TWI478253B - Micro-bump forming device - Google Patents

Micro-bump forming device Download PDF

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Publication number
TWI478253B
TWI478253B TW100117392A TW100117392A TWI478253B TW I478253 B TWI478253 B TW I478253B TW 100117392 A TW100117392 A TW 100117392A TW 100117392 A TW100117392 A TW 100117392A TW I478253 B TWI478253 B TW I478253B
Authority
TW
Taiwan
Prior art keywords
substrate
filling
solder ball
film
printing
Prior art date
Application number
TW100117392A
Other languages
English (en)
Chinese (zh)
Other versions
TW201209944A (en
Inventor
向井範昭
阿部豬佐雄
Original Assignee
日立製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立製作所股份有限公司 filed Critical 日立製作所股份有限公司
Publication of TW201209944A publication Critical patent/TW201209944A/zh
Application granted granted Critical
Publication of TWI478253B publication Critical patent/TWI478253B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW100117392A 2010-05-24 2011-05-18 Micro-bump forming device TWI478253B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010118426A JP5462712B2 (ja) 2010-05-24 2010-05-24 マイクロバンプ形成装置

Publications (2)

Publication Number Publication Date
TW201209944A TW201209944A (en) 2012-03-01
TWI478253B true TWI478253B (zh) 2015-03-21

Family

ID=44971669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100117392A TWI478253B (zh) 2010-05-24 2011-05-18 Micro-bump forming device

Country Status (4)

Country Link
US (1) US8302838B2 (https=)
JP (1) JP5462712B2 (https=)
KR (1) KR101209322B1 (https=)
TW (1) TWI478253B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012131861A1 (ja) 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
US10722965B2 (en) 2013-06-26 2020-07-28 Senju Metal Industry Co., Ltd. Solder ball supplying method, solder ball supplying device, and solder bump forming method
CN112091346B (zh) * 2020-09-07 2022-08-19 昆山联滔电子有限公司 一种激光喷射焊球的焊接方法
CN117680867B (zh) * 2024-02-04 2024-05-24 南京航空航天大学 一种基于纳米颗粒植入与微量元素补偿的高强焊丝的焊接方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5768775A (en) * 1995-08-24 1998-06-23 Matsushita Electric Industrial Co., Ltd. Mounting apparatus of conductive balls and mounting method thereof
US6417089B1 (en) * 2000-01-03 2002-07-09 Samsung Electronics, Co., Ltd. Method of forming solder bumps with reduced undercutting of under bump metallurgy (UBM)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2788639B2 (ja) * 1988-09-28 1998-08-20 株式会社日立製作所 半導体集積回路装置の製造方法
JPH04186791A (ja) 1990-11-20 1992-07-03 Nec Toyama Ltd 印刷配線板の製造方法
JPH09102478A (ja) * 1995-10-06 1997-04-15 Sony Corp 半田ボールの被搭載面のクリーニング方法、クリーニング機構及び半田ボール搭載装置
JP3405175B2 (ja) * 1998-03-10 2003-05-12 松下電器産業株式会社 導電ボールの実装装置および実装方法
JP3880027B2 (ja) * 1998-09-17 2007-02-14 千住金属工業株式会社 はんだバンプの形成方法
JP3606191B2 (ja) * 2000-10-25 2005-01-05 松下電器産業株式会社 導電性ボールの整列装置および搭載装置
JP3931215B2 (ja) * 2002-05-29 2007-06-13 澁谷工業株式会社 導電性ボール搭載装置
JP3997904B2 (ja) 2002-12-02 2007-10-24 カシオ計算機株式会社 金属ボールの形成方法
JP2008142775A (ja) 2007-11-29 2008-06-26 Athlete Fa Kk ボール供給装置及びボール振込装置
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5768775A (en) * 1995-08-24 1998-06-23 Matsushita Electric Industrial Co., Ltd. Mounting apparatus of conductive balls and mounting method thereof
US6417089B1 (en) * 2000-01-03 2002-07-09 Samsung Electronics, Co., Ltd. Method of forming solder bumps with reduced undercutting of under bump metallurgy (UBM)

Also Published As

Publication number Publication date
US20110284618A1 (en) 2011-11-24
US8302838B2 (en) 2012-11-06
TW201209944A (en) 2012-03-01
JP5462712B2 (ja) 2014-04-02
KR101209322B1 (ko) 2012-12-06
JP2011249409A (ja) 2011-12-08
KR20110128737A (ko) 2011-11-30

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MM4A Annulment or lapse of patent due to non-payment of fees