY stage 9 moves, the galvano area of the galvano scanner is reached to the desired coordinates (target coordinates). The laser processing is performed by taking coordinated control before the XY slide table 9 is stopped. When the XY stage 9 is stopped and the galvano scanner scanning area reaches the desired coordinates, the laser processing apparatus 100 performs laser processing while the XY stage 9 is stopped.

The laser processing apparatus 100 is provided with a control device (processing control device) 200, amplifiers 31x, 31y, 32x, 32y, motors 5x, 5y, XY slides 9, galvanometer scanners Gx, Gy. And a laser oscillator (laser source) 6.

The control device 200 includes a galvanometer scanner controller (laser scanning system control unit) that controls the galvanometer scanners Gx and Gy, and an XY stage controller (transport system control unit) that controls the XY stage 9 . The control device 200 controls the XY stage 9 and the galvano-type scanners Gx, Gy so that the laser beam is irradiated to the desired laser beam irradiation position.

The galvanometer scanner controller 1 outputs control signals (galvanometer scanner control commands) for controlling the galvanometer scanners Gx, Gy to the amplifiers 31x, 31y. The XY stage controller 2 outputs a control signal (XY stage control command) for controlling the XY stage 9 to the amplifiers 32x, 32y.

The amplifiers 31x, 31y respectively amplify the galvanometer scanner control commands sent from the galvanometer scanner controller 1 and then transmit them to the galvanometer scanners Gx, Gy. The amplifiers 32x, 32y respectively amplify the XY stage control commands sent from the XY stage controller 2, and transmit them to the motors 5x, 5y.

The laser oscillator 6 is a device that outputs laser light (pulse output) to deliver laser light to the workpiece W, and is controlled by the galvanometer scanner controller 1. The galvanometer scanners Gx, Gy cause the laser light emitted from the laser oscillator 6 to be positioned in the scanning area of the ammeter scanner to be irradiated onto the workpiece W. The galvanometer scanners Gx and Gy irradiate the laser light to the laser processing position on the workpiece W by scanning the laser light through an f θ lens (f θ lens) (not shown). The galvanometer scanners Gx, Gy have encoders 8x, 8y connected to the galvanometer scanner controller 1. The encoders 8x, 8y detect the state of the galvanometer scanner Gx, Gy (galvanometer scanner position information), and transmit the detected galvanometer scanner position information to the galvanometer scanner controller 1 .

The timing of the laser light output from the laser oscillator 6 and the position at which the galvanometer scanners Gx and Gy illuminate the laser light are controlled by the galvanometer scanner 1 from the encoder 8x. The 8y galvanometer scanner position information is controlled so that the laser light can be illuminated to the desired opening.

The motors 5x, 5y move the XY slide 9 in the XY plane (in the plane parallel to the main surface of the workpiece W) to the position (X, Y coordinate) according to the XY slide control command. The XY slide table 9 carries the workpiece W and moves in the XY plane to convey the workpiece W. The XY stage 9 is provided with a linear scale 7x for detecting the position of the XY stage 9 in the X direction, and a linear scale 7y for detecting the position of the XY stage 9 in the Y direction. The linear optical scales 7x and 7y are attached to the XY slide table 9 in order to accurately detect the position information (coordinates) of the XY slide table 9.

The linear optical scales 7x, 7y of the present embodiment transmit position information (XY slide position information) of the detected XY slide table 9 in the XY plane to the XY slide controller 2 and the galvanometer scanner controller. 1. Linear optical ruler 7x, 7y is not The XY stage position information to be transmitted to the galvanometer scanner controller 1 is directly transmitted to the galvanometer scanner controller 1 through the XY stage controller 2. Since the processing cycle of the galvano-scanner controller 1 is higher than the processing cycle of the XY stage controller 2, if the position information of the linear optical scales 7x, 7y is transferred through the XY stage controller 2 To the galvanometer scanner controller 1, there is a delay that cannot be coordinated.

The XY slide controller 2 controls the position of the XY slide table 9 based on a machining program (program) and an XY slide position information which will be described later. In the XY stage controller 2 of the present embodiment, the XY stage 9 is controlled to move in the XY plane in a stepwise manner. Specifically, the XY stage controller 2 sequentially moves the XY stage 9 carrying the workpiece W to the galvano scanner scanning area, and the XY stage 9 is performed during the laser processing in each processing area. stop.

The galvanometer scanner controller 1 controls the galvanometer scanners Gx and Gy (the irradiation position of the laser light) based on the machining program and the XY stage position information described later. The galvanometer scanner controller 1 of the present embodiment starts the scanning of the galvano-scanners Gx, Gy before the XY slide table 9 starts moving until a predetermined time immediately before the next machining position is stopped. The galvanometer scanner scans the laser area.

Specifically, when the XY stage 9 moves the next processing area of the workpiece W to the galvano scanner scanning area in a stepwise manner, when the foremost end portion of the next processing area approaches the target coordinates (galvanometer) The front end portion of the scanning area of the scanner is separated by a predetermined distance (into the in-position range described later), and coordinated control is started. Coordinated control, by synchronizing the XY stage 9 with the galvanometer scanners Gx, Gy, while the XY stage 9 is still operating, the galvanometer sweep The scanners Gx and Gy scan for laser processing control.

