TWI468257B - A lapping apparatus, a grinding method, and a manufacturing method of a sheet-like member - Google Patents

Description

Grinding device, grinding method, and manufacturing method of thin plate member

The present invention relates to a grinding device, a grinding method, and a method of manufacturing a thin plate member.

The grinding device is a thin plate-shaped workpiece that is formed into a substantially square shape (substantially polygonal shape), and is subjected to end surface grinding of a fragile thin plate glass used in a portable terminal such as a mobile phone. Most of the screens of the portable terminal use a substantially square thin plate glass plate. In such a thin plate glass, an approximate workpiece shape is generally cut from a large glass plate, and the cut end face of the glass plate is accurately ground by a grinding stone of a grinding device to form a predetermined shape. In particular, when the grinding is performed, the chamfering process is also performed, thereby preventing the end surface of the thin glass plate from being damaged. When the grinding is performed by the grindstone of the above-described grinding device, the grinding stone heated by the processing is sprayed from the injection nozzle to cool the grinding stone.

In the case where the outer shape of the glass plate is ground as described above, the grinding stone is relatively moved along the periphery of the glass plate, so that the grinding processing position where the grinding stone is in contact with the glass plate is viewed from the direction of the rotation axis of the grinding stone to be 360 degrees. The direction changes. In other words, for example, when one long side of a substantially square glass plate is ground, the grinding position is viewed from the direction of the rotation axis at 12 o'clock, and the grinding position adjacent to the long side is ground. At the 3 o'clock direction, shift to the 6 o'clock direction when grinding other long sides, and shift to 9 o'clock when grinding other short sides. Further, as described above, when the grinding processing position is sequentially changed during the grinding operation, the grinding fluid supply means for supplying an appropriate grinding fluid to the grinding processing position must also be viewed in the 360-degree direction from the direction of the rotation axis of the grinding stone.

As one of the means for supplying the grinding fluid to the periphery of the grindstone, (1) a ring-shaped supply pipe centered on a grindstone is provided, and a technique of continuously supplying a grinding fluid from the supply pipe toward the center of the grindstone has been developed ( Refer to Japanese Laid-Open Patent Publication No. 2006-346803. However, in the case of such a supply form of the grinding fluid, a large amount of grinding fluid must be consumed. In order to explain this in detail, the grindstone rotates the air around it in a state of being rotated, and in order to break the air layer, the grinding fluid is supplied to the grindstone, and the grinding fluid must be supplied at a sufficient pressure and at a sufficient flow rate. Therefore, when the grinding fluid is supplied from the above-mentioned annular supply pipe, it is necessary to continuously supply the grinding fluid at a flow rate of about 10 times the grinding fluid required at the grinding processing position, so that a sufficient grinding fluid can be supplied to the grinding processing position. .

In addition, if a sufficient flow rate is supplied to the grinding processing position in such a supply form, a large amount of grinding fluid is sprayed toward the grindstone, and as a result, water is accumulated around the grindstone, and the grindstone is rotated in the accumulated water. . In this case, the water film generated by the rotation of the grindstone blocks the jet of the grinding fluid from the supply pipe, which may result in the failure to stably supply the desired grinding fluid to the grinding position, which may cause the grinding fluid to fail to perform. Features.

In addition, as another grinding fluid supply means, (2) a plurality of injection nozzles are provided around the square glass plate of the workpiece, and a technique of spraying the grinding fluid from the injection nozzle near the grinding processing position has been developed (refer to Japan). JP-A-5-162055). However, in the case where the injection nozzle is provided in this way, a large number of injection nozzles must be provided depending on the size of the glass plate, which not only has a problem that the cost of the manufacturing apparatus itself becomes high, but also the installation place of the injection nozzle must be ensured.

Further, as another grinding fluid supply means, (3) it is also conceivable to change the structure of the movement and the ejection direction by one injection nozzle following the grinding processing position of the grindstone. However, with this configuration, the following mechanism causes the device to be re-integrated, resulting in a high cost of the polishing device itself, and it is necessary to secure the installation space of the above-described follow-up mechanism.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-346803

[Patent Document 2] Japanese Patent Laid-Open No. 5-162055

Accordingly, an object of the present invention is to provide a grinding device, a grinding method, and a method for producing a thin plate member which can perform the grinding process of the end surface of the thin plate-shaped workpiece reliably and safely.

The grinding device of the present invention includes a stage on which a workpiece of a thin plate shape is placed, a grinding stone having a grinding surface on which an end surface of the workpiece can be ground, and a grinding stone, and a workpiece to be ground by the grinding surface a moving means for moving the grindstone and the workpiece relative to each other, a plurality of spray nozzles disposed around the grindstone at substantially equal angular intervals, and a plurality of jets for ejecting the micronized liquid to the grinding surface, and the plurality of jets The injection of the nozzle is controlled so as to control the liquid to be ejected toward the rear of the grinding stone in the rotation direction of the grindstone based on the grinding processing position of the grindstone contacting the workpiece.

In the grinding device, the workpiece is placed on the stage, and the workpiece and the grindstone are relatively moved by the moving means, and the end surface of the workpiece can be ground by the grindstone. Further, in the grinding operation, since the jet nozzle ejects the micronized liquid toward the grindstone, the micronized liquid easily breaks through the air layer which is rotated by the grindstone surface on the grindstone surface (grinding surface), and is easy to be sure Ground to the grinding surface of the grindstone. Further, since the injection nozzle ejects the liquid in the direction of the rotation in the comparison grinding processing position, the liquid that reaches the grinding surface of the grinding stone easily reaches the grinding processing position as the grinding stone rotates.

In particular, in the grinding device, even if the relative position of the grinding processing position and the grinding stone rotating shaft is changed as the end surface grinding progresses, the injection of the injection nozzle is controlled by the control means, and the grinding processing position can be rotated more than the grinding stone. The liquid is sprayed backwards, so there is no need to supply a large amount of liquid that is not necessary. Therefore, according to the grinding device, it is possible to reduce the cost required for the liquid, and it is possible to prevent the occurrence of water accumulation around the grindstone.

Further, since the ejection of the liquid is performed by the spray nozzle disposed around the grindstone, a plurality of spray nozzles are not required to be provided over the entire end portion of the workpiece. Therefore, compared with the case where the injection nozzle is provided over the entire end portion of the workpiece, the apparatus can reduce the number of injection nozzles, can reduce the cost of the manufacturing apparatus itself, and can easily ensure the installation place of the injection nozzle.

Further, the grinding method of the present invention is a grinding method in which the end surface of the thin plate-shaped workpiece is ground by a grindstone in a state where the liquid is ejected by the jet nozzle to the grindstone, and has a grinding step and a liquid ejecting step; In the grinding step, the grinding stone is rotated about a rotation axis substantially perpendicular to the plane of the workpiece, and the grinding stone and the injection nozzle are relatively moved with respect to the workpiece, and the end surface of the workpiece is pressed. Performing the grinding; the liquid ejecting step is: when the grinding step is performed, based on the grinding processing position of the grindstone in contact with the workpiece, when the relative position to the rotating shaft of the grindstone is changed, the grindstone is compared The grinding processing position further ejects the micronized liquid behind the rotation direction.

In the method, in the liquid ejecting step, the micronized liquid is ejected toward the grindstone from the spray nozzle, and the micronized liquid easily breaks through the air layer which is rotated by the rotation of the grindstone on the surface of the grindstone (grinding surface). It is easy to supply to the grinding surface of the grindstone. Further, since the liquid is ejected from the injection nozzle toward the rear side in the rotation direction from the grinding processing position, the liquid reaching the grinding surface of the grindstone easily reaches the grinding processing position in accordance with the rotation of the grindstone.

In particular, in the grinding method, when the relative position of the grinding processing position and the rotating shaft of the grindstone is changed in the liquid ejecting step, the grinding processing position of the grindstone can be injected in the backward direction of the rotating direction, so that it is not necessary to supply the liquid. A lot of liquid. Therefore, according to the grinding method, it is possible to reduce the cost required for the liquid, and it is possible to prevent the occurrence of water accumulation around the grindstone.

Further, in the grinding method, since the jetting nozzle and the grindstone are relatively moved relative to the workpiece in the grinding step, a plurality of jet nozzles are not required to be provided over the entire end portion of the workpiece. Therefore, the number of injection nozzles can be reduced as compared with the case where the injection nozzle is provided over the entire end portion of the workpiece, and the cost of the apparatus for carrying out the grinding method can be reduced, and the installation place of the injection nozzle can be easily secured.

