TWI509372B - 夾具及處理裝置 - Google Patents

夾具及處理裝置 Download PDF

Info

Publication number
TWI509372B
TWI509372B TW102148074A TW102148074A TWI509372B TW I509372 B TWI509372 B TW I509372B TW 102148074 A TW102148074 A TW 102148074A TW 102148074 A TW102148074 A TW 102148074A TW I509372 B TWI509372 B TW I509372B
Authority
TW
Taiwan
Prior art keywords
jig
processing apparatus
processed
fixed
clamp
Prior art date
Application number
TW102148074A
Other languages
English (en)
Chinese (zh)
Other versions
TW201426204A (zh
Inventor
Norihiro Ohta
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW201426204A publication Critical patent/TW201426204A/zh
Application granted granted Critical
Publication of TWI509372B publication Critical patent/TWI509372B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • ing And Chemical Polishing (AREA)
TW102148074A 2012-12-28 2013-12-24 夾具及處理裝置 TWI509372B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012289142A JP6168384B2 (ja) 2012-12-28 2012-12-28 チャック及び処理装置

Publications (2)

Publication Number Publication Date
TW201426204A TW201426204A (zh) 2014-07-01
TWI509372B true TWI509372B (zh) 2015-11-21

Family

ID=51409104

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102148074A TWI509372B (zh) 2012-12-28 2013-12-24 夾具及處理裝置

Country Status (3)

Country Link
JP (1) JP6168384B2 (ja)
KR (1) KR101531112B1 (ja)
TW (1) TWI509372B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6448338B2 (ja) 2014-12-05 2019-01-09 三菱電機株式会社 タッチパネル構造の製造方法及び表示装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002052085A (ja) * 2000-08-11 2002-02-19 Nippon Sharyo Seizo Kaisha Ltd ステントのレーザ加工装置
CN1348400A (zh) * 1999-04-28 2002-05-08 稻叶哲夫 自动车床用棒材支承装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002045988A (ja) * 2000-08-04 2002-02-12 Olympus Optical Co Ltd 可撓性管の溶接接合装置
JP2002178188A (ja) * 2000-12-07 2002-06-25 Nippon Sharyo Seizo Kaisha Ltd レーザ切断加工における極薄板金属板の保持装置
JP4572303B1 (ja) * 2010-02-12 2010-11-04 株式会社ルス・コム 通電検査治具用接触子の製造方法及び、これにより製造した通電検査治具用接触子、並びにこれを備えている通電検査治具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1348400A (zh) * 1999-04-28 2002-05-08 稻叶哲夫 自动车床用棒材支承装置
JP2002052085A (ja) * 2000-08-11 2002-02-19 Nippon Sharyo Seizo Kaisha Ltd ステントのレーザ加工装置

Also Published As

Publication number Publication date
JP2014130972A (ja) 2014-07-10
JP6168384B2 (ja) 2017-07-26
TW201426204A (zh) 2014-07-01
KR20140088010A (ko) 2014-07-09
KR101531112B1 (ko) 2015-06-23

Similar Documents

Publication Publication Date Title
TWI278629B (en) Contact terminal for spiral contactor, and the contactor
JP6484137B2 (ja) プローブ及び接触検査装置
TWI516770B (zh) A method of manufacturing a conductive device for the use of a contact device for the power supply,
KR102461856B1 (ko) 검사 헤드용 접촉 프로브의 제조 방법
JP2003185678A (ja) 化学的にエッチングした光画定された微小電気接点
JP2018503805A (ja) 垂直プローブを含むテストヘッド
TWI509372B (zh) 夾具及處理裝置
JP2007509352A (ja) 光画成（ｐｈｏｔｏ−ｄｅｆｉｎｅｄ）マイクロ電気接点の形成方法
KR20190013732A (ko) 접촉 도전 지그, 및 검사 장치
TWI388839B (zh) 探針單元
TWI387753B (zh) 測試插座之製作方法及其所使用的彈性測試探針
US20140111238A1 (en) Spiral probe and method of manufacturing the spiral probe
JP6193073B2 (ja) メタルマスクの製造方法
TW201602715A (zh) 配列用遮罩及其製造方法
JP2007155535A (ja) 検査治具および検査治具の製造方法
TWI476401B (zh) X射線檢查裝置及品質判斷方法
KR20220024107A (ko) 금속 제품의 미세 가공 장치 및 금속 제품의 미세 가공 방법
JP2014109068A (ja) エッチング装置及びエッチング処理方法
JP2016201493A (ja) 導電性ボール定置用マスク、及びその製造方法
WO2022054802A1 (ja) 接触端子、検査治具、検査装置、及び製造方法
KR101521722B1 (ko) 반송 장치 및 접촉자 조립 장치
JP5273841B2 (ja) プローブ実装方法
JP2011119494A (ja) 球状体搭載方法、球状体搭載装置および球状体搭載済基板
KR101757860B1 (ko) 탐침, 탐침 카드 및 그 제조방법
JP2010276428A (ja) 基板検査装置用プローブピン