TW201224654A - Photosensitive resin composition - Google Patents

Abstract

A photosensitive resin composition comprises component (A), component (B), component (C), component (D) and component (E). The pattern formed by the photosensitive resin composition is heat durable and water repellent. The component (A) includes a copolymer having a structure unit selected from a group consisting of unsaturated carboxylic acid and unsaturated carboxylic acid anhydride and a structure unit formed from an unsaturated cyclic ether compound having 2-4 carbon atoms, except the structure unit formed from an unsaturated compound having full fluoroalkyl group with 4-6 carbon atoms. The component (B) is a polymer having a structure unit formed form an unsaturated compound having full fluoroalkyl group with 4-6 carbon atoms. The component (C) is a polymeric compound. The component (D) is a polymerization initiator and the component (E) is a solvent.

Description

201224654 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a composition of a photosensitive resin composition. [Prior Art] In the display device of recent years, a filter film, an ITO electrode of a liquid crystal display element, an organic EL display element, a circuit wiring board, and the like are often produced by an ink-jet method. Further, in the ink jet method, a partition wall formed of a photosensitive resin composition is often used. For the photosensitive resin composition, for example, a photosensitive resin composition using a polymer obtained by polymerizing a fluorene-substituted acrylate having a fluoroalkyl group having 4 to 6 carbon atoms is known (JP-A-2008-28725 No. 1) Bulletin). SUMMARY OF THE INVENTION However, in the photosensitive resin composition proposed in the past, the heat resistance of the obtained pattern may not be sufficiently satisfactory.

The present invention provides a photosensitive resin composition containing (in), (B), (C), (D) and (E); (A) which provides the following technical features of [1] to [6]; a structural unit derived from at least one selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride, and a structural unit derived from an unsaturated compound having an oxime ether structure having 2 to 4 carbon atoms The copolymer (however, does not contain a structural unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms). -5- 201224654 (B) Polymer containing a structural unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms (C) Polymerizable compound (D) A polymerization initiator (E) solvent. [2] The photosensitive resin composition according to [1], wherein (B) is a copolymer containing at least one structural unit selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride. . [3] The photosensitive resin composition according to [1] or [2], wherein (C) is a polymerization initiator containing a ruthenium compound. [4] A pattern formed by the photosensitive resin composition according to any one of [1] to [3]. [5] A separator for inkjet, comprising the photosensitive resin composition according to any one of [1] to [3]. [6] A display device comprising at least one selected from the group consisting of the pattern described in [4] and the partition wall for inkjet described in [5]. The photosensitive resin composition of the present invention can produce a pattern having excellent heat resistance. The photosensitive resin composition of the present invention is a photosensitive resin composition containing (A), (B), (C), (D) and (E). (A) a structural unit derived from at least one of a group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride, and an unsaturated compound derived from a cyclic ether structure having a carbon number of 2 to 4 β; Copolymer 1 of structural unit ( -6- 201224654 However, it does not contain a structural unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms). (hereinafter also referred to as "resin (A)") (B) a polymer containing a structural unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms (hereinafter also referred to as " (C)" (C) polymerizable compound (D) polymerization initiator (E) solvent Further, the photosensitive resin composition of the present invention may contain, and resin (A) and resin (B) Selected from a group of dissimilar resins (hereinafter also referred to as "resin (A1)"), a polymerization starting aid (D1), a polyfunctional thiol compound (T), and a surfactant (F) At least one type of hydrazine, in the present specification, an exemplary compound of each component may be used singly or in combination, unless otherwise specified. The photosensitive resin composition of the present invention contains a resin (A). The resin (A) is a resin (A-1): at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides (a) (hereinafter also referred to as "(a)") A copolymer obtained by polymerization of an unsaturated compound (b) having a cyclic ether structure of 2 to 4 carbon atoms (hereinafter also referred to as "(b)"), a resin (A-2): and (a) And (b) a monomer (c) copolymerized (however, a cyclic ether structure having a carbon number of 2 to 4 is not contained). (The following also refers to the case of 201224654 "(C)"), and the copolymer obtained by (a), and (b) polymerization. However, (a), (b) and (c) do not contain a perfluoroalkyl group having 4 to 6 carbon atoms. The resin (A) is preferably a resin (A-1). (a) specifically, for example, unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, fluorene-vinylbenzoic acid, m-vinylbenzoic acid, p-vinylbenzoic acid; Fumaric acid, miconic acid, mesaconic acid, itaconic acid, 3-glycolic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2 , an unsaturated dicarboxylic acid such as 3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid or 1, 4-cyclohexene dicarboxylic acid; containing methyl-5-norbornene-2,3 - Dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2 .1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5 a bicyclic unsaturated compound of a carboxyl group such as carboxy-6-ethylbicyclo[2_2.1]hept-2-ene; maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinyl phthalic acid, 4-ethylene Phthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6- Two-ring double ring [2.2.1] Unsaturated dicarboxylic acid anhydride such as hept-2-ene anhydride (nadic anhydride); succinic acid mono [2-(methyl)propenyl oxyethyl], phthalic acid mono [2-( Monovalent carboxylic acid -8 - 201224654 of monovalent or higher polymethyl carboxylic acid such as methyl methacryloyloxyethyl] - 201224654 of unsaturated mono((meth) propylene fluorenyl oxyalkyl] ester; such as hydrazine: -(hydroxymethyl) Acrylic, unsaturated acrylates containing a hydroxyl group and a carboxyl group in the same molecule. Among these, acrylic acid, methacrylic acid, and maleic anhydride are often used from the viewpoints of copolymerization reactivity, alkali solubility, and the like. In the present specification, "(meth)acrylic acid" means at least one selected from the group consisting of acrylic acid and methacrylic acid. The terms "(meth)acryloyl" and "(meth)acrylate" have the same meaning. (b) an unsaturated compound having a cyclic ether structure having 2 to 4 carbon atoms (for example, at least one selected from the group consisting of an oxirane ring, a propylene oxide ring, and a tetrahydrofuran ring) A monomer having a cyclic ether structure of 2 to 4 carbon atoms and a monomer having an ethylenically unsaturated double bond is preferred, and a monomer having a cyclic ether structure of 2 to 4 carbon atoms and a monomer having a (meth)acryloxy group is more preferable. . (b), for example, an unsaturated compound (b1) having an oxiranyl group (hereinafter also referred to as "(b1)"), an unsaturated compound (b2) having an oxypropylene group (hereinafter also There is a case called "(b2)"), an unsaturated compound (b3) of tetrahydrofuranfuranyl (hereinafter also referred to as "(b3)"), and the like. (bl) is an unsaturated compound (b 1 -1 ) having a structure obtained by epoxidizing a linear or branched unsaturated aliphatic hydrocarbon group (hereinafter also referred to as "(b)" In the case of the unsaturated alicyclic hydrocarbon, the unsaturated compound (b 1 - 2 ) having a structure obtained by epoxidation (hereinafter also referred to as "(bl-2)"). (bl) 'A -9 - 201224654 monomer having an oxiranyl group and a (meth) propylene fluorenyloxy group, preferably having a structure of an epoxidized unsaturated alicyclic hydrocarbon (meth) A monomer having a propylene oxy group is more preferable. These monomers can improve the storage stability of the photosensitive resin composition. (bl-l), specifically, for example, glycidyl (meth) acrylate, yS-methyl glycidyl (meth) acrylate, 0-ethyl glycidyl (meth) propyl enoate Ester, glycidyl vinyl ether, fluorene-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-hydrazine-ethylene Glycidyl glycidyl ether, α-methyl-m-vinylbenzyl glycidyl ether, α-methyl-P-vinylbenzyl glycidyl ether, 2,3-bis(glycidyloxy) Methyl)styrene, 2,4-bis(glycidyloxymethyl)styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxymethyl) ) styrene, 2,3,4-tris(glycidyloxymethyl)styrene, 2,3,5-tris(glycidyloxymethyl)styrene, 2,3,6-tris (glycidol) Methoxymethyl)styrene, 3,4,5-tris(glycidyloxymethyl)styrene, 2,4,6-tris(glycidyloxymethyl)styrene, JP-A-7-248625 A compound or the like described in the publication. (bl-2), for example, vinylcyclohexene monooxide, 1,2-epoxy-4-vinylcyclohexane (for example, CELLOXIDE 2000; manufactured by DAICEL Chemical Industry Co., Ltd.), 3,4- Epoxycyclohexyl methacrylate (eg 'CYCLOMER A400; manufactured by DAICEL Chemical Industry Co., Ltd.), 3,4-epoxycyclohexylmethyl methacrylate (for example, cYCLOMER Μ100; DAICEL Chemical Industry) And a compound represented by the formula (I), a compound represented by the formula (II), and the like. -10- 201224654

^xXir\ (I) (Π) [In the formula (I) and the formula (π), R1 and R2 represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and the hydrogen atom contained in the alkyl group may be represented by a hydroxyl group. Replace. X1 and X2 represent a single bond, -R3-, *-R3-〇-, *-R3-S-, *-r3-nh-. R3 represents an alkanediyl group having 1 to 6 carbon atoms. * indicates the key with the key. The alkyl group having 1 to 4 carbon atoms, specifically, for example, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an η-butyl group, a sec-butyl group, a tert-butyl group or the like. An alkyl group which may be substituted by a hydroxyl group, for example, hydroxymethyl, 1-hydroxyethyl, 2-hydroxyethyl, 1-hydroxypropyl, 2-hydroxypropyl, 3-hydroxypropyl, hydrazine-hydroxyl_1 Methyl ethyl, 2-hydroxy-1-methylethyl, 1-hydroxybutyl, 2-hydroxybutyl, 3-hydroxybutyl, 4-hydroxybutyl and the like. R1 and R2' are preferably a hydrogen atom, a base group, a hydroxymethyl group, a hydrazine-hydroxyethyl group or a 2-hydroxyethyl group, and more preferably a hydrogen atom or a methyl group. Alkanediyl', for example, methyl, ethyl, propyl-1,2-diyl, propyl-1-, 3-yl, butyl-1,4- _ yl, pentyl-1,5 - Yiji, Jiyuan-1,6-X1 and X2 are preferably a single bond, a methyl group, a methyl group, a * _CH2-〇_ (* indicates a bond with a ruthenium), *-ch2ch2- The o-group or the like is more preferably a single bond, *-CH2CH2-0- group or the like. -11 - 201224654 The compound represented by the formula (I), for example, a compound represented by any one of the formula (I-1) to the formula (I-1). Preferably, it is a formula (1-1), a formula (1_3), a formula (1-5), a formula (1-7), a formula (1-9), and a formula (1-11) to a formula (1-15). a compound or the like represented by any of them. More preferably, it is a compound represented by any one of formula (1), formula (1-7), formula (1-9), and formula (1-15). Ο II H2C=CH-C—0 5? i? 〇 II h2c=ch-c-o—ch2 H2C=CH-C—Ο—02Η4

Ch3o I II h2c=c—c— ch3 o I II h2c=c—c—0 —ch2 ch3 o I II h2c=c—c—0—c2h4

2020=Π-0

o II H2C =CH -C -O -〇2 H4-S o II Η2〇=ΟΗ—C—O—C2H4-N CH30 I 11 Η2〇=0—C—O—C2H4—S CH3o I II H2C=C ——c —o —c2 H4—Nl H

(MO)

CHoOH o I II H2O—C 0 Q

Ch3o ·, I tl Η2〇=0—C 0—C2H4—〇 (1-13)

H2c=c· C2H4OH o (1-15) "C—0

The compound represented by the formula (II) is, for example, a compound represented by any one of the formulae (IK1) to (11-15). Preferably, the formula, A1-1), formula (II-3), formula (II-5), formula (II-7), formula (Ή y), and formula (Π-Η)~式(Π-丨) 5) The term of the compound represented by the person. More preferably, -12-201224654 is a compound represented by any one of the formula (II-1), the formula (II-7), the formula (II-9), and the formula (II-15). 0 II H2C:CH—C—0 i? if (II-1) H2C=CH—C—0—CH ο II h2c:ch—c—o—c2h4. h2c--ch—c—o—c2h4-o iH3? h2c=c-c-o ch3 o I II Η2〇==ό~-0一Ο—CH· CH3 ο I II Η2〇=ό—C—O—C2H4