In the invention, as the injection nozzle, a two-fluid nozzle that mixes a liquid and a gas is preferably used. In this way, the sprayed micronized liquid can surely break through the air layer around the grindstone generated by the rotation of the grindstone.

In still another aspect of the invention, the injection center axis of the injection nozzle may be provided along the tangential direction of the outer circumference of the grindstone, or may be provided to substantially intersect the rotation axis of the grindstone.

Further, in the invention, the control means may adopt a configuration in which, when the grinding operation is performed, when the relative position of the grinding processing position and the grinding stone rotating shaft is changed, the injection nozzle for performing the spraying is switched. As described above, when the relative position of the grinding processing position and the grinding stone rotation axis is changed, the control means switches the injection nozzles that are ejected among the plurality of injection nozzles, so that the liquid can be reliably injected backward in the rotation direction in comparison with the grinding processing position of the grindstone.

Further, in the above configuration, the stone bearing member that rotatably supports the rotating shaft of the grindstone and the nozzle holder fixed to the grindstone bearing member may be further provided, and the plurality of spray nozzles are mounted On the nozzle holder. In this way, a plurality of injection nozzles can be easily and surely mounted on the nozzle holder fixed to the stone bearing member, and the installation of the injection nozzle can be facilitated.

Further, in the case of the above configuration, it is preferable to control the injection nozzles to be simultaneously ejected to be two or less, so that the effect of performing a reliable grinding operation with a small amount of liquid can be exhibited.

Further, in the case of employing the above configuration, the control means preferably performs the control of ejecting liquid from an injection nozzle when the grindstone is relatively moved in a direction with respect to the workpiece, after which the grindstone is relatively opposed When the workpiece is moved in the other direction crossing the one direction, the liquid is ejected from the other ejection nozzles, and the relative movement from the one direction to the relative movement in the other direction is performed from the one ejection nozzle and Both of the other injection nozzles eject liquid. In this way, the end surface in one direction of the workpiece is ejected from the one jet nozzle, and the end surface in the other direction of the workpiece is ejected from the other jet nozzle, and the grinding operation can be surely performed. Between the end surface in one direction of the workpiece and the end surface in the other direction (for example, a corner portion), since the liquid is ejected from both the one of the ejection nozzles and the other ejection nozzles, the liquid can be surely supplied while being supplied to the portion. The grinding of objects.

Further, in addition to the above-described grinding device and grinding method, the object of the present invention includes a method of manufacturing a thin plate-shaped member including the above-described grinding method.

As described above, according to the present invention, since the liquid can be surely allowed to reach the grinding processing position of the grindstone by the spray nozzle, the workpiece can be ground. Therefore, the end surface of the thin plate-shaped workpiece can be reliably and safely ground. .

Embodiments of the present invention will be described in detail below with reference to the drawings.

First, the overall structure of the grinding device will be described with reference to Figs. 1 to 3 . Further, in each of the drawings, the grinding device is also provided with a protective plate around it in order to secure the safety of the operator, as is well known.

As shown in FIGS. 2 and 3, the grinding device M has a substantially rectangular lattice-shaped base 1 at its lower portion, and various units for performing grinding processing are provided on the upper surface.

In the base 1, the known steel square members 11, 12, and 13 are combined in the left-right direction, the front-rear direction, and the up-and-down direction, and the upper units are strongly supported.

A flat iron material 14 made of iron is placed on the upper surface of the base 1. By the flat plate 14, the square members 11, 12, 13 of the base 1 are shielded, and each unit can be placed on the base 1.

Further, an electronic control unit 15 (control means) is provided in the base 1 to control various units for the grinding process. Further, although not described in detail, the electronic control unit 15 is provided with storage means for storing processing information and the like. Further, although not shown, a control panel for allowing the operator H to input information to the electronic control unit 15 is also provided.

As shown in Fig. 1, the unit provided on the upper portion (on the base 1) of the grinding device M includes: a transport robot 2 installed at the center, and four processing units 3A, 3B, 3C, and 3D provided around the center. The loading and unloading table 4 provided in front of the transport robot 2 and the illumination moving unit 5 extending in the front-rear direction at the left and right sides of the transport robot 2 are provided.

The transport robot 2 is composed of a horizontal joint type (SCARA) robot that is a three-joint joint that moves in the horizontal direction. The first to third figures show the reference state in which the transport robot 2 does not operate, and the operation state is described later with reference to FIGS. 4 to 6 .

The upper and lower slide shafts 20 are provided at the front end of the transport robot 2. At the lower end of the vertical sliding shaft 20, a suction hand 21 for sucking and holding a substantially square (substantially polygonal) thin plate glass W of a workpiece (workpiece) is provided. Further, at the upper end of the vertical slide shaft 20, a camera 23 for image acquisition is attached through the mounting bracket.

In the transport robot 2, the sheet glass W (Wo, Wi) is transported from the loading/unloading table 4 to the processing units 3A, 3B, 3C, and 3D, and is fed from the processing units 3A, 3B, 3C, and 3D to the take-out table. 4 handling. The conveyance work of the workpiece W is performed by the above-described adsorption hand 21. Further, in the transport robot 2, the workpiece W placed thereon can be imaged from above the processing units 3A, 3B, 3C, and 3D by the camera 23.

The four processing units are the first processing unit 3A, the second processing unit 3B, the third processing unit 3C, and the fourth processing unit 3D which are respectively disposed on the front, rear, left, and right sides of the transport robot 2 .

The components of the respective processing units 3A, 3B, 3C, and 3D are set to be identical, and the same grinding operation can be performed. For example, as shown in the first processing unit 3A, the constituent elements include a processing table 30 that sucks and holds the workpiece W in a grinding state, a grinding spindle 31 that performs grinding of the workpiece W from above the processing table 30, and is adjacent to the processing table 30. A tool holder 32 for holding a plurality of grinding tools (grinding stones), and an injection nozzle unit 110 for grinding the grinding fluid to be mounted on the grinding spindle 31.

Among these, the processing table 30 is provided with a left and right slide mechanism 34 (moving means) for sliding the center processing stage 33 in the left-right direction. A resin telescopic cover 35 is provided on the right and left sides of the processing stage 33 (the telescopic cover on the right side of the processing stage 33 is covered by a grinding spindle or the like and is not shown). The stretching cover 35 prevents the grinding fluid from intruding into the left and right sliding mechanism 34. Further, a baffle plate 36 having a rectangular box shape and having an upper opening is provided on the upper surface of the processing stage 33, and the baffle 36 prevents the grinding fluid from splashing.

Further, the grinding spindle 31 is provided with a rear sliding mechanism 38 (moving means) that can be slidably moved in the front-rear direction. Further, between the grinding spindle 31 and the front and rear slide mechanism 38, the upper and lower guide mechanisms 39 are movable in the up and down direction. In this manner, the grinding spindle 31 can move freely not only in the front-rear direction but also in the vertical direction.

Further, as shown in FIG. 2, the front and rear slide mechanism 38 is a side seat 16 that is strongly fixed to a large square material that extends in the front-rear direction. In this way, the support rigidity of the grinding spindle 31 can be improved and the grinding precision can be improved.

The tool 匣32 can hold up to five grinding tools (grinding stones) 6, ... (refer to Fig. 2 and Fig. 3). A plurality of grinding tools 6 such as grindstones having different diameters and grindstones having different abrasive materials are held in the tool magazine 32. The plurality of grinding tools 6 are selectively attached to the grinding spindle 31 in accordance with the processing contents.

The input/unloading table 4 includes an opening and closing door 40 for opening and closing the operator H, a rectangular cymbal mounting table 41 that moves in conjunction with the opening and closing door 40, and a workpiece that is detachably attached to the cymbal mounting table 41. 42.

The opening and closing door 40 is formed of a rectangular steel plate having a long lateral length of a hinge shaft 43 (see FIG. 3) extending in the horizontal direction at the lower end, and a handle portion 44 having a substantially U-shape in plan view is provided on the upper outer surface. The operator H holds the handle portion 44 to rotate the opening and closing door 40 toward the front side around the hinge shaft 43 to open the loading/unloading table 4, and takes out the workpiece W into the grinding device M.

