TWI498297B - Glass substrate processing methods - Google Patents

Glass substrate processing methods Download PDF

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Publication number
TWI498297B
TWI498297B TW102119857A TW102119857A TWI498297B TW I498297 B TWI498297 B TW I498297B TW 102119857 A TW102119857 A TW 102119857A TW 102119857 A TW102119857 A TW 102119857A TW I498297 B TWI498297 B TW I498297B
Authority
TW
Taiwan
Prior art keywords
laser
glass substrate
processing
irradiation step
line
Prior art date
Application number
TW102119857A
Other languages
English (en)
Chinese (zh)
Other versions
TW201400425A (zh
Inventor
Norifumi Arima
Kenji Fukuhara
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201400425A publication Critical patent/TW201400425A/zh
Application granted granted Critical
Publication of TWI498297B publication Critical patent/TWI498297B/zh

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
TW102119857A 2012-06-19 2013-06-05 Glass substrate processing methods TWI498297B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012137410A JP5991860B2 (ja) 2012-06-19 2012-06-19 ガラス基板の加工方法

Publications (2)

Publication Number Publication Date
TW201400425A TW201400425A (zh) 2014-01-01
TWI498297B true TWI498297B (zh) 2015-09-01

Family

ID=49892160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102119857A TWI498297B (zh) 2012-06-19 2013-06-05 Glass substrate processing methods

Country Status (4)

Country Link
JP (1) JP5991860B2 (ja)
KR (1) KR101556282B1 (ja)
CN (1) CN103508666B (ja)
TW (1) TWI498297B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
WO2016010954A2 (en) 2014-07-14 2016-01-21 Corning Incorporated Systems and methods for processing transparent materials using adjustable laser beam focal lines
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
JP6664686B2 (ja) * 2015-10-05 2020-03-13 国立大学法人埼玉大学 基板加工方法及び剥離基板製造方法
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
WO2018180417A1 (ja) * 2017-03-31 2018-10-04 三星ダイヤモンド工業株式会社 スクライブ加工方法及びスクライブ加工装置
CN110204187B (zh) * 2018-02-28 2021-06-08 深圳市裕展精密科技有限公司 激光切割装置
KR102140979B1 (ko) * 2018-09-20 2020-08-05 (주)유티아이 직각 형상 가공을 위한 개선된 slp 및 이에 의해 제조된 직각 형상 가공을 위한 셀컷팅된 쉬트글라스

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05305467A (ja) * 1992-04-27 1993-11-19 Central Glass Co Ltd 光透過性材料のレーザー切断法
JP2007038287A (ja) * 2005-08-05 2007-02-15 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2009269057A (ja) * 2008-05-08 2009-11-19 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
CN102271860A (zh) * 2008-12-17 2011-12-07 伊雷克托科学工业股份有限公司 用于激光加工具有倒角边缘的玻璃的方法
CN102470549A (zh) * 2009-07-03 2012-05-23 旭硝子株式会社 脆性材料基板的切割方法、切割装置以及通过该切割方法获得的车辆用窗玻璃

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
TW568809B (en) 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
KR101181707B1 (ko) * 2004-05-20 2012-09-19 미쓰보시 다이야몬도 고교 가부시키가이샤 머더 기판 절단방법, 머더 기판 스크라이브 장치,프로그램 및 기록매체
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
EP2480507A1 (en) * 2009-08-28 2012-08-01 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05305467A (ja) * 1992-04-27 1993-11-19 Central Glass Co Ltd 光透過性材料のレーザー切断法
JP2007038287A (ja) * 2005-08-05 2007-02-15 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2009269057A (ja) * 2008-05-08 2009-11-19 Miyachi Technos Corp レーザ加工方法及びレーザ加工装置
CN102271860A (zh) * 2008-12-17 2011-12-07 伊雷克托科学工业股份有限公司 用于激光加工具有倒角边缘的玻璃的方法
CN102470549A (zh) * 2009-07-03 2012-05-23 旭硝子株式会社 脆性材料基板的切割方法、切割装置以及通过该切割方法获得的车辆用窗玻璃

Also Published As

Publication number Publication date
JP5991860B2 (ja) 2016-09-14
JP2014001102A (ja) 2014-01-09
CN103508666B (zh) 2016-03-09
TW201400425A (zh) 2014-01-01
KR20130142917A (ko) 2013-12-30
CN103508666A (zh) 2014-01-15
KR101556282B1 (ko) 2015-09-30

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