When the XY slide table 9 is moved, the XY slide table 9 is first accelerated to a predetermined speed, and then decelerated until it stops. Therefore, the timing at which the next processing region approaches a predetermined distance from the target coordinates is the timing at which the speed of the XY stage 9 becomes slower than the predetermined speed. Therefore, when the XY stage 9 moves the next processing area on the workpiece W to the scanning area of the galvano scanner in a stepwise manner, the speed at which the speed of the XY stage 9 becomes slower than the predetermined speed ( Before stopping, start coordinated control.

As described above, in the present embodiment, the XY slide controller 2 moves the XY slide table 9 in a stepwise manner, and the galvanometer scanner controller 1 is placed on the XY slide table 9 (workpiece W). The coordinated control of the galvanometer scanners Gx, Gy and the XY slide table 9 is performed before a machining position (the galvano scanner scanning area) is stopped. Therefore, the coordinated control is performed only at a predetermined timing in which the XY slide table 9 is moving (a predetermined period immediately before the XY slide table 9 is stopped).

Fig. 2 is a view showing the configuration of the control device. The control device 200 includes a galvanometer scanner controller 1, an XY slide controller 2, a machining program storage unit 3, and a machining instruction unit 4. Among them, the galvanometer scanner controller 1 and the XY slide controller 2 correspond to the control unit described in the patent application.

The machining program storage unit 3 is a memory for processing a machining program to be used for laser processing of the workpiece W. The machining program is composed of two machining programs, one of which is a machining program for the XY slide including the workpiece position command specifying the position of the XY slide 9, and the other includes the specified laser machining position. A machining program for a galvanometer scanner formed by a machining position command or the like used in a galvanometer scanner. The machining instruction unit 4 transmits the machining position command to the galvanometer scanner controller 1 according to two machining programs, and the workpiece position command is executed. Transfer to the XY slide controller 2.

The XY slide controller 2 has an XY slide position information input unit 21 and a slide control unit 22. The XY stage position information input unit 21 inputs the XY stage position information transmitted from the linear optical scales 7x, 7y, and transmits the information to the slide table control unit 22. The slide control unit 22 controls the position of the XY slide table 9 based on the workpiece position command and the XY table position information transmitted from the machining instruction unit 4.

The galvanometer scanner controller 1 has an XY stage position information input unit 11 and a galvanometer type scanner control unit 12. The XY stage position information input unit 11 inputs the XY stage position information transmitted from the linear optical scales 7x, 7y, and transmits the information to the galvanometer scanner control unit 12. The galvanometer scanner control unit 12 controls the galvano-type scanners Gx, Gy (the laser light irradiation position) based on the machining position command and the XY table position information transmitted from the machining instruction unit 4.

The control device 200 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. Further, the CPU performs laser processing control of the workpiece W by using a machining program belonging to a computer program.

Here, the relationship between the coordinates of the XY stage 9 and the coordinates of the galvano-type scanners Gx and Gy in the coordinated control will be described. In the normal stepping process, when the coordinates (Gx, Gy) of the galvanometer scanner Gx, Gy = (0, 0), the processing region is positioned such that the laser light is irradiated at the center of the processing region. The position of the processing region (the position of the XY stage 9) is expressed as (Tx0, Ty0) = (0, 0).

On the other hand, in the case of coordinated control, the XY stage 9 should be positioned with (Tx, Ty) = (0, 0) as the target, but for example, when the XY stage is moving in the X+ direction, it is from (Tx, Ty)=(-1.0,0) starts as the in-position range. At this point, suppose you want When the laser light is irradiated to the center of the processing area, the coordinates of the galvanometer scanner Gx, Gy must be (Gx, Gy) = (-1.0, 0). That is, the distance between the current coordinates (Tx, Ty) and the target coordinates (Tx0, Ty0) when the stepping of the XY slide table 9 is advanced can be made equivalent to XY slip by causing the galvanometer scanner Gx, Gy to operate. The deviation of the table 9 from the target coordinates is offset.

By controlling the galvanometer scanners Gx and Gy in this manner, even if it takes time (a few microseconds to several tens of microseconds) to irradiate the laser light, the galvanometer scanners Gx and Gy can be operated while being interlocked with the XY slider 9. As a result, it is possible to prevent the laser processing hole from becoming elliptical or positionally offset. In the method of synchronizing the XY stage 9 and the galvano-type scanners Gx and Gy, the method described in Patent Document 1 or the like can be employed.

Next, the processing sequence of each processing region set on the workpiece W will be described. The processing order of each processing area is set in advance in the processing program for the galvanometer scanner. Fig. 3 is a view for explaining the processing sequence of each processing region set on the workpiece W.

In the present embodiment, a plurality of processing regions are set in the workpiece W, and a plurality of processing regions are used to divide the region on the workpiece W. Fig. 3 is a plan view showing a workpiece W in a case where a region on the workpiece W is divided by a lattice-shaped processing region arranged in the X-axis direction and the Y-axis direction. The size of the processing regions 10-1, 10-2, ..., 10-N (N is a natural number) corresponds to the size of the scanning area of the galvano scanner.

