TWI487619B - A metal foil composite body and a flexible printed board using the same, and a molded body and a method for producing the same - Google Patents
A metal foil composite body and a flexible printed board using the same, and a molded body and a method for producing the same Download PDFInfo
- Publication number
- TWI487619B TWI487619B TW101109004A TW101109004A TWI487619B TW I487619 B TWI487619 B TW I487619B TW 101109004 A TW101109004 A TW 101109004A TW 101109004 A TW101109004 A TW 101109004A TW I487619 B TWI487619 B TW I487619B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal foil
- resin layer
- layer
- composite
- foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/542—Shear strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/022—Mechanical properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/24983—Hardness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011080476 | 2011-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201242763A TW201242763A (en) | 2012-11-01 |
TWI487619B true TWI487619B (zh) | 2015-06-11 |
Family
ID=46930557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101109004A TWI487619B (zh) | 2011-03-31 | 2012-03-16 | A metal foil composite body and a flexible printed board using the same, and a molded body and a method for producing the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140113121A1 (ja) |
EP (1) | EP2679384B1 (ja) |
JP (1) | JP5127086B1 (ja) |
KR (1) | KR101528995B1 (ja) |
CN (1) | CN103429424B (ja) |
TW (1) | TWI487619B (ja) |
WO (1) | WO2012132814A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5325175B2 (ja) | 2010-07-15 | 2013-10-23 | Jx日鉱日石金属株式会社 | 銅箔複合体、及び成形体の製造方法 |
US10178816B2 (en) | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
CN104080605B (zh) | 2012-01-13 | 2016-08-24 | Jx日矿日石金属株式会社 | 铜箔复合体、以及成形体及其制造方法 |
JP5770113B2 (ja) * | 2012-01-13 | 2015-08-26 | Jx日鉱日石金属株式会社 | 金属箔複合体、並びに成形体及びその製造方法 |
BR112014017075A2 (pt) | 2012-01-13 | 2017-06-13 | Jx Nippon Mining & Metals Corp | composto de folha de cobre, produto formado e método de produção dos mesmos |
JP5887287B2 (ja) * | 2013-01-04 | 2016-03-16 | Jx金属株式会社 | 電磁波シールド用金属箔及び電磁波シールド材 |
JP6147559B2 (ja) * | 2013-05-07 | 2017-06-14 | Jx金属株式会社 | 積層体、銅張積層体、フレキシブル配線板及び立体成型体 |
JP6218454B2 (ja) * | 2013-06-26 | 2017-10-25 | 東洋アルミニウム株式会社 | 半導体ベアチップ実装用回路基板及び半導体ベアチップ実装回路基板 |
US9480155B2 (en) | 2014-07-10 | 2016-10-25 | Apple Inc. | Flexible cables in electronic devices with moving components |
TW201700288A (zh) * | 2015-03-02 | 2017-01-01 | Dexerials Corp | 屏蔽帶之製造方法及屏蔽帶 |
JP6278922B2 (ja) * | 2015-03-30 | 2018-02-14 | Jx金属株式会社 | 電磁波シールド材 |
JPWO2016194964A1 (ja) * | 2015-06-04 | 2018-03-22 | 住友電気工業株式会社 | プリント配線板用原板及びプリント配線板 |
WO2017085849A1 (ja) * | 2015-11-19 | 2017-05-26 | 三井金属鉱業株式会社 | 誘電体層を有するプリント配線板の製造方法 |
JP6883449B2 (ja) * | 2017-03-13 | 2021-06-09 | Jx金属株式会社 | 電磁波シールド材 |