0

CH3o I II H2C=C——C—O—C2H4-S CH30

?h3〇 I II H2C=C—C—O—

C2h4oh o h2c=c-c—0

The compound represented by the formula (I) and the compound represented by the formula (II) can be used singly. Also, these may be mixed in any ratio. In the case of mixing, the mixing ratio is based on the molar ratio, preferably the formula (J): the formula (Π) is 5: 95 to 95: 5, more preferably 10: 90 to 90: 1 〇, the best For 20:80~80:20. (b2), preferably a monomer having an oxypropylene group and a (meth)acryloxy group. (b2), for example, '3-methyl-3-(methyl)acrylyloxymethyl propylene oxide, 3-ethyl-3-(methyl)propenyl methoxymethylcyclo-13-201224654 oxygen Propane, 3-methyl-3-(meth)acryloyloxyethyl propylene oxide, 3-ethyl-3-(methyl) propylene decyloxyethyl propylene oxide, and the like. (b3), preferably a monomer having a tetrahydrofuranyl group and a (meth)acryloxy group. (b3), specifically, for example, tetrahydrofurfuryl acrylate (for example, VISC OAT V# 150, manufactured by Osaka Organic Chemical Industry Co., Ltd.), tetrahydrofurfuryl methacrylate or the like. (c) For example, (meth) acrylates, N-substituted maleimides, unsaturated dicarboxylic acid diesters, alicyclic unsaturated compounds, styrenes, other vinyl compounds, and the like. (Meth) acrylates such as methyl (meth) acrylate, ethyl (meth) acrylate, η-butyl (meth) acrylate, sec-butyl (meth) acrylate, tert - alkyl esters such as butyl (meth) acrylate; cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5·2.1·02'6] decane 8-(yl) acrylate (in the technical field to which the invention pertains, the conventional name is also called dicyclopentanyl (meth) acrylate), dicyclopentadienyl oxygen Ethyl (meth) acrylate, tricyclo [5.2.1.02 '6] decene-8-yl (meth) acrylate (in the technical field to which the invention pertains, the conventional name is also referred to as "bicyclic ring" Cycloalkyl esters such as Dicyclopentenyl (meth) acrylate"), isodecyl (meth) acrylate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl ( Methyl) propylene-14- 201224654 hydroxyalkyl esters such as acid esters; phenyl (meth) acrylate, benzyl (meth) acrylate, etc. Alkyl and aryl esters. The unsaturated dicarboxylic acid diesters are, for example, diethyl maleate, diethyl fumarate, diethyl itaconate and the like. N-substituted maleimines, for example, N-phenyl maleimine, N-cyclohexylmaleimide, N-benzyl maleimide, N-type peryleneimine- 3-maleimide benzoate, N-succinimide-4-maleimide butyl ester, N-succinimide-6-maleimide caproate (capr 〇ate ), N-amber succinimide-3-maleimide propionate, N-(9-acridinyl)maleimide, and the like. An alicyclic unsaturated compound, for example, bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]g- 2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2. 1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[ 2.2.1] Hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2,-hydroxyethyl)bicyclo[2.2.1 ???hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxyl -5-Methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2 .1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5·cyclohexyloxycarbonylbicyclo 6 2.2.1]hept-2-ene, 5-benzene Oxycarbonylbicyclo[2.2.1]hept-2-ene, -15- 201224654 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-bis(cyclic Hexyloxy Yl) bicyclo [2.2.1] hept-2-ene unsaturated bicyclic compound, etc. and the like. Styrene-based, for example, styrene, α-methylstyrene, m-methylstyrene, P-methylstyrene, vinyltoluene, p-methoxystyrene, etc., other vinyl compounds, for example , (meth)acrylonitrile, ethylene chloride, dichloroethylene, decyl (meth)acrylate, vinyl acetate, 1,3-butadiene, isobutylene and 2,3-dimethyl-1,3-butyl Diene, etc. (c) 'For example, styrene, N-phenyl maleimine, N-cyclohexylmaleimide, N-benzyl maleimide and bicyclo [2.2.1] hept-2-ene The viewpoint of copolymerization reactivity and alkali solubility is preferred. In the resin (A-1), the ratio of the structural unit produced by each monomer is preferably in the range described below with respect to the total number of moles of the structural unit constituting the resin (A-1). (a) The structural unit produced; 5 to 60 mol% (more preferably 10 to 50 mol%) (b) The structural unit produced; 4〇~95 mol% (more preferably 50 to 90 m) When the ratio of the structural unit of the resin (A-1) is in the above range, regardless of the storage stability of the photosensitive resin composition, the developability when the photosensitive resin composition forms a pattern, and the obtained coating film and The solvent resistance, heat resistance and mechanical strength of the pattern are all tend to be better. The resin (A-1) is preferably a resin (A-1) wherein (b) is (bl) is -16 to 201224654, and a resin (A-1) having (b) is (bl-2) is more preferable. Resin (A-1), for example, can be referred to the document "Experimental method for polymer synthesis" (the method described in the issue of the first issue of the 1st edition of the 1st edition of the Otsuka Ryokan, Ltd.). And the cited documents described in this document are manufactured. Specifically, for example, a certain amount of (a) and (b), a polymerization initiator, a solvent, and the like are placed in a reaction vessel, for example, a state in which oxygen is replaced by nitrogen in the atmosphere to form an oxygen-removing atmosphere during stirring Heating and holding methods, etc. Further, the polymerization initiator, the solvent and the like used herein are not particularly limited, and may be used as long as they are generally used in the technical field. For example, the polymerization initiator may be an azo compound (2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylbutyronitrile) or the like) or an organic peroxide. (Phenyl peroxide, etc.), the solvent is not particularly limited as long as it dissolves the solvent of each monomer to be used, and the solvent (E) of the photosensitive resin composition can be, for example, a solvent described later. In order to adjust the molecular weight of the obtained resin, a chain transfer agent may be added at the time of polymerization. Chain transfer agent, for example, η-butane thiol, tert-butane thiol, η-dodecane thiol, 2-sulfonylethanol thioglycolic acid, thioglycolate B Ester, 2-ethylhexyl thioglycolate, methoxybutyl thioglycolate, 3-sulfonyl propionic acid, polyfluorene containing sulfonyl group (KF-2 001: manufactured by Shin-Etsu Chemical Co., Ltd.) Mercaptans; halogenated alkyls such as chloroform, carbon tetrachloride, and carbon tetrabromide. Further, as the obtained copolymer, a post-reaction solution without processing may be used, and a concentrated or diluted solution may be used, or a solid (powder) taken out by a method such as reprecipitation may be used. In particular, when the solvent used in the polymerization is -17 to 201224654, when the solvent is the same as the solvent (E) described later, the solution after the reaction can be used without processing, and the production steps can be simplified. The ratio of the structural unit produced by the respective monomers in the resin (A-2) to the total number of moles of the total structural unit constituting the resin (A-2) is preferably in the following range. (a) the structural unit produced; 2 to 40 mol% (more preferably 5 to 35 mol%) (c) the structural unit produced; 1 to 65 mol% (more preferably 1 to 60 m) %) (b) The structural unit produced; 2 to 95 mol% (more preferably 5 to 80 mol%) The ratio of the structural unit of the resin (A-2), in the above range, the photosensitive resin The storage stability of the composition, the developability when the photosensitive resin composition forms a pattern, and the solvent resistance, heat resistance, and mechanical strength of the obtained coating film and pattern tend to be good. Among the resins (A-2), the resin (A-2) wherein (b) is (bl) is preferable, and the resin (A-2) of (b) is (bl-2) is more preferable. The resin (A-2) can be produced in the same manner as the resin (A-1). The polystyrene-equivalent weight average molecular weight of the resin (A) is preferably 3,000 to 1 Torr, more preferably 5,000 to 50,000. When the weight average molecular weight of the resin (A) is within the above range, the coating property tends to be improved, and film formation of the exposed portion is less likely to occur during development. Further, it is easy to remove the development of the non-exposed portion. The molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (?η)) of the resin (A), preferably from 1.1 to 6.0, more preferably from 1.2 to 4.0, has a molecular weight distribution within the above range, and has improved developability. tendency. The acid value of the resin (Α) is 20 to 150 mgKOH/g, preferably 40 to 13 5 mgKOH/g, more preferably 50 to 135 mg/g. The acid value referred to herein is obtained by measuring the amount (mg) of calcium hydroxide required to neutralize the lg resin, which is determined by titration using an aqueous calcium hydroxide solution. The content of the resin (A) is preferably from 5 to 95% by mass, more preferably from 20 to 80% by mass, based on the total of the resin (A), the resin (A1) and the polymerizable compound (C). It is 40 to 60% by mass. When the content of the resin (A) is in the above range, the photosensitivity of the photosensitive resin composition, the adhesion of the obtained pattern, the solvent resistance and the mechanical properties tend to be further improved. The photosensitive resin composition of the present invention contains a resin (B). The resin (B) is a polymer having a structural unit produced by the unsaturated compound (d) having a perfluorocarbon group having 4 to 6 carbon atoms (hereinafter also referred to as "(d)"). (d), for example, a compound represented by the formula (d-Ο).

(d-0) 6 perfluoroalkyl 〇 -19- 201224654

Rd represents a hydrogen atom, a halogen atom, a cyano group, a phenyl group, an alkyl group having a benzyl group of 1 to 21, and a hydrogen atom contained in the alkyl group may be substituted by a halogen atom. Xd represents a single bond, a divalent aliphatic hydrocarbon group having 1 to 10 carbon atoms, a divalent alicyclic hydrocarbon group of 1 to 10, or a divalent aromatic having 6 to 12 carbon atoms, which is contained in the aliphatic hydrocarbon group and the alicyclic hydrocarbon group. Substituted by -CH2-, Ϊ, -CO-, _NRe-, -S- or -S02-. 〕

Rf is preferably a perfluoroalkyl group having 4 to 6 carbon atoms, perfluorobutyl group and perfluoro group. a carbon number of 1 to 21, such as methyl, ethyl, η-butyl, η-pentyl, η-hexyl, η-heptyl, n-octyl, nn-fluorenyl, etc. Affiliation; isopropyl, isobutyl, sec-butyl, isopentyl, methylpentylpentyl, 3-methylpentyl, 4-methylpentyl, 丨-ethylbutyl Base, 1-methylhexyl, 2-methylhexyl, 3-methylhexyl, hexyl, 5-methylhexyl, 1-ethylpentyl '2-ethylpentyl, 3-yl, 1-propyl Butyl, 1-methylheptyl, 2-methylheptyl, 3-methyl, 4-methylheptyl, 5-methylheptyl, 6-methylheptyl, 丨-ethyl 2-ethyl Hexyl, 3-ethylhexyl, 4-ethylhexyl, 2-propylpentylbutyl, 1-butyl-2-methylbutyl, hydrazine-butyl-3-methyl tert. butyl, 1,1-dimethylpropyl, 1,1-dimethylbutyl, anthracene, 2-butyl, 1,3-dimethylbutyl, 2,3-dimethylbutyl, oxime -propyl, 1,1-dimethylpentyl, 1,2-dimethylpentyl, L3-diyl, 1,4-dimethylpentyl, 2,2-dimethylpentyl, 2,3-dimethyl or carbon or hydroxy carbon number 3 group hydrocarbon ϊ 〇-〇-hexyl is η-propyl fluorenyl , 2-, 2-ethyl 4-methylethylpentylheptylhexyl, yl, 1-butyl, dimethyl 2-methylmethylpentylpentyl-20- 201224654, 2,4-di Methylpentyl, 3,3-dimethylpentyl, 3,4-dimethylpentyl,! _ a branched alkyl group such as ethyl-p-methylbutyl or 2-ethyl-3-methylbutyl.

Rd is preferably a hydrogen atom, a halogen atom or a methyl group.

a divalent aliphatic hydrocarbon group having a carbon number of 1 to 1 in Xd, such as methyl, ethyl, propane: 1,3-diyl, propane-1,2-diyl, butane-l,4- Dibasic, butane-1,3-diyl, butane-1,2-diyl, pentane-1,5-diyl, hexane-1,6-diyl, heptane-1,7- An alkanediyl group such as a diyl group or an octane-1,8-diyl group.

a divalent alicyclic hydrocarbon group having 3 to 10 carbon atoms in Xd, such as cyclopropanediyl, cyclobutanediyl, cyclopentanediyl, cyclohexanediyl, cycloheptanediyl, cyclodecane Second base and so on.

The divalent aromatic hydrocarbon group having 6 to 12 carbon atoms in Xd, for example, a phenyl group or a naphthalene group. -CH2- may be Xd substituted by -〇-, -CO-, -NRe-, -S- or -S02-, for example, a group represented by the formula (xd-Ι)~ (xd-ΙΟ) .

OH QCOCH3 (xd-l) (xd-2) (xd-3) (xd-4) (xd-5) (xd,6) (xd-7) ^^n,s〇2' CH3 C2H5 C4H9 (xd -8) (xd_9) (xd-10)

Xd is preferably a C 2 to 6 alkanediyl group. The ethyl group is more preferably an exoethyl group. The compound represented by the formula (d-1) is preferred.

(d-1) [In the formula (d-ι), a perfluoroalkyl group having a carbon number of 4 to 6 is represented.

Rg represents a hydrogen atom, a halogen atom or a methyl group. A compound represented by the formula (d-Ο), for example, a compound (d-1) to a compound (d-94). The general formula numbers indicated in the table and in the Xd column are the general formula numbers of the above-exemplified groups. Further, for example, the compound (d-Ι) is a compound represented by the following formula (d-Ι).

