TWI485025B - 偏光板切斷方法及藉由該方法切斷之偏光板 - Google Patents

偏光板切斷方法及藉由該方法切斷之偏光板 Download PDF

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Publication number
TWI485025B
TWI485025B TW100126146A TW100126146A TWI485025B TW I485025 B TWI485025 B TW I485025B TW 100126146 A TW100126146 A TW 100126146A TW 100126146 A TW100126146 A TW 100126146A TW I485025 B TWI485025 B TW I485025B
Authority
TW
Taiwan
Prior art keywords
film
polarizing plate
laser light
cut
groove
Prior art date
Application number
TW100126146A
Other languages
English (en)
Chinese (zh)
Other versions
TW201219139A (en
Inventor
Shin Oikawa
Rikiya Matsumoto
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW201219139A publication Critical patent/TW201219139A/zh
Application granted granted Critical
Publication of TWI485025B publication Critical patent/TWI485025B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
  • Liquid Crystal (AREA)
TW100126146A 2010-07-29 2011-07-25 偏光板切斷方法及藉由該方法切斷之偏光板 TWI485025B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010170611A JP5481300B2 (ja) 2010-07-29 2010-07-29 偏光板切断方法および当該方法によって切断された偏光板

Publications (2)

Publication Number Publication Date
TW201219139A TW201219139A (en) 2012-05-16
TWI485025B true TWI485025B (zh) 2015-05-21

Family

ID=45529858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100126146A TWI485025B (zh) 2010-07-29 2011-07-25 偏光板切斷方法及藉由該方法切斷之偏光板

Country Status (5)

Country Link
JP (1) JP5481300B2 (enExample)
KR (1) KR101706416B1 (enExample)
CN (1) CN103052464B (enExample)
TW (1) TWI485025B (enExample)
WO (1) WO2012014639A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104520917B (zh) * 2012-08-08 2017-03-08 住友化学株式会社 光学显示器件的生产方法以及光学显示器件的生产系统
WO2014024867A1 (ja) * 2012-08-08 2014-02-13 住友化学株式会社 光学表示デバイスの生産システム及び生産方法
WO2014038433A1 (ja) * 2012-09-07 2014-03-13 住友化学株式会社 光学部材貼合体の製造装置
WO2014097885A1 (ja) * 2012-12-18 2014-06-26 住友化学株式会社 光学表示デバイスの生産方法及び光学表示デバイスの生産システム
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
KR101683649B1 (ko) 2015-01-27 2016-12-07 현대자동차주식회사 차량 컨텐츠를 통합하고 가변하기 위한 사용자 맞춤 표시 시스템 및 그의 차량 컨텐츠 관리 방법, 그리고 이를 실행하는 컴퓨터 판독 가능한 기록매체
TWI583479B (zh) * 2015-06-12 2017-05-21 住華科技股份有限公司 光學膜片的加工方法
JP2017151164A (ja) * 2016-02-22 2017-08-31 住友化学株式会社 偏光板及び画像表示装置
KR101858432B1 (ko) * 2016-03-23 2018-05-16 동우 화인켐 주식회사 윈도우 기판 및 이의 제조 방법
KR102838251B1 (ko) 2017-01-05 2025-07-25 삼성디스플레이 주식회사 편광판 제조방법 및 편광판을 구비하는 표시장치
KR102066471B1 (ko) * 2017-03-10 2020-01-15 주식회사 엘지화학 편광필름의 재단 방법
KR102416550B1 (ko) 2017-04-28 2022-07-05 삼성디스플레이 주식회사 편광층, 이를 구비하는 표시 장치 및 표시 장치의 제조 방법
JP6792660B2 (ja) * 2019-03-04 2020-11-25 住友化学株式会社 光学積層体及びその製造方法
WO2021186986A1 (ja) * 2020-03-16 2021-09-23 住友化学株式会社 積層シートおよびその製造方法
JP2021149087A (ja) * 2020-03-16 2021-09-27 住友化学株式会社 積層シートおよびその製造方法
JP7831303B2 (ja) 2020-10-23 2026-03-17 コニカミノルタ株式会社 偏光板およびその製造方法、ならびに表示装置の製造方法
CN115890030B (zh) * 2022-11-22 2025-06-24 武汉市工程科学技术研究院 一种眼镜镜片加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200827080A (en) * 2006-09-22 2008-07-01 Nitto Denko Corp Optical film cutting method, and optical film
JP2008284572A (ja) * 2007-05-16 2008-11-27 Nitto Denko Corp レーザー加工方法及びレーザー加工品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1077074C (zh) * 1998-01-26 2002-01-02 四维企业股份有限公司 封装用复合膜
JP4233999B2 (ja) * 2003-12-25 2009-03-04 日東電工株式会社 積層型偏光板およびその製造方法
JP2006106016A (ja) * 2004-09-10 2006-04-20 Sumitomo Chemical Co Ltd 偏光板及びその製造方法
WO2006075736A1 (ja) * 2005-01-17 2006-07-20 Nitto Denko Corporation 偏光板、その製造方法、光学フィルムおよびそれを用いた画像表示装置
JP2007114270A (ja) * 2005-10-18 2007-05-10 Nippon Oil Corp 光学フィルムの製造方法
WO2008047712A1 (en) * 2006-10-17 2008-04-24 Nitto Denko Corporation Optical member adhering method, and apparatus using the method
JP4769165B2 (ja) * 2006-10-27 2011-09-07 富士フイルム株式会社 感光性積層体の製造装置及び製造方法
JP2008155465A (ja) * 2006-12-22 2008-07-10 Fujifilm Corp 感光性積層体の製造装置及び製造方法
JP5553397B2 (ja) * 2007-07-19 2014-07-16 日東電工株式会社 レーザー加工方法
JP2009157363A (ja) * 2007-12-03 2009-07-16 Nitto Denko Corp 積層光学製品、光学表示装置および光学表示装置の製造方法
WO2011016572A1 (ja) * 2009-08-06 2011-02-10 住友化学株式会社 偏光板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200827080A (en) * 2006-09-22 2008-07-01 Nitto Denko Corp Optical film cutting method, and optical film
JP2008284572A (ja) * 2007-05-16 2008-11-27 Nitto Denko Corp レーザー加工方法及びレーザー加工品

Also Published As

Publication number Publication date
CN103052464B (zh) 2015-02-11
KR20130130692A (ko) 2013-12-02
JP5481300B2 (ja) 2014-04-23
CN103052464A (zh) 2013-04-17
KR101706416B1 (ko) 2017-02-13
JP2012030243A (ja) 2012-02-16
TW201219139A (en) 2012-05-16
WO2012014639A1 (ja) 2012-02-02

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