TWI501838B - Coolant recovery method - Google Patents
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- TWI501838B TWI501838B TW100120660A TW100120660A TWI501838B TW I501838 B TWI501838 B TW I501838B TW 100120660 A TW100120660 A TW 100120660A TW 100120660 A TW100120660 A TW 100120660A TW I501838 B TWI501838 B TW I501838B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
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- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
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Description
本發明係關於從晶錠之切片工程排出之冷卻液之回收方法。The present invention relates to a method for recovering a coolant discharged from a slicing process of an ingot.
在半導體或太陽能電池等之製造工程中，有將矽、碳化矽、藍寶石等之晶錠，藉由線鋸等切片的工程。在此切片工程係一邊將被稱為coolant的冷卻液吹向線上一邊進行切斷。氧化矽等磨粒，係以補助藉由線切斷之目的而被使用，使磨粒分散在冷卻液中而藉由線來進行切斷之游離磨粒方式，與使用固定了磨粒之線之固定磨粒方式被採用。此固定磨粒方式相較於游離磨粒方式之鋒利度佳，不僅可縮短作業時間，且有可使所切斷之晶圓的厚度之差異小之優點。In the manufacturing process of a semiconductor or a solar cell, there is a process of slicing an ingot such as tantalum, niobium carbide or sapphire by a wire saw or the like. In this slicing system, the cooling liquid called coolant is blown to the line and cut. The abrasive grains such as cerium oxide are used in the form of a free abrasive grain in which the abrasive grains are dispersed in the cooling liquid and are cut by the wire, and the wire in which the abrasive grains are fixed is used. The fixed abrasive method is adopted. This fixed abrasive grain method has better sharpness than the free abrasive grain method, and not only can shorten the working time, but also has the advantage that the difference in thickness of the cut wafer can be made small.
多量之冷卻液會從如此之晶錠之切片工程排出，但直接廢棄不僅從經濟上的觀點，以及環保上的觀點來看都不佳。因此，將被排出之冷卻液回收再利用為佳。A large amount of coolant will be discharged from the slicing of such ingots, but direct disposal is not only economically and environmentally friendly. Therefore, it is preferable to recycle and discharge the discharged coolant.
在此冷卻液中除了磨粒以外，混入了多量的晶錠的切屑。因此，有必要將這些混在物分離除去而僅回收冷卻液成分。因此專利文獻1中，提案了將所回收之冷卻液放入離心分離器後，更由不織布所形成之過濾器處理之方法。又，專利文獻2中，也開示了使用離心分離器之方法。In addition to the abrasive grains, a large amount of chips of the ingot are mixed in the coolant. Therefore, it is necessary to separate and remove these mixed substances and recover only the coolant component. Therefore, in Patent Document 1, a method in which the collected cooling liquid is placed in a centrifugal separator and further processed by a filter formed of a non-woven fabric is proposed. Further, Patent Document 2 also discloses a method of using a centrifugal separator.
然而，以這些以往的方法所得到之磨粒與切屑之分離效率差，特別是矽切屑由於具有0.1μm~10μm之範圍的粒度因此無法充分除去，而有所得到之回收液的清澄度低的問題。However, the separation efficiency of the abrasive grains and the chips obtained by these conventional methods is inferior, and in particular, the ruthenium chips have a particle size in the range of 0.1 μm to 10 μm, and thus cannot be sufficiently removed, and the obtained recovery liquid has a low degree of clarity. problem.
因此，本發明者們，嘗試使用膜孔徑為0.1μm程度之陶瓷膜來將冷卻液中之矽切屑分離除去。若使用如此之陶瓷膜，應該幾乎可以完全除去0.1~10μm之矽切屑。然而，由於冷卻液中含有分子量為1萬~100萬之增黏劑，若要過濾如此之冷卻液，則由於增黏劑無法透過膜，而無法提高過濾速度，可確認到缺乏實用性。Therefore, the present inventors attempted to separate and remove the swarf chips in the cooling liquid using a ceramic film having a membrane pore size of about 0.1 μm. If such a ceramic film is used, the chip of 0.1 to 10 μm should be almost completely removed. However, since the coolant contains a viscosity-increasing agent having a molecular weight of 10,000 to 1,000,000, if such a coolant is to be filtered, since the tackifier cannot pass through the film, the filtration speed cannot be increased, and the practicality is not confirmed.