-22- 201224654 [Table 1] Compound Rd xd d-1 H c2h4 xd-c4f9 d-2 F c2h4 d-3 Cl c2h4 d-4 Br c2h4 d_5 I c2h4 d-6 cf3 c2h4 d-7 ch3 C2H4 d-8 CN c2h4 d-9 c6h5 C2H4 d-10 ch2-c6h5 C2H4 d-11 H single bond d-12 F single bond d-13 Cl single bond d-14 Br single bond d-15 I single button d-16 cf3 single button D-17 ch3 single bond d-18 H (xd~l) d-19 Cl (xd-1) d-20 ch3 (xd~l) -23- 201224654 d-21 H (xd-2) d-22 Cl (xd-2) d-23 ch3 (xd-2) d-24 H (xd~3) d-25 Cl (xd-3) d-26 ch3 (xd~3) d-27 H (xd-4) D-28 Cl (xd-4) d-29 ch3 (xd-4) d-30 H (xd-5) d-31 Cl (xd-5) d-32 ch3 (xd_5) ^Y^〇-xd— C4f9 Rd d-33 H (xd-6) d-34 Cl (xd-6) d-35 ch3 (xd-6) d-36 H (xd~7) d-37 Cl (xd-7) d-38 Ch3 (xd-7) d-39 H (xd-8) d-40 Cl (xd_8) d_41 ch3 (xd-8) d-42 H (xd_9) d-43 Cl (xd~9) d-44 ch3 ( Xd-9) d-45 H (xd-10) d_46 Cl (xd-10) d-47 ch3 (xd-10) -24- 201224654 [Table 2] Compound Rd Xd f. ～13 d-48 H C2H4 d-49 F c2h4 d~50 Cl c2h4 d-51 Br c2h4 d-52 I c2h4 d-53 cf3 c2h4 d-54 ch3 c2h4 d-55 CN c2h4 d-56 C6H5 c2h4 d- 57 ch2-c6h5 c2h4 d-58 H single button d-59 F single button d-60 Cl single button d-61 Br single button d-62 I single button d-63 cf3 single button d-64 ch3 single button d-65 H (xd~l) d-66 Cl (xd-l) d-67 ch3 (xd-1) d-68 H (xd-2) d-69 Cl (xd-2) d-70 ch3 (xd-2 ) d-71 H (xd-3) d-72 Cl (xd-3) d-73 ch3 (xd-3) d-74 H (xd-4) d-75 Cl (xd-4) -25- 201224654 D-76 ch3 (xd-4) d-77 H (xd~5) d-78 Cl (xd-5) d-79 ch3 (xd~5) d-80 H (xd-6) d-81 Cl ( Xd-6) d-82 ch3 (xd-6) d-83 H (xd-7) d-84 Cl (xd*~7) d-85 ch3 (xd-7) d-86 H (xd~8) D-87 Cl (xd-8) d-88 ch3 (xd-8) d-89 H (xd-9) d-90 Cl (xd~9) d-91 ch3 (xd-9) d-92 H ( Xd-10) d-93 Cl (xd-10) d-94 ch3 (xd-10) Resin (B), which contains a structural unit derived from (d) and a structural unit derived from (a) Preferably, it comprises a structural unit produced by (d) and a structural unit produced by (a) and produced by (b) The structural unit of the resin is better. When the resin (B) contains the structural unit produced in (a), since the developability is further improved, the resin (B) tends to suppress unevenness due to residue or development. Since the resin (B) contains (b) the structural unit produced, it tends to improve solvent resistance. Further, the resin -26-201224654 (B) may contain the structural unit produced by (c). (a), (b) and (c) are the same as above. When the resin (B) is a copolymer of (a) and (d), the ratio of the structural unit produced by each monomer to the total number of moles of the structural unit constituting the resin (B) is in the following range good. (a) The structural unit produced; 5 to 40% by mass (more preferably 10 to 30% by mass) (d) The structural unit produced; 60 to 95% by mass (more preferably 7 to 90% by mass) Resin (B) in the case of the copolymers of (a), (b) and (d), the ratio of the structural unit produced by each monomer to the total number of moles of the structural unit constituting the resin (B) is as follows The range is good. (a) The structural unit produced; 5 to 40% by mass (more preferably 1 to 30% by mass) (b) The structural unit produced; 5 to 80% by mass (more preferably -70% by mass) (d The structural unit produced; 10 to 80% by mass (more preferably 2 to 70% by mass). The resin (B) is a copolymer of (a), (b), (c) and (d), each The ratio of the structural unit produced by the monomer to the total number of moles of the structural unit constituting the resin (B) is preferably in the range described below. (a) The structural unit produced; 5~4 〇 mass% (more preferably i 〇~30 mass%) (b) the structural unit produced; 5~70 mass% (more preferably 1〇-27- 201224654 ～60质量质量) (c) The structural unit produced; 10 to 50% by mass (more preferably 20 to 40% by mass) (d) The structural unit produced: 10 to 80% by mass (more preferably 20 〜 70% by mass) When the ratio of each structural unit is in the above range, the water repellency and developability tend to be more excellent. The polystyrene-equivalent weight average molecular weight of the resin (B) is preferably 3,000 to 20,000, more preferably 5,000 to 15,000. When the weight average molecular weight of the resin (A) is in the above range, the coating property tends to be more excellent, and film formation in the exposed portion is less likely to occur during development, and it is easy to remove.

I Development of the non-exposure section. The acid value of the resin (B) is from 20 to 200 mgKOH/g, preferably from 40 to 150 mg/g. The content of the resin (B) is preferably 0.001 to 10 parts by mass, more preferably 0.01 to 5 parts by mass, based on 1 part by mass of the total of the resin (A) 'resin (A1) and the polymerizable compound (C). Share. When the content of the resin (B) is in the above range, the developability can be further improved at the time of formation of the pattern, and the water repellency of the obtained pattern can be further improved. The photosensitive resin composition of the present invention may contain a resin (A1). Resin (A1), for example, resin (Al-1): (a) and (c) copolymer obtained by polymerization, resin (Al-2): (a) and (c) copolymer obtained by polymerization, and (b) Resin obtained by the reaction, -28 - 201224654 resin (Al-3): (b) a copolymer obtained by (c) polymerization, and a resin obtained by reacting with (a). In the resin (A 1 -1 ), the ratio of the structural unit produced by each monomer is preferably in the range described below with respect to the total number of moles of the total structural unit constituting the resin (A1-1). (a) The structural unit produced; 2 to 40 mol% (more preferably 5 to 35 mol%) (c) the structural unit produced; 60 to 98 mol% (more preferably 65 to 95 mol) %) When the ratio of the structural unit of the resin (A1-1) is within the above range, the storage stability of the photosensitive resin composition is improved, the developability when the photosensitive resin composition is patterned, and the resulting coating The solvent resistance of the film and the pattern tends to be. The resin (A1-1) can be produced in the same manner as the resin (A-1). The resin (A1-2) is a copolymer obtained by reacting the copolymer of (a) and (c) with (b). The resin (A 2 ) is, for example, produced by a two-stage process. In this case, please refer to the above-mentioned document "Experimental Method for Polymer Synthesis" (Dazu Takashi, Institute of Chemicals, 1st Edition, 1st Edition, 1st issue, March 1, 1972), special opening 2001-89533 It is produced by the method described in the bulletin. First, in the first stage, a copolymer of (a) and (c) is obtained in the same manner as in the production method of the above resin (A-1). -29- 201224654 In this case, as in the above, the obtained copolymer may be used without a solution after the reaction, or may be obtained by using a concentrated or diluted solution, or by reprecipitation or the like. The solution after the solid (powder) can also be used. Further, in the same manner as described above, it is preferred to use a weight average molecular weight and a molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (?η)] in terms of polystyrene. The ratio of the structural unit produced by (a) and (c) to the total number of moles constituting the entire structural unit of the copolymer is preferably in the range described below. (a) The structural unit produced; 5 to 50 mol% (more preferably 1 〇 to 45 mol%) (c) The structural unit produced; 50 to 95 mol% (more preferably 55 to 90 mol) Ear %) Next, in the second stage, the carboxylic acid and a part of the carboxylic acid anhydride (a) produced by the obtained copolymer are reacted with the cyclic ether of the above (b). (b), (b) or (b2) is preferred, and (b 1-1) is more preferred. Specifically, for example, after the above steps, the atmosphere in the flask is replaced by nitrogen with air, and in the flask, 5 to 80 mol% (15) is added relative to the molar amount of (a), relative to (a) And (b) and (c) are a total of 0.001 to 5% by mass of a reaction catalyst of a carboxyl group and a cyclic ether (for example, tris(dimethylaminomethyl)phenol), and relative to (a) The total amount of (b) and (c) is 0.001 to 5% by mass of the polymerization inhibitor -30-201224654 (for example, hydroquinone, etc.), and further reacted at 60 to 130 ° C for 1 to 10 hours. The resin (A1 -2 ) can be obtained under the conditions '. Further, in the same manner as in the polymerization conditions, the addition method or the reaction temperature can be appropriately adjusted in consideration of the amount of heat generated by the production equipment or the polymerization. Further, in this case, the number of moles of (b) is preferably from 10 to 75 mol%, more preferably from 15 to 7 mol%, relative to the number of moles of (a). When it is in this range, the storage stability of the photosensitive resin composition and the developability of the photosensitive resin composition pattern can be improved, and the solvent resistance, heat resistance, and mechanical strength of the obtained coating film and pattern can be improved. And the tendency of the balance of the sensitivity, the resin (A1-3), the first stage is the same as the method for producing the above resin (A-1), and the copolymer of (b) and (c) is obtained. In other cases, the obtained copolymer may be a solution obtained by a reaction without processing, or a solution obtained by concentration or dilution, or a solution obtained by removing a solid (powder) by a method such as reprecipitation. The ratio of the structural units produced by (b) and (c) to the total number of moles of the total structural unit constituting the aforementioned copolymer is the structural unit produced by the following range (b); 5 to 95 Ear % (more preferably 1 〇 ~ 90 mol %) (c) The resulting structural unit; 5 to 95 mol % (more preferably 1 〇 ~ 90 mol %) In addition, with resin (A1-2) The manufacturing method is the same as that of -31 - 201224654. The cyclic ether produced by (b) in the copolymer of (b) and (c) is reacted with the carboxylic acid or carboxylic anhydride having (a). By. The hydroxyl group which is formed by the reaction of the cyclic ether with a carboxylic acid or a carboxylic acid anhydride may be further reacted with a carboxylic acid anhydride. The amount of (a) which can be reacted with the aforementioned copolymer is preferably from 5 to 80 mol based on the (b) mole number. When the reactivity of the cyclic ether is higher, the unreacted (b) remains less likely to be present, so (b) is preferably (b) and (b1 -1) is preferred. The polystyrene-equivalent weight average molecular weight of the resin (A1) is preferably from 3,000 to 100,000, more preferably from 5,000 to 50,000. When the weight average molecular weight of the resin (A) is in the above range, the coating property tends to be improved, and film formation at the exposed portion is less likely to occur during development, and the non-exposed portion is easily removed by development. The molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (?n)) of the resin (A1) is preferably from 1.1 to 6.0, more preferably from 1.2 to 4.0. When the molecular weight distribution is in the above range, it has a tendency to improve developability. The acid value of the tree 膪 (Α1) is 20 to 150 mgKOH/g, preferably 40 to 135 mgKOH/g, more preferably 50 to 135 mgKOH/g. The content of the resin (A1) is preferably from 0 to 80% by mass, more preferably from 5% to 50% by mass, based on the total amount of the resin (A) and the resin (A1). When the content of the resin (A1) is within the above range, a high sensitivity pattern can be formed and excellent developability can be obtained.

