TWI492348B - 樹脂密封半導體裝置及製造此裝置之方法 - Google Patents

樹脂密封半導體裝置及製造此裝置之方法 Download PDF

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Publication number
TWI492348B
TWI492348B TW099129107A TW99129107A TWI492348B TW I492348 B TWI492348 B TW I492348B TW 099129107 A TW099129107 A TW 099129107A TW 99129107 A TW99129107 A TW 99129107A TW I492348 B TWI492348 B TW I492348B
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Taiwan
Prior art keywords
die pad
resin
inner lead
semiconductor device
lead
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TW099129107A
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English (en)
Chinese (zh)
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TW201125087A (en
Inventor
佐藤正行
前村好士
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精工電子有限公司
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Publication of TW201125087A publication Critical patent/TW201125087A/zh
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Publication of TWI492348B publication Critical patent/TWI492348B/zh

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    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW099129107A 2009-09-18 2010-08-30 樹脂密封半導體裝置及製造此裝置之方法 TWI492348B (zh)

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Application Number Priority Date Filing Date Title
JP2009217642A JP5220714B2 (ja) 2009-09-18 2009-09-18 樹脂封止型半導体装置及びその製造方法

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TW201125087A TW201125087A (en) 2011-07-16
TWI492348B true TWI492348B (zh) 2015-07-11

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US (1) US8253238B2 (enExample)
JP (1) JP5220714B2 (enExample)
KR (1) KR101665721B1 (enExample)
CN (1) CN102024773B (enExample)
TW (1) TWI492348B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5649277B2 (ja) * 2008-12-22 2015-01-07 ローム株式会社 半導体装置
CN103972357B (zh) * 2013-02-06 2016-12-28 光宝电子(广州)有限公司 发光二极管封装件及其导线架
JP6294020B2 (ja) 2013-07-16 2018-03-14 セイコーインスツル株式会社 蓋体部、この蓋体部を用いた電子デバイス用パッケージ及び電子デバイス
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