【專利文獻1】日本專利特開平9-168971號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 9-168971
【專利文獻2】日本專利特開11-33913號公報[Patent Document 2] Japanese Patent Laid-Open No. 11-33913
因此本發明之目的係解決上述先前問題點，提供即使從晶錠之切片工程中排出之冷卻液含有增黏劑之情況，也可充分除去混入之矽粉，且可維持實用的過濾速度之冷卻液的回收方法。Therefore, the object of the present invention is to solve the above-mentioned problems, and to provide a cooling powder which can be sufficiently removed even if the coolant discharged from the slicing process of the ingot contains a tackifier, and can maintain a practical filtration speed. Liquid recovery method.
為解決上述課題而做成之本發明，係將從晶錠之切片工程排出之含有增黏劑之冷卻液，藉由陶瓷膜過濾將切屑膜分離，將所得到之清澄的冷卻液回收之冷卻液回收方 法，其特徵在於：藉由使用膜孔徑為1~10μm之陶瓷膜，不僅可確保含有增黏劑之冷卻液之過濾速度，且藉由定期的重覆進行空氣逆洗，而可一邊抑制過濾速度的低下且掃流過濾。In order to solve the above problems, the present invention is a cooling liquid containing a tackifier which is discharged from a slicing process of an ingot, and the chip film is separated by filtration through a ceramic membrane, and the obtained clear cooling liquid is cooled and recovered. Liquid recovery The method is characterized in that by using a ceramic membrane having a membrane pore diameter of 1 to 10 μm, not only the filtration speed of the coolant containing the tackifier but also the periodic backwashing of the air can be suppressed, and the filtration can be suppressed while the filtration is performed. The speed is low and the sweep is filtered.
又，在較佳的實施形態中，前述切屑是在固定磨粒方式之切片工程中發生，冷卻液係以聚乙二醇為主成分，含有分子量為1萬~100萬之增黏劑。又，增黏劑之黏度為15~20厘泊(cP)。Further, in a preferred embodiment, the chips are generated in a fixed abrasive grain sectioning process, and the coolant is mainly composed of polyethylene glycol and contains a tackifier having a molecular weight of 10,000 to 1,000,000. Moreover, the viscosity of the tackifier is 15 to 20 centipoise (cP).
又，可附加在所回收之清澄之冷卻液中添加調合新的冷卻液，送回至晶錠之切片工程之工程。Further, it is possible to add a new cooling liquid to the recovered clarified cooling liquid and return it to the slicing engineering of the ingot.
根據本發明之冷卻液的回收方法，從晶錠之切片工程排出之含有增黏劑之冷卻液，係藉由膜孔徑為1~10μm之陶瓷膜掃流過濾而分離切屑。由於使用如此之膜孔徑大的陶瓷膜，因此包含在冷卻液中之分子量為1萬~100萬之增黏劑也可透過膜孔。又，如前述，切屑係具有0.1~10μm之粒度分布，但由於在陶瓷膜之膜內部之捕捉或是由於堆積於膜之一次側表面之切屑之補捉效果，即使是膜孔徑為1~10μm之陶瓷膜也可充分除去切屑。According to the method for recovering a cooling liquid of the present invention, the coolant containing the tackifier discharged from the slicing process of the ingot is subjected to sweeping filtration by a ceramic membrane having a pore diameter of 1 to 10 μm to separate the chips. Since such a ceramic film having a large pore diameter is used, a tackifier having a molecular weight of 10,000 to 1,000,000 contained in the cooling liquid can also pass through the pores of the membrane. Further, as described above, the chip has a particle size distribution of 0.1 to 10 μm, but the film pore diameter is 1 to 10 μm due to the trapping inside the film of the ceramic film or the chipping effect of the chips deposited on the primary side surface of the film. The ceramic film can also sufficiently remove chips.
