KR101209322B1 - 마이크로 범프 형성 장치 - Google Patents

마이크로 범프 형성 장치 Download PDF

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Publication number
KR101209322B1
KR101209322B1 KR1020110048221A KR20110048221A KR101209322B1 KR 101209322 B1 KR101209322 B1 KR 101209322B1 KR 1020110048221 A KR1020110048221 A KR 1020110048221A KR 20110048221 A KR20110048221 A KR 20110048221A KR 101209322 B1 KR101209322 B1 KR 101209322B1
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KR
South Korea
Prior art keywords
substrate
filling
film
solder
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020110048221A
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English (en)
Korean (ko)
Other versions
KR20110128737A (ko
Inventor
노리아끼 무까이
이사오 아베
Original Assignee
가부시키가이샤 히타치플랜트테크놀로지
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Application filed by 가부시키가이샤 히타치플랜트테크놀로지 filed Critical 가부시키가이샤 히타치플랜트테크놀로지
Publication of KR20110128737A publication Critical patent/KR20110128737A/ko
Application granted granted Critical
Publication of KR101209322B1 publication Critical patent/KR101209322B1/ko
Assigned to 가부시키가이샤 히타치세이사쿠쇼 reassignment 가부시키가이샤 히타치세이사쿠쇼 권리의 전부이전등록 Assignors: 가부시키가이샤 히타치플랜트테크놀로지
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0112—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H10W72/9445—Top-view layouts, e.g. mirror arrays

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020110048221A 2010-05-24 2011-05-23 마이크로 범프 형성 장치 Expired - Fee Related KR101209322B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010118426A JP5462712B2 (ja) 2010-05-24 2010-05-24 マイクロバンプ形成装置
JPJP-P-2010-118426 2010-05-24

Publications (2)

Publication Number Publication Date
KR20110128737A KR20110128737A (ko) 2011-11-30
KR101209322B1 true KR101209322B1 (ko) 2012-12-06

Family

ID=44971669

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110048221A Expired - Fee Related KR101209322B1 (ko) 2010-05-24 2011-05-23 마이크로 범프 형성 장치

Country Status (4)

Country Link
US (1) US8302838B2 (https=)
JP (1) JP5462712B2 (https=)
KR (1) KR101209322B1 (https=)
TW (1) TWI478253B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012131861A1 (ja) 2011-03-28 2012-10-04 千住金属工業株式会社 鉛フリーはんだボール
US10722965B2 (en) 2013-06-26 2020-07-28 Senju Metal Industry Co., Ltd. Solder ball supplying method, solder ball supplying device, and solder bump forming method
CN112091346B (zh) * 2020-09-07 2022-08-19 昆山联滔电子有限公司 一种激光喷射焊球的焊接方法
CN117680867B (zh) * 2024-02-04 2024-05-24 南京航空航天大学 一种基于纳米颗粒植入与微量元素补偿的高强焊丝的焊接方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258132A (ja) * 2009-04-23 2010-11-11 Hitachi Plant Technologies Ltd ハンダボール印刷装置およびハンダボール印刷方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2788639B2 (ja) * 1988-09-28 1998-08-20 株式会社日立製作所 半導体集積回路装置の製造方法
JPH04186791A (ja) 1990-11-20 1992-07-03 Nec Toyama Ltd 印刷配線板の製造方法
JP3196582B2 (ja) * 1995-08-24 2001-08-06 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
JPH09102478A (ja) * 1995-10-06 1997-04-15 Sony Corp 半田ボールの被搭載面のクリーニング方法、クリーニング機構及び半田ボール搭載装置
JP3405175B2 (ja) * 1998-03-10 2003-05-12 松下電器産業株式会社 導電ボールの実装装置および実装方法
JP3880027B2 (ja) * 1998-09-17 2007-02-14 千住金属工業株式会社 はんだバンプの形成方法
KR100319813B1 (ko) * 2000-01-03 2002-01-09 윤종용 유비엠 언더컷을 개선한 솔더 범프의 형성 방법
JP3606191B2 (ja) * 2000-10-25 2005-01-05 松下電器産業株式会社 導電性ボールの整列装置および搭載装置
JP3931215B2 (ja) * 2002-05-29 2007-06-13 澁谷工業株式会社 導電性ボール搭載装置
JP3997904B2 (ja) 2002-12-02 2007-10-24 カシオ計算機株式会社 金属ボールの形成方法
JP2008142775A (ja) 2007-11-29 2008-06-26 Athlete Fa Kk ボール供給装置及びボール振込装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258132A (ja) * 2009-04-23 2010-11-11 Hitachi Plant Technologies Ltd ハンダボール印刷装置およびハンダボール印刷方法

Also Published As

Publication number Publication date
US20110284618A1 (en) 2011-11-24
US8302838B2 (en) 2012-11-06
TW201209944A (en) 2012-03-01
JP5462712B2 (ja) 2014-04-02
JP2011249409A (ja) 2011-12-08
KR20110128737A (ko) 2011-11-30
TWI478253B (zh) 2015-03-21

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