The photosensitive resin composition of the present invention is a compound containing a polymerizable compound (C-32-201224654 polymerizable compound (C), which is polymerized by an active radical generated by a polymerization initiator (D), for example, having ethylene. The compound which is unsaturatedly bonded, etc., is preferably a (meth) acrylate compound. The polymerizable compound (C) having one ethylenically unsaturated bond, for example, is exemplified as (a), (b) And the compound of (c) is the same compound, wherein (meth) acrylate is preferred. The polymerizable compound (C) having two ethylenically unsaturated bonds, such as 1,3-butanediol Di(methyl)acrylate, 1,3-butanediol (meth)acrylate, 1,6-hexanediol di(meth)acrylate, ethylene glycol di(meth)acrylate , diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, Polyethylene glycol diacrylate, bisphenol A bis(acryloxyethyl ether), B Bis-bisphenol A di(meth)acrylate, propoxylated neopentyl glycol di(meth)acrylate, ethoxylated neopentyl glycol di(meth)acrylate, 3- Methylpentanediol di(meth)acrylate, etc. A polymerizable compound (c) having three or more ethylenically unsaturated bonds, such as trimethylolpropane tri(meth)acrylate or pentaerythritol III ( Methyl) acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trihydroxyl Methylpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol tetra (meth) acrylate, Tripentaerythritol penta (meth) acrylate, tripentaerythritol-33- 201224654 hexa(meth) acrylate, tripentaerythritol heptaerythritol pentaerythritol octa(methyl) propyl citrate, pentaerythritol tris (methyl) Reaction of acid vinegar with anhydride, two a reaction of pentaerythritol penta(methyl) propane with an acid anhydride, tripentaerythritol hepta (meth) acrylate and caprolactone modified dimethylol propyl tris(meth) acrylate, endogenous pentaerythritol di (a) Acrylate, caprolactone modified tris(2,yl)isocyanurate di(meth)acrylate, caprolactone modified quaternary alcohol tetra(meth)acrylate, caprolactone modified Pentaerythritol penta() acrylate, caprolactone modified dipentaerythritol hexa(meth) propylene, caprolactone modified tripentaerythritol tetra(meth) acrylate, caprolactam tripentaerythritol penta (meth) acrylate, Lactone modified tri-quaternary alcohol hexa(meth) acrylate, caprolactone modified trimellititol seven () acrylate, caprolactone modified tripellitate octa (meth) propylene, caprolactone modified pentaerythritol three (A A acrylate and an anhydride, a caprolactone-modified dipentaerythritol penta (meth) acrylate with an acid reactant, a caprolactone-modified trimiperol pentoxide (meth) acrylate anhydride, and the like. Further, the photopolymerizable compound (C) having three or more functional groups is more preferably dipentaerythritol hexa(meth)acrylate. The content of the polymerizable compound (C) is preferably 5% by mass, more preferably 2% to 80% by mass based on the total amount of the resin (A) lipid (A1) and the polymerizable compound (c). When the amount of the polymerizable compound (C) is within the above range, the sensitivity, the strength of the resulting pattern, the reliability, and the like tend to be further improved. ί ester, ;) propionate anhydride ester changed to hydroxyethyl pentoxide tetramethyl ester ester pentylene tetramethyl ester reaction anhydride and acid, δ~95, flat-34- 201224654 A resin composition containing a polymerization initiator (D). The polymerization initiator (D) is not particularly limited as long as it is a compound which starts polymerization by the action of light or heat, and a known polymerization initiator can be used. The polymerization initiator (D) is, for example, an alkylphenone compound, a diimidazole compound, a triazine compound, a phosphonium oxide compound, an anthracene compound or the like. Further, a photo-and/or thermal cationic polymerization initiator (for example, a component composed of a key cation and an anion produced by Lewis acid) described in JP-A-2008-181087 can be used. Among them, at least one selected from the group consisting of a biimidazole compound, a phenylalkyl ketone compound and an oxime ester compound is preferable, and particularly an oxime ester compound is preferred. When a polymerization initiator containing these compounds is used, it is particularly preferable to have a tendency to achieve high sensitivity. The aforementioned benzophenone compound [e.g., diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 2-hydroxyl [4- (2-carbylethoxy)phenyl]-2-methylpropan-1-one, 2-hydroxyl-bu {4-[4-(2-yl-2-methyl-propenyl) ]-Phenyl} ·2_methyl-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2- morpholinyl-fluorene-(4-methylpyridylphenyl)-2-methylpropane -丨-ketone, 2_dimethylamino 2-branched-1-(4-morpholinylphenyl)butane-indole-ketone, 2-dimethylamino 2-(2-methyl) Benzyl)-1-(4-morpholinylphenyl)butane-butanone, 2-dimethylamino-2-(3.methylbenzyl)-1-(4-morpholinylphenyl) Butane-ketone, 2-dimethylamino-2-(4-methylbenzyl)-!-('morpholinophenyl)butane-1-one, 2-dimethylamino-2_ (2-ethylbenzyl)morpholinylphenyl-35- 201224654 ) Butan-1-one, 2-dimethylamino-2-(2-propylbenzyl)-1-(4-? Polinylphenyl)butan-1-one, 2-dimethylamino-2-(2-butylbenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2 -Dimethylamino-2-(2,3-dimethylbenzyl)-1-( 4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2-(2,4-dimethylbenzyl)-1-(4-morpholinylphenyl)butane 1-ketone, 2-dimethylamino-2-(2-chlorobenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2-dimethylamino- 2-(2-Bromobenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2-(3-chlorobenzyl)-1- (4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2-(4-chlorobenzyl)-1-(4-morpholinylphenyl)butane-1 -ketone, 2-dimethylamino-2-(3-bromobenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2- (4-bromobenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2-(2-methoxybenzyl)-1-( 4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2-(3-methoxybenzyl)-1-(4-morpholinylphenyl)butane-1 -ketone, 2-dimethylamino-2-(4-methoxybenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2 -(2-methyl-4-methoxybenzyl)-1-(4-morpholinylphenyl)butan-1-one, 2-dimethylamino-2-(2-methyl- 4-bromobenzyl)-1-(4-morpholinyl) Butane-1-one, 2-dimethylamino-2-(2-bromo-4-methoxybenzyl)-1_(4-morpholinylphenyl)butan-1-one An oligomer such as 2-hydroxy-2-methyl-l-[4-(1-methylvinyl)phenyl]propan-1-one. The above biimidazole compound, for example, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis(2,3-dichloro Phenylphenyl)-4,4',5,5'-tetraphenylbisimidazole (for example, JP-A-6-7-53 72, -36-201224654, JP-A-6-75373, etc.), 2, 2 , _bis(2_chlorophenyl). 4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis(2-chlorophenyl)·4,4',5, 5'-tetrakis(alkoxyphenyl)bisimidazole, 2,2,_bis(2-chlorophenyl)-4,4',5,5'-tetrakis(dialkoxyphenyl)bisimidazole , 2,2,·bis(2-chlorophenyl)-4,4,5,5,-tetrakis(trialkoxyphenyl)bisimidazole (for example, Japanese Patent Publication No. Sho 48-38408, JP-A-. An imidazole-based compound in which a phenyl group at the 4,4'5,5'-position is substituted with a carbamoyloxy group (for example, Japanese Patent Laid-Open Publication No. Hei 7-10913, etc.). Preferred is 2,2,-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidine, 2,2,-bis(2,3-dichlorobenzene) -4,4',5,5'-tetraphenyl bispyrene, 2,2,-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl Bis-imidazole and the like. The aforementioned triazine compound, for example, 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloro) Methyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-yellowyl-I,3,5·3 Oxazine, 2,4-bis(trichloromethyl)_6_(4.methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6- [2-(5-Methyl-2-pyran-2-yl)ethyl]-1,3,5-trisyl, 2,4-bis(dichloromethyl)-6-[2-(furan- 2-yl)vinyl]H5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)ethyl) -1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethyl]-1,3,5-di Xiao et al. The above phosphonium phosphide compound is, for example, 2,4,6-trimethylbenzylidenediphenylphosphine oxide or the like. The aforementioned oxime ester compound, for example, N-benzimidyloxy-1-(4-benzene-37-201224654 sulfamoylphenyl)butan-1-one-2-imine, N-ethoxyl Carbophenylpropan-1-one-2-imine, Ν·benzylideneoxy_丨_(4-ylphenyl)octane-1-one-2-imine, Ν-acetamidine-1- [9-ethylbenzyl benzhydryl)-9Η-carbitol-3-yl]ethane-oxime-imine, [9-ethyl-6- { 2 -methyl_4- (3,3 -Dimethyl-2,4-dioxoindolylmethyloxy)benzhydryl}-9Η-carbitol-3-yl]amine and the like. You can also use Ikaqiu (registered trademark) 〇χΕ_01, above-mentioned 'Ciba.", N-1919 (available from ADEKA, etc.) and 'polymerization initiator (D). For example, benzoin (, benzoin A) can be used. Benzoin compounds such as ketone, benzoin ethyl ether, benzoin isopropyl isobutyl ether; benzophenone, hydrazine-benzoic acid methyl, 4-phenylbenzophenone, 4-benzylidene-based a benzophenone compound such as 4'-methyl sulfide, 3,3', 4,4'-tetra (tert-butyl peroxycarbonyl) di 2,4,6-trimethylbenzophenone; , an oxime compound such as 2-ethyl hydrazine or camphor hydrazine; ίο-butyridone, benzyl, methyl phenylglyoxylate, and a titanocene compound in combination with a polymerization initiator (D) described later 1) It is preferable to use it in combination. Further, a polymerization initiator having a base for the start of chain transfer, and a photopolymerization initiator described in JP-A-2002-5442 05 Starting agent, compounds of the formulae (a) to (f), etc.. oxyl-1 -phenylsulfonyl-6-(2-methyl N-ethyl-7-heterocyclic pentylene-1 -Asian OXE-02 (Company) benzo In): ether, rest: formazanyldiphenyl benzophenone, 10-phenanthrenequinone, phenyl-2-chlorol I, etc. These may be used, for example, as described below, -38- 201224654

(a) Φ)

(c) (Φ

(e) (Ο The polymerization initiator having a chain shifting group may be used as the component (c) constituting the resin (A). The photosensitive resin composition of the present invention may also be combined with the above polymerization initiation. The polymerization initiator (D1) is simultaneously used as the agent (D). The polymerization initiation aid (D 1 ) can be used in combination with the polymerization initiator (D) to promote the polymerization starting from -39 to 201224654. A sensitizer used for the polymerization of the polymerizable polymerizable compound, a polymerization initiation aid (D1), for example, a compound represented by the following formula (~(V), a thioxanthone, an amine compound, and Carboxylic acid compound, etc. : w£n/c=ch-c-r5 (ΠΙ) R4 [The dotted line indicated by 'w1 in the formula (III) represents an aromatic ring having a carbon number of 6 to 12 which can be substituted by halogen. Represents -Ο- or -S-. R4 represents a monovalent saturated hydrocarbon group having 1 to 6 carbon atoms. R5 represents a carbon number of 1 to 12 and a hydrocarbon group which may be substituted by a halogen atom or a carbon number which may be substituted by a halogen atom An aryl group of 6 to 12] a halogen atom, for example, a fluorine atom, a chlorine atom, a bromine atom or the like. An aromatic ring having 6 to 12 carbon atoms, for example, a benzene ring or a naphthalene ring. An aromatic ring having a carbon number of 6 to 12 substituted by a halogen atom, a benzene ring, a methylbenzene ring, a dimethylbenzene ring, an ethylbenzene ring, a propyl benzene benzene ring, a pentyl benzene ring, a hexyl benzene ring Cyclohexylbenzene ring, chloro-based thin dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, phenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring a monovalent saturated hydrocarbon group having 1 to 6 carbon atoms of a bromo-naphthalene ring, for example, methyl, ethyl propyl, isopropyl, η-butyl, 1-methylpropyl, 2-methylpropyl, butyl Base, η-pentyl, 1-methylbutyl, 2-methylbutyl, 3-methylbutylate III) The valence of the compound is suffrage, butyl ring, phenyl group, etc., η -tert- Base, -40- 201224654 1,1-dimethylpropyl, 1,2-dimethylpropyl, 2,2-dimethylpropyl, η-hexyl, cyclohexyl, etc. Can be replaced by a halogen atom a monovalent saturated hydrocarbon group having 1 to 12 carbon atoms, for example, 'the above-mentioned monovalent saturated hydrocarbon group having 1 to 6 carbon atoms, for example, heptyl, octyl, decyl, fluorenyl, fenyl, fluorenyl, 1 -Chlorobutyl, 2-chlorobutyl, 3-chlorobutyl, etc. And an aryl group having 6 to 12 carbon atoms, such as phenyl, chlorophenyl, dichlorophenyl, bromophenyl, dibromophenyl, chlorobromophenyl, biphenyl, chloro Biphenyl, dichlorobiphenyl, bromophenyl, dibromophenyl, naphthyl 'chloronaphthyl, dichloronaphthyl, bromonaphthyl, dibromonaphthyl, etc. a compound represented by III), specifically, for example, 2-[2-keto-2-(2-phenyl)ethylidene]-3-methylnaphthalene [2,1-d]-salva, 2-[2-mercapto-2-(2-phenyl)ethylidene-3-methyl-[l,2-d]thiazoline, 2-[2-keto-2-(2-benzene) Ethylene]-3-methylnaphthalene [2,3-d]thiazoline, 2-[2-keto-2-(2-naphthyl)ethylidene-3-methylbenzothiazide嗤琳, 2-[2-mercapto-2-(1-Cetyl)ethylidene-3-3-methylbenzoquinazoline, 2-[2-keto-2-(2-naphthyl) Ethyl]-3-methyl-5-phenylbenzoquinazoline, 2-[2-keto-2-(1-naphthyl)ethylidene-3-methyl-5-phenylphenylhydrazine Thiazoline, 2-[2-keto-2-(2-naphthyl)ethylidene-3-methyl-5-fluorobenzoquinone thiazoline, 2-[2-keto-2-(1- Naphthyl) Ethyl]-3-methyl-5-fluorobenzoquinone thiazoline, 2-[2-keto-2-(2-naphthyl)ethylidene]-3-methyl-5-chlorobenzothiazole Porphyrin, 2-[2-keto-2-(p-naphthyl)ethylidene]-3-methyl-5-chlorobenzoquinone-oxime-41 - 201224654 porphyrin, 2-[2-keto-2-( 2-naphthyl)ethylidene]-3-methyl-5-bromobenzoquinone thiazoline, 2-[2-keto-2-(1-naphthyl)ethylidene]-3-methyl- 5-bromobenzoquinone thiazoline, 2-[2-keto-2-(4-phenylphenyl)ethylidene]-3-methylbenzoquinazoline, 2-[2-keto-2 -(4-Phenylphenyl)ethylidene]-3-methyl-5-phenylbenzoquinazoline, 2-[2-keto-2-(2-naphthyl)ethylene]-3 -methylnaphthalene [2, Ι-d] thiazoline, 2-[2-keto-2-(2-naphthyl)ethylidene]-3-methylnaphthalene [l,2-d]thiazoline, 2-[2-keto-2-(4-phenylphenyl)ethylidene]-3-methylnaphthalene [2, Ι-d]thiazoline, 2-[2-keto-2-(4) -phenylphenyl)ethylidene-3-methylnaphthalene [l,2-d]thiazoline, 2-[2-keto-2-(4-fluorophenyl)ethylidene-3- Methylnaphthalene [2,1-d]thiazoline, 2-[2-keto-2-(4-fluorophenyl)ethylidene-3-methylnaphthalene [l, 2-d]thiazoline, 2-[2-keto-2-(2-phenyl)ethylidene]-3-methylnaphthalene [2, Ι-d]oxazoline, 2-[2-ketone 2-(2-phenyl)ethylidene-3-methylnaphthalene [l,2-d]oxazoline, 2-[2-keto-2-(2-phenyl)ethylene -3-methylnaphthalene [2,3-d]oxazoline, 2-[2-keto-2-(2-naphthyl)ethylidene]-3-methylbenzoxazole, 2 -[2-keto-2-(1-naphthyl)ethylidene]-3-methylbenzoxazoline, 2-[2-keto-2-(2-naphthyl)ethylene] -3-methyl-5-phenylbenzoxazoline, 2-[2-keto-2-(1-naphthyl)ethylidene]-3-methyl-5-phenylbenzoxazole Porphyrin, 2-[2-keto-2-(2-naphthyl)ethylidene]-3-methyl-5-fluorobenzoxazoline, 2-[2-keto-2-(1- Naphthyl)ethylidene-3-3-methyl-5-fluorobenzoxazoline, 2-[2-keto-2-(2-naphthyl)ethylidene-3-methyl-5- Chlorobenzoquinone oxazoline, 2-[2-keto-2-(1-naphthyl)ethylidene]-3-methyl-5-chlorobenzoxazoline, 2-[2-ketone Benzyl-2-(2-naphthyl-42- 201224654) ethylene]·3_methyl_5-bromobenzoquinone oxazoline, 2-[2-keto-2((1-naphthyl)) Ethylene · 3-methyl_5-bromobenzoquinoxaline, 2-[2-keto-2-(4-phenylphenyl)ethylidene]-3-methylbenzoquinone, 2- [2- 2-keto-2_(heart phenylphenyl)ethylidene]-3-methyl-5(phenylphenyl)oxazoline, 2-[2-keto-2-(1-naphthyl) Ethylene]_3·methylnaphthalene [2, bd]oxazoline, 2-[2-keto-2-(1-naphthyl)ethylidene]_3_methyl ban [l,2-d Oxymatrine, 2-[2-keto-2-(4-phenylphenyl)ethylidene]-3-methylnaphthalene [2,1-d]Doxazoline, 2-[2-ketone Benzyl-2-(4-phenylphenyl)ethylidene_3_methylnaphthalene [丨, 2-0]oxazoline, 2_[2-keto-2-(4-fluorophenyl)-ethylidene 3-methylnaphthalene [2,1-d]oxaporphyrin, 2-[2-keto-2-(4-fluorophenyl)ethylidene]-3-methylnaphthalene [1,2 - (1) chewing porphyrin and the like.