When the workpiece W is subjected to laser processing, the XY stage 9 is moved in the XY plane so that each processing area sequentially becomes a galvano scanner scanning area. For example, after the laser processing is performed in the processing area 10-1, the XY stage 9 is moved to make the next processing area 10-2 a galvanometer scanner scanning area. area. Then, after the laser processing is performed in the processing region 10-2, the XY slider 9 is moved to make the processing region 10-3 a galvanometer scanner scanning region. When the workpiece W is subjected to laser processing, the process of moving the scanning area of the galvanometer scanner to the processing area and the laser processing in the processing area are repeated.

Next, the processing procedure of the laser processing in the first embodiment will be described. Fig. 4 is a view for explaining the processing procedure of the laser processing in the first embodiment. Here, the case where laser processing is performed in the order of the processing region 10-1 to the processing region 10-6 will be described.

After the laser processing is performed in the processing area 10-1, the XY stage 9 is moved to make the processing area 10-2 a galvano scanner scanning area. The XY slide table 9 starts moving, and the XY slide table 9 starts to accelerate. Then, when the XY stage 9 reaches the predetermined speed, the acceleration of the XY stage 9 is ended, and the XY stage 9 continues to move at a predetermined speed. Then, when the XY slide table 9 is stopped, the XY slide table 9 is started to be decelerated. When the speed of the XY slide table 9 is reduced to 0, the XY slide table 9 is stopped.

In the present embodiment, the control device 200 starts the coordinated control when the XY stage 9 starts decelerating and the machining area approaches a predetermined distance from the target coordinate. In other words, the control device 200 starts the coordinated control when the difference in the distance between the processing region and the target coordinates (the distance to the target coordinate) becomes less than a predetermined value. In this way, coordinated control begins when the processing region enters the in position range by a predetermined distance from the target coordinate.

Then, the control device 200 performs coordinated control of the galvano-scan scanners Gx, Gy and the XY slide table 9 until the XY slide table 9 is stopped. In other words, in the in-position range, the coordinated control is performed until the XY slide table 9 is stopped. The in-position range is based on, for example, the moving speed of the XY slide table 9, The speed of the positioning of the galvanometer scanner Gx, Gy, etc. is set.

The area where the coordinated control is performed (coordinated control area) is the area of a part of the processing area. For example, the front end portion of the moving direction in the processing region is used as the coordinated control region. In Fig. 4, the coordinated control regions of the processing regions 10-2 to 10-6 are indicated by the coordinated control regions 40-2 to 40-6.

For example, after laser processing is performed over the entire area of the processing area 10-1, the XY stage 9 starts moving to make the processing area 10-2 a galvanometer scanner scanning area. Then, when the processing region 10-2 enters the in-position range, the coordinated control region 40-2 in the processing region 10-2 is subjected to laser processing by the coordinated control until the XY slider 9 is stopped. Then, after the XY slide table 9 is stopped, laser processing is performed on a region other than the coordinated control region 40-2 in the processing region 10-2 while the XY slide table 9 is stopped.

Then, after the laser processing is completed in the entire area of the processing region 10-2, the XY slider 9 starts moving to make the processing region 10-3 a galvanometer scanner scanning region. Then, laser processing is sequentially performed on the processing regions 10-3 to 10-6 by the same processing as the processing region 10-2. In addition, the in-position range and the coordinated control area do not have to be the same area, and the coordinated control area can be any area.

Fig. 5-1 is a diagram showing the moving speed of the XY stage, and Fig. 5-2 is a diagram for explaining the relationship between the distance to the target coordinate of the processing area and the in-position range. The horizontal axis of Fig. 5-1 is time, and the vertical axis is the moving speed of the XY stage 9. As shown in Fig. 5-1, the XY slide table 9 is accelerated for a predetermined time as soon as it starts moving. After the acceleration, the XY stage 9 reaches a predetermined speed. Then, as the processing area approaches the target coordinate, the XY stage 9 begins to decelerate. With this deceleration, the XY stage 9 stops the machining area at the target coordinate.

In the present embodiment, after the XY slide table 9 is changed to be slower than the predetermined speed, the period until the XY slide table 9 is stopped (the period in which the machining region enters the in-position range) (time range 71) is coordinated.

Fig. 5-2 shows the remaining distance 51A indicating the distance from the processing region to the target coordinates, the in-position information 52A indicating whether or not the in-position is in position, and the irradiation timing information 53A indicating the timing of irradiating the laser light. The remaining distance 51A corresponds to the current position of the processing area.

As the XY slide table 9 moves, the value of the remaining distance 51A becomes small, and then the remaining distance 51A becomes 0 at the time point when the XY slide table 9 is stopped. In the process in which the remaining distance 51A becomes smaller, the remaining distance 51A becomes smaller to a predetermined value, and the processed area enters the in-position range. The range in which the coordinated control is performed is, for example, a range of ±1 mm from the target coordinates to the X direction and the Y direction.

When the machining area enters the in-position range, the in-position information 52A becomes a state indicating that it is in place (High). Since the in-position information 52A is in a state in which it is in the position, it is in a state in which laser processing is possible, so laser processing using coordinated control is started. The laser processing is started, and as shown by the illumination timing information 53A, the laser light is irradiated to the workpiece W at a predetermined timing. In this case, the galvanometer scanner controller 1 assumes that the XY stage 9 is stopped at the target position and controls the galvanometer scanners Gx, Gy.