Both side ends of the cymbal mounting table 41 are coupled to a coupling mechanism 45 that is coupled to the upper portion of the opening and closing door 40. Further, the lower portion of the crucible setting table 41 is slidably placed on the slide rail 46 extending in the front-rear direction (see FIG. 3). Therefore, when the operator H performs the opening operation of the opening and closing door 40, the transmission connecting mechanism 45 can slide the cymbal mounting table 41 connected to the opening and closing door 40 to the outer side of the grinding device M. When the operator H performs the closing operation of the opening and closing door 40, the crucible setting table 41 can be slidably moved toward the inner side of the grinding device M.

The workpiece 匣 42 is provided with four laminated portions 48 partitioned by a resin wall 47, and four workpiece W laminates can be arranged in the left-right direction. In this case, the unprocessed workpiece Wi is laminated on the right two laminated portions 48, and the processed workpiece Wo is laminated on the left two laminated portions 48. The workpiece 匣 42 is provided with grip portions 49 for conveyance at both ends so that the operator H can be detached from the cymbal mounting table 41.

The operator H mounts (places) the unprocessed workpiece W on the workpiece 匣 42, and arranges the workpiece 匣 42 on which the workpiece W is placed on the cymbal mounting table 41, and closes the opening and closing door 40 to complete preparation before processing.

The illumination moving unit 5 includes a moving rail 50 that extends in the front-rear direction on both sides of the transport robot 2, and a substantially square-shaped illumination frame 52 that is supported by the moving rail 50 by the vertical moving mechanism 51.

The front end and the rear end of the moving rail 50 are fixed to the metal flat plate 14 through the support brackets 50a and 50a. The rear end of the moving rail 50 extends to the position of the tool 匣 32 of the processing unit (the second processing unit 3B, the fourth processing unit 3D) on the rear side. Therefore, the illumination frame 52 can be moved largely to the rear side of the grinding device M, and the illumination frame can be made at the standby point when the illumination frame 52 is not used (at the time of grinding processing for each of the machining units 3A, 3B, 3C, and 3D). 52 retreat to the position on the back side.

In the illumination frame 52, a plurality of LEDs (not shown) are embedded in the inner peripheral surface of each of the frame portions 52a, ... to illuminate the inside of the frame. When the camera 23 captures the workpiece W, the illumination frame 52 can be moved to the shutter 36 of the processing table 30, and the workpiece W can be illuminated from the side by the LED to make the shape (profile) of the workpiece W appear, and the workpiece can be easily performed. W shooting.

Next, the transport robot 2 will be described with reference to FIGS. 4 to 6 . Fig. 4 is a three-side view of the transport robot, (a) is a front view, (b) is a side view, and (c) is a plan view. Fig. 5 and Fig. 6 are explanatory views of the operation when the transport robot performs the transport, and Fig. 5(a) shows the state from the reference state to the workpiece holding start state, and Fig. 5(b) shows the state from the workpiece holding start state to the travel. The workpiece conveyance state of the processing table, Fig. 6(c) shows the workpiece conveyance state to the processing table to the camera shooting state, and Fig. 6(d) shows the state from the camera shooting state to the next workpiece holding state.

The transport robot 2 is composed of a horizontal joint type robot having three joints that move in the horizontal direction as described above, and is movable in the horizontal direction. Specifically, as shown in FIG. 4(b), the transport robot 2 is provided to be rotatable in the first joint 2Ja, the second joint 2Jb, and the third joint 2Jc, and is movable in the left-right direction. In this manner, the vertical sliding shaft 20 at the front end of the front side arm 24 can be moved in the horizontal direction.

The vertical slide shaft 20 penetrates the front end of the front arm 24 in the vertical direction, and is also slidable in the vertical direction.

The suction hand 21 is provided at the lower end of the upper and lower slide shafts 20. In the suction hand 21, four suction cups 26 facing the lower side are provided on the rectangular flat bottom plate 25. The negative pressure is applied to the suction cup 26 to generate an adsorption force, whereby the sheet glass W of the workpiece is adsorbed and held.

The four suction cups 26, ..., as shown in Fig. 4(c), are disposed on the left and right sides respectively. The two workpieces W are adsorbed and held by the two suction cups 26. Therefore, one suction hand 21 can carry two pieces of workpiece W at a time.

Further, in the suction hand 21, pins 72 projecting downward are provided at both ends of the bottom plate 25. The pins 27 and 27 are abutting members that abut against the workpiece W. That is, before the workpiece W is conveyed, the workpiece W is pushed into the workpiece 42 by the movement of the transport robot 2, and the workpiece W is aligned in the workpiece 42.

The camera 23 described above is provided at the upper end of the vertical slide shaft 20. The camera 23 holds a position (projecting portion of the bottom plate 25) with respect to the workpiece W of the suction hand 21, and is disposed at a position shifted by about 90 degrees. This is because when the camera 23 performs photographing, it is prevented from being blocked by the bottom plate 25. The camera 23 is constituted by a general CCD camera and can acquire two-dimensional image data.

Further, the camera 23 is attached to the vertical slide shaft 20 via a mounting bracket 22. The mounting bracket 22 includes a wrist portion 22a that is slightly curved downward, a camera mounting portion 22b that can adjust the position in the vertical direction, and a cylindrical shaft fixing portion 22c that is fixed to the vertical sliding shaft 20. Since the camera 23 is fixed to the vertical slide shaft 20 through the arm portion 22a, it is located at a position separated from the vertical slide shaft 20, and the front arm 24 can be prevented from being reflected during imaging.

Next, the operation when the transport robot 2 performs the transport will be described with reference to FIGS. 5 and 6 .

As shown in Fig. 5(a), the transport robot 2 first slightly rotates the joints in the counterclockwise direction from the reference state, and adsorbs the unprocessed workpiece Wi stacked on the workpiece 匣 42 by the suction hand 21. At this time, the upper and lower slide shafts 20 are largely rotated counterclockwise to rotate the bottom plate 25 of the suction hand 21, and the unprocessed workpiece Wi is sucked by the suction cup 26 on the left side.

Then, as shown in Fig. 5(b), the transport robot 2 rotates the joints in a counterclockwise direction to convey the workpiece Wi to the processing table 30 of the first machining unit. At this time, the workpiece Wi is transported to an approximate position and placed on the processing table 30. That is, the strict position confirmation is not performed, and the workpiece Wi is transported to the processing table 30 and placed at an approximate position.

Next, as shown in Fig. 6(c), the transport robot 2 rotates the front side arm 24 further in the counterclockwise direction, and rotates the up and down slide shaft 20 in the clockwise direction, so that the camera 23 is surely positioned in the workpiece Wi. Above (just above). In this manner, the transport robot 2 can photograph the workpiece Wi that is carried and placed by the camera 23 by itself. The order of photographing of the workpiece W and the like will be described later.

Finally, as shown in Fig. 6(d), after the photographing of the workpiece Wi is completed, the transport robot 2 resets the joints in the clockwise direction in order to carry the next unprocessed workpiece W, by the left side of the bottom plate 25. The suction cup 26 sucks the next workpiece W.

Then, the transport robot 2 repeatedly performs the operation of FIG. 5(b), and transports the unprocessed workpiece W from the workpiece 匣42 to the next processing stage. In this way, the unprocessed workpiece W can be continuously transported on the processing table of the empty processing unit.

Further, although not specifically illustrated, the transport robot 2 transports the processed workpiece Wo after the machining is completed by the suction cup 26 on the right side, and transports it from the processing table 30 to the workpiece 匣 42. The conveyance robot 2 receives the processed workpiece Wo from the processing table 30 before performing the operation of FIG. 5(b), and simultaneously conveys the unprocessed workpiece Wi and conveys the processed workpiece Wo.

Next, the processing unit will be described. Fig. 7 is a plan view of the processing unit, Fig. 8 is a front view showing a part of the processing unit, and Fig. 9 is a side view of the processing unit including a part of the section.

The processing unit 3B (described as a second processing unit for convenience) has a processing table 30 for holding the workpiece W, a grinding spindle 31 for grinding the workpiece W, and a grinding tool 6 as shown in Fig. 7. Tool 匣32.

The processing table 30 includes the rectangular processing stage 33 (stage), the left and right sliding mechanism 34 that moves the processing stage 33 to the left and right, the telescopic cover 35 that covers the left and right sliding mechanism 34, and the processing stage 33. The upper baffle 36 and the spray nozzle unit 110 for jetting the grinding fluid.

