TW201219157A - capable of reliably and safely grinding the end face of the thin plate workpiece - Google Patents

capable of reliably and safely grinding the end face of the thin plate workpiece Download PDF

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Publication number
TW201219157A
TW201219157A TW100123090A TW100123090A TW201219157A TW 201219157 A TW201219157 A TW 201219157A TW 100123090 A TW100123090 A TW 100123090A TW 100123090 A TW100123090 A TW 100123090A TW 201219157 A TW201219157 A TW 201219157A
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Taiwan
Prior art keywords
boring
workpiece
grindstone
liquid
nozzle
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Application number
TW100123090A
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Chinese (zh)
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TWI468257B (en
Inventor
Toru Hayashida
Hiroshi Sada
Hiroshi Aoyama
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Hallys Corp
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Publication of TWI468257B publication Critical patent/TWI468257B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The objective of the present invention provides a grinding device capable of reliably and safely grinding an end face of a thin plate workpiece. The grinding device of this invention includes: a grindstone (61), a moving means, a plurality of injection nozzles (112) and a control means, wherein the grindstone (61) has a rotatable grinding surface at the outer periphery capable of grinding the end face of the workpiece (W); the moving means enables the grindstone (61) and the workpiece (W) to move relatively in order to grind the end face of the workpiece (W) with the grinding surface; the plural injection nozzles (112) are arranged around the grindstone (61) at substantially equiangular intervals and inject atomized liquid to the grinding surface; and the control means controls the injection of the plural injection nozzles (112) so that the liquid is injected toward the rear side of the rotating direction of the grindstone (61) on the basis of the grinding position of the grindstone (61) in contact with the workpiece (W).