For example, assume that the maximum moving speed of the XY stage 9 is 50 m/min, and the acceleration/deceleration time of the XY stage 9 is 100 msec (trapezoidal acceleration/deceleration). And, assuming that the processing area is a square of 50 mm on all four sides, the in-position range is ±1 mm. In this case, in order to move the galvano scanner scanning area from the processing area to the next processing area, the XY stage 9 must be moved by 50 mm. Moreover, the moving time of 50mm is 0.2 sec. This is because, in the case of a movement of 50 mm, the XY stage 9 does not reach the maximum speed, but a triangular waveform with a vertex of 500 mm/sec.

In this case, when the XY slide table 9 is stopped, the time from the remaining distance 51A to the in-position range to the stop is 0.02 sec. Therefore, assuming that the in-position range is ±1 mm, and as soon as the galvanometer scanner Gx, Gy is operated to start laser processing as soon as this range is entered, the processing time of each processing area is shortened by 0.02 sec.

Fig. 6-1 is a view showing a processing procedure of a conventional laser processing, and Fig. 6-2 is a view showing a processing procedure of the laser processing in the first embodiment. Figures 6-1 and 6-2 show cross-sectional views of the workpiece W.

As shown in Fig. 6-1, in the case where the processing region 82 on the workpiece W is outside the galvano scanner scanning region 81 (S1), laser processing is not performed. Then, in the case where the processing region 82 on the workpiece W enters the galvanometer scanner scanning region 81 (S2), no laser processing is performed until the processing region 82 enters the galvano scanner scanning region 81 as a whole. . Then, the entire processing area 82 enters the galvanometer scanner scanning area 81 (S3), and laser processing is started in a state where the processing area 82 is stopped.

As shown in Fig. 6-2, in the present embodiment, the processing region 82 on the workpiece W is outside the galvano-scan scanner scanning region 81 (S11), and laser processing is not performed. Then, even if the processing region 82 on the workpiece W enters the galvano-scan scanner scanning region 81 (S12), the laser processing is not performed until the processing region 82 enters the in-position range 83A.

Then, the processing region 82 enters the in-position range 83A (S13), and just as the processing region 82 is still moving, the control device 200 starts laser processing. Coordinated control. For example, when the XY slide 9 is moved to the vicinity of the target coordinates (for example, before 1 mm), the galvano-scan scanner processing using coordinated control is started. The coordinated control of the laser processing is performed for the coordinated control region 84A. The processing area 82 here corresponds to the processing areas 10-1 to 10-6 shown in FIG. 4, and the coordinated control area 84A corresponds to the coordinated control areas 40-2 to 40-6 shown in FIG. . The galvanometer scanner scanning processing for the coordinated control region 84A is performed from the traveling direction of the XY slider 9 as shown in, for example, FIG. 6-2.

The control device 200 causes the laser processing to continue in the state where the machining region 82 is stopped, after the machining region 82 is entirely entered into the galvano scanner scanning region 81 after the start of the coordinated control of the laser machining (S14). At this time, since the laser processing of the coordinated control region 84A has been completed, the control device 200 accepts the laser processing in the processing region other than the coordinated control region 84A. Therefore, the processing time can be shortened by the processing time of the coordinated control region 84A as compared with the related art.

The control device 200 subtracts the error between the current position of the XY stage 9 and the positioning position of the XY stage 9 regardless of whether the XY stage 9 is moving or stopped. And the laser light is irradiated.

The in-position range is not limited to ±1 mm, and may be a range narrower than ±1 mm or a range wider than ±1 mm. When the length of the scanning area of the galvanometer scanner in the X direction is x, the in-position range of the X direction can be set to be shorter than x/2. Similarly, the length of the scanning area of the galvanometer scanner in the Y direction is y, and the range of the Y direction is set to be shorter than y/2.

However, the setting characteristics of the actual XY slide table 9 may have characteristics as shown in, for example, FIG. Fig. 7 is a view showing the setting characteristics of the XY stage. Figure 7 shows the remaining distance 51B in the case where the in-position range is ±5μm, The in-place information 52B and the illumination timing information 53B.

The XY slide table 9 is, for example, a platform having a mass of 300 kg to 500 kg, and is very heavy, so that it cannot be stopped suddenly. Therefore, the XY stage 9 is as shown by the remaining distance 51B, and the speed is gradually lowered and then stopped. Therefore, when the machining area is brought into the in-position range with a certain speed reduction, and the machining area is brought into the in-position range with the speed being lowered slowly, the time required to enter the in-position range There will be differences. The difference in this time is the set delay time, which is, for example, 300 μsec.

After the machining area enters the in-position range, the XY slide table 9 also slowly decreases the speed and then stops. Therefore, there is a time lag between when the machining region enters the in-position range and when the XY slide table 9 is stopped, when the speed is lowered at a constant rate and when the speed is gradually decreased. For example, in the case where the speed is gradually lowered, it takes 0.05 sec from the time when the processing area enters the in-position range until the XY stage 9 is stopped.