Further, as shown in Fig. 8, the processing table 30 further includes various components.

First, on the upper surface of the processing stage 33, a suction stage 70 for adsorbing and holding the workpiece W to the inner center of the baffle 36 is provided. The suction stage 70 is constituted by a block-shaped pedestal having a substantially T-shape in which the upper surface (bearing surface) 70a has a rectangular shape (see Fig. 7). In the upper surface 70a of the adsorption stage 70, a plurality of intake ports 70b are provided in order to impart a negative pressure (see Fig. 10 and Fig. 11). Further, in order to avoid damage to the surface of the workpiece W of the thin glass, smooth processing is performed on the upper surface 70a of the adsorption stage 70.

Two reference pins 71, 71 for calculating the machine origin at the time of the grinding process are vertically disposed around the suction stage 70 so as to face the camera 23 side (upper side). The reference pins 71, 71 are imaged by the camera 23 in a state in which the workpiece W is placed (held) on the adsorption stage 70, and are disposed at positions that do not overlap the workpiece W. Further, the two reference pins 71, 71 are disposed at diagonal positions with respect to the workpiece W. Further, when the workpiece W is completely transparent, the position of the reference pin may be set to overlap the workpiece W.

Further, as shown in Fig. 8, the front end portion 71a of the reference pin 71 has a height hp set to be the same as the height hs of the upper surface 70a of the suction stage 70. With such a setting, when the camera 23 performs imaging, focus shift does not occur between the workpiece W and the reference pin 71, and image data can be reliably acquired.

Further, inside the baffle 36, a high-bottom, inclined, substantially quadrangular background plate 72 is provided. The background panel 72 is completely matt blackened to prevent reflections when the camera 23 is reflected, and the reflection of the workpiece W and the reference pin 71 is more prominent. Further, by setting the background plate 72 obliquely, the grinding fluid can be immediately moved downward. Further, the background plate 72 is formed with an insertion hole (not specifically shown) through which the reference pin 71 and the suction stage 70 are inserted.

At a position adjacent to the baffle 36, a drain pipe 73 and a drain pipe 74 for discharging the grinding fluid flowing downward from the baffle 36 are provided. By providing the drain pipe 73 and the drain duct 74, the grinding fluid can be prevented from staying in the baffle 36.

The left and right slide mechanism 34 freely slides the machining stage 33 in the left-right direction by a well-known LM guide. Further, the left and right slide mechanism 34 controls the amount of slip by the stepping motor 34M. That is, the position of the processing stage 33 in the left-right direction is controlled by the left and right sliding mechanism 34. As described above, the left and right slide mechanism 34 can define the left and right positions of the grinding path when performing the grinding process described later.

The telescopic cover 35 is expandable and contractible in the left-right direction like a so-called accordion. Therefore, even if the processing stage 33 is moved left and right by the left and right sliding mechanism 34, a gap does not occur between the processing stage 33 and the telescopic cover 35, and the grinding fluid can be prevented from flowing into the left and right sliding mechanism 34.

The baffle 36 is formed in a rectangular box shape having an upper opening as described above to prevent the grinding fluid from leaking to the outside. Specifically, as shown in Fig. 8, the side wall 36a of the shutter 36 extends to a position hc higher than the reference pin 71 (hp) and the suction stage 70 (hs) to prevent the grinding fluid from leaking out.

The grinding spindle 31 includes an electric motor 31a that generates a rotational driving force for grinding, and a chuck 31b that fixes the grinding tool 6 (grinding stone) to the main shaft of the electric motor 31a.

As described above, the grinding spindle 31 is provided with a front and rear slide mechanism 38. The front and rear slide mechanism 38 includes a slide rail 38a extending in the front-rear direction and a slider 38b moving on the slide rail 38a. The front and rear slide mechanism 38 also controls the amount of sliding of the slider 38b by the stepping motor 38M, and the front and rear slide mechanism 38 controls the front and rear positions of the grinding spindle 31. As described above, the front and rear slide mechanism 38 can define the position in the front-rear direction of the grinding path during the grinding process.

Further, between the grinding spindle 31 and the front and rear slide mechanism 38, the upper and lower guide mechanisms 39 are provided as described above. The vertical guide mechanism 39 also includes a rail 39a extending in the vertical direction and a moving member 39b moving on the rail. Further, the vertical guide mechanism 39 also controls the amount of vertical movement of the moving member 39b by the stepping motor 39M. The vertical position of the grinding spindle 31 is controlled by the vertical guide mechanism 39. Thus, when the grinding tool 6 is aligned with the workpiece W, the vertical guide mechanism 39 is used to adjust the position.

Further, the nozzle holder 111 of the spray nozzle unit 110 to be described later is attached to the grindstone bearing member 100 fixed to the moving member 39b (rotatably axially supporting the grinding spindle 31).

The tool holder 32 can hold up to five grinding tools 6, ... as described above. Specifically, as shown in Fig. 9, the five tool holding portions 32a, ... for holding the grinding tools 6, ... are arranged in a row in the front-rear direction, at the tool holding portion 32a and the grinding spindle 31. The transfer of the grinding tool 6 can be automatically performed between.

Therefore, in the grinding device M, a plurality of grinding tools 6, ... can be automatically replaced according to the grinding portion, and the degree of freedom of grinding can be improved.

The grinding tool 6 for grinding the spindle 31 will be described with reference to Figs. 10 and 11 . Fig. 10 is a detailed side view when a large diameter grinding tool is used, and Fig. 11 is a detailed side view when a small diameter grinding tool is used.

As described above, the grinding spindle 31 can be attached or detached by the chucking tool 31, and the large-diameter grinding tool 6A shown in Fig. 10 or the small-diameter grinding tool 6B shown in Fig. 11 can be switched. .

The large-diameter grinding tool 6A shown in Fig. 10 is provided with a large-diameter cylindrical processed portion 61 (grinding stone) to which a diamond particle 60 is adhered on a surface (grinding surface), and is fixed to the chuck 31b and extends in the vertical direction. The shaft portion 62 is provided with a flange portion 63 that is enlarged outward on the upper side of the processed portion 61. Further, three recessed portions 64 which are strip-shaped recessed are formed in the lower portion of the processed portion 61.

The large-diameter grinding tool 6A is rotated by the grinding spindle 31, and the concave portion 64 abuts against the outer edge (outer shape) Wa of the workpiece W, whereby the outer shape of the workpiece W is ground and chamfered. Another 70 represents the adsorption stage.

In this way, the workpiece W is ground by the large-diameter grinding tool 6A, and the grinding tool 6A can be stably ground during the grinding process, so that the machining accuracy can be improved. In addition, since the grinding tool 6A is a large diameter. The tool life of the tool can be extended, and the workpiece W can be continuously drilled in large quantities.

The small-diameter grinding tool 6B shown in Fig. 11 includes a small-diameter cylindrical processed portion 161 (grinding stone) for attaching the diamond particles 160 to the surface (grinding surface), and a shaft portion 162 fixed to the chuck 31b. A flange portion 163 is provided on the upper side of the processed portion 161. Further, in the lower portion of the processed portion 161, three recessed portions 164 which are recessed in a strip shape are formed.

Since the grinding tool 6B having the small diameter has a small diameter, the grinding tool 6 is inserted into the hole portion Wb of the workpiece W, and the concave portion 164 abuts against the inner edge Wc of the hole portion Wb, whereby the hole portion Wb of the workpiece W can be made inner. Shape grinding and chamfering.

In this way, the hole portion Wb of the workpiece W is internally ground by the small-diameter grinding tool 6B, and even if the hole portion Wb has a small diameter and is not easily processed, the grinding process can be surely performed.

The spray nozzle unit 110 will be described using Fig. 15. Fig. 15 is a schematic plan view for explaining the spray nozzle unit.

The jet nozzle unit 110 includes a nozzle holder 111 that is attached to the grinding stone bearing member 100 as described above, and a plurality of injection nozzles 112 attached to the nozzle holder 111. The injection nozzles 112 are disposed around the grindstone 61 (processed portion) at equal angular intervals. In the present embodiment, the injection nozzles 112 are disposed so as to surround the outer circumference of the grindstone 61, and the four injection nozzles 112 are disposed at intervals of 90 degrees apart from each other. In the present embodiment, the injection nozzles 112 are disposed such that the imaginary line connecting the pair of opposed injection nozzles 112 forms an angle of about 45 degrees with the side (long side) of the workpiece W. Further, as shown in Fig. 17, the injection nozzle 112 is disposed such that the imaginary line is parallel to the side of the workpiece W.

