JP5462712B2 - マイクロバンプ形成装置 - Google Patents

マイクロバンプ形成装置 Download PDF

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Publication number
JP5462712B2
JP5462712B2 JP2010118426A JP2010118426A JP5462712B2 JP 5462712 B2 JP5462712 B2 JP 5462712B2 JP 2010118426 A JP2010118426 A JP 2010118426A JP 2010118426 A JP2010118426 A JP 2010118426A JP 5462712 B2 JP5462712 B2 JP 5462712B2
Authority
JP
Japan
Prior art keywords
filling
substrate
film
solder
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010118426A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011249409A (ja
JP2011249409A5 (https=
Inventor
範昭 向井
猪佐雄 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2010118426A priority Critical patent/JP5462712B2/ja
Priority to TW100117392A priority patent/TWI478253B/zh
Priority to US13/111,252 priority patent/US8302838B2/en
Priority to KR1020110048221A priority patent/KR101209322B1/ko
Publication of JP2011249409A publication Critical patent/JP2011249409A/ja
Publication of JP2011249409A5 publication Critical patent/JP2011249409A5/ja
Application granted granted Critical
Publication of JP5462712B2 publication Critical patent/JP5462712B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2010118426A 2010-05-24 2010-05-24 マイクロバンプ形成装置 Expired - Fee Related JP5462712B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010118426A JP5462712B2 (ja) 2010-05-24 2010-05-24 マイクロバンプ形成装置
TW100117392A TWI478253B (zh) 2010-05-24 2011-05-18 Micro-bump forming device
US13/111,252 US8302838B2 (en) 2010-05-24 2011-05-19 Micro-bump forming apparatus
KR1020110048221A KR101209322B1 (ko) 2010-05-24 2011-05-23 마이크로 범프 형성 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010118426A JP5462712B2 (ja) 2010-05-24 2010-05-24 マイクロバンプ形成装置

Publications (3)

Publication Number Publication Date
JP2011249409A JP2011249409A (ja) 2011-12-08
JP2011249409A5 JP2011249409A5 (https=) 2012-11-15
JP5462712B2 true JP5462712B2 (ja) 2014-04-02

Family

ID=44971669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010118426A Expired - Fee Related JP5462712B2 (ja) 2010-05-24 2010-05-24 マイクロバンプ形成装置

Country Status (4)

Country Link
US (1) US8302838B2 (https=)
JP (1) JP5462712B2 (https=)
KR (1) KR101209322B1 (https=)
TW (1) TWI478253B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012131861A1 (ja) 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
US10722965B2 (en) 2013-06-26 2020-07-28 Senju Metal Industry Co., Ltd. Solder ball supplying method, solder ball supplying device, and solder bump forming method
CN112091346B (zh) * 2020-09-07 2022-08-19 昆山联滔电子有限公司 一种激光喷射焊球的焊接方法
CN117680867B (zh) * 2024-02-04 2024-05-24 南京航空航天大学 一种基于纳米颗粒植入与微量元素补偿的高强焊丝的焊接方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2788639B2 (ja) * 1988-09-28 1998-08-20 株式会社日立製作所 半導体集積回路装置の製造方法
JPH04186791A (ja) 1990-11-20 1992-07-03 Nec Toyama Ltd 印刷配線板の製造方法
JP3196582B2 (ja) * 1995-08-24 2001-08-06 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
JPH09102478A (ja) * 1995-10-06 1997-04-15 Sony Corp 半田ボールの被搭載面のクリーニング方法、クリーニング機構及び半田ボール搭載装置
JP3405175B2 (ja) * 1998-03-10 2003-05-12 松下電器産業株式会社 導電ボールの実装装置および実装方法
JP3880027B2 (ja) * 1998-09-17 2007-02-14 千住金属工業株式会社 はんだバンプの形成方法
KR100319813B1 (ko) * 2000-01-03 2002-01-09 윤종용 유비엠 언더컷을 개선한 솔더 범프의 형성 방법
JP3606191B2 (ja) * 2000-10-25 2005-01-05 松下電器産業株式会社 導電性ボールの整列装置および搭載装置
JP3931215B2 (ja) * 2002-05-29 2007-06-13 澁谷工業株式会社 導電性ボール搭載装置
JP3997904B2 (ja) 2002-12-02 2007-10-24 カシオ計算機株式会社 金属ボールの形成方法
JP2008142775A (ja) 2007-11-29 2008-06-26 Athlete Fa Kk ボール供給装置及びボール振込装置
JP5251699B2 (ja) * 2009-04-23 2013-07-31 株式会社日立プラントテクノロジー ハンダボール印刷装置およびハンダボール印刷方法

Also Published As

Publication number Publication date
US20110284618A1 (en) 2011-11-24
US8302838B2 (en) 2012-11-06
TW201209944A (en) 2012-03-01
KR101209322B1 (ko) 2012-12-06
JP2011249409A (ja) 2011-12-08
KR20110128737A (ko) 2011-11-30
TWI478253B (zh) 2015-03-21

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