[In the formulae (IV) and (V), the ring W2, W3 and the ring W4 represent mutually independent aromatic rings having 6 to 12 carbon atoms or heterocyclic rings having 2 to 10 carbon atoms, which are contained in the aromatic ring and the heterocyclic ring. The hydrogen atom may be replaced by a halogen atom. Y2 to Y5 represent mutually independent -0- or -S-»R6 to R9 represent a monovalent saturated hydrocarbon group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, the saturated hydrocarbon group and hydrogen contained in the aryl group The atom may be substituted by a halogen atom, a hydroxyl group or an alkoxy group having a carbon number of 1 to 6 - 43 - 201224654. An aromatic ring having a carbon number of 6 to 12, for example, an aromatic ring having the same contents as those enumerated in the formula (III) The hydrogen atom contained in the aromatic ring may be optionally substituted by the halogen atom exemplified above. A heterocyclic ring having 2 to 10 carbon atoms which may be substituted by a halogen atom, for example, a pyridine ring, a pyrimidine ring, a pyridazine ring, a pyrazine ring, a pyran ring or the like. A monovalent hydroxy-substituted saturated hydrocarbon group such as a hydroxymethyl group, a hydroxyethyl group, a hydroxypropyl group, a hydroxybutyl group or the like. A hydroxy-substituted aryl group such as a hydroxyphenyl group, a hydroxynaphthyl group or the like. a monovalent alkoxy-substituted saturated hydrocarbon group such as methoxymethyl, methoxyethyl, methoxypropyl, methoxybutyl, butoxymethyl, ethoxyethyl, ethoxy Propyl, propoxybutyl and the like. An alkoxy-substituted aryl group such as a methoxyphenyl group, an ethoxynaphthyl group or the like; a compound represented by the formula (IV) and the formula (V), specifically, for example, dimethoxynaphthalene or diethyl a dialkoxy naphthalene such as oxynaphthalene, dipropoxy naphthalene, diisopropoxy naphthalene or dibutoxynaphthalene; 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethyl Oxime, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, dipropoxyanthracene, diisopropoxyanthracene, dibutoxyanthracene, dipentane Alkyl hydrazine, dihexyloxy hydrazine, methoxyethoxy hydrazine, methoxypropoxy hydrazine, methoxyisopropoxy hydrazine, methoxy methoxy oxime, ethoxy methoxy fluorene , alkoxyisopropoxy oxime, ethoxybutoxy oxime, propoxy oxy oxime oxime, propoxy oxy oxime, isopropyl-44- 201224654 oxybutoxy hydrazine Bases: Dimethoxy oxytetraphenyl, diethoxy fused tetraphenyl, dipropoxy fused tetraphenyl, diisopropoxy fused tetraphenyl, dibutoxy fused tetraphenyl, etc. Benzene, etc. Thioxanthone compounds, for example, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro Base-4-propoxythioxanthone and the like. An amine compound such as an aliphatic amine compound such as triethanolamine, methyldiethanolamine or triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, 4- Isoamyl dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, hydrazine, hydrazine-dimethyl-p-toluidine, Aromatic amine compounds such as 4,4'-bis(dimethylamino)benzophenone (general name; Mi chi er"s ketone), 4,4'-bis(diethylamino)benzophenone A carboxylic acid compound such as phenylsulfonyl acetic acid, methylphenylsulfonyl acetic acid, ethyl phenylsulfonyl acetic acid, methyl ethyl phenylsulfonyl acetic acid, dimethylphenylsulfonate Acetic acid, methoxyphenylsulfonyl acetic acid, dimethoxyphenylsulfonyl acetic acid, chlorophenylsulfonyl acetic acid, dichlorophenylsulfonyl acetic acid, N-phenylglycine, benzene An aromatic heteroacetic acid such as oxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, or naphthyloxyacetic acid, etc. Combination of a polymerization initiator (D) and a polymerization initiator (D 1 ), such as benzene Ethyl ketone compound and thiophene A ketone compound, an acetophenone compound, an aromatic amine compound, etc. 'Specifically, for example, 2- morpholinyl-1 -(4-methylsulfonyl-45-201224654-phenyl)-2-methylpropane-1 -ketone with 2,4-diethylthioxanthone, 2-dimethylamino-2-benzyl-1-(4-morpholinylphenyl)butan-1-one and 2,4-di Ethylthioxanthone, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinylphenyl)butan-1-one and 2,4-diethyl Thioxanthone, 2-morpholinyl-1-(4-methylsulfonylphenyl)-2-methylpropan-1-one and 2-isopropylthioxanthone and 4-isopropylthioxanthene Ketone, 2-morpholinyl-1-(4-methylsulfonylphenyl)-2-methylpropan-1-one and 4,4'-bis(diethylamino)benzophenone, 2-Dimethylamino-2-benzyl-1-(4-morpholinylphenyl)butan-1-one with 4,4'-bis(diethylamino)benzophenone, 2 -Dimethylamino-2-(4-methylbenzyl)-1-(4-morpholinylphenyl)butan-1-one and 4,4'-bis(diethylamino)di Benzophenone, etc. Among them, a combination of an acetophenone compound and a thioxanthone compound is preferred, and 2-morpholinyl-1-(4-methylsulfonylphenyl)-2-methylpropane-1 is used. -ketones and 2,4-Diethylthioxanthone, 2-morpholinyl-1-(4-methylsulfonylphenyl)-2-methylpropan-1-one and 2-isopropylthioxanthone 4-isopropyl thioxanthone is more preferred. These combinations provide a pattern of high sensitivity and high visible light transmittance. The content of the polymerization initiator (D) relative to the resin (A) and the resin (A 1 ) The total amount of the polymerizable compound (C) is 100 parts by mass, preferably 0.5 to 30 parts by mass, more preferably 1 to 20 parts by mass, most preferably 1 to 10 parts by mass. When the content of the polymerization initiator (D) is in the above range, a pattern with high sensitivity can be obtained. The amount of the polymerization initiator (D1) to be used is preferably 0.1 to 10 parts by mass, more preferably 0.3% by mass based on 100 parts by mass of the total of the resin (A), the resin (A1) and the polymerizable compound (C). ~ 7 parts by mass. When the amount of the starting auxiliary (D1) is in the above range, a high sensitivity pattern can be obtained, and the resulting pattern has a good shape. The photosensitive resin composition of the present invention contains a solvent (E). In the present invention, the solvent to be used may, for example, be an ester solvent (a solvent containing -COO- in the molecule, a solvent containing no -0-) or an ether solvent other than an ester solvent (mole-containing in the molecule - without -coo- Solvent), ether ester solvent (solvent containing -coo- and -〇-), ketone solvent other than ester solvent (-CO-, solvent containing no -coo-), alcohol solvent, aromatic It is selected among hydrocarbon solvents, guanamine solvents, dimethyl sulfoxide and the like. Ester solvent, such as methyl lactate, ethyl lactate, butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, η-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, C Butyl acrylate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl valerate, ethyl valerate, propyl valerate, methyl acetate, ethyl acetate, cyclohexanol Acetate, r-butyrolactone, and the like. Ether solvents such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol single Ethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3 - Methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether 'diethylene glycol diethyl ether, diethylene glycol methyl Ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenyl ethyl ether, methyl anisole, and the like. Ether ester solvent, for example, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, 3-47-201224654 methoxypropyl Methyl ester, ethyl 3-methoxypropionate, 3-ethoxypropionic acid, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, 2-methoxyethyl ester, Propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethylpropionate, methyl 2-methoxy-2-methylpropanoate, 2-ethoxy-2 -ethyl propionate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyrate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate propylene glycol monopropyl Ether acetate, ethylene glycol monomethyl ether acetate, ethylene monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol ether acetate, and the like. Ketone solvents such as 4-hydroxy-4-methyl-2-pentanone, acetone, 2-, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentane Ketohexanone, isophorone, and the like. Alcohol solvent such as methanol, ethanol, propanol, butanol, hexanol, alcohol, ethylene glycol, propylene glycol, glycerol, etc. Aromatic hydrocarbon solvent, for example, benzene, toluene, xylene, 1,3,5-benzene Wait. The guanamine solvent is, for example, N,N-dimethylformamide, N,N-dimethylamine, N-methylpyrrolidone or the like. These solvents may be used singly or in combination of two or more kinds. Among the above solvents, from the viewpoints of coatability and dryness, an organic solvent having a boiling point at 1 at m of 1 20 ° C or more and 1 80 ° C or less is used. Among them, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate acetoacetate ethyl, diethylene glycol methyl ethyl ether, 3-methoxybutyrate, 3-methoxy-1 - Butanol and the like are preferred. The solvent (E) is preferably used in the lyomethyl propionate oxymethyl ethyl ester, the diol alcohol monobutanone or the cyclohexatrimethyl hydrazine, and the 3-ethyl group is -48-201224654, which can be inhibited. The coating film is uneven, and the flatness of the coating film can be made good. The content of the solvent (E) in the photosensitive resin composition of the present invention is preferably from 60 to 95% by mass, more preferably from 70 to 90% by mass, based on the total amount of the photosensitive resin composition. In other words, the solid content of the photosensitive resin composition is preferably from 5 to 40% by mass, more preferably from 10 to 30% by mass. When the content of the solvent (E) is within the above range, the flatness of the film obtained by coating the photosensitive resin composition tends to be improved. Here, the solid content means the amount obtained by removing the solvent (E) from the photosensitive resin composition. Further, the photosensitive resin composition of the present invention may further contain a polyfunctional thiol compound (T). The polyfunctional thiol compound (T) refers to a compound having two or more sulfonyl groups (-SH) in the molecule. In particular, when a compound having two or more sulfonyl groups bonded by a carbon atom derived from an aliphatic hydrocarbon group is used, the sensitivity of the photosensitive resin composition of the present invention tends to be improved. a polyfunctional thiol compound (T), specifically, for example, hexanedithiol, decanedithiol, 1,4-bis(methylsulfonyl)benzene, butanediol bis(3-sulfonate) Propionate), butanediol bis(3-sulfonyl acetate), ethylene glycol bis(3-sulfonyl acetate), trimethylolpropane tris(3-sulfonyl) Acid ester), butanediol bis(3-sulfonylpropionate), trimethylolpropane tris(3-sulfonylpropionate), trimethylolpropane tris(3-sulfonylpropyl) Acid ester), pentaerythritol tetrakis(3-sulfonylpropionate), pentaerythritol tetrakis(3-sulfonylacetate), trishydroxyethyltris(3-sulfonylpropionate), pentaerythritol tetra(3) - sulfobutyl butyl ester), 1,4-bis(3-sulfonylbutyloxy) butane, and the like. The content of the polyfunctional thiol compound (T) is preferably 0.1 to 10 parts by mass, more preferably 0.05 to 7 parts by mass, per 100 parts by mass of the polymerization initiator (D). When the content of the polyfunctional thiol compound (in the above range) is within the above range, the sensitivity of the photosensitive resin composition can be improved, and the developability tends to be good, which is more preferable. The photosensitive resin composition of the present invention may contain a surfactant (F) (however, it is different from the resin (Β)). The surfactant is, for example, a polyoxymethylene surfactant, a fluorine-based surfactant, a polyoxygenated surfactant having a fluorine atom, or the like. A polyoxygenated surfactant, for example, an interfacial surfactant having a siloxane coupling. Specifically, for example, 徕 徕 矽 DC DC3PA, with SH7PA, with DC11PA, with SH21PA, with SH28PA, with SH29PA, with SH30PA 'polyether modified poly fluorenone oil SH8400 (trade name: Toray. Dow Corning (share) System, ΚΡ321, ΚΡ322, ΚΡ3 23, ΚΡ 3 24, ΚΡ3 26, ΚΡ340, ΚΡ341 (Shin-Etsu Chemical Industry Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF-4446, TSF4452, TSF4460 ( Momentive PerformanceMaterials Japan Co., Ltd.). The fluorine-based surfactant is, for example, a surfactant having a fluorocarbon chain or the like. Specifically, for example, 'FLUORINERT (registered trademark) FC430, with FC431 (Sumitomo 3M (share) system), USG fluorine (registered trademark) F142D, with F171, with F172, with F173, with F177, with F183, with R30 ( DIC (share) system, F-Top (registered trademark) EF301, -50- 201224654 with EF3 03, with EF351, with EF352 (Mitsubishi Metal Electronics Co., Ltd.), SAFURO (registered trademark) S381, with S382, Same as SC101, SC105 (Asahi Glass Co., Ltd.), E58 44 (manufactured by Daikin Precision Chemical Research Institute). A polyfluorene-based surfactant having a fluorine atom, for example, a surfactant having a siloxane chain and a fluorocarbon chain. Specifically, for example, Megève (registered trademark) R08' is the same as BL20, F475, F477, F443 (DIC). It is preferably Megfrid (registered trademark) F475 or the like. The content of the surfactant (F) is 0.001% by mass or more and 0.2% by mass or less, preferably 0.002% by mass or more and 0.1% by mass or less, more preferably 〇.〇, based on the total amount of the photosensitive resin composition. 1% by mass or more and 0.05% by mass or less. When the content of the surfactant is within this range, the flatness of the coating film can be excellent. The photosensitive resin composition of the present invention may contain various additives such as a chelating agent, another polymer compound, an adhesion promoter, an antioxidant, an ultraviolet absorber, a photostabilizer, and a chain transfer agent, if necessary. The photosensitive resin composition of the present invention does not substantially contain a coloring agent such as a pigment or a dye. In the photosensitive resin composition of the present invention, the content of the coloring agent with respect to the entire composition is, for example, preferably less than 1% by mass, more preferably less than 0.5% by mass. In the photosensitive resin composition of the present invention, the average transmittance in the case of measuring the transmittance at a measurement wavelength of 400 to 700 nm using a spectrophotometer in a quartz crystal cell having a length of 1 cm in the optical path is preferably 70% or more. More preferably, it is more than 80%. -51 - 201224654 The photosensitive resin composition of the present invention preferably has an average transmittance of the coating film of 90% or more, more preferably 95% or more, as a coating film. The average transmittance is a coating film having a thickness of 3 cm after heat curing (for example, curing at 1 〇〇 to 250 ° C for 5 minutes to 3 hours), using a spectrophotometer at a measurement wavelength of 400 to 700 nm. The average enthalpy obtained by the measurement was carried out under the conditions. Thus, a coating film having excellent transparency in the visible light region can be provided. The photosensitive resin composition of the present invention can be applied, for example, to a substrate such as glass, metal, or plastic, or to a substrate on which a filter film, various insulating or conductive films, a driving circuit, or the like is formed, and is formed in a specific shape. The pattern is drawn, and the pattern can be formed. Further, the coating film or pattern may be used as a part of forming a component such as a display device. First, the photosensitive resin composition of the present invention is applied onto a substrate. The coating can be carried out by various coating apparatuses such as a spin coater, a slit & rotary coater, a slit coater, an ink jet, a roll coater, and a dip coater as described above. Subsequently, it is preferably dried by drying or pre-baking to remove volatile components such as a solvent. Thus, a smooth and uncured coating film can be obtained. The film thickness of the coating film in this case is not particularly limited, and it can be appropriately adjusted in