TWI478997B - Adhesive tape, laminated body and image display device - Google Patents

Adhesive tape, laminated body and image display device Download PDF

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Publication number
TWI478997B
TWI478997B TW099123605A TW99123605A TWI478997B TW I478997 B TWI478997 B TW I478997B TW 099123605 A TW099123605 A TW 099123605A TW 99123605 A TW99123605 A TW 99123605A TW I478997 B TWI478997 B TW I478997B
Authority
TW
Taiwan
Prior art keywords
adhesive tape
group
monomer
weight
copolymer
Prior art date
Application number
TW099123605A
Other languages
English (en)
Chinese (zh)
Other versions
TW201109400A (en
Inventor
Yasuharu Nagai
Kohei Maruo
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201109400A publication Critical patent/TW201109400A/zh
Application granted granted Critical
Publication of TWI478997B publication Critical patent/TWI478997B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW099123605A 2009-07-16 2010-07-16 Adhesive tape, laminated body and image display device TWI478997B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009167775 2009-07-16
JP2009205969 2009-09-07
JP2009292078 2009-12-24

Publications (2)

Publication Number Publication Date
TW201109400A TW201109400A (en) 2011-03-16
TWI478997B true TWI478997B (zh) 2015-04-01

Family

ID=43449471

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099123605A TWI478997B (zh) 2009-07-16 2010-07-16 Adhesive tape, laminated body and image display device

Country Status (5)

Country Link
JP (1) JPWO2011007861A1 (ja)
KR (1) KR101800470B1 (ja)
CN (2) CN104277745A (ja)
TW (1) TWI478997B (ja)
WO (1) WO2011007861A1 (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012173247A1 (ja) * 2011-06-17 2012-12-20 積水化学工業株式会社 透明粘着テープ、金属薄膜付フィルム積層体、カバーパネル-タッチパネルモジュール積層体、カバーパネル-ディスプレイパネルモジュール積層体、タッチパネルモジュール-ディスプレイパネルモジュール積層体、及び、画像表示装置
TWI475085B (zh) * 2011-07-19 2015-03-01 Lg Chemical Ltd 觸碰面板
KR20130131795A (ko) * 2012-05-24 2013-12-04 (주)엘지하우시스 유연도가 높은 점착 조성물
JP2014189778A (ja) * 2013-03-28 2014-10-06 Lintec Corp 両面粘着シートおよび捲回体
KR101687066B1 (ko) * 2013-06-19 2016-12-15 주식회사 엘지화학 점착제 조성물
KR101692108B1 (ko) * 2013-06-19 2017-01-02 주식회사 엘지화학 점착제 조성물
JP6367599B2 (ja) * 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート
CN104650758B (zh) * 2013-11-22 2020-12-08 日东电工株式会社 双面粘合片
JP6350546B2 (ja) * 2013-12-09 2018-07-04 王子ホールディングス株式会社 高硬度フィルム
CN105683324B (zh) * 2013-12-27 2018-06-22 积水化学工业株式会社 光学用粘合剂、光学用粘合带及层叠体
JP6456717B2 (ja) * 2014-03-31 2019-01-23 マクセルホールディングス株式会社 粘着テープ
JP6341889B2 (ja) * 2015-07-06 2018-06-13 綜研化学株式会社 遮光性両面粘着部材用のアクリル系粘着剤組成物、遮光性両面粘着部材および画像表示装置
JP6220481B2 (ja) * 2015-09-01 2017-10-25 リンテック株式会社 粘着シート
TW201723121A (zh) * 2015-09-01 2017-07-01 Lintec Corp 黏著薄片
JP2017082094A (ja) * 2015-10-28 2017-05-18 積水化学工業株式会社 半導体加工用両面粘着テープ
WO2017073077A1 (ja) * 2015-10-30 2017-05-04 株式会社クラレ 射出成形複合体および加飾シート、並びにこれらの製造方法
JP6974405B2 (ja) * 2016-08-18 2021-12-01 積水化学工業株式会社 (メタ)アクリル系粘着剤及び粘着テープ
JP6585563B2 (ja) * 2016-08-18 2019-10-02 積水化学工業株式会社 (メタ)アクリル系粘着剤
JP6443590B1 (ja) * 2017-02-28 2018-12-26 住友ベークライト株式会社 半導体基板加工用粘着テープおよび半導体装置の製造方法
TWI725785B (zh) * 2020-03-19 2021-04-21 碩正科技股份有限公司 半導體晶圓保護片
KR20220138554A (ko) * 2021-04-05 2022-10-13 삼성디스플레이 주식회사 점착 조성물 및 이를 포함한 디스플레이 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005042061A (ja) * 2003-07-25 2005-02-17 Nitto Denko Corp 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材及びその製造方法、並びに画像表示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK0883658T3 (da) * 1996-02-26 2001-03-19 Minnesota Mining & Mfg Grafisk mærkningsfilm omfattende trykfølsomt klæbestof
EP1245656A1 (en) * 2001-03-30 2002-10-02 3M Innovative Properties Company Transparent pressure-sensitive adhesive layer
DE10234246A1 (de) * 2002-07-27 2004-02-05 Tesa Ag Haftklebemassen mit hohem Brechungsindex auf Basis von Acrylatblockcopolymeren
JP4521520B2 (ja) * 2003-08-06 2010-08-11 綜研化学株式会社 低極性フィルム用粘着剤
JP2006011523A (ja) * 2004-06-22 2006-01-12 Three M Innovative Properties Co タッチパネルセンサー

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005042061A (ja) * 2003-07-25 2005-02-17 Nitto Denko Corp 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材及びその製造方法、並びに画像表示装置

Also Published As

Publication number Publication date
WO2011007861A1 (ja) 2011-01-20
CN102471657B (zh) 2014-09-17
KR101800470B1 (ko) 2017-11-22
KR20120039021A (ko) 2012-04-24
TW201109400A (en) 2011-03-16
JPWO2011007861A1 (ja) 2012-12-27
CN102471657A (zh) 2012-05-23
CN104277745A (zh) 2015-01-14

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