TWI499644B - 硬化性組成物、硬化物以及光半導體裝置 - Google Patents

硬化性組成物、硬化物以及光半導體裝置 Download PDF

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Publication number
TWI499644B
TWI499644B TW101114054A TW101114054A TWI499644B TW I499644 B TWI499644 B TW I499644B TW 101114054 A TW101114054 A TW 101114054A TW 101114054 A TW101114054 A TW 101114054A TW I499644 B TWI499644 B TW I499644B
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TW
Taiwan
Prior art keywords
group
polyoxyalkylene
integer
mol
sio
Prior art date
Application number
TW101114054A
Other languages
English (en)
Chinese (zh)
Other versions
TW201247785A (en
Inventor
中西康二
田崎太一
長谷川公一
Original Assignee
Jsr股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr股份有限公司 filed Critical Jsr股份有限公司
Publication of TW201247785A publication Critical patent/TW201247785A/zh
Application granted granted Critical
Publication of TWI499644B publication Critical patent/TWI499644B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101114054A 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置 TWI499644B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011094922 2011-04-21
JP2012034100A JP5505436B2 (ja) 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン

Publications (2)

Publication Number Publication Date
TW201247785A TW201247785A (en) 2012-12-01
TWI499644B true TWI499644B (zh) 2015-09-11

Family

ID=47433784

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101114054A TWI499644B (zh) 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置
TW104108949A TW201525073A (zh) 2011-04-21 2012-04-20 聚矽氧烷

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW104108949A TW201525073A (zh) 2011-04-21 2012-04-20 聚矽氧烷

Country Status (2)

Country Link
JP (2) JP5505436B2 (OSRAM)
TW (2) TWI499644B (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101556274B1 (ko) * 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
US11028266B2 (en) 2016-08-12 2021-06-08 Wacker Chemie Ag Curable organopolysiloxane composition, encapsulant and semiconductor device
EP3660100B1 (en) * 2017-07-24 2024-10-30 Dow Toray Co., Ltd. Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure
JP7574544B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び、樹脂添加用オルガノポリシロキサン組成物
JP7574543B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び樹脂添加用オルガノポリシロキサン組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167228A (ja) * 1989-11-28 1991-07-19 Shin Etsu Chem Co Ltd エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末
TW201035173A (en) * 2008-12-05 2010-10-01 Shinetsu Chemical Co Addition curable silicone composition for producing cured product having high refractive index, and sealing material for optical device comprising the composition
JP2010265437A (ja) * 2009-04-14 2010-11-25 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469327B2 (ja) * 1994-08-03 2003-11-25 信越化学工業株式会社 オルガノポリシロキサンの製造方法
JP2003192790A (ja) * 2001-12-27 2003-07-09 Dow Corning Toray Silicone Co Ltd ラジカル重合性オルガノポリシロキサン混合物およびその製造方法
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP2011057755A (ja) * 2009-09-07 2011-03-24 Shin-Etsu Chemical Co Ltd シリコーン組成物及びその硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167228A (ja) * 1989-11-28 1991-07-19 Shin Etsu Chem Co Ltd エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末
TW201035173A (en) * 2008-12-05 2010-10-01 Shinetsu Chemical Co Addition curable silicone composition for producing cured product having high refractive index, and sealing material for optical device comprising the composition
JP2010265437A (ja) * 2009-04-14 2010-11-25 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物

Also Published As

Publication number Publication date
JP5696798B2 (ja) 2015-04-08
JP2012233153A (ja) 2012-11-29
TW201525073A (zh) 2015-07-01
JP2014074183A (ja) 2014-04-24
JP5505436B2 (ja) 2014-05-28
TW201247785A (en) 2012-12-01

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