Therefore, the laser processing is started after the XY slide table 9 is stopped, and the laser processing is started after the machining region enters the in-position range, and the difference therebetween is 0.05 sec. Therefore, with the laser processing method of the present embodiment, the processing time of 0.05 sec can be shortened in each processing region.

When the processing area enters the in-position range, the in-position information 52B becomes a state indicating that it is in place (for example, High). Since the in-position information 52B is in a state in which it is in the position, it is in a state in which laser processing is possible, so laser processing using coordinated control is started. The laser processing is started, and as shown by the illumination timing information 53B, the laser light is irradiated to the workpiece W at a predetermined timing.

The XY slide table 9 is on the back of the ball screw of the XY slide table 9. When the backlash is increased, the rigidity of the floor is not high enough, etc., there is vibration when it stops. Fig. 8 is a view for explaining the vibration at the time of stopping the XY slide. Fig. 8 shows the remaining distance 51C, the in-position information 52C, and the irradiation timing information 53C in the case where the oscillation occurs when the XY slide table 9 is stopped.

When the XY slide table 9 stops vibrating, the XY slide table 9 repeats the action of the oscillation of the machining area briefly entering the in-position range and then running outside the in-position range.

In such a case, if the vibration of the XY stage 9 and the timing of the irradiation of the laser light are not coordinated, the laser beam is irradiated with the vibration of the XY stage 9 and the irradiation position of the laser beam is shifted.

When the in-position range is set to be smaller than the amplitude at the stop of the remaining distance 51C (the vibration amplitude of the XY stage 9) (for example, ±5 μm), the in-position information 52C is repeated at High when the XY slide table 9 is stopped. Change between Low.

Specifically, the processing area enters the in-position range, and the in-position information 52C is temporarily High, and the processing area runs out of the in-position range, and the in-position information 52C becomes Low.

Then, when the in-position information 52C is turned to High, the laser processing is possible. Therefore, the laser processing using the coordinated control is started, and when the in-position information 52C is Low, the laser processing is not performed. So stop the laser processing. At the beginning of the laser processing, the laser light is irradiated to the workpiece W at a predetermined timing as indicated by the illumination timing information 53C, but if the processing region is out of the in-position range at the timing of irradiating the laser light, there is a laser light irradiation position. The situation where an offset occurs.

Therefore, this embodiment vibrates when the XY slide table 9 stops. In the case where the in-position range is set to be larger than the amplitude at the stop of the remaining distance 51C (for example, ±1 mm), the coordinated control is performed in the in-position range.

Fig. 9 is a diagram for explaining the relationship between the amplitude at the time of stop of the remaining distance information and the in-position range. Fig. 9 shows the remaining distance 51D, the in-position information 52D, and the irradiation timing information 53D in the case where the in-position range is set to be larger than the amplitude at the stop of the remaining distance 51D. The remaining distance 51D here is the same as the remaining distance 51C shown in FIG.

By setting the in-position range to a range larger than the amplitude at the stop of the remaining distance 51D, even if the XY stage 9 vibrates at the time of stopping, it is possible to prevent the machining area from temporarily entering the in-position range and then running out of the in-position range. Further, even when the XY slide table 9 vibrates, the galvanometer scanners Gx and Gy are positioned in consideration of the position coordinates of the XY slide table 9, so that the XY slide table 9 can be canceled by the machining position accuracy. Vibration.

When the processing area enters the in-position range, the in-position information 52D will become High. When the in-position information 52D is turned to High, the laser processing is possible, and laser processing using coordinated control is started. At the start of the laser processing, the laser light is irradiated to the workpiece W at a predetermined timing as indicated by the illumination timing information 53D.

The in-position range can be set to a different range in the X direction and the Y direction. Further, the in-position range may be set in accordance with the moving distance of the XY slide table 9 when the machining region is moved, the deceleration when the XY slide table 9 is stopped, or the like.

The timing of the coordinated control can be set according to the moving speed of the XY stage 9. For example, the control device 200 performs coordinated control in a case where the moving speed of the XY slide table 9 is equal to or lower than a predetermined value. The timing of coordinated control can also be based on It is set in the shape (roundness, etc.) of the hole formed in the workpiece W.

As described above, according to the first embodiment, the laser processing apparatus 100 adds the elements of the coordinated control in the case of the stepping method. Therefore, the algorithm of the CAM data is not complicated, and the coordinated control can be easily realized. Moreover, since the coordinated control is employed, the cycle time can be reduced. Therefore, efficient laser processing can be easily performed. Further, since the in-position range is set to be larger than the amplitude at the stop of the remaining distance 51D, the accuracy of the machining position can be improved.

Further, since the front end portion in the moving direction of the processing region is used as the coordinated control region, it is possible to efficiently determine the irradiation position of the laser light for the remaining processing regions after the laser processing using the coordinated control.

Embodiment 2.

Next, a second embodiment of the present invention will be described using the tenth and eleventh drawings. In the second embodiment, the rear end portion in the moving direction of the processing region is used as the coordinated control region, and then the laser processing is performed in the same processing procedure as in the first embodiment.