Further, in the present embodiment, the injection nozzle 112 sprays the grinding liquid toward the rotation shaft of the grindstone 61, and fixes the injection nozzle 112 such that the injection center axis of the injection nozzle 112 intersects with the rotation axis of the grindstone 61. It is also possible to fix the injection nozzle 112 such that its injection center axis is along the tangential direction of the outer circumference of the grindstone. Further, the injection nozzle 112 can also be arranged to be rotatable in order to change the direction (ejection direction) of the injection center axis, and the direction of the injection center axis is controlled by the above-described electronic control unit 15.

Each of the injection nozzles 112 is controlled to be ejected and stopped by the above-described electronic control unit. The specific control method is explained later.

Further, in the present embodiment, each of the injection nozzles 112 is a two-fluid nozzle that mixes a liquid and a gas. The two-fluid nozzle pulverizes and pulverizes a liquid supplied in a high-pressure state by a high-speed air stream composed of compressed air, and then ejects the liquid together with the gas. Further, the injection nozzle unit 110 is provided with a liquid connection port 113 and a gas connection port 114 for supplying a liquid (grinding liquid) and a gas (air) to each of the injection nozzles 112, and the liquid connection port 113 and the gas connection port 114 are respectively connected. The grinding fluid storage unit (not shown) and the compressor (not shown) are used.

Further, various grinding fluids can be used for the grinding fluid sprayed from the injection nozzles 112. As the grinding fluid, it can have any function of cooling the cooling stone, cleaning function of removing the grinding debris, lubricating function for reducing the grinding resistance, and preventing the rusting function of the grinding stone, or having multiple functions at the same time. . Further, a water-soluble grinding fluid (water-soluble type) which is transparent or translucent and soluble in water, a monomer such as kerosene or a mixture of sulfur, chlorine or the like mixed therein may be used as a surfactant or an emulsifier. An oil-based grinding fluid (mineral oil type) composed of a high-pressure additive, a synthetic oil-based material other than mineral oil or an emulsifier, and an emulsion system in the middle of the water-based grinding fluid and the oil-based grinding fluid. Grinding fluid, etc. Among such a variety of grinding fluids, the appropriate conditions can be adopted according to the grinding conditions.

Next, the control method of the grinding device M will first be described with reference to FIGS. 12 to 14 for the control method of the workpiece W grinding path calculation. Fig. 12 is a flow chart showing a control method of the grinding device, Fig. 13 is a side view showing a state of the camera processing table, and Fig. 14 is an explanatory view for explaining processing and calculation methods of the captured data.

As shown in the flowchart of Fig. 12, after starting, first, the model data (outer shape, hole portion, and the like) of the workpiece W is input to the electronic control unit 15 at S1. In the input operation, for example, the design data (CAD data) of the processed workpiece Wo is converted into a grinding data such as a grinding path using another software, and then input to the electronic control unit 15.

After the above-described input operation is completed, the actual workpiece Wi (hereinafter referred to as the actual workpiece) is placed (loaded) on the processing table 30 at S2. This mounting work is performed by the transport robot 2 described above. By this mounting operation, the unprocessed actual workpiece Wi is placed on the adsorption stage 70 of the processing table 30.

Then, at S3, the image of the actual workpiece Wi and the reference pins 71, 71 is obtained by the camera 23. Figure 13 shows the shooting status of the camera. As shown in Fig. 13, in the grinding device M, the workpiece Wi and the reference pins 71, 71 of the processing table 30 are imaged by the camera 23 attached to the upper portion of the transport robot 2 that transports the workpiece Wi. By photographing the processing table 30 from the upper position as described above, it is possible to minimize the variation of the image data of the workpiece Wi and the reference pins 17 and 17 which are obtained.

An example of the image data thus obtained is shown in Figure 14(a). The workpiece Wi and the two reference pins 71, 71 are acquired as image data to calculate position data.

Next, at S4, the machine origin C of the processing table 30 is calculated based on the positions of the reference pins 71, 71. The machine origin C here is the reference for the mechanical coordinates of the grinding process, and by specifying the machine origin C, the correct grinding process can be performed.

The mechanical origin C is determined by the midpoint of the connecting line L of the two reference pins 71, 71 as shown in Fig. 14(b). As another example, as shown by a broken line, two reference pins 71 ' , 71 ' are further added, and the intersection with the connection line N of the two reference pins 71 ' , 71 ' may be set to the machine origin C.

Next, at S5, the gravity center position P of the outer shape Wa of the actual workpiece Wi and the gravity center position Q of the hole portion Wb are calculated based on the data of the actual workpiece Wi. Here, the position of the center of gravity refers to the position of the center of gravity of the figure, which is determined according to the outer shape of the workpiece W and the shape of the hole. The black circles P and Q shown in Fig. 14(b) are the position of the center of gravity of the outer shape Wa of the actual workpiece W and the position of the center of gravity of the hole portion Wb.

Then, at S6, the position of the center of gravity of the actual workpiece Wi (the center of gravity P of the outer shape and the position of the center of gravity Q of the hole) and the position of the center of gravity of the model Wm (the position of the center of gravity Pm of the outer shape and the position of the center of gravity Qm of the hole) are made coincident. By matching the center-of-gravity positions P and Q of the actual workpiece W with the centroid positions Pm and Qm of the model Wm, the difference between the actual workpiece Wi and the model Wm (difference in positional data) can be clarified. The state shown in Fig. 14(c) is a state in which the actual workpiece Wi and the center-of-gravity positions P, Q, Pm, and Qm of the model Wm (small chain line) are matched. In this manner, by making the center-of-gravity positions P, Q, Pm, and Qm coincide, the difference between the actual workpiece Wi and the model Wm can be made clear.

Next, in S7, the machine origin C of the machining table 30 and the center of gravity P of the actual workpiece Wi are compared, and the offset of the center of gravity C of the machine origin C and the actual workpiece Wi is calculated (the offset X in the lateral direction, vertical) The amount of shift Y in the direction and the amount of shift in the direction of rotation θ). Further, the actual workpiece Wi and the model Wm are also compared, and the amount of cut Δw is calculated from the difference in the shape. In this way, the amount of grinding of the actual workpiece Wi and the like can be clarified.

Figure 14(d) shows the various offsets and amounts of cut. The offset amount of the center-of-gravity position P of the actual workpiece Wi with respect to the machine origin C of the processing table is shifted to the left side by X, and shifted to the upper side by Y, and is also inclined to the right side by θ.

Further, regarding the amount of shaving, the amount of Δw1 in the width direction is calculated by subtracting the width dimension T1 of the model from the width dimension r1 of the actual workpiece Wi and dividing by 2, and the amount of Δw2 in the longitudinal direction is from the actual workpiece. The length dimension r2 of Wi is subtracted from the length dimension T2 of the model and divided by 2.

When the amount of Δw1 and Δw2 in the width direction and the longitudinal direction are obtained in this manner, the larger value is regarded as the final amount of Δw. The reason for this determination is that, during the grinding process, since the workpiece is cut by a certain amount of cutting amount along the trajectory similar to the shape of the model, a large value can be selected to surely enter. Cut in and grind into a shape closer to the model.

Next, at S8, the grinding path of the workpiece Wi is calculated in accordance with the X, Y, θ offset, and the amount of cut Δw. This grinding path changes depending on the shape of the actual workpiece Wi and the position of the actual workpiece Wi, and therefore varies depending on each workpiece W.

Then, at S9, the actual workpiece Wi is ground based on the calculated grinding path. This grinding operation is performed by moving the grinding spindle 31 and the processing table 30 (processing stage 33) separately. The grinding operation of the workpiece W is performed by using the above-described large-diameter grinding tool 6A and the small-diameter grinding tool 6B in accordance with the grinding portion.

Next, an injection control method of the grinding fluid from the injection nozzle at the time of the grinding operation will be described using FIG. Figure 16 is a schematic plan view showing the grinding state of the workpiece. Further, in Fig. 16, in order to distinguish the four injection nozzles, 112a to 112d are used as the symbols of the injection nozzles.

