TWI509352B - 感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法 - Google Patents

感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法 Download PDF

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Publication number
TWI509352B
TWI509352B TW100128456A TW100128456A TWI509352B TW I509352 B TWI509352 B TW I509352B TW 100128456 A TW100128456 A TW 100128456A TW 100128456 A TW100128456 A TW 100128456A TW I509352 B TWI509352 B TW I509352B
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TW
Taiwan
Prior art keywords
compound
radiation
film
resin composition
acid
Prior art date
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TW100128456A
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English (en)
Chinese (zh)
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TW201224651A (en
Inventor
Eiji Yoneda
Nobuhiro Nishi
Seiichirou Kodama
Katsumi Inomata
Original Assignee
Jsr Corp
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Publication of TW201224651A publication Critical patent/TW201224651A/zh
Application granted granted Critical
Publication of TWI509352B publication Critical patent/TWI509352B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Optical Filters (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW100128456A 2010-08-10 2011-08-10 感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法 TWI509352B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010179739 2010-08-10
JP2011146634A JP5724681B2 (ja) 2010-08-10 2011-06-30 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、カラーフィルタ及びカラーフィルタの形成方法

Publications (2)

Publication Number Publication Date
TW201224651A TW201224651A (en) 2012-06-16
TWI509352B true TWI509352B (zh) 2015-11-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW100128456A TWI509352B (zh) 2010-08-10 2011-08-10 感放射線性樹脂組成物、硬化膜、硬化膜之形成方法、彩色濾光片及彩色濾光片之形成方法

Country Status (3)

Country Link
JP (1) JP5724681B2 (ko)
KR (1) KR101307972B1 (ko)
TW (1) TWI509352B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6184087B2 (ja) * 2012-12-07 2017-08-23 日本化薬株式会社 活性エネルギー線硬化型樹脂組成物、及びそれを用いた表示素子用スペーサー及び／またはカラーフィルター保護膜
JP6430098B2 (ja) * 2013-01-15 2018-11-28 日立化成株式会社 タッチパネル電極の保護膜用感光性透明材
WO2015115552A1 (ja) 2014-01-29 2015-08-06 日立化成株式会社 接着剤組成物、接着剤組成物から得られる樹脂硬化物、接着剤組成物を用いた半導体装置の製造方法、及び固体撮像素子
TWI660023B (zh) 2014-01-29 2019-05-21 日立化成股份有限公司 樹脂組成物、使用樹脂組成物之半導體裝置的製造方法、及固態成像元件
KR20160114048A (ko) 2014-01-29 2016-10-04 히타치가세이가부시끼가이샤 접착제 조성물, 접착제 조성물을 사용한 반도체 장치의 제조 방법, 및 고체 촬상 소자
JP6675820B2 (ja) * 2014-02-25 2020-04-08 日立化成株式会社 アクリル樹脂組成物及び電子部品

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1916761A (zh) * 2005-08-16 2007-02-21 Jsr株式会社 感光性树脂组合物、显示面板用隔垫和显示面板
TW200848953A (en) * 2007-02-16 2008-12-16 Taiyo Ink Mfg Co Ltd Composition for forming cured film pattern, and method for producing cured film pattern by using the same

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JPH066590B2 (ja) * 1985-07-15 1994-01-26 サンアプロ株式会社 新規アミジン，その製造法および使用法
JP2841095B2 (ja) * 1990-01-25 1998-12-24 チッソ株式会社 液晶配向膜及び液晶表示素子
JP3101986B2 (ja) * 1992-07-24 2000-10-23 ジェイエスアール株式会社 耐熱性感放射線性樹脂組成物
JPH07188395A (ja) * 1993-11-16 1995-07-25 Sumitomo Bakelite Co Ltd 樹脂組成物
TWI247195B (en) * 2003-01-30 2006-01-11 Chi Mei Corp Photosensitive resin composition for spacer
JP2006184841A (ja) * 2004-12-01 2006-07-13 Jsr Corp 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル
KR20070021057A (ko) * 2005-08-16 2007-02-22 제이에스알 가부시끼가이샤 감광성 수지 조성물, 표시 패널용 스페이서 및 표시 패널
JP2010013558A (ja) * 2008-07-03 2010-01-21 Toyobo Co Ltd 光硬化性・熱硬化性樹脂組成物、光硬化性・熱硬化性層、インキ、接着剤、及び、プリント回路基板
JP5454772B2 (ja) * 2008-11-17 2014-03-26 Ｊｓｒ株式会社 液晶配向剤、液晶配向膜およびその形成方法ならびに液晶表示素子
JP5451048B2 (ja) * 2008-12-05 2014-03-26 株式会社ダイセル 共重合体及び感光性樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1916761A (zh) * 2005-08-16 2007-02-21 Jsr株式会社 感光性树脂组合物、显示面板用隔垫和显示面板
TW200848953A (en) * 2007-02-16 2008-12-16 Taiyo Ink Mfg Co Ltd Composition for forming cured film pattern, and method for producing cured film pattern by using the same

Also Published As

Publication number Publication date
KR20120024399A (ko) 2012-03-14
JP2012058725A (ja) 2012-03-22
KR101307972B1 (ko) 2013-09-12
TW201224651A (en) 2012-06-16
JP5724681B2 (ja) 2015-05-27

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