TWI501336B - 用以控制感應耦合電漿室中邊緣表現的設備與方法 - Google Patents

用以控制感應耦合電漿室中邊緣表現的設備與方法 Download PDF

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Publication number
TWI501336B
TWI501336B TW097149222A TW97149222A TWI501336B TW I501336 B TWI501336 B TW I501336B TW 097149222 A TW097149222 A TW 097149222A TW 97149222 A TW97149222 A TW 97149222A TW I501336 B TWI501336 B TW I501336B
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TW
Taiwan
Prior art keywords
substrate
edge
top plate
processing
top surface
Prior art date
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TW097149222A
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English (en)
Chinese (zh)
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TW200939381A (en
Inventor
劉煒
史文博格玖漢尼斯
蓋葉韓Ｄ
蓋葉頌Ｔ
寇蒂斯羅傑
伯提妮菲利浦Ａ
馬克麥可Ｊ
Original Assignee
應用材料股份有限公司
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Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW200939381A publication Critical patent/TW200939381A/zh
Application granted granted Critical
Publication of TWI501336B publication Critical patent/TWI501336B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
TW097149222A 2007-12-19 2008-12-17 用以控制感應耦合電漿室中邊緣表現的設備與方法 TWI501336B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/960,300 US8999106B2 (en) 2007-12-19 2007-12-19 Apparatus and method for controlling edge performance in an inductively coupled plasma chamber

Publications (2)

Publication Number Publication Date
TW200939381A TW200939381A (en) 2009-09-16
TWI501336B true TWI501336B (zh) 2015-09-21

Family

ID=40789121

Family Applications (2)

Application Number Title Priority Date Filing Date
TW097149222A TWI501336B (zh) 2007-12-19 2008-12-17 用以控制感應耦合電漿室中邊緣表現的設備與方法
TW104108494A TWI534930B (zh) 2007-12-19 2008-12-17 用以控制感應耦合電漿室中邊緣表現的設備與方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104108494A TWI534930B (zh) 2007-12-19 2008-12-17 用以控制感應耦合電漿室中邊緣表現的設備與方法

Country Status (6)

Country Link
US (1) US8999106B2 (https=)
JP (1) JP5704923B2 (https=)
KR (1) KR101504084B1 (https=)
CN (1) CN101874292B (https=)
TW (2) TWI501336B (https=)
WO (1) WO2009085709A1 (https=)

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Also Published As

Publication number Publication date
KR20100105695A (ko) 2010-09-29
JP2011510481A (ja) 2011-03-31
CN101874292A (zh) 2010-10-27
KR101504084B1 (ko) 2015-03-19
TW200939381A (en) 2009-09-16
US20090162952A1 (en) 2009-06-25
JP5704923B2 (ja) 2015-04-22
WO2009085709A1 (en) 2009-07-09
US8999106B2 (en) 2015-04-07
CN101874292B (zh) 2013-02-13
TWI534930B (zh) 2016-05-21
TW201523773A (zh) 2015-06-16

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