又，根據本發明之冷卻液之回收方法，藉由定期的反覆進行僅有空氣的逆洗，而抑制冷卻液的過濾速度低下。因此過濾液不需要使用於陶瓷膜之逆洗，所以可提高冷卻液之回收效率。Further, according to the method for recovering a cooling liquid of the present invention, the backwashing with only air is periodically repeated, and the filtration rate of the cooling liquid is suppressed from being lowered. Therefore, the filtrate does not need to be used for backwashing of the ceramic membrane, so that the recovery efficiency of the coolant can be improved.
以下，顯示本發明之實施形態。在以下之說明晶錠雖為矽晶錠，但對於從碳化矽、藍寶石等之晶錠的切片工程排出之冷卻液，也可同樣的適用。Hereinafter, embodiments of the present invention will be described. In the following description, the ingot is a twin ingot, but the same applies to the cooling liquid discharged from the slicing of an ingot such as tantalum carbide or sapphire.
第1圖係表示本發明之實施形態之方塊圖，1為矽晶錠之切片工程，2為從此切片工程1排出之冷卻液的回收槽。在切片工程1中，一邊將被稱為coolant的冷卻液吹向線上一邊進行切斷。如前述，切斷方式已知有固定磨粒方式與游離磨粒方式，本發明對於任一種之方式皆可對應。將矽晶錠切片之線鋸用的冷卻液係以聚乙二醇為主成分，含有分子量為1萬~100萬之增黏劑，具有15~20厘泊之黏性者居多。若切削進行，則由於冷卻液中矽切屑逐漸蓄積而性能逐漸劣化，因此將已使用之冷卻液批次的排出至回收槽2。如前述，矽切屑係具有0.1~10μm之粒度分布。Fig. 1 is a block diagram showing an embodiment of the present invention, wherein 1 is a slicing process of a twin ingot, and 2 is a recovery tank for a coolant discharged from the slicing project 1. In the slicing project 1, the cooling liquid called coolant is cut while being blown onto the wire. As described above, the cutting method is known to have a fixed abrasive grain method and a free abrasive grain method, and the present invention can be applied to any of the methods. The coolant for the wire saw of the twin ingot is mainly composed of polyethylene glycol, and contains a tackifier having a molecular weight of 10,000 to 1,000,000, and has a viscosity of 15 to 20 centipoise. When the cutting is performed, the performance of the coolant is gradually deteriorated due to the gradual accumulation of the swarf in the coolant, so that the used coolant batch is discharged to the recovery tank 2. As described above, the ruthenium chips have a particle size distribution of 0.1 to 10 μm.
將所排出之已使用冷卻液從回收槽2藉由過濾用泵浦3而送往陶瓷膜4，而進行掃流過濾。陶瓷膜4為膜孔徑1~10μm之物，在此實施形態雖使用陶瓷製之連續式管柱膜，但膜形狀並不限定於此，也可為平膜或管狀膜。使所使用之陶瓷膜4之膜孔徑為1~10μm，係由於若膜孔徑較此小，則增黏劑之分子不容易透過膜孔，過濾速度變慢而不實用，相反的若超過10μm，則具有0.1~10μm之粒度分布之矽切屑之一部無法分離除去，而變得無法得到清澄的冷卻液之故。膜孔徑若在1~10μm之範圍，則矽切屑幾乎可100%分離除去。又，陶瓷膜4之膜孔徑之更佳的範圍為1~3μm。The discharged used coolant is sent from the recovery tank 2 to the ceramic membrane 4 by the filtration pump 3, and is subjected to sweep filtration. The ceramic membrane 4 has a membrane pore size of 1 to 10 μm. In this embodiment, a ceramic continuous tubular membrane is used. However, the membrane shape is not limited thereto, and may be a flat membrane or a tubular membrane. The membrane pore size of the ceramic membrane 4 to be used is 1 to 10 μm, because if the pore diameter of the membrane is small, the molecules of the tackifier do not easily penetrate the pores of the membrane, and the filtration speed is slow and practical, and if it exceeds 10 μm, Then, one of the chips having a particle size distribution of 0.1 to 10 μm cannot be separated and removed, and a clear coolant cannot be obtained. When the pore diameter of the membrane is in the range of 1 to 10 μm, the crumb is almost 100% separated and removed. Further, the film aperture of the ceramic film 4 is more preferably in the range of 1 to 3 μm.
