TWI509352B - 感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法 - Google Patents

感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法 Download PDF

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Publication number
TWI509352B
TWI509352B TW100128456A TW100128456A TWI509352B TW I509352 B TWI509352 B TW I509352B TW 100128456 A TW100128456 A TW 100128456A TW 100128456 A TW100128456 A TW 100128456A TW I509352 B TWI509352 B TW I509352B
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TW
Taiwan
Prior art keywords
compound
radiation
film
resin composition
acid
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TW100128456A
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English (en)
Chinese (zh)
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TW201224651A (en
Inventor
Eiji Yoneda
Nobuhiro Nishi
Seiichirou Kodama
Katsumi Inomata
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Jsr Corp
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Publication of TW201224651A publication Critical patent/TW201224651A/zh
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Publication of TWI509352B publication Critical patent/TWI509352B/zh

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • G02B5/201Filters in the form of arrays
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Optical Filters (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Polymerisation Methods In General (AREA)
TW100128456A 2010-08-10 2011-08-10 感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法 TWI509352B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010179739 2010-08-10
JP2011146634A JP5724681B2 (ja) 2010-08-10 2011-06-30 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、カラーフィルタ及びカラーフィルタの形成方法

Publications (2)

Publication Number Publication Date
TW201224651A TW201224651A (en) 2012-06-16
TWI509352B true TWI509352B (zh) 2015-11-21

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Family Applications (1)

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TW100128456A TWI509352B (zh) 2010-08-10 2011-08-10 感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法

Country Status (3)

Country Link
JP (1) JP5724681B2 (ko)
KR (1) KR101307972B1 (ko)
TW (1) TWI509352B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6184087B2 (ja) * 2012-12-07 2017-08-23 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び/またはカラーフィルター保護膜
JP6430098B2 (ja) * 2013-01-15 2018-11-28 日立化成株式会社 タッチパネル電極の保護膜用感光性透明材
TWI669369B (zh) 2014-01-29 2019-08-21 日立化成股份有限公司 黏著劑組成物、由黏著劑組成物獲得之樹脂硬化物、使用黏著劑組成物之半導體裝置的製造方法、及固態成像元件
WO2015115553A1 (ja) 2014-01-29 2015-08-06 日立化成株式会社 接着剤組成物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子
CN105934478B (zh) * 2014-01-29 2020-01-14 日立化成株式会社 树脂组合物、使用了树脂组合物的半导体装置的制造方法、以及固体摄像元件
JP6675820B2 (ja) * 2014-02-25 2020-04-08 日立化成株式会社 アクリル樹脂組成物及び電子部品
CN117590695B (zh) * 2023-11-29 2024-07-30 深圳市道尔顿电子材料股份有限公司 一种可低温固化负型感光性树脂组合物和一种硬化膜及其制备方法

Citations (2)

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CN1916761A (zh) * 2005-08-16 2007-02-21 Jsr株式会社 感光性树脂组合物、显示面板用隔垫和显示面板
TW200848953A (en) * 2007-02-16 2008-12-16 Taiyo Ink Mfg Co Ltd Composition for forming cured film pattern, and method for producing cured film pattern by using the same

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JPH066590B2 (ja) * 1985-07-15 1994-01-26 サンアプロ株式会社 新規アミジン,その製造法および使用法
JP2841095B2 (ja) * 1990-01-25 1998-12-24 チッソ株式会社 液晶配向膜及び液晶表示素子
JP3101986B2 (ja) * 1992-07-24 2000-10-23 ジェイエスアール株式会社 耐熱性感放射線性樹脂組成物
JPH07188395A (ja) * 1993-11-16 1995-07-25 Sumitomo Bakelite Co Ltd 樹脂組成物
TWI247195B (en) * 2003-01-30 2006-01-11 Chi Mei Corp Photosensitive resin composition for spacer
JP2006184841A (ja) * 2004-12-01 2006-07-13 Jsr Corp 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
KR20070021057A (ko) * 2005-08-16 2007-02-22 제이에스알 가부시끼가이샤 감광성 수지 조성물, 표시 패널용 스페이서 및 표시 패널
JP2010013558A (ja) * 2008-07-03 2010-01-21 Toyobo Co Ltd 光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板
JP5454772B2 (ja) * 2008-11-17 2014-03-26 Jsr株式会社 液晶配向剤、液晶配向膜およびその形成方法ならびに液晶表示素子
JP5451048B2 (ja) * 2008-12-05 2014-03-26 株式会社ダイセル 共重合体及び感光性樹脂組成物

Patent Citations (2)

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CN1916761A (zh) * 2005-08-16 2007-02-21 Jsr株式会社 感光性树脂组合物、显示面板用隔垫和显示面板
TW200848953A (en) * 2007-02-16 2008-12-16 Taiyo Ink Mfg Co Ltd Composition for forming cured film pattern, and method for producing cured film pattern by using the same

Also Published As

Publication number Publication date
TW201224651A (en) 2012-06-16
JP5724681B2 (ja) 2015-05-27
KR20120024399A (ko) 2012-03-14
JP2012058725A (ja) 2012-03-22
KR101307972B1 (ko) 2013-09-12

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