TWI510860B - Photosensitive resin composition - Google Patents

Photosensitive resin composition Download PDF

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Publication number
TWI510860B
TWI510860B TW100130488A TW100130488A TWI510860B TW I510860 B TWI510860 B TW I510860B TW 100130488 A TW100130488 A TW 100130488A TW 100130488 A TW100130488 A TW 100130488A TW I510860 B TWI510860 B TW I510860B
Authority
TW
Taiwan
Prior art keywords
group
structural unit
compound
resin composition
mass
Prior art date
Application number
TW100130488A
Other languages
English (en)
Chinese (zh)
Other versions
TW201224654A (en
Inventor
Katsuharu Inoue
Motohiko Murakami
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW201224654A publication Critical patent/TW201224654A/zh
Application granted granted Critical
Publication of TWI510860B publication Critical patent/TWI510860B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Graft Or Block Polymers (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW100130488A 2010-09-01 2011-08-25 Photosensitive resin composition TWI510860B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010195477 2010-09-01

Publications (2)

Publication Number Publication Date
TW201224654A TW201224654A (en) 2012-06-16
TWI510860B true TWI510860B (zh) 2015-12-01

Family

ID=45824787

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100130488A TWI510860B (zh) 2010-09-01 2011-08-25 Photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP5803431B2 (ja)
KR (1) KR101539809B1 (ja)
TW (1) TWI510860B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5598621B1 (ja) * 2014-02-28 2014-10-01 住友化学株式会社 感光性樹脂組成物
KR101511476B1 (ko) 2014-02-28 2015-04-10 스미또모 가가꾸 가부시키가이샤 감광성 수지 조성물
JP5644970B1 (ja) 2014-02-28 2014-12-24 住友化学株式会社 感光性樹脂組成物
KR101636178B1 (ko) * 2014-12-30 2016-07-04 동우 화인켐 주식회사 스페이서 형성용 감광성 수지 조성물 및 이로부터 제조되는 스페이서
EP3376286A1 (en) * 2015-11-10 2018-09-19 Asahi Glass Company, Limited Photosensitive composition for biochip for fluorescence analysis, method for manufacturing biochip for fluorescence analysis, and biochip for fluorescence analysis

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009053663A (ja) * 2007-08-02 2009-03-12 Fujifilm Corp 硬化性組成物、硬化膜、フォトスペーサーの製造方法、液晶表示装置用基板及び液晶表示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440903B (zh) * 2007-07-10 2014-06-11 Nippon Steel & Sumikin Chem Co 濾色器間隔壁形成用感光性樹脂組成物與使用該樹脂組成物形成之濾色器間隔壁，及濾色器與濾色器的製造方法
JP5591490B2 (ja) * 2008-09-19 2014-09-17 富士フイルム株式会社 水不溶性化合物の微粒子、その分散物、及びその製造方法
KR101000360B1 (ko) * 2008-09-22 2010-12-13 롬엔드하스전자재료코리아유한회사 현상 가능한 초소수성 감광성조성물
JP5561136B2 (ja) * 2009-12-11 2014-07-30 Ｊｓｒ株式会社 感放射線性樹脂組成物ならびに液晶表示素子のスペーサーおよびその形成方法
JP5393543B2 (ja) * 2010-03-11 2014-01-22 富士フイルム株式会社 感光性樹脂組成物、硬化膜、及び、液晶表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009053663A (ja) * 2007-08-02 2009-03-12 Fujifilm Corp 硬化性組成物、硬化膜、フォトスペーサーの製造方法、液晶表示装置用基板及び液晶表示装置

Also Published As

Publication number Publication date
KR101539809B1 (ko) 2015-07-27
JP5803431B2 (ja) 2015-11-04
TW201224654A (en) 2012-06-16
KR20120022670A (ko) 2012-03-12
JP2012073603A (ja) 2012-04-12
CN102385248A (zh) 2012-03-21

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MM4A Annulment or lapse of patent due to non-payment of fees