TWI485820B - Resin sealing forming device - Google Patents

Resin sealing forming device Download PDF

Info

Publication number
TWI485820B
TWI485820B TW101148612A TW101148612A TWI485820B TW I485820 B TWI485820 B TW I485820B TW 101148612 A TW101148612 A TW 101148612A TW 101148612 A TW101148612 A TW 101148612A TW I485820 B TWI485820 B TW I485820B
Authority
TW
Taiwan
Prior art keywords
resin sealing
resin
molding apparatus
frame member
mold
Prior art date
Application number
TW101148612A
Other languages
English (en)
Chinese (zh)
Other versions
TW201349401A (zh
Inventor
Shinji Takase
Takeaki Taka
Takashi Tamura
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW201349401A publication Critical patent/TW201349401A/zh
Application granted granted Critical
Publication of TWI485820B publication Critical patent/TWI485820B/zh

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW101148612A 2012-05-29 2012-12-20 Resin sealing forming device TWI485820B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012121587A JP5774545B2 (ja) 2012-05-29 2012-05-29 樹脂封止成形装置

Publications (2)

Publication Number Publication Date
TW201349401A TW201349401A (zh) 2013-12-01
TWI485820B true TWI485820B (zh) 2015-05-21

Family

ID=49731219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101148612A TWI485820B (zh) 2012-05-29 2012-12-20 Resin sealing forming device

Country Status (4)

Country Link
JP (1) JP5774545B2 (ja)
KR (1) KR101440218B1 (ja)
CN (1) CN103448187B (ja)
TW (1) TWI485820B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711520B (zh) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 樹脂密封成形裝置及樹脂密封成形方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
JP6143711B2 (ja) * 2014-06-02 2017-06-07 Ｔｏｗａ株式会社 半導体圧縮樹脂封止方法及び半導体圧縮樹脂封止装置
JP6349181B2 (ja) * 2014-07-18 2018-06-27 Ｔｏｗａ株式会社 クリーニング方法及びクリーニング機構
JP6491464B2 (ja) * 2014-11-28 2019-03-27 Ｔｏｗａ株式会社 成形品製造装置及び成形品製造方法
JP6491508B2 (ja) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP2016213240A (ja) * 2015-04-30 2016-12-15 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2017051972A (ja) * 2015-09-09 2017-03-16 Ｔｏｗａ株式会社 プレス機構、プレス方法、圧縮成形装置および圧縮成形方法
JP6649752B2 (ja) * 2015-11-19 2020-02-19 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置
JP6580519B2 (ja) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法
JP6710107B2 (ja) * 2016-06-10 2020-06-17 アサヒ・エンジニアリング株式会社 樹脂封止装置
JP6886341B2 (ja) * 2017-05-10 2021-06-16 Ｔｏｗａ株式会社 樹脂成形用成形型、樹脂成形装置、樹脂成形用成形型調整方法、及び樹脂成形品製造方法
JP6886416B2 (ja) * 2018-03-09 2021-06-16 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN112171990A (zh) * 2020-09-03 2021-01-05 孙喜杰 一种防翘曲变形的塑料压制成型工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235366A (ja) * 2007-03-16 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法及び樹脂封止装置
JP2008283111A (ja) * 2007-05-14 2008-11-20 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
TW201219182A (en) * 2010-09-16 2012-05-16 Towa Corp capable of performing compression forming without using a mold release film and having a simple structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4373059B2 (ja) * 2002-08-08 2009-11-25 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
JP2008001045A (ja) 2006-06-26 2008-01-10 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5143617B2 (ja) 2008-04-08 2013-02-13 住友重機械工業株式会社 圧縮成形方法
JP5153536B2 (ja) 2008-09-17 2013-02-27 Ｔｏｗａ株式会社 半導体チップの圧縮成形用金型

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235366A (ja) * 2007-03-16 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法及び樹脂封止装置
JP2008283111A (ja) * 2007-05-14 2008-11-20 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
TW201219182A (en) * 2010-09-16 2012-05-16 Towa Corp capable of performing compression forming without using a mold release film and having a simple structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711520B (zh) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 樹脂密封成形裝置及樹脂密封成形方法

Also Published As

Publication number Publication date
JP2013247315A (ja) 2013-12-09
CN103448187B (zh) 2016-05-18
TW201349401A (zh) 2013-12-01
KR101440218B1 (ko) 2014-09-12
JP5774545B2 (ja) 2015-09-09
CN103448187A (zh) 2013-12-18
KR20130133658A (ko) 2013-12-09

Similar Documents

Publication Publication Date Title
TWI485820B (zh) Resin sealing forming device
KR101832597B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
TWI531459B (zh) Compression forming die and compression forming method
TWI668769B (zh) 轉移成形機及製造電子零件之方法
TWI679100B (zh) 樹脂成形裝置及樹脂成形品製造方法
JP5140517B2 (ja) 樹脂モールド装置および樹脂モールド方法
JP6861609B2 (ja) 樹脂成形装置及び樹脂成形品の製造方法
US20220161469A1 (en) Resin molding apparatus and method for manufacturing resin molded product
TWI712101B (zh) 搬運裝置、樹脂成形裝置、搬運方法及樹脂成形品的製造方法
CN109727878B (zh) 树脂成型装置及树脂成型品的制造方法
TW201832299A (zh) 樹脂密封方法及樹脂密封裝置
TWI679096B (zh) 將一載體與電子元件至少部分封裝之模具及封裝之成型裝置及封裝之方法
JP5385636B2 (ja) 圧縮成形用金型
CN112677422B (zh) 树脂成形品的制造方法及树脂成形装置
JP5218573B2 (ja) 樹脂成形装置
JP5511724B2 (ja) 電子部品の樹脂封止成形方法及び装置
WO2018139631A1 (ja) 樹脂封止装置及び樹脂封止方法
TWI527273B (zh) Method and apparatus for sealing resin sealing of semiconductor wafer and apparatus for preventing edge of resin
JP2009090503A (ja) 電子部品の樹脂封止成形用金型
US11992982B2 (en) Method for manufacturing resin molded product
KR20110123035A (ko) 반도체 패키지 제조용 몰딩장치 및 몰딩방법
TW201712764A (zh) 電子零件密封裝置及使用該裝置的電子零件密封方法
JP2012161927A (ja) プリフォーム成形機構及びプリフォーム成形方法
KR20170033665A (ko) 스페이서의 사출 성형장치
JP2009113306A (ja) 電子部品の樹脂封止成形方法及び装置