Fig. 10 is a view for explaining the processing procedure of the laser processing in the second embodiment. Here, a case where laser processing is performed in the order of the processing region 10-1 to the processing region 10-6 will be described. In the present embodiment, the laser processing apparatus 100 performs the movement processing and the coordinated control processing of the XY stage 9 as in the case of the first embodiment.

The coordinated control region of this embodiment is a rear end portion of the moving direction in the processing region. The coordinated control regions in which the coordinated control regions 41-2 to 41-6 are used as the processing regions 10-1 to 10-6 are shown in Fig. 10.

For example, the laser is applied to the entire area of the processing area 10-1. After the work, the XY stage 9 starts moving to make the processing area 10-2 a galvanometer scanner scanning area. Then, when the processing region 10-2 enters the in-position range, the coordinated control is performed until the XY slider 9 is stopped, and the coordinated control region 41-2 in the processing region 10-2 is subjected to laser processing. Then, after the XY slide table 9 is stopped, laser processing is performed on a region other than the coordinated control region 41-2 in the processing region 10-2 while the XY slide table 9 is stopped. After the laser processing is performed on the entire area of the processing region 10-2, the laser processing is sequentially performed for the processing regions 10-3 to 10-6.

Fig. 11 is a view showing a processing procedure of the laser processing in the second embodiment. Figure 11 shows a cross-sectional view of the workpiece W. The processes (S21) to (S22) shown in Fig. 11 are the same as the processes (S11) to (S12) described in the sixth embodiment with reference to Fig. 6-2. That is, in the case where the processing region 82 on the workpiece W is outside the galvano-scan scanner scanning region 81 (S21), laser processing is not performed. Then, in the case where the processing region 82 on the workpiece W enters the galvano scanner scanning region 81 (S22), no laser processing is performed until the processing region 82 enters the in-position range 83B.

Then, the processing region 82 enters the in-position range 83B (S23), and the control device 200 starts the coordinated control of the laser processing while the processing region 82 is still moving. The coordinated control of the laser processing is performed for the coordinated control region 84B (S24). Here, the coordinated control area 84B corresponds to the coordinated control areas 41-2 to 41-6 and the like shown in FIG.

The control device 200 causes the laser processing to continue in the state where the XY stage 9 is stopped, if the entire processing area 82 enters the galvano scanner scanning area 81 after the start of the coordinated control of the laser processing (S25). . At this time, coordinated control Since the laser processing of the area 84B has been completed, the control device 200 accepts the laser processing in the processing area other than the coordinated control area 84B. Therefore, the processing time can be shortened by the processing time of the coordinated control region 84B as compared with the related art.

As described above, according to the second embodiment, the laser processing apparatus 100 adds the elements of the coordinated control in the case of the stepping method. Therefore, as in the first embodiment, the coordinated control can be easily realized. Moreover, since the coordinated control is employed, the cycle time can be reduced.

Further, since the rear end portion in the moving direction of the processing region is used as the coordinated control region, it is possible to efficiently determine the irradiation position of the laser light for the remaining processing regions after the laser processing using the coordinated control.

Embodiment 3.

Next, a third embodiment of the present invention will be described using FIG. In the third embodiment, laser processing using coordinated control is started when the processing region enters the scanning area of the galvano scanner. Then, after the laser processing of the coordinated control area is completed, the laser processing is temporarily stopped, and after the movement of the XY stage 9 is completed, the laser processing outside the coordinated control area is performed.

Fig. 12 is a view showing a processing procedure of the laser processing in the third embodiment. Figure 12 shows a cross-sectional view of the workpiece W. The process (S31) shown in Fig. 12 is the same as the process (S11) described in the first embodiment with reference to Fig. 6-2. That is, in the case where the processing region 82 on the workpiece W is outside the galvano scanner scanning region 81 (S31), laser processing is not performed.

Then, when the processing region 82 on the workpiece W enters the galvanometer scanner scanning region 81, the control device 200 starts the coordinated control of the laser processing while the processing region 82 is still moving. Coordinated control of laser processing The system is performed for the coordinated control region 84C located at the front end portion of the moving direction in the processing region 82 (S32). Here, the coordinated control area 84C corresponds to the coordinated control areas 40-2 to 40-6 and the like shown in FIG.

The control device 200 stops the laser processing when the laser processing for the coordinated control region 84C is completed. In this case, even if the laser processing for the coordinated control region 84C ends, the XY stage 9 continues the process of moving the processing region 82 to the galvano scanner scanning region 81 (S33).

When the movement of the XY stage 9 is completed and the processing area 82 is entirely entered into the galvano scanner scanning area 81 (S34), the control apparatus 200 restarts the laser processing while the XY stage 9 is stopped. At this time, since the laser processing of the coordinated control region 84C has been completed, the control device 200 accepts the laser processing in the processing region other than the coordinated control region 84C. Therefore, the processing time can be shortened by the processing time of the coordinated control region 84C as compared with the related art.

As described above, according to the third embodiment, since the laser processing apparatus 100 adds the elements of the coordinated control in the case of the stepping method, the coordinated control can be easily realized as in the first embodiment. Moreover, since the coordinated control is employed, the cycle time can be reduced.

