TWI504628B - Hardened resin composition and hardened product thereof - Google Patents
Hardened resin composition and hardened product thereof Download PDFInfo
- Publication number
- TWI504628B TWI504628B TW100120614A TW100120614A TWI504628B TW I504628 B TWI504628 B TW I504628B TW 100120614 A TW100120614 A TW 100120614A TW 100120614 A TW100120614 A TW 100120614A TW I504628 B TWI504628 B TW I504628B
- Authority
- TW
- Taiwan
- Prior art keywords
- acid
- group
- resin composition
- anhydride
- compound
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010134465 | 2010-06-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201200536A TW201200536A (en) | 2012-01-01 |
TWI504628B true TWI504628B (zh) | 2015-10-21 |
Family
ID=45098215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100120614A TWI504628B (zh) | 2010-06-11 | 2011-06-10 | Hardened resin composition and hardened product thereof |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5768047B2 (ja) |
KR (1) | KR20130098876A (ja) |
CN (1) | CN102939315A (ja) |
SG (1) | SG186254A1 (ja) |
TW (1) | TWI504628B (ja) |
WO (1) | WO2011155613A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5472924B2 (ja) * | 2010-10-21 | 2014-04-16 | 日本化薬株式会社 | 硬化性樹脂組成物およびその硬化物 |
JP6006725B2 (ja) * | 2011-09-09 | 2016-10-12 | 日本化薬株式会社 | 光半導体素子封止用硬化性樹脂組成物およびその硬化物 |
JP6602170B2 (ja) * | 2015-11-16 | 2019-11-06 | 日本化薬株式会社 | 多価カルボン酸樹脂およびそれを含有する多価カルボン酸樹脂組成物、エポキシ樹脂組成物、熱硬化性樹脂組成物、それらの硬化物並びに半導体装置 |
KR20180129867A (ko) * | 2016-03-31 | 2018-12-05 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 |
KR102624978B1 (ko) | 2016-11-28 | 2024-01-15 | 에이치엘만도 주식회사 | 디스크 브레이크 |
CN107742286B (zh) * | 2017-09-28 | 2021-01-29 | 河北工业大学 | 一种多晶硅太阳能电池片el测试裂纹缺陷检测方法 |
CN112442256B (zh) * | 2020-11-03 | 2021-12-17 | 南京大学 | 一种环氧树脂基高分子材料及其制备方法和应用 |
CN112708277A (zh) * | 2020-12-23 | 2021-04-27 | 北京化工大学 | 一种高强度柔性聚硅氧烷气凝胶及制备方法 |
CN113461359B (zh) * | 2021-06-29 | 2022-05-10 | 江苏先帅科技有限公司 | 一种管片预制件用复合聚羧酸减水剂及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1153620C (zh) * | 1999-11-09 | 2004-06-16 | 国王企业有限公司 | 作为交联催化剂的磷酸酯的金属盐 |
JP2010053203A (ja) * | 2008-08-27 | 2010-03-11 | Nof Corp | 熱硬化性樹脂組成物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH089658B2 (ja) * | 1988-12-13 | 1996-01-31 | 新日本理化株式会社 | エポキシ樹脂用硬化促進剤及びその硬化剤組成物ならびにエポキシ樹脂組成物 |
JPH07108935B2 (ja) * | 1989-01-10 | 1995-11-22 | 新日本理化株式会社 | エポキシ樹脂用硬化剤組成物及びエポキシ樹脂組成物 |
JP3012358B2 (ja) * | 1991-04-30 | 2000-02-21 | 東レ・ダウコーニング・シリコーン株式会社 | 加熱硬化性エポキシ樹脂組成物 |
JP2003124529A (ja) * | 2002-09-24 | 2003-04-25 | Nichia Chem Ind Ltd | 発光ダイオードおよびその形成方法 |
JP2004292706A (ja) * | 2003-03-27 | 2004-10-21 | Nof Corp | 光半導体封止用エポキシ樹脂組成物及び光半導体装置 |
US7279223B2 (en) * | 2003-12-16 | 2007-10-09 | General Electric Company | Underfill composition and packaged solid state device |
JP5141499B2 (ja) * | 2008-10-31 | 2013-02-13 | 日油株式会社 | 熱硬化性樹脂組成物 |
TWI488890B (zh) * | 2009-10-06 | 2015-06-21 | Nippon Kayaku Kk | A polycarboxylic acid composition and a method for producing the same, and a hardening resin composition comprising the polycarboxylic acid composition |
-
2011
- 2011-06-10 KR KR1020127031395A patent/KR20130098876A/ko not_active Application Discontinuation
- 2011-06-10 TW TW100120614A patent/TWI504628B/zh not_active IP Right Cessation
- 2011-06-10 WO PCT/JP2011/063412 patent/WO2011155613A1/ja active Application Filing
- 2011-06-10 JP JP2012519441A patent/JP5768047B2/ja not_active Expired - Fee Related
- 2011-06-10 CN CN2011800288827A patent/CN102939315A/zh active Pending
- 2011-06-10 SG SG2012090577A patent/SG186254A1/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1153620C (zh) * | 1999-11-09 | 2004-06-16 | 国王企业有限公司 | 作为交联催化剂的磷酸酯的金属盐 |
JP2010053203A (ja) * | 2008-08-27 | 2010-03-11 | Nof Corp | 熱硬化性樹脂組成物 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2011155613A1 (ja) | 2013-08-15 |
JP5768047B2 (ja) | 2015-08-26 |
WO2011155613A1 (ja) | 2011-12-15 |
SG186254A1 (en) | 2013-01-30 |
TW201200536A (en) | 2012-01-01 |
CN102939315A (zh) | 2013-02-20 |
KR20130098876A (ko) | 2013-09-05 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |