TWI504628B - Hardened resin composition and hardened product thereof - Google Patents

Hardened resin composition and hardened product thereof Download PDF

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Publication number
TWI504628B
TWI504628B TW100120614A TW100120614A TWI504628B TW I504628 B TWI504628 B TW I504628B TW 100120614 A TW100120614 A TW 100120614A TW 100120614 A TW100120614 A TW 100120614A TW I504628 B TWI504628 B TW I504628B
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TW
Taiwan
Prior art keywords
acid
group
resin composition
anhydride
compound
Prior art date
Application number
TW100120614A
Other languages
English (en)
Chinese (zh)
Other versions
TW201200536A (en
Inventor
Chie Sasaki
Yoshihiro Kawada
Masataka Nakanishi
Original Assignee
Nippon Kayaku Kk
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Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW201200536A publication Critical patent/TW201200536A/zh
Application granted granted Critical
Publication of TWI504628B publication Critical patent/TWI504628B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW100120614A 2010-06-11 2011-06-10 Hardened resin composition and hardened product thereof TWI504628B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010134465 2010-06-11

Publications (2)

Publication Number Publication Date
TW201200536A TW201200536A (en) 2012-01-01
TWI504628B true TWI504628B (zh) 2015-10-21

Family

ID=45098215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100120614A TWI504628B (zh) 2010-06-11 2011-06-10 Hardened resin composition and hardened product thereof

Country Status (6)

Country Link
JP (1) JP5768047B2 (ja)
KR (1) KR20130098876A (ja)
CN (1) CN102939315A (ja)
SG (1) SG186254A1 (ja)
TW (1) TWI504628B (ja)
WO (1) WO2011155613A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472924B2 (ja) * 2010-10-21 2014-04-16 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
JP6006725B2 (ja) * 2011-09-09 2016-10-12 日本化薬株式会社 光半導体素子封止用硬化性樹脂組成物およびその硬化物
JP6602170B2 (ja) * 2015-11-16 2019-11-06 日本化薬株式会社 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置
KR20180129867A (ko) * 2016-03-31 2018-12-05 다이요 잉키 세이조 가부시키가이샤 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
KR102624978B1 (ko) 2016-11-28 2024-01-15 에이치엘만도 주식회사 디스크 브레이크
CN107742286B (zh) * 2017-09-28 2021-01-29 河北工业大学 一种多晶硅太阳能电池片el测试裂纹缺陷检测方法
CN112442256B (zh) * 2020-11-03 2021-12-17 南京大学 一种环氧树脂基高分子材料及其制备方法和应用
CN112708277A (zh) * 2020-12-23 2021-04-27 北京化工大学 一种高强度柔性聚硅氧烷气凝胶及制备方法
CN113461359B (zh) * 2021-06-29 2022-05-10 江苏先帅科技有限公司 一种管片预制件用复合聚羧酸减水剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1153620C (zh) * 1999-11-09 2004-06-16 国王企业有限公司 作为交联催化剂的磷酸酯的金属盐
JP2010053203A (ja) * 2008-08-27 2010-03-11 Nof Corp 熱硬化性樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH089658B2 (ja) * 1988-12-13 1996-01-31 新日本理化株式会社 エポキシ樹脂用硬化促進剤及びその硬化剤組成物ならびにエポキシ樹脂組成物
JPH07108935B2 (ja) * 1989-01-10 1995-11-22 新日本理化株式会社 エポキシ樹脂用硬化剤組成物及びエポキシ樹脂組成物
JP3012358B2 (ja) * 1991-04-30 2000-02-21 東レ・ダウコーニング・シリコーン株式会社 加熱硬化性エポキシ樹脂組成物
JP2003124529A (ja) * 2002-09-24 2003-04-25 Nichia Chem Ind Ltd 発光ダイオードおよびその形成方法
JP2004292706A (ja) * 2003-03-27 2004-10-21 Nof Corp 光半導体封止用エポキシ樹脂組成物及び光半導体装置
US7279223B2 (en) * 2003-12-16 2007-10-09 General Electric Company Underfill composition and packaged solid state device
JP5141499B2 (ja) * 2008-10-31 2013-02-13 日油株式会社 熱硬化性樹脂組成物
TWI488890B (zh) * 2009-10-06 2015-06-21 Nippon Kayaku Kk A polycarboxylic acid composition and a method for producing the same, and a hardening resin composition comprising the polycarboxylic acid composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1153620C (zh) * 1999-11-09 2004-06-16 国王企业有限公司 作为交联催化剂的磷酸酯的金属盐
JP2010053203A (ja) * 2008-08-27 2010-03-11 Nof Corp 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
JPWO2011155613A1 (ja) 2013-08-15
JP5768047B2 (ja) 2015-08-26
WO2011155613A1 (ja) 2011-12-15
SG186254A1 (en) 2013-01-30
TW201200536A (en) 2012-01-01
CN102939315A (zh) 2013-02-20
KR20130098876A (ko) 2013-09-05

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