accordance with the materials, applications, and the like to be used, for example, about 1 to 6 μm. Further, on the obtained uncured coating film, ultraviolet rays generated by light, for example, a mercury lamp or a light-emitting diode, may be irradiated through a light mask forming a target pattern. The shape of the light mask at this time is not particularly limited, and it may be appropriately selected depending on the shape or size of the -52-201224654, the use of the pattern, and the like. In recent years, the exposure machine can use a light source of less than 3 50 nm to cut light in this wavelength region, and to light near 436 nm, near 408 nm, and near 365 nm, using a band pass that can take out the wavelength regions. The filter (BandPass Filter) performs selective extraction to illuminate the entire exposed surface with a uniform and slightly parallel light. Using a mask aligner, a stepper, etc., the mask and the substrate material at this time are brought to the correct position, and the exposed portion of the coating film is contacted with the developer, for example, the non-exposure portion ( That is, the non-pixel part is the way of dissolving and developing, and the shape of the figure is obtained. The developing method may be any one of a liquid-filling method, a dipping method, a spraying method, and the like. Further, the substrate material at the time of development may be inclined at an arbitrary angle. Developing the developing solution used, preferably an aqueous solution of a basic compound. The basic compound may be any of an inorganic or organic basic compound. Specific examples of the inorganic basic compound include sodium hydroxide, calcium hydroxide, disodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium phosphate 'ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium citrate, potassium citrate, Sodium carbonate, potassium carbonate, sodium hydrogencarbonate, potassium hydrogencarbonate, sodium borate, potassium borate, atmosphere, and the like. Organic basic compound 'for example, tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethyl Amine, triethylamine, monoisopropylamine, diisopropyl-53-201224654 amine, ethanolamine, and the like. The concentration in the aqueous solution of the inorganic and organic basic compounds is preferably from 0.01 to 10% by mass, more preferably from 0.03 to 5% by mass. The developer described above may contain a surfactant. The surfactant may be any of a nonionic surfactant, an anionic surfactant or a cationic surfactant. Nonionic surfactants', for example, polyoxyethylene alkyl ethers, polyoxyethylene aryl ethers, polyoxyethylene alkyl aryl ethers, other polyoxyethylene derivatives, oxyethylene/oxypropylene block polymers, Sorbitol fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, polyoxyethylene alkylamine, and the like. An anionic surfactant, for example, a higher alcohol sulfate salt such as sodium lauryl sulfate or sodium oleyl sulfate, an alkyl sulfate such as sodium lauryl sulfate or ammonium lauryl sulfate, or dodecylbenzenesulfonic acid An alkyl aryl sulfonate such as sodium or sodium dodecyl naphthalene sulfonate. The cationic surfactant is, for example, an amine salt such as stearylamine hydrochloride or lauryl trimethylammonium chloride or a quaternary ammonium salt. The concentration of the surfactant in the alkali developer is preferably in the range of 0.01 to 10% by mass, preferably 0.05 to 8% by mass, more preferably 0.1 to 5% by mass. After development, the pattern can be obtained by washing with water. Subsequently, post-baking can also be carried out in conjunction with necessity. After the baking, for example, it is preferably carried out at a temperature ranging from 1 500 to 240 ° C for 1 to 18 minutes. When the unhardened coating film is exposed, it is possible to obtain a coating film having no pattern without using a pattern-forming -54 - 201224654 light mask for performing full light irradiation and/or omitting development. One of the display devices of the present invention will be described using an organic EL (Electro-Luminescence) display device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an enlarged mode of a portion of a display device 1 in an exemplary embodiment of a display device of the present invention. Fig. 2 is a plan view showing a partially enlarged mode of the display device 1 in an example of the display device of the present invention. The display device 1 is mainly composed of a plurality of organic EL elements 4 including a support substrate 2, a partition wall 3 partitioning the block previously set on the support substrate 2, and a block disposed in the block defined by the partition wall 3. The partition wall 3 is equivalent to the partition wall of the present invention. The partition wall 3 is formed by, for example, a lattice shape or a linear shape on the support substrate 2. Further, Fig. 2 shows a display device 1 in which a partition wall 3 having a lattice shape is provided. In the same figure, the area in which the partition wall 3 is provided is implemented in a line manner. On the support substrate 2, a plurality of specific recesses 5 are set using the partition wall 3 and the support substrate 2. This recess 5 corresponds to a block planned via the partition wall 3. In the display device 1, the partition walls 3 are provided in a lattice shape. Therefore, when viewed from one side in the thickness direction Z of the support substrate 2 (hereinafter also referred to as "surface observation"), it is found that the plurality of concave portions 5 are arranged in an array. That is, the concave portion 5 is provided at a predetermined interval in the direction X of the row, and the column direction Y is also arranged at a specific interval. The shape obtained by observing the plane of each concave portion 5 is not particularly limited. For example, the concave portion 5 is formed into a shape such as a nearly rectangular shape, a nearly elliptical shape, and an oval coin shape as viewed in plan. In the state of the embodiment -55-201224654, the concave portion 5 provided with a nearly rectangular shape is known from a plan view. Further, in the present specification, the direction X of the row and the direction γ of the column are perpendicular to the thickness direction z of the support substrate, and the directions perpendicular to each other are present. Further, in the case where the linear partition walls are provided in the other embodiments, the partition walls are arranged such that a plurality of partition wall portions extending in the row direction X are arranged in the row direction Y at regular intervals. In this form, a linear recess is provided via the linear partition wall and the support substrate. The partition wall is formed by gradually narrowing the width so that the support substrate extends toward the partition space. For example, the partition wall extending in the column direction γ has a cross-sectional shape when it is cut perpendicularly to the plane in the extending direction (column direction Y), and the width gradually narrows as the support substrate extends toward the partition space. In Fig. 1, the partition wall of the shape of the foot is displayed on the upper bottom, and when compared with the bottom of the support substrate side, it is known that the lower bottom portion is wider than the upper bottom. Further, the cross section of the partition wall actually formed is not only a trapezoidal shape, but the straight portion and the corner of the trapezoidal shape also have a circular shape. The partition wall 3 preferably has a top surface for water repellency. Further, the top surface means that the surface of the partition wall 3 exists in a plane which is located closest to the support substrate 2 at the position of the closest partition space. When the top surface of the partition wall 3 exhibits water repellency, the coating applied to the region (recess 5) surrounded by the partition wall 3 can be prevented from overflowing to the adjacent region via the top surface of the partition wall 3. The organic EL element 4 is provided with a block (i.e., the recess 5) partitioned by the partition wall 3. In the display device 1, when the grid-shaped partition walls 3 - 56 - 201224654 are provided, each of the organic EL elements 4 is provided with each recess 5 . In other words, in the organic EL element 4, since the concave portions 5 are arranged in the same array, the support substrate 2 is provided with recesses at a certain interval except for the direction X of the rows. groove. The shape and arrangement of the partition wall 3 can be appropriately set in accordance with the style of the display device such as the number of pixels and the resolution, ease of manufacture, and the like. For example, the direction X of the row of the partition wall 3 or the width Y of the column is about 5/im to 50//m, the height of the partition wall 3 is about 0.5//m to 5#m, and the direction of the row X or column. The interval between the partition walls 3 adjacent to each other in the direction Y, that is, the direction X of the rows of the recesses 5 or the width Y of the columns is about 1 〇//m 2 to 2 〇 0//m. Further, the width of the direction X of the first electrode 6 or the direction Y of the column is about 〇Am to 200 "m. The partition wall 3 can be formed by the method of forming the photosensitive resin composition of the present invention in accordance with the above-described pattern. Further, in the case where the linear partition walls are provided in the other embodiments, in the recesses in the row direction X of the organic EL element 4, the grooves are arranged at specific intervals in the row direction X. In the display device 1, three types of organic EL elements 4 are provided. That is, (1) a red organic EL element 4R that emits red light, (2) a green organic EL element 4G that emits green light, and (3) a blue organic EL element 4B that emits blue light. The organic EL element 4 is configured to sequentially laminate the first electrode, the organic EL layer, and the second electrode from the side of the support substrate. In the present specification, one or a plurality of layers provided between the first electrode 6 and the second electrode 10, and -57 to 201224654 are respectively referred to as machine EL layers. The organic EL element 4 is a light-emitting layer having at least one layer as an organic EL layer. Further, the organic EL element may have an organic EL layer different from the light-emitting layer, in addition to the light-emitting layer of one layer. For example, a hole injection layer, a hole transport layer, an electron block layer, an electron transport layer, an electron injection layer, and the like as an organic EL layer are provided between the first electrode 6 and the second electrode 10. Further, two or more light-emitting layers may be provided between the first electrode 6. and the second electrode 10. The organic EL element 4 is a pair of electrodes formed of an anode and a cathode, and includes a first electrode 6 and a second electrode 10. One of the first electrode 6 and the second electrode 10 is set to be an anode, and the other electrode is set to be a cathode. In the display device 1, the first electrode 6 having the function as the anode, the first organic EL layer 7 as the hole injection layer function, and the second organic EL functioning as the light-emitting layer function are sequentially laminated on the support substrate 2. The layer 9 is configured to be the second electrode 10 of the cathode function. The first electrode 6 is provided with the organic EL element 4 in this order. That is, the organic EL element 4 and the same number of first electrodes 6 are provided on the support substrate 2. The first electrode 6 is provided corresponding to the arrangement of the organic EL elements 4, and is arranged in the same array as the organic EL element 4. Further, the partition wall 3 is formed mainly in a lattice-like shape in a region where the first electrode 6 is not contained, and is formed so as to cover the peripheral portion of the first electrode 6 (refer to Fig. 1). The first organic EL layer 7' corresponding to the hole injection layer is placed on the first electrode 6 in the recess 5. In the first organic EL layer 7, if necessary, different materials or film thicknesses may be provided depending on the type of each organic EL element. Moreover, the first organic EL layer 7 of the same material and the same film thickness can be formed from the viewpoint of the ease of the step of forming the first organic EL layer 7 from -58 to 201224654. The first organic EL layer 7 is supplied by an inkjet method to a coating material containing a material capable of forming the first organic EL layer 7, and is dried and heated in a region surrounded by the partition wall 3 (recess 5). And/or light irradiation to form a coating to cure. The second organic EL layer 9 having the function of the light-emitting layer is provided on the first organic EL layer 7 provided in the concave portion 5. The above-mentioned light-emitting layer can be provided in combination with the type of the organic EL element. Therefore, the red light-emitting layer 9R can be disposed in the recess 5 provided with the red organic EL element 4R, the green light-emitting layer 9G can be disposed in the recess 5 provided with the green organic EL element 4G, and the blue light-emitting layer 9B can be disposed in the blue The concave portion 5 of the organic EL element 4B. The second electrode 10 is formed entirely in a display region in which the organic EL element 4 is provided. In other words, the second electrode 10 is formed on the partition wall 3 in addition to the second organic EL layer 9, and is continuously formed on a plurality of organic EL elements. As described above, the organic EL element 4 of the plurality of organic EL elements 4 formed on the support substrate 2 can be manufactured by coating the sealing layer and the sealing substrate (not shown). The pattern obtained by the photosensitive resin composition of the present invention is a pattern having both high heat resistance and water repellency, and is particularly suitable as an ITO electrode or an organic EL for producing a filter film or a liquid crystal display element by an inkjet method. A partition wall used for display elements, circuit wiring boards, and the like. In addition, for example, it is also suitable for use in a light-modulating-59-201224654 device constituting a part of the filter film substrate and/or the array substrate, a protective film that can be drawn, an interlayer insulating film, a liquid crystal matching bump, a microlens, The coating layer or the like for adjusting the film thickness, the touch surface member material, the coating film having the pattern obtained by the above method, the protective film of a portion of the film substrate and/or the array substrate. The above-mentioned board and array substrate are suitably used for a liquid crystal display device, an organic device, electronic paper, or the like. [Embodiment] Embodiments Hereinafter, the present invention will be described in detail by way of examples. %" and "part j", unless otherwise specified, refer to mass % and (synthesis example 1). The nitrogen gas is supplied at 0.02 L/min to form a nitrogen atmosphere with a reflux condenser, a dropping funnel and a stirrer. 1 200 parts by mass of butanol and 3-methoxybutyl acetate 105 were heated to 7 (TC) with stirring. Subsequently, 60 3,4-epoxytricyclo[5.2.1.026] fluorenyl methacrylate was used. Acrylate (the compound represented by the formula and the compound represented by the formula (Π-l) are mixed in a molar manner), 240 parts by mass is dissolved in 3 parts by mass of 3-methoxybutyl group to prepare a solution, and the solution is used. The funnel was dropped into a flask kept at 70 ° C. The structure of the filter plate was used to form a "filter portion" in the EL display example. In the flask, methoxy-1-min , in parts by mass, (1-1) Ϊ ratio 50: acid ester 1 40 4 hours -60-201224654 ο II HaC^CH—0—Ο

