KR101556282B1 - 유리 기판의 가공 방법 - Google Patents

유리 기판의 가공 방법 Download PDF

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Publication number
KR101556282B1
KR101556282B1 KR1020130062309A KR20130062309A KR101556282B1 KR 101556282 B1 KR101556282 B1 KR 101556282B1 KR 1020130062309 A KR1020130062309 A KR 1020130062309A KR 20130062309 A KR20130062309 A KR 20130062309A KR 101556282 B1 KR101556282 B1 KR 101556282B1
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South Korea
Prior art keywords
laser
line
substrate
divided
irradiation step
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KR1020130062309A
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English (en)
Korean (ko)
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KR20130142917A (ko
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노리후미 아리마
켄지 후쿠하라
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미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20130142917A publication Critical patent/KR20130142917A/ko
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
KR1020130062309A 2012-06-19 2013-05-31 유리 기판의 가공 방법 KR101556282B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012137410A JP5991860B2 (ja) 2012-06-19 2012-06-19 ガラス基板の加工方法
JPJP-P-2012-137410 2012-06-19

Publications (2)

Publication Number Publication Date
KR20130142917A KR20130142917A (ko) 2013-12-30
KR101556282B1 true KR101556282B1 (ko) 2015-09-30

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Application Number Title Priority Date Filing Date
KR1020130062309A KR101556282B1 (ko) 2012-06-19 2013-05-31 유리 기판의 가공 방법

Country Status (4)

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JP (1) JP5991860B2 (ja)
KR (1) KR101556282B1 (ja)
CN (1) CN103508666B (ja)
TW (1) TWI498297B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200034070A (ko) * 2018-09-20 2020-03-31 (주)유티아이 직각 형상 가공을 위한 개선된 slp 및 이에 의해 제조된 직각 형상 가공을 위한 셀컷팅된 쉬트글라스

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) * 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
CN107073642B (zh) 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
JP6664686B2 (ja) * 2015-10-05 2020-03-13 国立大学法人埼玉大学 基板加工方法及び剥離基板製造方法
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
KR20190129914A (ko) * 2017-03-31 2019-11-20 미쓰보시 다이야몬도 고교 가부시키가이샤 스크라이브 가공 방법 및 스크라이브 가공 장치
CN110204187B (zh) * 2018-02-28 2021-06-08 深圳市裕展精密科技有限公司 激光切割装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4156513B2 (ja) 2001-09-21 2008-09-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法およびスクライブ装置
US20100025387A1 (en) 2005-09-08 2010-02-04 Imra America, Inc. Transparent material processing with an ultrashort pulse laser

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JPH05305467A (ja) * 1992-04-27 1993-11-19 Central Glass Co Ltd 光透過性材料のレーザー切断法
CN100577386C (zh) * 2004-05-20 2010-01-06 三星钻石工业股份有限公司 母基板分割方法、母基板划线装置
JP4614844B2 (ja) * 2005-08-05 2011-01-19 住友重機械工業株式会社 レーザ加工方法及びレーザ加工装置
JP5539625B2 (ja) * 2008-05-08 2014-07-02 ミヤチテクノス株式会社 レーザ加工方法
US9346130B2 (en) * 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
WO2011002089A1 (ja) * 2009-07-03 2011-01-06 旭硝子株式会社 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス
US8943855B2 (en) * 2009-08-28 2015-02-03 Corning Incorporated Methods for laser cutting articles from ion exchanged glass substrates

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4156513B2 (ja) 2001-09-21 2008-09-24 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法およびスクライブ装置
US20100025387A1 (en) 2005-09-08 2010-02-04 Imra America, Inc. Transparent material processing with an ultrashort pulse laser

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200034070A (ko) * 2018-09-20 2020-03-31 (주)유티아이 직각 형상 가공을 위한 개선된 slp 및 이에 의해 제조된 직각 형상 가공을 위한 셀컷팅된 쉬트글라스
KR102140979B1 (ko) 2018-09-20 2020-08-05 (주)유티아이 직각 형상 가공을 위한 개선된 slp 및 이에 의해 제조된 직각 형상 가공을 위한 셀컷팅된 쉬트글라스

Also Published As

Publication number Publication date
JP2014001102A (ja) 2014-01-09
CN103508666A (zh) 2014-01-15
TWI498297B (zh) 2015-09-01
CN103508666B (zh) 2016-03-09
KR20130142917A (ko) 2013-12-30
JP5991860B2 (ja) 2016-09-14
TW201400425A (zh) 2014-01-01

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