As shown in Fig. 16(a), when the end surface of one of the long sides of the workpiece W is ground, it is rearward of the grinding direction of the grindstone 61 from the grinding processing position (the contact point of the workpiece W end surface and the grindstone 61). The first injection nozzle 112a on the side sprays the grinding fluid. At this time, the grinding fluid is not sprayed from the other three injection nozzles 112b, ....

Next, as shown in Fig. 16(b), when grinding the corner between the long side of the workpiece W and the short side adjacent to the long side, not only the first injection nozzle 112a but also the second injection The nozzle 112b (the injection nozzle on the rear side in the rotation direction of the grindstone 61 from the first injection nozzle 112b) also ejects the grinding fluid. At this time, the grinding fluid is not sprayed from the other two injection nozzles 112c, 112d.

Next, as shown in Fig. 16(c), when the short side of the workpiece W is to be ground, the ejection of the grinding liquid from the first injection nozzle 112a is stopped, and the rotation direction of the grindstone 61 is made more than the grinding processing position. The second injection nozzle 112b on the rear side sprays the grinding fluid. At this time, the grinding fluid is not sprayed from the other two injection nozzles 112c, 112d.

As shown in Fig. 16 (d), when the end faces of the other long sides of the workpiece W are to be ground, the grinding liquid is sprayed from the third injection nozzle 112c on the rear side in the rotation direction of the grindstone 61 from the grinding processing position. At this time, the grinding fluid is not sprayed from the other three injection nozzles 112a, .... Further, in the corner portion between the sixteenth (c) and (d), similarly to the above-described corner portion (Fig. 16(b)), not only the second injection nozzle 112b but also the third injection nozzle 112c is sprayed and ground. liquid.

In the above description, only the case where the workpiece W is subjected to the outer shape grinding using the large-diameter grinding tool 6A will be described, and the case where the hole portion of the workpiece W is subjected to the inner shape grinding using the small-diameter grinding tool 6B is also The same control method as described above controls the injection and stops the injection to perform the grinding operation. In other words, the grinding operation can be performed by spraying the grinding liquid from one of the injection nozzles on the rear side in the rotation direction of the grindstone than the grinding processing position. Further, at the corner portion, the grinding operation can be performed by spraying the grinding liquid from both the next predetermined injection nozzle and the injection nozzle currently being sprayed.

Finally, at S10, the actual workpiece Wi is taken out (moved out) from the processing table 30. This take-out operation is also performed by the transport robot 2, and the processed workpiece Wo is taken out from the processing table 30.

Next, in S11, it is judged whether or not the job is completed, and if the work is to be continued (NO), the process proceeds to S2 in order to perform the machining of the next workpiece W. On the other hand, if the job is to be completed (judgment YES: the power is turned off), it is directly moved to the end.

The grinding device M of the present embodiment is controlled by the above steps.

In the present embodiment, in the grinding step, the jetting nozzle 112 composed of the two-fluid nozzle sprays the fine-grained grinding fluid toward the grindstone 61, and the micronized grinding fluid easily breaks through the surface of the grindstone 61 (grinding surface) by grinding. The rock 61 is rotated to carry a rotating air layer, and is easily supplied to the grinding surface of the grindstone 61. Further, since the grinding liquid is sprayed from the injection nozzle 112 to the rear side in the rotation direction from the grinding processing position, the liquid reaching the grinding surface of the grindstone 61 easily reaches the grinding processing position as the grinding stone 61 rotates.

Further, the grinding fluid sprayed from the two-fluid nozzle 112 has less interference with the liquid droplets generated when the liquid particles of the previously obtained grinding liquid are discharged by the centrifugal force generated by the grindstone 61, and can efficiently reach the grindstone in order. The grinding surface of 61, and the grinding surface of the grinding stone 61 and the grinding chip. In the collision, the gas existing in the space between the abrasive grains of the grinding surface of the grindstone 61 functions differently from the case of the general liquid supply mode (in the case where the liquid is supplied in a state where the gas is shielded in a comprehensive manner). In other words, by allowing the liquid particles to act on the gas blocks in the respective spaces, the gas can be pushed out from the space between the abrasive grains, and the gas can be displaced into a liquid by the gas. Further, the grinding liquid that has reached between the abrasive grains stays in the space by the surface tension of the periphery. Therefore, an appropriate amount of the grinding liquid can be stably held between the abrasive grains, and the space for the grinding liquid can be stably and efficiently supplied to the grinding liquid in the space as the grinding stone 61 rotates to the grinding processing position.

Further, as long as the grinding liquid has a cooling function, the cooling state of the abrasive grains at the grinding processing position can be stabilized, and the grinding heat can be removed from the periphery of the grinding processing position, thereby preventing the abrasive grains from being overheated and reducing the abrasion. Further, since the cooling effect is provided, the heating of the grinding chips can be reduced, and the phenomenon that the grinding chips are welded to the space between the abrasive grains or the abrasive grains can be prevented, and the processing state can have good thermal stability. Therefore, stable processing quality can be achieved when processing thermally fragile or heat sensitive materials.

In addition, when the grinding fluid has a lubricating function or the like, the grinding fluid can be sufficiently supplied to the space between the grindstone 61, the abrasive grains, and the abrasive grains, and the non-adhesive action and the lubricating action are exerted, thereby reducing the adhesion of the grinding debris. The effect and the abrasive grain prevent the heating effect.

Further, according to the grinding device, the washing effect can be exhibited by the intermittent collision and the collision force of the liquid particles. This is an effect of further sweeping out the grinding chips after the phenomenon of adhesion between the abrasive grains by the above-described effects is reduced. After the above-mentioned adhesion phenomenon is alleviated, the grinding debris in the space between the abrasive grains and the abrasive grains which are retained and adhered, and the grinding debris are directly collided, and the grinding debris is hit, and the fixed cutting portion is hit. Peel off and sweep out efficiently with the grinding fluid. Further, by the effect of the grinding fluid having the above-described lubricating function, the adhesion state of the deposits can be reduced, and the effect of multiplying the adhesion of the grinding chips can be obtained.

Further, according to the grinding device, when the relative position of the grinding processing position and the rotating shaft of the grindstone 61 is changed in the grinding operation, the injection of the injection nozzle 112 is controlled by the control means 15, so that the grinding processing of the grindstone 61 can be surely compared. The position is further sprayed in the direction of the rotation, without the need to supply non-essential grinding fluid. Therefore, according to the grinding device, the cost required for the grinding fluid can be reduced, and the water accumulation state around the grindstone 61 can be prevented.

Further, according to the grinding device, the injection nozzle 112 and the grindstone 61 are moved together during the grinding operation, so that it is not necessary to provide the injection nozzle 112 over the entire end portion of the workpiece. Therefore, compared with the case where the injection nozzle is provided over the entire end portion of the workpiece, the injection nozzle can be reduced, and the cost of the apparatus can be reduced, and the installation place of the injection nozzle can be easily secured. Further, the grinding device is provided with four injection nozzles 112 so as to surround the outer circumference of the grindstone 61. Since each of the injection nozzles 112 is disposed at a position opposite to the rotation axis of the grindstone 61, the structure is simple and the device can be lowered. Cost, and it is easy to ensure the installation place of the spray nozzle.

Further, according to the grinding device, the grinding liquid can be sprayed from the appropriate injection nozzle 112 in accordance with the long side and the short side of the workpiece W, so that the grinding operation can be surely performed, and since the corners of the workpiece W are from the two injection nozzles 112. The grinding liquid is sprayed, and in this portion, the liquid can be surely supplied and the workpiece can be ground. Further, since the injection nozzles 112 that simultaneously perform the injection are controlled by the control means 15 within two, the grinding operation can be surely performed using a small amount of liquid according to the grinding device.

In addition, the fluid supply ratio/pressure ratio of each fluid (grinding fluid and air) of each two-fluid nozzle, the supply amount of the mixed fluid, the supply pressure, and the like are corresponding to the number of revolutions of the grindstone, the type of the grindstone, and the abrasive grains. According to the grinding method of the present embodiment, in the grinding process of the sheet glass having a thickness of 0.2 mm to 3.0 mm, it is possible to perform high-efficiency grinding with an end surface grinding amount of 20 μm or less. Compared with the case of using a general grinding method, it is possible to obtain a grinding speed improvement effect of about 5 times to 10 times.