(Μ)

(Π-1) Further, 'the polymerization initiator 2,2,-azobis(2,4-dimethylbutyronitrile) was dissolved in 30 parts by mass of 225 parts by mass of 3-methoxybutyl acetate. The solution was dropped into the flask over 4 hours using another dropping funnel. After completion of the dropwise addition of the solution of the polymerization initiator, the mixture was kept at 70 ° C for 4 hours, and then cooled to room temperature to obtain a copolymer of solid content of 32.6 mass% and acid value of 110 mg-KOH/g (in terms of solid content). A solution of the substance (resin Aa). The obtained resin Aa had a weight average molecular weight Mw of ι.3χ104 and a molecular weight distribution of 2.50. The resin Aa is a copolymer having the following structural unit.

-61 201224654 (Synthesis Example 2) In a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, nitrogen gas was flowed at 0.02 L/min to form a nitrogen atmosphere, and 59 parts by mass of 3-methoxy-1-butanol was added. 81 parts by mass of 3-methoxybutyl acetate was heated to 7 ° C under stirring. Subsequently, 40 parts by mass of methacrylic acid, 3,4-epoxytricyclo[5.2.1.02·6]decyl acrylate (the compound represented by the formula (M) and the compound represented by the formula (II-1)) The mixture was dissolved in 80 parts by mass of 3-methoxy-1-butanol and 110 parts by mass of 3-methoxybutyl acetate in a molar ratio of 50:50. The solution was dropped into a flask kept at 70 ° C for 4 hours using a drip pump. Further, the polymerization initiator 2,2'-azobis(2,4-dimethylbutyronitrile) 36 parts by mass of 3-methoxy-1-butanol 1 质量1 parts by mass and 3 - A are dissolved A solution of 139 parts by mass of oxybutyl acetate was dropped into the flask over 5 hours using another dropping pump. After the completion of the dropwise addition of the solution of the polymerization initiator, the solid content was 42.5 mass%, and the acid value was 56 mg-KOH/g (in terms of solid content) after 7 hours (after TC, followed by cooling to room temperature). Copolymer (Resin Ab) solution. The obtained resin Ab has a weight average molecular weight (Mw) of 7.6 x 103 and a molecular weight distribution of 2.01. Resin Ab is a copolymer having the following structural units. -62- 201224654

(Synthesis Example 3) 30 parts of methacrylic acid, 30 parts of 2-hydroxyethyl methacrylate, and isodecyl methacrylic acid were added to the four-necked flask which provided the reflux-cooling tube, the nitrogen-introduction tube, the thermometer, and the stirring apparatus. 40 parts of ester, 5.9 parts of 2-sulfonylethanol, and 163 parts of propylene glycol monomethyl ether acetate were heated to 70 ° C, and stirred under a nitrogen stream for 30 minutes. 1.3 parts of azobisisobutyronitrile was added thereto, and polymerization was carried out for 18 hours. Subsequently, 29.3 parts of 2-ethyl isocyanate (Karenz AOI; manufactured by Showa Denko Co., Ltd.) was added, and 50 ppm of hydroquinone monomethyl ether was added to the entire composition under a nitrogen stream at 45 ° C. The reaction was carried out for 1 hour to obtain a copolymer (resin Ac) solution having a solid content of 34% by mass. The weight average molecular weight () of the obtained resin Ac was 4,090. The resin Ac is a copolymer having the following structural unit. -63- 201224654 ch3 ch3 ch3

Handle 1

HcT (Synthesis Example 4) In a flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen gas was flowed in a nitrogen atmosphere at 〇2 L/min, and 200 parts by mass of 3-methoxy-1-butanol was added thereto. 105 parts by mass of 3-methoxybutyl acetate was heated to 70 ° C with stirring. Subsequently, 55 parts by mass of methacrylic acid and 3,4-epoxytricyclo[5.2.1.02·6]decyl acrylate (the compound represented by the formula (1-1) and the formula (Π-1) are represented. a compound having a molar ratio of 50:50, 175 parts by mass, and 70 parts by mass of N-cyclohexylmaleimine dissolved in 140 parts by mass of 3-methoxybutyl acetate to prepare a solution, using a drop The solution was dropped into a flask kept at 70 ° C for 4 hours. Further, 30 parts by mass of a polymerization initiator 2,2'-azobis(2,4-dimethylbutyronitrile) was dissolved in a solution of 225 parts by mass of 3-methoxybutyl acetate, and another solution was used. The drip was dropped into the flask over 5 hours. After the completion of the dropwise addition of the solution of the polymerization initiator, after maintaining at 70 ° C for 4 hours, and then cooling to room temperature, the solid content was 32.6% by mass -64 to 201224654, and the acid value was 10 mg-KOH/g ( Copolymer (resin Ad) solution in terms of solid content. The obtained resin Ad had a weight average molecular weight (Mw) of 13,600, a number average molecular weight (?n) of 5,400, and a molecular weight distribution of 2.5. It is known that the resin Ad has the following structural unit.

(Synthesis Example 5) In a flask equipped with a reflux condenser, a dropping funnel, and a stirrer, nitrogen gas was flowed at 0.02 L/min to form a nitrogen atmosphere, and 140 parts by mass of diethylene glycol ethyl methyl ether was added thereto, followed by heating under stirring. To 7 (TC. Subsequently, 40 parts by mass of methacrylic acid, 3,4-epoxytricyclo[5.2.1_02·6]decyl acrylate (compound represented by formula (1-1) and formula (II) -1) a mixture of the compounds represented by the molar ratio = 50: 50) 3 40 parts by mass of a bicyclocyclopentadienyl acrylate (a compound represented by the following formula (Xl) and a formula (x2)) A mixture of the compounds, Mohr ratio = 50: 50) 20 parts by mass was dissolved in 190 parts by mass of diethylene glycol ethyl methyl ether to prepare a solution.

65- 201224654 The resulting solution was dropped into a flask kept at 70 ° C for 4 hours using a drip pump. Further, a solution of 240 parts by mass of diethylene glycol ethyl methyl ether of 30 parts by mass of a polymerization initiator 2,2'-azobis(2,4-dimethylbutyronitrile) is dissolved, and other solutions are used. The pump was dropped and dropped into the flask over 5 hours. After the completion of the dropwise addition of the solution of the polymerization initiator, it was kept at 7 ° C for 4 hours, and then cooled to room temperature to obtain a solution of a copolymer (resin Ae ) having a solid content of 41.8%. The obtained resin Ac had a weight average molecular weight (Mw) of 9·6 χ 103, a molecular weight distribution (Mw/Mn) of 2.02, and an acid value of 60 mg-KOH/g in terms of solid content. It is known that the resin Ae has the following structural unit"

(Synthesis Example 6) In a 1 L flask equipped with a reflux condenser, a dropping funnel, and a stirrer, nitrogen gas was flowed at 0.02 L/min to form a nitrogen atmosphere, and 140 parts by mass of diethylene glycol ethyl methyl ether was added thereto while stirring. Heat to 70. Subsequently, '40 parts by mass of methacrylic acid, 3,4-epoxytricyclo[5.2.1.02·6]decyl acrylate (the compound represented by the formula (M) and the compound represented by the formula (II-1)) a mixture of, molar ratio = 5 〇: 5 〇) 320 parts by mass of dicyclopentadienyl acrylate) 4 parts by mass dissolved in 190 parts by mass of di-66-201224654 ethylene glycol ethyl methyl ether, To make a solution. The resulting solution was dropped into a flask kept at 70 ° C for 4 hours using a dropping pump. Further, a solution of 240 parts by mass of diethylene glycol ethyl methyl ether of 30 parts by mass of a polymerization initiator 2,2'-azobis(2,4-dimethylbutyronitrile) is dissolved, and other solutions are used. The pump was dropped and dropped into the flask over a period of 5 hours. After the solution of the polymerization initiator was added dropwise, the mixture was kept at 70 ° C for 4 hours, and then cooled to room temperature to obtain a copolymer having a solid content of 41.8%. (Resin Af) solution. The obtained resin Ad had a weight average molecular weight (Mw) of 7.9 X 103, a molecular weight distribution (Mw/Mn) of 1.82, and an acid value of 60 mg-KOH/g in terms of solid content. It is known that the resin Af has the following structural unit.

-ecH2 (Synthesis Example 7) Adding α-chloroacrylic acid 3,3,4,4,5,5,6,6 to a four-necked flask equipped with a reflux cooling tube, a nitrogen inlet tube, a thermometer, and a stirring device. 78 parts of 6-nonafluorohexyl ester, 19.5 parts of methacrylic acid, 19.5 parts of isodecyl methacrylate, 13 parts of glycidyl methacrylate, 12.7 parts of dodecanethiol, propylene glycol monomethyl ether 266 parts of acetate was heated to 70 ° C and stirred under a nitrogen stream for 30 minutes. One part of azobisisobutyronitrile was added to 201224654, and polymerization was carried out for 18 hours to obtain a solution of a copolymer (resin Ba) having a solid content of 33% by mass and an acid value of 68 mg-KOH/g (in terms of solid content). The weight average molecular weight of the obtained resin Ba was 7,5 Å. It was found that the resin Ba is a copolymer having the following structural unit.

