KR101440218B1 - 수지봉지 성형장치 - Google Patents

수지봉지 성형장치 Download PDF

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Publication number
KR101440218B1
KR101440218B1 KR1020130015029A KR20130015029A KR101440218B1 KR 101440218 B1 KR101440218 B1 KR 101440218B1 KR 1020130015029 A KR1020130015029 A KR 1020130015029A KR 20130015029 A KR20130015029 A KR 20130015029A KR 101440218 B1 KR101440218 B1 KR 101440218B1
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KR
South Korea
Prior art keywords
resin
frame member
driving mechanism
molding apparatus
mold
Prior art date
Application number
KR1020130015029A
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English (en)
Korean (ko)
Other versions
KR20130133658A (ko
Inventor
신지 다카세
다케아키 다카
다카시 다무라
Original Assignee
토와 가부시기가이샤
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Publication of KR20130133658A publication Critical patent/KR20130133658A/ko
Application granted granted Critical
Publication of KR101440218B1 publication Critical patent/KR101440218B1/ko

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020130015029A 2012-05-29 2013-02-12 수지봉지 성형장치 KR101440218B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012121587A JP5774545B2 (ja) 2012-05-29 2012-05-29 樹脂封止成形装置
JPJP-P-2012-121587 2012-05-29

Publications (2)

Publication Number Publication Date
KR20130133658A KR20130133658A (ko) 2013-12-09
KR101440218B1 true KR101440218B1 (ko) 2014-09-12

Family

ID=49731219

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130015029A KR101440218B1 (ko) 2012-05-29 2013-02-12 수지봉지 성형장치

Country Status (4)

Country Link
JP (1) JP5774545B2 (ja)
KR (1) KR101440218B1 (ja)
CN (1) CN103448187B (ja)
TW (1) TWI485820B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
JP6143711B2 (ja) * 2014-06-02 2017-06-07 Ｔｏｗａ株式会社 半導体圧縮樹脂封止方法及び半導体圧縮樹脂封止装置
JP6349181B2 (ja) * 2014-07-18 2018-06-27 Ｔｏｗａ株式会社 クリーニング方法及びクリーニング機構
JP6491464B2 (ja) * 2014-11-28 2019-03-27 Ｔｏｗａ株式会社 成形品製造装置及び成形品製造方法
JP6491508B2 (ja) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP2016213240A (ja) * 2015-04-30 2016-12-15 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2017051972A (ja) * 2015-09-09 2017-03-16 Ｔｏｗａ株式会社 プレス機構、プレス方法、圧縮成形装置および圧縮成形方法
JP6649752B2 (ja) * 2015-11-19 2020-02-19 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置
JP6580519B2 (ja) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法
JP6710107B2 (ja) * 2016-06-10 2020-06-17 アサヒ・エンジニアリング株式会社 樹脂封止装置
JP6886341B2 (ja) * 2017-05-10 2021-06-16 Ｔｏｗａ株式会社 樹脂成形用成形型、樹脂成形装置、樹脂成形用成形型調整方法、及び樹脂成形品製造方法
JP6886416B2 (ja) * 2018-03-09 2021-06-16 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
TWI711520B (zh) * 2019-09-11 2020-12-01 日商朝日科技股份有限公司 樹脂密封成形裝置及樹脂密封成形方法
CN112171990A (zh) * 2020-09-03 2021-01-05 孙喜杰 一种防翘曲变形的塑料压制成型工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008001045A (ja) 2006-06-26 2008-01-10 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP2009248481A (ja) 2008-04-08 2009-10-29 Sumitomo Heavy Ind Ltd 圧縮成形方法
JP2010069656A (ja) 2008-09-17 2010-04-02 Towa Corp 半導体チップの圧縮成形方法及び金型

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4373059B2 (ja) * 2002-08-08 2009-11-25 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法
JP2008235366A (ja) * 2007-03-16 2008-10-02 Fujitsu Ltd 電子部品の樹脂封止方法及び樹脂封止装置
JP2008283111A (ja) * 2007-05-14 2008-11-20 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP5174874B2 (ja) * 2010-09-16 2013-04-03 Ｔｏｗａ株式会社 圧縮成形型及び圧縮成形方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008001045A (ja) 2006-06-26 2008-01-10 Sumitomo Heavy Ind Ltd 樹脂封止装置及び樹脂封止方法
JP2009248481A (ja) 2008-04-08 2009-10-29 Sumitomo Heavy Ind Ltd 圧縮成形方法
JP2010069656A (ja) 2008-09-17 2010-04-02 Towa Corp 半導体チップの圧縮成形方法及び金型

Also Published As

Publication number Publication date
JP2013247315A (ja) 2013-12-09
TW201349401A (zh) 2013-12-01
KR20130133658A (ko) 2013-12-09
CN103448187A (zh) 2013-12-18
TWI485820B (zh) 2015-05-21
JP5774545B2 (ja) 2015-09-09
CN103448187B (zh) 2016-05-18

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