CN103052464B - 偏振片的切割方法以及使用该方法切割的偏振片 - Google Patents

偏振片的切割方法以及使用该方法切割的偏振片 Download PDF

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Publication number
CN103052464B
CN103052464B CN201180037027.2A CN201180037027A CN103052464B CN 103052464 B CN103052464 B CN 103052464B CN 201180037027 A CN201180037027 A CN 201180037027A CN 103052464 B CN103052464 B CN 103052464B
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CN
China
Prior art keywords
polarizing plate
film
cut
laser light
polaroid
Prior art date
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Expired - Fee Related
Application number
CN201180037027.2A
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English (en)
Chinese (zh)
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CN103052464A (zh
Inventor
及川伸
松本力也
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Sumitomo Chemical Co Ltd
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Sumitomo Chemical Co Ltd
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Publication date
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Publication of CN103052464A publication Critical patent/CN103052464A/zh
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Publication of CN103052464B publication Critical patent/CN103052464B/zh
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
  • Liquid Crystal (AREA)
CN201180037027.2A 2010-07-29 2011-07-05 偏振片的切割方法以及使用该方法切割的偏振片 Expired - Fee Related CN103052464B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010170611A JP5481300B2 (ja) 2010-07-29 2010-07-29 偏光板切断方法および当該方法によって切断された偏光板
JP2010-170611 2010-07-29
PCT/JP2011/065369 WO2012014639A1 (ja) 2010-07-29 2011-07-05 偏光板切断方法および当該方法によって切断された偏光板

Publications (2)

Publication Number Publication Date
CN103052464A CN103052464A (zh) 2013-04-17
CN103052464B true CN103052464B (zh) 2015-02-11

Family

ID=45529858

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180037027.2A Expired - Fee Related CN103052464B (zh) 2010-07-29 2011-07-05 偏振片的切割方法以及使用该方法切割的偏振片

Country Status (5)

Country Link
JP (1) JP5481300B2 (enExample)
KR (1) KR101706416B1 (enExample)
CN (1) CN103052464B (enExample)
TW (1) TWI485025B (enExample)
WO (1) WO2012014639A1 (enExample)