如此而除去了矽切屑等之陶瓷膜4的過濾液，係被送往過濾冷卻液槽5。又，通過陶瓷膜4之一次側之濃縮液係藉由配管6而被送回回收槽2。此濃縮液係與已使用之冷卻液混合而再度藉由泵浦3送往陶瓷膜4，進行掃流過濾，因此回收槽2之內部的冷卻液會被逐漸濃縮。與此之同時過濾速度也會逐漸低下，但在本發明，藉由反覆僅有空氣之逆洗，而抑制冷卻液之過濾速度低下。The filtrate of the ceramic membrane 4 from which the chips or the like are removed in this manner is sent to the filtration coolant tank 5. Further, the concentrated liquid that has passed through the primary side of the ceramic membrane 4 is returned to the recovery tank 2 by the pipe 6. This concentrate is mixed with the used coolant and sent to the ceramic membrane 4 by the pump 3 again for sweep filtration, so that the coolant inside the recovery tank 2 is gradually concentrated. At the same time, the filtration speed is gradually lowered, but in the present invention, the filtration speed of the cooling liquid is suppressed to be lowered by repeating the backwashing only with air.
空氣逆洗，係藉由從逆洗用空氣源7來將壓縮空氣導入陶瓷膜4之二次側來進行。在本發明中僅有空氣逆洗的有效理由，係由於陶瓷膜4之膜孔徑大，為1~10μm，因此比較低壓的空氣貫通膜面而從一次側吹出，可使膜內的閉塞物剝離之故。此時，殘留於膜內之增黏劑也被吹出在一次側。空氣逆洗的頻率為每5~30分鐘1次，1次的空氣逆洗所需要的時間為1~5秒左右。此空氣逆洗，係在過濾運轉繼續中進行，其壓力為較一次側的液體壓力高0.2~0.5MPa程度之高壓即可。The air backwashing is performed by introducing compressed air from the backwashing air source 7 to the secondary side of the ceramic membrane 4. In the present invention, the reason why only the air backwashing is effective is that the ceramic membrane 4 has a large pore diameter of 1 to 10 μm. Therefore, the relatively low-pressure air penetrates the membrane surface and is blown from the primary side, so that the occlusion in the membrane can be peeled off. The reason. At this time, the tackifier remaining in the film was also blown out on the primary side. The frequency of air backwashing is once every 5 to 30 minutes, and the time required for air backwashing once is about 1 to 5 seconds. This air backwashing is carried out while the filtration operation is continued, and the pressure is higher than the liquid pressure of the primary side by 0.2 to 0.5 MPa.
反覆如此之空氣逆洗而持續進行掃流過濾，回收槽2內之已使用回收液之SS濃度達到25~40wt%。若到達此狀態，則被濃縮之已使用冷卻液被取出至廢棄槽8，陶瓷膜4係藉由氫氧化鈉或硝酸等藥品來藥品洗淨。陶瓷膜4相較於高分子膜耐藥性優良，因此即使重覆使用了氫氧化鈉或硝酸之藥液洗淨也不會劣化。In response to such air backwashing, the sweep filtration is continued, and the concentration of the used recovered liquid in the recovery tank 2 reaches 25 to 40% by weight. When this state is reached, the concentrated coolant is taken out to the disposal tank 8, and the ceramic membrane 4 is washed with a medicine such as sodium hydroxide or nitric acid. Since the ceramic membrane 4 is superior in chemical resistance to the polymer membrane, it is not deteriorated even if it is washed with a chemical solution of sodium hydroxide or nitric acid.
