TWI501838B - Coolant recovery method - Google Patents
Coolant recovery method Download PDFInfo
- Publication number
- TWI501838B TWI501838B TW100120660A TW100120660A TWI501838B TW I501838 B TWI501838 B TW I501838B TW 100120660 A TW100120660 A TW 100120660A TW 100120660 A TW100120660 A TW 100120660A TW I501838 B TWI501838 B TW I501838B
- Authority
- TW
- Taiwan
- Prior art keywords
- coolant
- filtration
- recovering
- cooling liquid
- tackifier
- Prior art date
Links
- 239000002826 coolant Substances 0.000 title claims description 53
- 238000000034 method Methods 0.000 title claims description 35
- 238000011084 recovery Methods 0.000 title description 15
- 238000001914 filtration Methods 0.000 claims description 49
- 239000000919 ceramic Substances 0.000 claims description 30
- 239000000110 cooling liquid Substances 0.000 claims description 23
- 239000011148 porous material Substances 0.000 claims description 14
- 238000011001 backwashing Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 2
- 238000005374 membrane filtration Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 description 41
- 239000006061 abrasive grain Substances 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229920005597 polymer membrane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010144448A JP5640260B2 (ja) | 2010-06-25 | 2010-06-25 | クーラント回収方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201208814A TW201208814A (en) | 2012-03-01 |
| TWI501838B true TWI501838B (zh) | 2015-10-01 |
Family
ID=45355551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100120660A TWI501838B (zh) | 2010-06-25 | 2011-06-14 | Coolant recovery method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5640260B2 (enExample) |
| KR (1) | KR101799598B1 (enExample) |
| CN (1) | CN102294758B (enExample) |
| TW (1) | TWI501838B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013248707A (ja) * | 2012-05-31 | 2013-12-12 | Panasonic Corp | クーラント廃液の再生方法、クーラント廃液の処理方法、クーラント廃液の処理システム、及び再生クーラント液の製造方法 |
| JP6331474B2 (ja) * | 2014-02-28 | 2018-05-30 | ブラザー工業株式会社 | 工作機械の洗浄液濾過装置 |
| CN105174522B (zh) * | 2015-10-09 | 2017-11-17 | 浙江瑞翌新材料科技股份有限公司 | 一种金刚线切割废冷却液的回收方法及系统 |
| CN117774150A (zh) * | 2022-09-22 | 2024-03-29 | 内蒙古中环光伏材料有限公司 | 一种去除硅单晶金刚线切片用冷却液中硅粉的方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1133361A (ja) * | 1997-07-18 | 1999-02-09 | Toshiba Ceramics Co Ltd | 微細粒子を含む液体の処理方法および処理装置 |
| JP2000343525A (ja) * | 1999-06-08 | 2000-12-12 | Sumitomo Metal Ind Ltd | 半導体材料の切断・加工方法 |
| JP2010030033A (ja) * | 2008-07-02 | 2010-02-12 | Sharp Corp | クーラント再生方法およびスラリー再生方法 |
| WO2010071873A2 (en) * | 2008-12-20 | 2010-06-24 | Cabot Microelectronics Corporation | Wiresaw cutting method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3249373B2 (ja) * | 1996-02-21 | 2002-01-21 | 信越半導体株式会社 | 水溶性スラリー廃液の再利用システム |
| US5664990A (en) * | 1996-07-29 | 1997-09-09 | Integrated Process Equipment Corp. | Slurry recycling in CMP apparatus |
| JP3389141B2 (ja) * | 1999-04-26 | 2003-03-24 | 株式会社スーパーシリコン研究所 | スライシング用スラリーの評価方法及びスラリー |
| JP4369054B2 (ja) * | 1999-07-01 | 2009-11-18 | エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ | 使用済グリコール系スラリーの分離、再生および再使用法 |
| JP4609675B2 (ja) * | 2007-08-16 | 2011-01-12 | オルガノ株式会社 | メタル研磨ｃｍｐ工程排水処理装置及び方法 |
-
2010
- 2010-06-25 JP JP2010144448A patent/JP5640260B2/ja active Active
-
2011
- 2011-06-14 TW TW100120660A patent/TWI501838B/zh active
- 2011-06-15 KR KR1020110058125A patent/KR101799598B1/ko active Active
- 2011-06-23 CN CN201110172424.2A patent/CN102294758B/zh active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1133361A (ja) * | 1997-07-18 | 1999-02-09 | Toshiba Ceramics Co Ltd | 微細粒子を含む液体の処理方法および処理装置 |
| JP2000343525A (ja) * | 1999-06-08 | 2000-12-12 | Sumitomo Metal Ind Ltd | 半導体材料の切断・加工方法 |
| JP2010030033A (ja) * | 2008-07-02 | 2010-02-12 | Sharp Corp | クーラント再生方法およびスラリー再生方法 |
| WO2010071873A2 (en) * | 2008-12-20 | 2010-06-24 | Cabot Microelectronics Corporation | Wiresaw cutting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102294758A (zh) | 2011-12-28 |
| JP2012006115A (ja) | 2012-01-12 |
| TW201208814A (en) | 2012-03-01 |
| CN102294758B (zh) | 2015-08-05 |
| KR101799598B1 (ko) | 2017-11-20 |
| KR20120000502A (ko) | 2012-01-02 |
| JP5640260B2 (ja) | 2014-12-17 |
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