In addition, the grinding device M of the present embodiment is a grinding device M that performs end surface grinding of thin glass (W), and preliminarily mounts (stores) the material (S1) of the thin glass model Wm, and based on the reference pin 71 obtained by the camera 23, The photographing data of 71 calculates the machine origin C of the processing table 30 (S4). Then, based on the photographing data of the thin plate glass (actual workpiece Wi) obtained by the camera 23, the center of gravity P of the thin plate glass (actual workpiece Wi) is obtained (S5), and the machine origin C of the processing table 30 and the thin plate glass (W) When the center of gravity P is compared, the offset amount of the thin glass (the shift amount X in the vertical direction, the shift amount Y in the lateral direction, and the shift amount θ in the rotational direction) is calculated (S7), and the offset is calculated. The grinding path (S8) of the quantity is operated by the grinding spindle 31 based on the calculated grinding path (S9).

Therefore, even if the "marked mark (mark)" or the like is not formed in the thin plate glass (W) itself, the "machine origin C" can be obtained by the reference pins 71, 71 provided on the processing table 30, and the thin plate glass can be grasped ( The offset amount (X, Y, θ) of W) can be accurately ground by the thin plate glass (W) in which no mark (symbol) or the like is formed by the offset amount that is grasped.

In the grinding device M for the end face grinding of the thin plate glass (W) for the display screen of the portable terminal such as a mobile phone, the grinding process is performed by the imaging data of the camera 23, so that the machining can be performed with high precision. Grinding can be performed even if no mark or the like is provided on the surface of the thin plate glass (W).

Further, in the present embodiment, the machine origin is obtained by using a plurality of reference pins 71 and 71. In addition, the machine origin can be obtained by the partial protrusion protruding portion, and the local coloring reference can be used. The department finds the mechanical origin.

Further, in the present embodiment, the center of gravity P of the thin plate glass (W) is aligned with the center of gravity Pm of the model Wm, and the thin plate glass (W) and the model Wm are compared to calculate the amount of cutting Δw of the grinding spindle 31. In other words, it is determined how much the thin plate glass (W) is larger than the model Wm (for example, the difference between the longitudinal direction and the width direction is measured, and the magnitude of the "difference"), and the amount of cut Δw is changed in accordance with the size.

Therefore, the amount of Δw of the thin plate glass (W) can be changed depending on the workpiece, and the thin plate glass (W) can be processed in a more correct shape and size.

In this way, the amount of cutting Δw of the thin glass that is changed depending on the workpiece can be more accurately grasped to perform the grinding operation, so that processing of a plurality of thin glass sheets can be performed with high precision.

Further, in the present embodiment, the gravity center position P of the outer shape Wa of the thin glass and the gravity center position Q of the shape of the hole portion Wb are obtained, and the position of the center of gravity of the workpiece Wi is calculated.

By calculating the gravity center position P of the outer shape Wa of the thin plate glass (W) and the gravity center position Q of the shape of the hole portion Wb of the thin plate glass, even the thin plate glass having the hole portion can be surely ground in accordance with the shape of the model Wm. .

In this way, even in the case of the thin glass (W) having a complicated shape of the hole portion Wb, the grinding path can be accurately calculated and the grinding can be performed with high precision.

Further, in the present embodiment, the reference pins 71, 71 are provided at both side positions of the thin plate glass (W).

Thus, the machine origin C formed on the connecting line L of the at least two reference pins 71, 71 can be formed at a position close to the center of gravity P of the thin plate glass (W).

Therefore, the offset amount of the thin glass (W) can be calculated more accurately. In other words, by bringing the machine origin C closer to the center of gravity P of the thin plate glass (W), it is possible to reduce the error in the calculation of the offset amount, and to calculate the correct offset amount.

Therefore, it is possible to perform grinding processing with higher precision.

Further, in the present embodiment, the front end portion 71a of the reference pin 71 is set to be the same height as the upper surface 70a of the suction stage 70 (hp = hs), the distance to the camera 23, and the thin plate glass (W) are The distance of the camera 23 is substantially the same.

As described above, since the position of the photographed point (front end portion 71a) of the reference pin 71 and the position of the sheet glass (W) in the height direction substantially match, the focus of the camera 23 can be surely aligned.

In this way, the reference pin 71 and the thin glass (W) can be reliably photographed at the same time, and the amount of shift of the thin glass (W) can be more accurately calculated.

The present invention is not limited to the above-described embodiment, and includes an embodiment that can be applied to all of the grinding devices.

In the grinding device of the present embodiment, the workpiece W is a thin plate glass for a mobile phone, and may be, for example, a thin plate glass for a portable audio device, or a thin plate glass for a portable game machine. Furthermore, thin plate glass for portable navigation machines, thin plate glass for portable televisions, and the like can also be used.

Further, in the above-described embodiment, since the four injection nozzles 112 are provided, the end portions of the substantially square sides can be surely supplied with liquid by the respective injection nozzles 112, and the grinding operation is performed. In the present invention, the number of injection nozzles is not Limited to four. For example, as shown in Fig. 18, eight injection nozzles 112 can be provided. In the grinding device shown in Fig. 18, eight injection nozzles 112 are disposed at equal angular intervals, specifically, at positions spaced apart from each other by 45 degrees. Further, the six injection nozzles may be disposed at positions spaced apart from each other by 60 degrees (equal angular interval).

In the grinding device shown in Fig. 18, the grinding liquid is sprayed from one injection nozzle 112 in the same manner as in the above-described embodiment, with respect to the grinding of the long side and the short side of the workpiece W. Further, at the time of the grinding of the corner portion, the grinding liquid can be sprayed only from the injection nozzles 112 disposed between the injection nozzles 112 used for the grinding of the long side and the short side.

Further, even in the case where four injection nozzles 112 are provided, it is not limited to those shown in the above-described embodiments (Fig. 16) and Fig. 17, and as shown in Fig. 19, the injection nozzle 112 can be disposed in the same manner. The imaginary line connected to the pair of injection nozzles 112 and the side (long side) of the workpiece W are positioned at a predetermined angle. Here, the predetermined angle means that the position of the grinding fluid can be surely supplied to the grinding of the corner portion of the workpiece W, for example, 30 degrees.

Further, the control method of the control means of the plurality of injection nozzles 112 is not limited to the above embodiment, and an appropriate design change can be made within the scope of the present invention.

For example, it is also possible to control the grinding liquid to be sprayed from the injection nozzle 112 located on the front side in the rotation direction of the grinding stone from the grinding processing position. Thus, the grinding nozzle 61 can be ground by the injection nozzle 112 on the front side in the rotation direction. The grinding debris attached to the surface is removed.

In this case, different grinding fluids can be used for the injection nozzle 112 on the front side and the injection nozzle 112 on the rear side in the rotation direction of the grinding processing position (for example, the grinding fluid having the cooling function is sprayed from the rear side). The nozzle is sprayed, and the grinding liquid having the washing function is sprayed from the injection nozzle on the front side. However, when the diameter of the grindstone is small, the two kinds of grinding fluids may interfere with each other to affect the function. Therefore, it is preferable to use the above two kinds of grinding fluids only in the case where the diameter of the grindstone is large.

Further, in the above-described embodiment, the description will be made with respect to the use of the two-fluid nozzle as the injection nozzle. For example, an ultrasonic superimposed nozzle may be used in which the ultrasonic vibration is superimposed on the liquid by the ultrasonic oscillator to eject the microparticles. Liquid.

By using an ultrasonic superimposed nozzle, the jet of water flowing from the nozzle toward the object (grinding surface of the grindstone and the workpiece) is used as an ultrasonic transmission medium, and the ultrasonic vibration generated by the grinding fluid can be excited by the ultrasonic vibration acceleration. The force imparts an adhesion to the grindstone surface and an air layer in the intergranular space. Therefore, according to the ultrasonic superimposing nozzle, the air layer of the deposit and the space between the abrasive grains is vibrated, and the grinding solution effectively penetrates the contact point around the grinding fluid to generate a wedging effect, and the wedging effect is utilized. The sweep is performed to obtain a displacement effect.

Therefore, an ultrasonic oscillator must be provided in the vicinity of the nozzle, and the water flowing from the nozzle cannot be interrupted between the objects. Therefore, the method of installing the device (the storage volume of the ultrasonic oscillator, the distance from the object, etc.) and the operation are used. There is a limit, and the burden of the device including the ultrasonic oscillating device is increased, and these disadvantages exist.

