TWI492348B - 樹脂密封半導體裝置及製造此裝置之方法 - Google Patents

樹脂密封半導體裝置及製造此裝置之方法 Download PDF

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Publication number
TWI492348B
TWI492348B TW099129107A TW99129107A TWI492348B TW I492348 B TWI492348 B TW I492348B TW 099129107 A TW099129107 A TW 099129107A TW 99129107 A TW99129107 A TW 99129107A TW I492348 B TWI492348 B TW I492348B
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TW
Taiwan
Prior art keywords
die pad
resin
inner lead
semiconductor device
lead
Prior art date
Application number
TW099129107A
Other languages
English (en)
Chinese (zh)
Other versions
TW201125087A (en
Inventor
佐藤正行
前村好士
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精工電子有限公司
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Publication of TW201125087A publication Critical patent/TW201125087A/zh
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Publication of TWI492348B publication Critical patent/TWI492348B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW099129107A 2009-09-18 2010-08-30 樹脂密封半導體裝置及製造此裝置之方法 TWI492348B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009217642A JP5220714B2 (ja) 2009-09-18 2009-09-18 樹脂封止型半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW201125087A TW201125087A (en) 2011-07-16
TWI492348B true TWI492348B (zh) 2015-07-11

Family

ID=43755903

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099129107A TWI492348B (zh) 2009-09-18 2010-08-30 樹脂密封半導體裝置及製造此裝置之方法

Country Status (5)

Country Link
US (1) US8253238B2 (enExample)
JP (1) JP5220714B2 (enExample)
KR (1) KR101665721B1 (enExample)
CN (1) CN102024773B (enExample)
TW (1) TWI492348B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5649277B2 (ja) * 2008-12-22 2015-01-07 ローム株式会社 半導体装置
CN103972357B (zh) * 2013-02-06 2016-12-28 光宝电子(广州)有限公司 发光二极管封装件及其导线架
JP6294020B2 (ja) 2013-07-16 2018-03-14 セイコーインスツル株式会社 蓋体部、この蓋体部を用いた電子デバイス用パッケージ及び電子デバイス
US9269690B2 (en) * 2013-12-06 2016-02-23 Nxp B.V. Packaged semiconductor device with interior polygonal pads
JP6371582B2 (ja) * 2014-05-15 2018-08-08 ローム株式会社 パッケージ
CN105252712A (zh) * 2015-10-26 2016-01-20 张家港凯思半导体有限公司 一种直插式分立器件和制作方法以及成型模具
JP6394634B2 (ja) * 2016-03-31 2018-09-26 日亜化学工業株式会社 リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法
US10153424B2 (en) * 2016-08-22 2018-12-11 Rohm Co., Ltd. Semiconductor device and mounting structure of semiconductor device
JP2018056451A (ja) * 2016-09-30 2018-04-05 ルネサスエレクトロニクス株式会社 半導体装置
JP6821258B2 (ja) * 2017-03-14 2021-01-27 エイブリック株式会社 半導体装置
JP7208725B2 (ja) * 2017-09-04 2023-01-19 ローム株式会社 半導体装置
US10535812B2 (en) * 2017-09-04 2020-01-14 Rohm Co., Ltd. Semiconductor device
US12113330B2 (en) 2018-09-26 2024-10-08 Rohm Co., Ltd. Semiconductor laser device
EP3671829B1 (en) * 2018-12-17 2023-09-27 Nexperia B.V. Leadframe assembly for a semiconductor device
WO2022164574A1 (en) * 2021-01-29 2022-08-04 Microchip Technology Incorporated Lead frames for semiconductor packages with increased reliability and related packages and methods
JP7450576B2 (ja) * 2021-03-22 2024-03-15 株式会社東芝 半導体装置
CN116053254B (zh) * 2023-01-31 2024-04-19 海信家电集团股份有限公司 功率模块和具有其的电子设备
CN116960005A (zh) * 2023-06-27 2023-10-27 扬州虹扬科技发展有限公司 一种扁桥芯片塑封方法

Citations (2)

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JPH11103003A (ja) * 1997-07-31 1999-04-13 Matsushita Electron Corp 半導体装置及び半導体装置のリードフレーム
JP2008103550A (ja) * 2006-10-19 2008-05-01 Aoi Electronics Co Ltd 半導体装置

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JPH1041454A (ja) * 1996-07-22 1998-02-13 Nec Corp マルチチップパッケージ構造
EP0895287A3 (en) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Semiconductor device and lead frame for the same
KR100403142B1 (ko) * 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
TW473951B (en) * 2001-01-17 2002-01-21 Siliconware Precision Industries Co Ltd Non-leaded quad flat image sensor package
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
JP3576540B2 (ja) * 2002-08-19 2004-10-13 沖電気工業株式会社 マルチチップパッケージ
JP4050199B2 (ja) * 2003-07-31 2008-02-20 セイコーインスツル株式会社 リードフレーム及びそれを用いた樹脂封止型半導体装置及びその製造方法
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Publication number Priority date Publication date Assignee Title
JPH11103003A (ja) * 1997-07-31 1999-04-13 Matsushita Electron Corp 半導体装置及び半導体装置のリードフレーム
JP2008103550A (ja) * 2006-10-19 2008-05-01 Aoi Electronics Co Ltd 半導体装置

Also Published As

Publication number Publication date
TW201125087A (en) 2011-07-16
US20110068442A1 (en) 2011-03-24
CN102024773A (zh) 2011-04-20
KR20110031133A (ko) 2011-03-24
KR101665721B1 (ko) 2016-10-12
US8253238B2 (en) 2012-08-28
JP2011066327A (ja) 2011-03-31
CN102024773B (zh) 2014-09-03
JP5220714B2 (ja) 2013-06-26

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