Further, since the front end portion in the moving direction of the processing region is used as the coordinated control region, it is possible to efficiently position the irradiation position of the laser light for the remaining processing regions after the laser processing using the coordinated control.

Embodiment 4.

Next, a fourth embodiment of the present invention will be described using Figs. 13 to 15. In the fourth embodiment, the coordinated control described in the second embodiment is performed, and the coordinated control described in the third embodiment is also performed. That is, entering the galvanometer sweep in the processing area The time at which the scanner scans the area begins with laser processing using coordinated control. Then, after the laser processing of the coordinated control area is completed, the laser processing is temporarily stopped, and then when the processing area enters the in-position range, the laser processing using the coordinated control is started. Then, after the movement of the XY slide table 9 is completed, laser processing other than the coordinated control region is performed.

Next, the processing procedure of the laser processing in the fourth embodiment will be described. Fig. 13 is a view for explaining the processing procedure of the laser processing in the fourth embodiment. Here, the case where laser processing is performed in the order of the processing region 10-1 to the processing region 10-6 will be described.

The coordinated control region of this embodiment is a front end portion and a rear end portion in the moving direction among the processing regions. In Fig. 13, the coordinated control areas of the processing areas 10-2 to 10-6 are indicated by the coordinated control areas 40-2 to 40-6, 41-2 to 41-6.

For example, after laser processing is performed over the entire area of the processing area 10-1, the XY stage 9 starts moving to make the processing area 10-2 a galvanometer scanner scanning area. Then, when a part of the processing region 10-2 enters the in-position range, coordinated control is performed to perform laser processing on the coordinated control region 41-2 in the processing region 10-2. The control device 200 stops the laser processing after the laser processing for the coordinated control region 41-2 is completed.

Then, after the XY stage 9 starts decelerating, when the processing area 10-2 enters the in-position range, the control device 200 starts the coordinated control again. Thereby, the laser processing for the coordinated control region 40-2 is performed while the XY slide table 9 is stopped.

As described above, in the processing area 10-2, laser processing is performed on the coordinated control areas 41-2, 40-2 by coordinated control. Then, stop at the XY slide 9 Thereafter, the region other than the coordinated control regions 41-2 and 40-2 in the processing region 10-2 is subjected to laser processing while the XY slider 9 is stopped.

After the laser processing is completed in the entire area of the processing area 10-2, the XY stage 9 starts moving to make the processing area 10-3 a galvanometer scanner scanning area. Then, the processing regions 10-3 to 10-6 are subjected to laser processing in the same manner as the processing region 10-2.

Fig. 14 is a view showing the moving speed of the XY stage. In Fig. 14, the horizontal axis represents time and the vertical axis represents the moving speed of the XY stage 9. In the present embodiment, coordinated control is performed during the period from the start of the movement of the XY stage 9 to the time when the speed becomes faster than the predetermined speed (time range 72). And, the coordinated control is performed during the period (time range 71) until the XY slide table 9 is stopped after the XY slide table 9 is slower than the predetermined speed.

Fig. 15 is a view showing the processing procedure of the laser processing in the fourth embodiment. Figure 15 shows a cross-sectional view of the workpiece W. The processes (S41) to (S43) shown in Fig. 15 are the same as the processes (S31) to (S33) described in the fourth embodiment. Further, the processes (S44) to (S46) shown in Fig. 15 are the same as the processes (S23) to (S25) described in the first embodiment with reference to Fig. 11.

That is, in the case where the processing region 82 on the workpiece W is outside the galvano-scan scanner scanning region 81 (S41), laser processing is not performed. Then, when the processing region 82 on the workpiece W enters the galvanometer scanner scanning region 81, the control device 200 starts the coordinated control of the laser processing while the processing region 82 is still moving. The coordinated control of the laser processing is performed for the coordinated control region 84C (S42).

The control device 200 stops the laser processing when the laser processing for the coordinated control region 84C is completed. In this case, even if the laser processing for the coordinated control region 84C is completed, the XY stage 9 continues the process of moving the processing region 82 to the galvano scanner scanning region 81 (S43).

Then, when the processing region 82 enters the in-position range 83B (S44), the control device 200 restarts the coordinated control of the laser processing while the processing region 82 is still moving. The coordinated control of the laser processing is performed for the coordinated control region 84B (S45).

After the control device 200 starts the coordinated control of the laser processing, when the entire area of the processing area 82 enters the galvano scanner scanning area 81 (S46), the laser processing is performed while the XY stage 9 is stopped. carry on. At this time, since the laser processing of the coordinated control regions 84B, 84C has been completed, the control device 200 accepts the laser processing in the processing regions other than the coordinated control regions 84B, 84C. Therefore, the processing time can be shortened by the processing time of the coordinated control regions 84B, 84C as compared with the prior art.

As described above, according to the fifth embodiment, since the laser processing apparatus 100 adds the elements of the coordinated control based on the stepping method, the coordinated control can be easily realized as in the first embodiment. Moreover, the processing cycle time can be reduced because of coordinated control.

Further, since the front end portion and the rear end portion in the moving direction in the processing region serve as the coordinated control region, it is possible to efficiently irradiate the laser light to the remaining processing regions after the laser processing using the coordinated control. Position it.