另一方面，過濾冷卻槽5中收集了除去矽切屑的冷卻液。此冷卻液為矽切屑幾乎100%被除去之清澄的冷卻液，因此在調合槽9中添加了新的冷卻液後送回切片工程1，而被再使用。On the other hand, in the filtration cooling tank 5, the cooling liquid from which the swarf chips are removed is collected. This coolant is a clear coolant in which the swarf chips are almost 100% removed. Therefore, a new coolant is added to the mixing tank 9, and then returned to the slicing project 1 and reused.
在以上說明之實施形態，已使用之冷卻液係從回收槽2直接送往陶瓷膜4而進行掃流過濾，但也可以如第2圖所示，在陶瓷膜4之前段設置既存技術之被稱為傾倒型離心機(Decanter)之離心分離機10。藉由此離心分離機10之矽切屑的分離回收雖不完全，但若將混入冷卻液之矽切屑的一部分藉由離心分離機10除去，則陶瓷膜4之負荷被減輕，維持更高速之過濾速度變得可能。又，離心分離機10與陶瓷膜4並列設置也是可能的。In the embodiment described above, the used cooling liquid is directly sent to the ceramic membrane 4 from the recovery tank 2 to perform the sweep filtration. However, as shown in Fig. 2, the existing technique may be provided in the front stage of the ceramic membrane 4. A centrifugal separator 10 called a decanter. Although the separation and recovery of the chips by the centrifugal separator 10 are incomplete, if a part of the chips which are mixed with the coolant is removed by the centrifugal separator 10, the load of the ceramic membrane 4 is reduced, and the filtration at a higher speed is maintained. Speed is possible. Further, it is also possible to arrange the centrifugal separator 10 in parallel with the ceramic membrane 4.
如此，藉由本發明，從晶錠之切片工程排出之含有增黏劑之冷卻液，可以實用的過濾速度充分除去切屑，而回收清澄的冷卻液。以下顯示本發明之實施例。As described above, according to the present invention, the coolant containing the tackifier discharged from the slicing process of the ingot can sufficiently remove the chips at a practical filtration rate, and recover the clear coolant. Embodiments of the invention are shown below.
【實施例】[Examples]
使用膜孔徑為2μm之連續式管柱膜型陶瓷膜(本申請者之公司製：19孔)，進行從矽晶錠之切片工程排出之種之已使用冷卻液的過濾。過濾溫度為室溫(25℃)。重覆過濾開始後每10分鐘後進行2秒鐘的空氣逆洗，持續24小時之掃流過濾。A continuous tubular membrane type ceramic membrane (manufactured by the company of the present applicant: 19 holes) having a membrane pore size of 2 μm was used, and filtration of the used coolant discharged from the slicing of the twin ingot was performed. The filtration temperature was room temperature (25 ° C). After 10 minutes from the start of the repeated filtration, air backwashing was carried out for 2 seconds, followed by sweep filtration for 24 hours.