In a four-necked flask equipped with a reflux cooling tube, a nitrogen inlet tube, a thermometer and a stirring device, α-chloroacrylic acid 3,3,4,4,5,5,6,6,7,7,8 was added. 78 parts of 8,8-tridecafluorooctyl ester, 19.5 parts of methacrylic acid, 19.5 parts of isodecyl methacrylate, 13 parts of glycidyl methacrylate, 12.7 parts of dodecanethiol, propylene glycol monomethyl 266 parts of ethyl ether acetate, heated to 70 ° C, and stirred under a nitrogen stream for 30 minutes. One part of azobisisobutyronitrile was added thereto, and polymerization was carried out for 18 hours to obtain a solution of a copolymer (resin Bb) having a solid content of 33% by mass and an acid value of 65 mg-KOH/g (in terms of solid content). The obtained resin Bb had a weight average molecular weight of 6,800. The resin Bb is a copolymer having the following structural unit. It is known that the resin Bb has the following structural unit. -68- 201224654

The weight average molecular weight (Mw) and the number average molecular weight (??) of the resins obtained in Synthesis Examples 1 to 5 were measured by the following conditions using the GPC method. Device; Κ2479 (made by Shimadzu Corporation)

Pipe string; SHIMADZU Shim-pack GPC-80M

Column temperature; 40 ° C solvent; THF (tetrahydrofuran)

Flow rate; 1. OmL/min detector; RI The ratio of the weight average molecular weight and the number average molecular weight (Mw/Mn) in terms of polystyrene obtained above was taken as the molecular weight distribution. (Examples 1 to 4 and Comparative Example 1) <Preparation of photosensitive resin composition> The components of Table 3 were separately mixed to obtain a photosensitive resin composition 1 - 69 - 201224654 [Table 3] Photosensitive resin Composition 1 2 3 4 5 6 7 8 Resin (A) (parts) Aa 60 60 60 Ab 60 Ac 19 Ad 60 Ae 60 Af 60 Resin (B) (parts) Ba 0.4 0.4 3. 7 1 0.4 0.4 0.4 Bb 0.4 Polymerizable compound (C) (parts) Ca 40 40 40 40 40 40 40 Cb 8 Polymerization initiator (D) (parts) Da 2 2 2 2 2 2 2 Db 0.8 Other components (parts) Za 0.5 Zb 0.5 Solvent © (%) Ea 26 26 26 26 100 26 Eb 20 20 20 20 20 Ec 17 17 17 17 17 25 25 Ed 37 37 37 37 37 25 25 Ee 50 50 Solid content (%) 33 33 33 33 29.8 33 33 33 Composition Average Transmittance (%) 91 90 89 91 93 90 91 93 Average Transmittance of Film (%) 99 99 99 99 99 99 99 99 The components in Table 3 are as follows. The parts described in the column of the resin (A) and the resin (B) are expressed by parts by mass in terms of solid content. Resin (A); Aa: Resin Aa-70-201224654 Resin (A) obtained in Synthesis Example 1; Ab: Resin Ab resin (A) obtained in Synthesis Example 2; Ac: Resin Ac resin (A) obtained in Synthesis Example 3. Ad: Resin Ad resin (A) obtained in Synthesis Example 4; Ae: Resin Ae resin (A) obtained in Synthesis Example 5; Af: Resin Af resin (B) obtained in Synthesis Example 6; B a : Synthesis Example 7 Resin B a Resin (B); Bb: Resin Bb polymerizable compound (C) obtained in Synthesis Example 8; Ca: dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA; 曰本化药(股制制制制) Polymerization Compound (C); (: 13: pentaerythritol tetraacrylate (eight-TMMT; manufactured by Shin-Nakamura Chemical Co., Ltd.) polymerization initiator (D); Da: N-acetonitrile-1-[9-ethyl - 6-(2-Methylbenzylidene)-9H-carbitol-3-yl]ethane-1-imide (Ekaqiu (registered trademark) OXE02 ; BASF 曰本(股)) Polymerization Starting agent (D); Db: 2-hydroxy-l-{4-[4-(2-hydroxy-2-methylpropenyl)-benzyl]phenyl}-2-methylpropane-1- Ketone (Ekaqiu (registered trademark) 127; BASF Japan (stock)) Solvent (E); Ea; Glycol monomethyl ether acetate solvent (E); Eb; 3-ethoxypropionic acid ethyl solvent (E); E c ; 3-methoxy 1-butanol solvent (E); Ed; -methoxybutyl acetate solvent (E); Ee; diethylene glycol methyl ethyl ether solvent (E) is the solid content of the photosensitive resin composition, according to the "solid content of Table 3 ( In the manner of %)", the solvent component (E a ) to (E e ) of 201224654 in the solvent (E) is represented by the ratio of the solvent (E). Other components; Za; thermal crosslinking agent Saimer 3 00 (Mitsui)) Other components; Zb; tetrahydrohydrous phthalic acid (manufactured by Ricky Japan Physicochemical Co., Ltd.) <Average transmittance of the composition> The photosensitive resin composition obtained above A violet near-infrared spectrophotometer (V-650: Japan Spectrophotometer, light path length; 1 cm) was used to measure the average transmittance (%) at 400 to 700 nm. The results are shown in Table 3. <Production of Coating Film> A 2-inch square glass substrate (Iker XG; Corning) was sequentially dried using a neutral detergent, water, and alcohol. On the glass, the photosensitive resin compositions 1 to 4 obtained above were spin-coated so as to have a film thickness of 3.0/m, and the dryer (manufactured by Michael Technology Co., Ltd.) was used. After drying under reduced pressure to 6 6 kPa, it was baked and dried at 80 ° C for 2 minutes using a hot plate. After cooling, an exposure machine (manufactured by TME-1 50RSK Con, a light source; an ultrahigh pressure mercury lamp) was used to irradiate light having an exposure amount of 50 mJ/cm 2 (base of 365 nm) in a large atmosphere. Further, the irradiation of the photosensitive resin composition is to use an ultrahigh pressure mercury lamp. The quality technology (share TH; new outside visible) (Shizhong Zhiping company glass substrate, later with decompression pressure for pre-burning; To p - surrounded, at this time after the light -72-201224654, after The coating film was immersed and vibrated at 23 ° C for 60 seconds in contact with an aqueous developing solution containing 0.12% of a nonionic surfactant and 0.04% of calcium hydroxide, followed by 230 ° C, 20 in an oven. A coating film was obtained after heating for a minute (post-baking). The photosensitive resin composition 5 was coated in the same manner as above except that the exposure amount was replaced by 500 mJ/cm 2 (3 65 nm). Average transmittance> The average transmittance (%) in 400 to 700 nm was measured using a microscopic spectrophotometer (OSP-SP200; manufactured by OLYMPUS Co., Ltd.), and the higher the transmittance, the smaller the absorption. The results are shown in Table 3. <Contact angle> The contact angle of the obtained coating film was measured using a contact angle meter (DGD Fast/60; manufactured by GBX Corporation), and the contact angle with anisole was measured. When it is expressed, the higher the water repellency is. The higher the contact angle of the coating film, the phase is used. In the pattern formed by the photosensitive resin composition, the contact angle is also high. The photosensitive resin composition having a high contact angle is used to form the partition wall, and the ink jet device is used in the recess surrounded by the partition wall. In the case of a transfer coating, the coating is easy to pluck. Therefore, when a filter film is formed by an inkjet method, it is less likely to cause color mixing of a coating with an adjacent pixel region. -73- 201224654 <Solvent resistance Evaluation of the properties> The obtained coating film was immersed in N-methylpyrrolidone at 40 ° C for 40 minutes, and then the film thickness and transmittance were measured. The film thickness before and after the immersion and the transmittance at 400 nm were determined. The rate of change of the film thickness (%) = film thickness after immersion / film thickness before immersion (μιη) transmittance change rate (%) = transmittance after immersion ( %)/Transmission rate before immersion (%) Further, the adhesion test was performed on the immersed coating film, which was a coating film after immersion, using a shearer and a super-shear guide machine (made by Taiyo Machinery Co., Ltd.) ) cut at intervals of 1 mm to make 100 lmmxlmm holes. The cut hole is attached with a tape (cellophane tape; registered trademark) with a width of 24 mm (made by Nichiban Co., Ltd.), and the adhesive film is adhered to the tape by using an eraser on the tape, and the tape is coated at one end of the tape after 2 minutes. The film was directly peeled off at a right angle. Then, the number of holes remaining on the substrate without peeling off the coating film was visually calculated. The more the number of holes remaining in the substrate, the better the adhesion. When the solvent resistance in the film is good, the pattern formed by using the same photosensitive resin composition also exhibits good solvent resistance. The results are shown in Table 4. <Evaluation of heat resistance> The obtained coating film was placed in a clean oven, and the film thickness and transmittance were measured after 24 hours of heating (1 hour - 74 to 201224654 TC. The film thickness before and after heating and the transmittance in 400 nm) The rate of change of film thickness (%) = film thickness after heating (μπι) / film thickness before heating (μιη) transmittance change rate (%) = transmittance after heating (%) / transmittance before heating (%) When the heat resistance of the coating film is good, the heat resistance in the pattern formed using the same photosensitive resin composition is also good. The results are shown in Table 4. Formation of the pattern> A 2 inch square glass substrate (Iker XG; manufactured by Corning Incorporated) was sequentially washed with a neutral detergent, water and alcohol, and dried. The photosensitive resin compositions 1 to 4 and 6 to 8 were respectively spin-coated on the glass substrate at a film thickness of 3 · 5 /zm after baking, and dried under reduced pressure to a reduced pressure using a vacuum dryer (manufactured by Michael Technology Co., Ltd.). After 66 kPa, it was pre-baked and dried on a hot plate at 80 ° C for 2 minutes. After cooling, the sensitization was applied. The distance between the substrate of the resin composition and the quartz glass light mask is set to 10 〇 / / m, using an exposure machine (TME-15 0RSK; Top-Con (light), light source; ultra-high pressure mercury lamp), under atmospheric atmosphere The light having an exposure amount of 50 mJ/cm 2 (3 65 nm basis) is irradiated. Further, at this time, the photosensitive resin composition is irradiated, and the emitted light generated by the ultrahigh pressure mercury lamp is passed through an optical filter (UV-33; In the same way as the spectroscopic (share) system. -75- 201224654, the light mask is the pattern (having a 13/im light portion with 1 side, the square is 100/zm apart) (ie, in the same plane) After the light is irradiated, the coating film is immersed in a nonionic surfactant 0.12% and a calcium hydroxide developer for 1 〇〇 at 25 ° C for development, and after washing with water, After baking at 23 ° C for 15 minutes, the pattern "photosensitive resin composition 5, except for the exposure amount of 3 65 nm) was replaced by the same <pattern shape observation > Scanning electron microscope (S-4000; manufactured by the company) observed the shape of the pattern. In the case of being used, the smoothing cone (the shape shown in FIG. 3) is preferably a transparent transparent part of the square to form a stain and vibrate in a water-based oven containing 0.04%, and is subjected to 500 m J/cm 2 . Film.] 曰立制所 as a partition wall - 76 - 201224654 [Table 4] Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Photosensitive resin composition 1 2 3 4 5 Heat resistance film thickness change rate [ %] 97 98 97 97 88 Transmission rate change rate [%] 94 96 94 95 93 Solvent resistance film thickness change rate [%] 101 100 102 102 102 Transmission rate change rate [%] 102 100 100 101 100 Adhesion 100 100 100 100 100 contact angle [degrees] 25 30 33 20 28 pattern woven forward cone forward cone forward cone forward cone forward cone embodiment 5 Example 6 Example 7 Photosensitive resin composition Material 6 7 8 Heat resistance Na change rate w] 98 97 98 Transmission rate change rate [%] 98 95 95 Solvent resistance film thickness change rate w] 100 101 101 Transmission rate change rate [%] 100 100 100 Adhesion 100 100 100 contact angle [degrees] 20 27 28 pattern shape forward cone forward cone forward cone from the result of the example The photosensitive resin composition of the present invention can maintain the state of the high contact angle, to obtain the coating film having excellent heat resistance and pattern. Industrial Applicability The photosensitive resin composition of the present invention can provide a pattern having excellent heat resistance. -77- 201224654 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a partially enlarged mode of a display device of the present invention. Figure 2 is a plan view showing a partially enlarged mode of the display device of the present invention. Figure 3: Forward cone. [Description of main component symbols] 1 : Display device 2 : Support substrate 3 : Partition wall 4 : Organic EL element 5 : Concave portion 6 : First electrode 7 : First organic EL layer (hole injection layer) 9: 2nd Organic EL layer (light emitting layer) 10 : second electrode -78-

Claims (1)

201224654 VII. Patent application scope: 1. A photosensitive resin composition characterized by containing (A), (B), (C), (D) and (E) components, (A) containing unsaturated carboxylic acid And a structural unit derived from at least one selected from the group consisting of unsaturated carboxylic anhydrides, and a structural unit derived from an unsaturated compound having a cyclic ether structure having a carbon number of 2 to 4 (but not a structural unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms, and (B) a structural unit derived from an unsaturated compound having a perfluoroalkyl group having 4 to 6 carbon atoms a polymer, (C) a polymerizable compound, (D) a polymerization initiator, and (E) a solvent. 2. The photosensitive resin composition of claim 1, wherein (B) is a structural unit derived from at least one selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride; Copolymer. 3. The photosensitive resin composition according to claim 1 or 2, wherein (C) is a polymerization initiator containing a ruthenium compound. A pattern characterized by being formed of a photosensitive resin composition of the first application of the patent scope. A partition wall for ink jets, which is characterized in that it is formed of a photosensitive resin composition of the first application of the patent application. A display device characterized by comprising at least one selected from the group consisting of the pattern of the patent application No. -79-201224654 and the partition wall for inkjet according to item 5 of the patent application. -80-