The processes described in Embodiments 1 to 4 can be combined. Perform laser processing. For example, the processing described in the seventh and ninth embodiments of the first embodiment can be applied to the second to fourth embodiments.

(industrial use)

As described above, the processing control device, the laser processing device, and the processing control method of the present invention can be utilized for laser processing of a workpiece.

51A‧‧‧Remaining distance

52A‧‧‧Information in place

53A‧‧‧Irradiation timing information

Claims (8)

A machining control device includes a control unit that controls an XY stage and a galvanometer scanner, and the XY stage carries a workpiece and is in a plane parallel to a main surface of the workpiece, that is, in an XY plane Moving, the galvanometer scanner is configured such that the laser light emitted from the laser source is positioned in the scanning area of the ammeter scanner to irradiate the laser light onto the workpiece, wherein the control unit is required to When the workpiece is subjected to laser processing, the XY stage is controlled such that the processing area set in a lattice shape corresponding to the galvanometer scanner scanning area on the workpiece is sequentially moved to the galvanometer. Scanning the area and controlling the galvanometer scanner to position the laser light relative to each processing region on the scanning area of the galvanometer scanner, with the processing area facing the galvanometer When the scanning area of the scanner moves, when the processing area enters the range of the predetermined distance from the moving target coordinate, the XY is not caused. a first coordinated control of positioning the laser light in the scanning area of the galvanometer scanner while moving the XY stage while moving the XY stage, and reaching the galvanometer scanner scanning area in the processing area When the XY stage is stopped, the first coordinated control area in the processing area is subjected to laser processing by performing the first coordinated control, and the XY stage stops when the processing area reaches the galvanometer scanner scanning area. At the time of stopping the XY stage, the remaining processing areas in the processing area are subjected to laser processing. The processing control device according to claim 1, wherein the in-position range is set based on a vibration amplitude when the XY stage is stopped. The processing control device according to claim 1 or 2, wherein when the processing region enters the galvanometer scanner scanning region, the XY slider is moved while the XY slider is not stopped. The second coordinated control of the laser light positioned in the scanning area of the galvanometer scanner to receive the laser processing in the second coordinated control region, and the laser processing is performed when the laser processing of the second coordinated control region ends Stopping, when the processing region enters the aforementioned in-position range, the first coordinated control region in the processing region is subjected to laser processing by performing the aforementioned first coordinated control. The processing control device according to claim 1 or 2, wherein the first coordinated control region is a front end portion in a moving direction of the processing region. The processing control device according to claim 1 or 2, wherein the first coordinated control region is a rear end portion in a moving direction of the processing region. The processing control device according to claim 3, wherein the first coordinated control region is a front end portion in a moving direction of the processing region, and the second coordinated control region is among the processing regions. The rear end of the moving direction. A laser processing apparatus comprising: an XY slide, which carries a workpiece and moves in a plane parallel to a main surface of the workpiece, that is, in an XY plane; The galvanometer scanner is configured such that laser light emitted from a laser source is positioned in a scanning area of a galvanometer scanner to irradiate laser light onto the workpiece; and a control unit controls the XY stage and the aforementioned In the galvanometer type scanner, the control unit controls the XY stage so that the tymometer scan area is on the workpiece and the galvanometer scan area when laser processing is performed on the workpiece Correspondingly, the processing regions set in a lattice shape are sequentially moved to the galvanometer scanner scanning area, and the galvanometer scanner is controlled to cause the laser light to move to the scanning area of the galvanometer scanner relative to the movement. Positioning in each of the processing regions, when the processing region is moved toward the galvano scanner scanning region, when the processing region enters a range within a predetermined distance from a moving target coordinate, Stopping the XY slide while moving the XY slide to position the laser light in the scanning area of the galvanometer scanner Adjusting control, and when the processing area reaches the galvanometer scanner scanning area and the XY stage stops, the coordinated control area in the processing area is subjected to laser processing by performing the aforementioned coordinated control, when the processing area is When the thyristor is stopped and the XY stage is stopped, the remaining processing area in the processing area is subjected to laser processing while the XY stage is stopped. A processing control method comprising: targeting a workpiece to be processed The XY slide that moves in the XY plane of the main surface of the workpiece, and the laser light emitted from the laser source are positioned in the scanning area of the galvanometer scanner to irradiate the laser light to the aforementioned processing The galvanometer scanner controls the XY stage to perform the laser processing on the workpiece to sequentially move the processing area set on the workpiece to the galvanometer scanner Scanning the area, and controlling the galvanometer scanner to control the positioning of the laser light relative to each processing area on the scanning area of the galvanometer scanner, wherein the control step is When the processing area moves toward the scanning area of the galvano scanner, when the processing area enters a range within a predetermined distance from the moving target coordinate, the method of stopping the XY slide is not started. Moving the aforementioned XY stage to coordinate the positioning of the laser light in the scanning area of the galvanometer scanner, and reaching in the processing area The galvanometer scanner scan area and the XY stage stop, the coordinated control area in the processing area is subjected to laser processing by performing the coordinated control, and the processing area reaches the galvanometer scanner scanning area. When the XY stage is stopped, the remaining processing areas in the processing area are subjected to laser processing while the XY stage is stopped.