JP7217122B2 (ja) * | 2018-09-29 | 2023-02-02 | 日鉄ケミカル&マテリアル株式会社 | 金属張積層板及びその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006240073A (ja) * | 2005-03-03 | 2006-09-14 | Shin Etsu Chem Co Ltd | フレキシブル金属箔ポリイミド積層板 |
JP2006272743A (ja) * | 2005-03-29 | 2006-10-12 | Nippon Steel Chem Co Ltd | 積層体の製造方法 |
JP2009108376A (ja) * | 2007-10-31 | 2009-05-21 | Nikko Kinzoku Kk | 銅箔及びそれを用いたフレキシブルプリント基板 |
JP2010194759A (ja) * | 2009-02-23 | 2010-09-09 | Nippon Steel Materials Co Ltd | 蓄電デバイス容器用樹脂被覆ステンレス鋼箔 |
TW201109167A (en) * | 2009-07-07 | 2011-03-16 | Nippon Mining Co | Copper foil composite |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH073237B2 (ja) | 1986-10-20 | 1995-01-18 | 株式会社ユニシアジェックス | タ−ビン型燃料ポンプ |
JPH0732307B2 (ja) | 1991-12-17 | 1995-04-10 | 日鉱グールド・フォイル株式会社 | 印刷回路用銅箔の表面処理方法 |
JPH07290449A (ja) | 1994-04-27 | 1995-11-07 | Matsushita Electric Works Ltd | シート状の電磁波シールド成形材料及びその製造方法 |
JP3009383B2 (ja) | 1998-03-31 | 2000-02-14 | 日鉱金属株式会社 | 圧延銅箔およびその製造方法 |
JP3768104B2 (ja) | 2001-01-22 | 2006-04-19 | ソニーケミカル株式会社 | フレキシブルプリント基板 |
JPWO2002067641A1 (ja) * | 2001-02-21 | 2004-06-24 | 鐘淵化学工業株式会社 | 配線基板およびその製造方法、並びに該配線基板に用いられるポリイミドフィルムおよび該製造方法に用いられるエッチング液 |
EP1407879A4 (en) * | 2001-05-24 | 2006-04-12 | Toray Industries | RESISTANT PLASTIC FILM WITH METAL AND WIRE JOINT COVERS, MANUFACTURING METHOD |
JP3879850B2 (ja) | 2003-06-10 | 2007-02-14 | ソニー株式会社 | 光ピックアップ装置とその製造方法 |
JP4202840B2 (ja) | 2003-06-26 | 2008-12-24 | 日鉱金属株式会社 | 銅箔及びその製造方法 |
-
2012
- 2012-03-08 US US14/006,242 patent/US20140113121A1/en not_active Abandoned
- 2012-03-08 KR KR1020137023289A patent/KR101528995B1/ko active IP Right Grant
- 2012-03-08 EP EP20120763155 patent/EP2679384B1/en active Active
- 2012-03-08 CN CN201280016293.1A patent/CN103429424B/zh active Active
- 2012-03-08 JP JP2012534876A patent/JP5127086B1/ja active Active
- 2012-03-08 WO PCT/JP2012/055933 patent/WO2012132814A1/ja active Application Filing
- 2012-03-16 TW TW101109004A patent/TWI487619B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006240073A (ja) * | 2005-03-03 | 2006-09-14 | Shin Etsu Chem Co Ltd | フレキシブル金属箔ポリイミド積層板 |
JP2006272743A (ja) * | 2005-03-29 | 2006-10-12 | Nippon Steel Chem Co Ltd | 積層体の製造方法 |
JP2009108376A (ja) * | 2007-10-31 | 2009-05-21 | Nikko Kinzoku Kk | 銅箔及びそれを用いたフレキシブルプリント基板 |
JP2010194759A (ja) * | 2009-02-23 | 2010-09-09 | Nippon Steel Materials Co Ltd | 蓄電デバイス容器用樹脂被覆ステンレス鋼箔 |
TW201109167A (en) * | 2009-07-07 | 2011-03-16 | Nippon Mining Co | Copper foil composite |
Also Published As
Publication number | Publication date |
---|---|
JP5127086B1 (ja) | 2013-01-23 |
EP2679384A4 (en) | 2014-08-13 |
CN103429424A (zh) | 2013-12-04 |
EP2679384A1 (en) | 2014-01-01 |
EP2679384B1 (en) | 2015-05-13 |
TW201242763A (en) | 2012-11-01 |
JPWO2012132814A1 (ja) | 2014-07-28 |
US20140113121A1 (en) | 2014-04-24 |
CN103429424B (zh) | 2015-12-02 |
KR101528995B1 (ko) | 2015-06-15 |
WO2012132814A1 (ja) | 2012-10-04 |
KR20130115379A (ko) | 2013-10-21 |
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