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* Cited by examiner, † Cited by third party
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TWI582491B (zh) * 2012-08-08 2017-05-11 住友化學股份有限公司 光學顯示設備之生產系統及生產方法
WO2014024872A1 (ja) * 2012-08-08 2014-02-13 住友化学株式会社 光学表示デバイスの生産方法および光学表示デバイスの生産システム
CN104583847B (zh) * 2012-09-07 2018-04-13 住友化学株式会社 光学构件贴合体的制造装置
KR102041658B1 (ko) * 2012-12-18 2019-11-08 스미또모 가가꾸 가부시키가이샤 광학 표시 디바이스의 생산 방법 및 광학 표시 디바이스의 생산 시스템
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
KR101683649B1 (ko) 2015-01-27 2016-12-07 현대자동차주식회사 차량 컨텐츠를 통합하고 가변하기 위한 사용자 맞춤 표시 시스템 및 그의 차량 컨텐츠 관리 방법, 그리고 이를 실행하는 컴퓨터 판독 가능한 기록매체
TWI583479B (zh) * 2015-06-12 2017-05-21 住華科技股份有限公司 光學膜片的加工方法
KR101858432B1 (ko) * 2016-03-23 2018-05-16 동우 화인켐 주식회사 윈도우 기판 및 이의 제조 방법
KR102838251B1 (ko) 2017-01-05 2025-07-25 삼성디스플레이 주식회사 편광판 제조방법 및 편광판을 구비하는 표시장치
KR102066471B1 (ko) * 2017-03-10 2020-01-15 주식회사 엘지화학 편광필름의 재단 방법
KR102416550B1 (ko) * 2017-04-28 2022-07-05 삼성디스플레이 주식회사 편광층, 이를 구비하는 표시 장치 및 표시 장치의 제조 방법
JP6792660B2 (ja) * 2019-03-04 2020-11-25 住友化学株式会社 光学積層体及びその製造方法
KR20220149510A (ko) * 2020-03-16 2022-11-08 수미토모 케미칼 컴퍼니 리미티드 적층 시트 및 그 제조 방법
JP2021149087A (ja) * 2020-03-16 2021-09-27 住友化学株式会社 積層シートおよびその製造方法
CN116324943A (zh) 2020-10-23 2023-06-23 柯尼卡美能达株式会社 偏振片及其制造方法、以及显示装置的制造方法
CN115890030B (zh) * 2022-11-22 2025-06-24 武汉市工程科学技术研究院 一种眼镜镜片加工装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1224687A (zh) * 1998-01-26 1999-08-04 四维企业股份有限公司 封装用复合膜
JP2006106016A (ja) * 2004-09-10 2006-04-20 Sumitomo Chemical Co Ltd 偏光板及びその製造方法
CN1952695A (zh) * 2005-10-18 2007-04-25 新日本石油株式会社 光学薄膜的制造方法
CN101103286A (zh) * 2005-01-17 2008-01-09 日东电工株式会社 偏振片、其制造方法、光学薄膜及使用其的图像显示装置
CN101206400A (zh) * 2006-12-22 2008-06-25 富士胶片株式会社 感光性层叠体的制造装置及制造方法
CN101219592A (zh) * 2006-10-27 2008-07-16 富士胶片株式会社 感光性层叠体的制造装置及制造方法
CN101347869A (zh) * 2007-07-19 2009-01-21 日东电工株式会社 激光加工方法
JP2009157363A (ja) * 2007-12-03 2009-07-16 Nitto Denko Corp 積層光学製品、光学表示装置および光学表示装置の製造方法
CN101528445A (zh) * 2006-10-17 2009-09-09 日东电工株式会社 光学部件贴合方法以及使用该方法的装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4233999B2 (ja) * 2003-12-25 2009-03-04 日東電工株式会社 積層型偏光板およびその製造方法
JP2008073742A (ja) * 2006-09-22 2008-04-03 Nitto Denko Corp 光学フィルムの切断方法及び光学フィルム
JP5096040B2 (ja) 2007-05-16 2012-12-12 日東電工株式会社 レーザー加工方法及びレーザー加工品
WO2011016572A1 (ja) * 2009-08-06 2011-02-10 住友化学株式会社 偏光板の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1224687A (zh) * 1998-01-26 1999-08-04 四维企业股份有限公司 封装用复合膜
JP2006106016A (ja) * 2004-09-10 2006-04-20 Sumitomo Chemical Co Ltd 偏光板及びその製造方法
CN101103286A (zh) * 2005-01-17 2008-01-09 日东电工株式会社 偏振片、其制造方法、光学薄膜及使用其的图像显示装置
CN1952695A (zh) * 2005-10-18 2007-04-25 新日本石油株式会社 光学薄膜的制造方法
CN101528445A (zh) * 2006-10-17 2009-09-09 日东电工株式会社 光学部件贴合方法以及使用该方法的装置
CN101219592A (zh) * 2006-10-27 2008-07-16 富士胶片株式会社 感光性层叠体的制造装置及制造方法
CN101206400A (zh) * 2006-12-22 2008-06-25 富士胶片株式会社 感光性层叠体的制造装置及制造方法
CN101347869A (zh) * 2007-07-19 2009-01-21 日东电工株式会社 激光加工方法
JP2009157363A (ja) * 2007-12-03 2009-07-16 Nitto Denko Corp 積層光学製品、光学表示装置および光学表示装置の製造方法

Also Published As

Publication number Publication date
JP5481300B2 (ja) 2014-04-23
WO2012014639A1 (ja) 2012-02-02
JP2012030243A (ja) 2012-02-16
CN103052464A (zh) 2013-04-17
TWI485025B (zh) 2015-05-21
TW201219139A (en) 2012-05-16
KR20130130692A (ko) 2013-12-02
KR101706416B1 (ko) 2017-02-13

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Granted publication date: 20150211