Further, in the above-described embodiment, only the end surface processing of the outer shape of the workpiece and the end surface processing of the inner portion of the hole portion of the workpiece will be described. However, the apparatus of the above-described embodiment is used as a grinding tool for drilling a drill using a drill. can. In the case of drilling, since the grinding processing position of the grinding fluid is located inside the workpiece, the direct effect of the two-fluid nozzle cannot be obtained in the grinding process, but it is used to remove the blockage of the drill after drilling. At the same time, the cleaning effect of the two-fluid nozzle can be exerted. In addition, the grinding debris discharged during the grinding may adhere to the surface of the workpiece to cause a decrease in quality. By continuously supplying the grinding fluid having the effect of the two-fluid nozzle to the surface near the processing, the grinding debris can be quickly removed and obtained. Maintain the effect of surface quality. In addition, the impact force of the two fluids can cause the main body of the drill to generate minute vibrations. Although the amount of vibration and the number of vibrations are not very high, the same effects as those of the ultrasonic superimposed nozzle can be obtained, and a certain effect can be expected.

Further, in the above-described embodiment, the case where the grinding stone 61 is moved in the longitudinal direction of the workpiece W and the workpiece W is moved in the short side direction of the workpiece W is described in the above-described embodiment, and the grinding device and the grinding method are described. As long as the workpiece W and the grindstone 61 are relatively moved in the plane direction of the workpiece W, for example, the grindstone can be moved not only in the longitudinal direction of the workpiece but also in the short side direction.

Further, the overall structure of the grinding device is not limited to the embodiment, and may be applied to, for example, only one processing unit or five or six more processing units.

Further, the grinding tool 6 is not limited to those described in the embodiment, and may be, for example, a ball type grinding tool, a disk type grinding tool, or a conical type grinding tool. In addition, the grinding stone material is also not limited to diamonds.

As described above, the grinding apparatus, the grinding method, and the method of manufacturing the thin plate-shaped member of the present invention can reliably perform the grinding of the workpiece by the jet nozzle to the grinding processing position of the grindstone, so that the sheet can be formed. The end surface of the workpiece is subjected to grinding processing in a safe and secure manner.

M. . . Grinding device

W. . . Workpiece (thin plate glass, workpiece)

Wi. . . Unprocessed workpiece

Wo. . . Processed workpiece

Wm. . . Workpiece model

15. . . Electronic control unit (control means)

twenty three. . . camera

30. . . Processing station

31. . . Grinding spindle

33. . . Processing stage (stage)

61,161. . . Processing department (grinding stone)

71. . . Benchmark

100. . . Grindstone bearing component

110. . . Spray nozzle unit

112 (112a~112d). . . Spray nozzle

C. . . Mechanical origin

P. . . Center of gravity of the workpiece shape

Q. . . Center of gravity of the shape of the hole

Fig. 1 is a plan view showing an embodiment of a grinding device of the present invention.

Fig. 2 is a front view of the grinding device of Fig. 1.

Figure 3 is a side view of the grinding device of Figure 1.

Fig. 4 is a three-side view of the transport robot of the grinding apparatus of Fig. 1, (a) is a front view, (b) is a side view, and (c) is a plan view.

Fig. 5 is an explanatory view showing an operation when the transport robot of the grinding device of Fig. 1 performs the conveyance, (a) shows the state from the reference state to the workpiece holding start state, and (b) shows the state from the workpiece holding start state to the processing table. Workpiece handling status.

Fig. 6 is an explanatory view showing an operation when the transport robot of the grinding device of Fig. 1 performs the conveyance, (c) shows the conveyance state from the workpiece to the processing table to the camera shooting state, and (d) shows the shooting state from the camera to the lower The start of the workpiece is maintained.

Fig. 7 is a plan view showing a second processing unit of the grinding device of Fig. 1.

Fig. 8 is a front cross-sectional view showing a second section of the second processing unit of the grinding apparatus of Fig. 1.

Fig. 9 is a side view showing a part of a cross section of a second processing unit of the grinding device of Fig. 1.

Fig. 10 is a detailed side view including a part of the cross section when the large-diameter grinding tool is used in the grinding device of Fig. 1.

Fig. 11 is a detailed side view showing a part of the cross section when the small-diameter grinding tool is used in the grinding device of Fig. 1.

Fig. 12 is a flow chart showing the control method of the grinding device of Fig. 1.

Fig. 13 is a side view showing a state in which the processing table is photographed by the camera of the grinding device of Fig. 1.

Fig. 14 (a) to (d) are explanatory views for explaining the processing and calculation method of the data captured by the grinding device of Fig. 1.

Fig. 15 is a schematic plan view showing a spray nozzle unit of the grinding device of Fig. 1.

16(a) to (d) are schematic plan views showing the grinding state of the workpiece of the grinding device of Fig. 1.

17(a) to (d) are schematic plan views showing a state in which the workpiece is ground in another embodiment of the grinding device of the present invention.

18(a) to (c) are schematic plan views showing a state in which a workpiece is ground in another embodiment of the grinding device of the present invention.

19(a) to (d) are schematic plan views showing a state in which the workpiece is ground in another embodiment of the grinding device of the present invention.

61. . . Processing department (grinding stone)

110. . . Spray nozzle unit

111. . . Jet rack

112. . . Spray nozzle

113. . . Liquid connection

114. . . Gas connection port

W. . . Workpiece (sheet glass)

Claims (10)

A grinding device includes a stage on which a workpiece of a thin plate shape is placed, a grinding stone having a grinding surface on which an end surface of the workpiece can be ground, and a grinding stone, and a workpiece to be ground by the grinding surface a moving means for moving the grindstone and the workpiece relative to the end surface, a plurality of spray nozzles disposed around the grindstone at substantially equal angular intervals, and ejecting the micronized liquid to the grinding surface, and contacting the workpiece The grinding processing position of the grindstone is controlled to be a control means for ejecting the liquid toward the rear side in the rotation direction of the grindstone by spraying with an injection nozzle located rearward in the rotational direction of the grindstone than the grinding processing position. The grinding device according to claim 1, wherein the injection nozzle is a two-fluid nozzle that mixes a liquid and a gas. The grinding device according to claim 1, wherein the injection center axis of the injection nozzle is disposed along a tangential direction of the outer circumference of the grindstone. The grinding device according to claim 1, wherein the injection center axis of the injection nozzle is disposed to substantially intersect the rotation axis of the grindstone. The grinding device according to claim 1, wherein the control means is controlled to perform the grinding operation during the grinding operation. When the relative position of the machining position and the grinding stone rotation axis is changed, the injection nozzle that performs the injection is switched. The grinding device according to claim 5, further comprising: a grinding stone bearing member that rotatably supports the rotating shaft of the grinding stone, and a nozzle holder fixed to the grinding stone bearing member, and The plurality of injection nozzles are mounted to the nozzle holder. The grinding device according to claim 5, wherein the control means is controlled such that the injection nozzles simultaneously ejected are within two. The grinding device of claim 5, wherein the control means is controlled to eject a liquid from a spray nozzle when the grindstone moves relative to the workpiece in a direction, and the grindstone is after the jet The liquid is ejected from another ejection nozzle when the workpiece is moved in the other direction intersecting with the one direction, and is switched from the relative movement in the one direction to the relative movement in the other direction. And other injection nozzles spray liquid. A grinding method is a grinding method in which an end surface of a thin plate-shaped workpiece is ground by a grindstone in a state in which a liquid is ejected by a spray nozzle to a grindstone, and has a grinding step and a liquid ejecting step; The grinding stone is rotated about a rotation axis substantially perpendicular to a plane of the workpiece, and the grinding stone and the injection nozzle are relatively moved with respect to the workpiece, and the end surface of the workpiece is ground; In the liquid ejecting step, when the grinding step is performed, the position relative to the grinding axis of the grindstone is changed based on the grinding position of the grindstone that is in contact with the workpiece, and the grinding position is more than the grinding position. The jetting nozzle is sprayed behind the grinding stone in the direction of rotation, and the grinding processing position of the grindstone is further sprayed with the micronized liquid behind the rotating direction. A method for producing a thin plate-shaped member, comprising the step of grinding an end surface by the grinding method according to claim 9 of the patent application.