其結果係如第3圖之圖表所示，已使用之冷卻液A在過濾開始時之SS濃度為約10wt%，可濃縮到約35wt%。又，過濾速度在過濾開始時為45L/m2 h，但在過濾結束時為20L/m2 h。已使用之冷卻液B在過濾開始時SS濃度為10wt%，可濃縮到約30wt%。又，過濾速度在過濾開始時為50L/m2 h，但在過濾結束時為15 L/m2 h。已使用之冷卻液C在過濾開始時SS濃度為8wt%，可濃縮到約25wt%。又，過濾速度在過濾開始時為30L/m2 h，但在過濾結束時為10L/m2 h。已使用之冷卻液D在過濾開始時SS濃度為6wt%，可濃縮到約25wt%。又，過濾速度在過濾開始時為20L/m2 h，但在過濾結束時為10L/m2 h。如此，已使用冷卻液之特性雖然有很大的差異，但只要根據本發明，含有矽切屑之已使用冷卻液皆大幅濃縮且可回收清澄的冷卻液。The result is as shown in the graph of Fig. 3, and the used coolant A has an SS concentration of about 10% by weight at the start of filtration and can be concentrated to about 35 wt%. And the filtration rate at the start of filtration of 45L / m 2 h, but at the end of the filter 20L / m 2 h. The coolant B that has been used has a SS concentration of 10% by weight at the start of filtration and can be concentrated to about 30% by weight. Further, the filtration rate was 50 L/m 2 h at the start of filtration, but was 15 L/m 2 h at the end of filtration. The coolant C that has been used has an SS concentration of 8 wt% at the start of filtration and can be concentrated to about 25 wt%. Further, the filtration rate was 30 L/m 2 h at the start of filtration, but was 10 L/m 2 h at the end of filtration. The coolant D that has been used has a SS concentration of 6 wt% at the start of filtration and can be concentrated to about 25 wt%. Further, the filtration rate was 20 L/m 2 h at the start of filtration, but was 10 L/m 2 h at the end of filtration. Thus, although the characteristics of the used coolant are greatly different, according to the present invention, the used coolant containing the swarf chips is greatly concentrated and the clear coolant can be recovered.
相對於此，使用分畫分子量為2萬之UF膜，過濾SS濃度約10wt%之已使用冷卻液E之情況，雖然過濾結束時之SS濃度為20wt%，但過濾速度較10 L/m2 h還慢很多，過濾品質也由於增黏劑被大幅除去，做為再生冷卻液之品質變化而不實用。On the other hand, in the case of using a UF film having a molecular weight of 20,000, and filtering the SS concentration of about 10% by weight, the coolant E was used, and although the SS concentration at the end of filtration was 20% by weight, the filtration rate was 10 L/m 2 . h is still much slower, and the quality of the filter is also largely removed by the tackifier, which is not practical as a quality change of the regenerative coolant.
又，在此實施例之SS濃度的測定係以下述方法進行。Further, the measurement of the SS concentration in this example was carried out by the following method.
(1) 首先，測定在乾燥器內乾燥保管之0.1μm薄膜過濾器之重量W1(mg)。(1) First, the weight W1 (mg) of a 0.1 μm membrane filter that was dried and stored in a desiccator was measured.
(2) 以0.1μm薄膜過濾器過濾V(mL)之試料。(2) A sample of V (mL) was filtered through a 0.1 μm membrane filter.
(3) 為防止從溶劑成分之析出，將堆積於0.1μm薄膜過濾器上之懸濁物質以純水充分洗淨。(3) In order to prevent precipitation from the solvent component, the suspended matter deposited on the 0.1 μm membrane filter was sufficiently washed with pure water.
(4) 使0.1μm薄膜過濾器及懸濁物質充分乾燥後，測定重量C(mg)。(4) After the 0.1 μm membrane filter and the suspended material were sufficiently dried, the weight C (mg) was measured.
(5) SS濃度(mg/L)，係藉由SS濃度=(W2-W1)/(V/1000)之式算出。(5) The SS concentration (mg/L) was calculated by the formula of SS concentration = (W2-W1) / (V / 1000).
如以上所說明，根據本發明，可從晶錠之切片工程排出之含有增黏劑的冷卻液分離除去切屑，而回收清澄之冷卻液，因此在經濟面及環保面皆可得到優良的成果。As described above, according to the present invention, the thickener-containing coolant discharged from the slicing process of the ingot can be separated and removed, and the clear cooling liquid can be recovered, so that excellent results can be obtained on both the economical and environmentally friendly surfaces.
1．．．晶錠之切片工程1. . . Ingot slicing engineering
2．．．冷卻液之回收槽2. . . Coolant recovery tank
3．．．過濾用泵浦3. . . Filter pump
4．．．陶瓷膜4. . . Ceramic Membrane
5．．．過濾冷卻液槽5. . . Filtration coolant tank
6．．．配管6. . . Piping
7．．．逆洗用空氣源7. . . Backwash air source
8．．．廢棄槽8. . . Abandoned tank
9．．．調合槽9. . . Blending slot
10．．．離心分離機10. . . Centrifugal separator
第1圖係表示本發明之實施形態之方塊圖。Fig. 1 is a block diagram showing an embodiment of the present invention.
第2圖係表示本發明之另一實施形態之圖表。Fig. 2 is a chart showing another embodiment of the present invention.
第3圖係表示本發明之實施例之圖表。Figure 3 is a diagram showing an embodiment of the present invention.
1．．．晶錠之切片工程1. . . Ingot slicing engineering
2．．．冷卻液之回收槽2. . . Coolant recovery tank
3．．．過濾用泵浦3. . . Filter pump
4．．．陶瓷膜4. . . Ceramic Membrane
5．．．過濾冷卻液槽5. . . Filtration coolant tank
6．．．配管6. . . Piping
7．．．逆洗用空氣源7. . . Backwash air source
8．．．廢棄槽8. . . Abandoned tank
9．．．調合槽9. . . Blending slot
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| JP6331474B2 (en) * | 2014-02-28 | 2018-05-30 | ブラザー工業株式会社 | Machine tool cleaning fluid filtration device |
| CN105174522B (en) * | 2015-10-09 | 2017-11-17 | 浙江瑞翌新材料科技股份有限公司 | A kind of recovery method and system of the useless cold but liquid of Buddha's warrior attendant wire cutting |
| CN117774150A (en) * | 2022-09-22 | 2024-03-29 | 内蒙古中环光伏材料有限公司 | Method for removing silicon powder in cooling liquid for slicing silicon single crystal diamond wire |
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| JPH1133361A (en) * | 1997-07-18 | 1999-02-09 | Toshiba Ceramics Co Ltd | Process for treating liquid containing fine particle and equipment thereof |
| JP2000343525A (en) * | 1999-06-08 | 2000-12-12 | Sumitomo Metal Ind Ltd | Method for cutting/processing semiconductor material |
| JP2010030033A (en) * | 2008-07-02 | 2010-02-12 | Sharp Corp | Method of regenerating coolant and method of regenerating slurry |
| WO2010071873A2 (en) * | 2008-12-20 | 2010-06-24 | Cabot Microelectronics Corporation | Wiresaw cutting method |
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| JP3249373B2 (en) * | 1996-02-21 | 2002-01-21 | 信越半導体株式会社 | Water-soluble slurry wastewater recycling system |
| US5664990A (en) * | 1996-07-29 | 1997-09-09 | Integrated Process Equipment Corp. | Slurry recycling in CMP apparatus |
| JP3389141B2 (en) * | 1999-04-26 | 2003-03-24 | 株式会社スーパーシリコン研究所 | Evaluation method of slurry for slicing and slurry |
| JP4369054B2 (en) * | 1999-07-01 | 2009-11-18 | エムイーエムシー・エレクトロニック・マテリアルズ・ソシエタ・ペル・アチオニ | Separation, regeneration and reuse of spent glycol slurry |
| JP4609675B2 (en) * | 2007-08-16 | 2011-01-12 | オルガノ株式会社 | Metal polishing CMP process wastewater treatment apparatus and method |
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| JPH1133361A (en) * | 1997-07-18 | 1999-02-09 | Toshiba Ceramics Co Ltd | Process for treating liquid containing fine particle and equipment thereof |
| JP2000343525A (en) * | 1999-06-08 | 2000-12-12 | Sumitomo Metal Ind Ltd | Method for cutting/processing semiconductor material |
| JP2010030033A (en) * | 2008-07-02 | 2010-02-12 | Sharp Corp | Method of regenerating coolant and method of regenerating slurry |
| WO2010071873A2 (en) * | 2008-12-20 | 2010-06-24 | Cabot Microelectronics Corporation | Wiresaw cutting method |
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