Description

201219157 六、發明說明: 【發明所屬之技術領域】 本發明是關於硏削裝置及硏削方法以及薄板狀構件之 製造方法。 【先前技術】 硏削裝置,是用來進行大致方形(大致多角形)的薄 板狀被加工物等,例如行動電話等的可攜式終端機所使用 之易碎性的薄板玻璃之端面硏削。該可攜式終端機的螢幕 大多採用大致方形的薄板狀玻璃板。這種薄板狀玻璃,一 般是從大型玻璃板裁切出大槪的工件形狀,將裁切後之玻 璃板端面藉由硏削裝置的磨石進行正確地硏削而形成既定 形狀。特別是在進行該硏削時,同時也進行去角加工,藉 此防止薄板狀玻璃板的端面破損。在藉由上述硏削裝置的 磨石進行硏削時,是對加工時被加熱的磨石從噴射噴嘴噴 射硏削液而將磨石施以冷卻。 在如上述般硏削玻璃板外形的情況,是讓磨石沿著玻 璃板的周圍相對地移動,因此磨石與玻璃板接觸之硏削加 工位置從磨石的旋轉軸方向觀察是朝360度的任意方向改 變。亦即,例如假定將大致方形狀的玻璃板之一個長邊實 施硏削時,從旋轉軸方向觀察硏削加工位置位於1 2點鐘方 向,要硏削與該長邊鄰接的短邊時硏削加工位置轉移至3 點鐘方向,要硏削其他長邊時轉移至6點鐘方向,要硏削 其他短邊時轉移至9點鐘方向。而且,如上述般使硏削加 -5- 201219157 工位置在硏削作業時依序改變的情況,用來對硏削加 置供應適當的硏削液之硏削液供應手段從磨石的旋轉 向觀察也必須爲360度方向》 作爲將硏削液供應給磨石周圍的手段之一.,(1 置以磨石爲中心之環狀的供應管,從供應管朝向磨石 方向連續地供應硏削液的技術已被開發出(參照曰本 2006-3 46 8 03號公報)。但在如此般硏削液的供應形 情況,必須耗費大量的硏削液。針對這點做詳細的說 磨石會將其周圍的空氣以連帶旋轉的狀態旋轉,爲了 該空氣層而將硏削液供應給磨石必須以充分壓力且充 量來供應硏削液。因此,從上述環狀的供應管供應硏 的情況,必須以在硏削加工位置所需的硏削液之將近 倍的流量保持適當壓力連續地供應,才能對硏削加工 供應充分的硏削液。 此外,若要以這樣的供應形態對硏削加工位置供 分的流量,會有大量的硏削液朝向磨石噴射,結果在 周圍發生積水的狀況,而成爲在該積水中讓磨石旋轉 。在此情況,磨石旋轉所產生的水膜,會阻擋來自供 之硏削液的噴射流,可能造成對硏削加工位置無法穩 供應所需硏削液的現象,而可能導致硏削液無法發揮 能。 此外,作爲其他的硏削液供應手段,(2 )沿著 工物之方形玻璃板的周圍設置複數個噴射噴嘴,從接 削加工位置的噴射噴嘴噴射硏削液的技術已被開發出 工位 軸方 )設 中心 特開 態的 明, 突破 分流 削液 約10 位置 應充 磨石 狀態 應管 定地 其功 被加 近硏 (參 ⑧ -6- 201219157 照日本特開平5 - 1 6205 5號公報)。然而,在如此般設置噴 射噴嘴的情況,依玻璃板的大小必須設置許多噴射噴嘴, 不僅有製造裝置本身成本變高的問題,且必須確保噴射噴 嘴的設置場所。 再者’作爲其他的硏削液供應手段,(3)讓一個噴 射噴嘴追隨磨石的硏削加工位置而改變移動及噴射方向的 構造也是可考慮的。然而,若採用此構造,該追隨用的機 構會造成裝置複雑化,而導致硏磨裝置本身的成本變高, 且必須確保上述追隨機構的設置空間。 [專利文獻1]日本特開2006-346803號公報 [專利文獻2]日本特開平5-162055號公報 【發明內容】 於是,本發明的目的是爲了提供可將薄板狀被加工物 的端面確實且安全地進行硏削加工之硏削裝置及硏削方法 以及薄板狀構件之製造方法。 本發明之硏削裝置係具備: 載置薄板狀的被加工物之載台、 在外周具有可硏削被加工物的端面之硏削面且能旋轉 之磨石、 爲了藉由該硏削面硏削被加工物的端面而讓磨石及被 加工物進行相對移動之移動手段、 以大致等角度間隔配設於磨石的周圍而對硏削面噴射 微粒子化的液體之複數個噴射噴嘴、以及 201219157 將上述複數個噴射噴嘴的噴射控制成以接觸上述被加 工物之磨石的硏削加工位置爲基準而朝向磨石的旋轉方向 後方噴射液體之控制手段。 該硏削裝置,是在載台載置被加工物,藉由移動手段 讓被加工物和磨石進行相對移動,而能將被加工物的端面 藉由磨石進行硏削。而且,在該硏削作業時,由於噴射噴 嘴將微粒子化的液體朝向磨石噴射,該微粒子化的液體容 易突破在磨石表面(硏削面)藉由磨石旋轉而連帶旋轉的 空氣層,容易確實地供應至磨石的硏削面》此外,由於噴 射噴嘴是對比硏削加工位置更靠旋轉方向後方噴射液體, 到達磨石硏削面之液體,容易隨著磨石的旋轉而到達硏削 加工位置。 特別是在該硏削裝置,即使隨著端面硏削的進展而使 硏削加工位置和磨石旋轉軸的相對位置改變,藉由控制手 段控制噴射噴嘴的噴射,能對比磨石的硏削加工位置更靠 旋轉方向後方噴射液體,因此不須供應非必要的大量液體 。因此依據該硏削裝置,可謀求降低液體所需的成本,而 且能防止在磨石周圍發生積水的狀況。 再者,由於液體的噴射是藉由配設於磨石周圍之噴射 噴嘴來進行,不須遍及被加工物的端部全體而設置多數個 噴射噴嘴。因此,相較於遍及被加工物的端部全體設置噴 射噴嘴的情況,該裝置可減少噴射噴嘴數目,可謀求製造 裝置本身的成本降低,並較容易確保噴射噴嘴的設置場所201219157 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a boring apparatus, a boring method, and a method of manufacturing a thin plate member. [Prior Art] The boring device is a thin plate-shaped workpiece to be used for a substantially square shape (substantially polygonal shape). For example, the end face of the fragile thin glass used in a portable terminal such as a mobile phone is boring. . Most of the screens of the portable terminal use a substantially square thin plate glass plate. Such a thin plate glass is generally formed by cutting a large workpiece shape from a large glass plate, and the cut end face of the glass plate is accurately honed by a grinding stone of a boring device to form a predetermined shape. In particular, when the boring is performed, the chamfering is also performed at the same time, thereby preventing the end surface of the thin glass plate from being damaged. When boring is performed by the grindstone of the above-described boring device, the grindstone is sprayed from the spray nozzle to the grindstone heated during the machining to cool the grindstone. In the case of boring the outer shape of the glass plate as described above, the grinding stone is relatively moved along the periphery of the glass plate, so that the boring processing position where the grinding stone is in contact with the glass plate is 360 degrees as viewed from the direction of the rotating shaft of the grinding stone. Change in any direction. That is, for example, when boring one long side of a substantially square glass plate is assumed, the boring processing position is located at 12 o'clock direction from the direction of the rotation axis, and the short side adjacent to the long side is honed. The cutting position is shifted to the 3 o'clock direction. When the other long sides are honed, the direction is shifted to the 6 o'clock direction. When the other short sides are honed, the direction is shifted to the 9 o'clock direction. Moreover, as described above, the boring plus -5 - 201219157 working position is changed sequentially during the boring operation, and the boring liquid supply means for supplying the appropriate boring liquid for the boring is rotated from the grinding stone. The observation must also be in the direction of 360 degrees. One of the means for supplying the boring liquid to the periphery of the grindstone. (1) A ring-shaped supply pipe centered on a grindstone, continuously supplied from the supply pipe toward the grindstone. The technique of boring fluid has been developed (refer to 曰本2006-3 46 8 03). However, in the case of the supply shape of the boring fluid, a large amount of boring fluid must be consumed. The grindstone rotates the air around it in a state of being rotated, and the supply of the blasting liquid to the grindstone for the air layer must supply the boring fluid at a sufficient pressure and charge. Therefore, from the above-mentioned annular supply pipe In the case of the supply of bismuth, it is necessary to continuously supply the pressure at a nearly double flow rate of the boring fluid required at the boring position to supply a sufficient boring fluid for the boring process. Morphology In the flow rate of the supply, a large amount of boring liquid is sprayed toward the grindstone, and as a result, water is accumulated in the surrounding water, and the grindstone is rotated in the accumulated water. In this case, the water film generated by the rotation of the grindstone will Blocking the jet from the boring fluid may cause the required boring fluid to be stably supplied to the boring position, and may cause the boring fluid to fail. In addition, as a means of supplying other boring fluid, (2) A plurality of injection nozzles are arranged around the square glass plate of the workpiece, and the technique of jetting the boring liquid from the injection nozzle at the cutting position has been developed to set the center axis state. Breaking through the shunting liquid about 10 positions should be filled with the grindstone state should be fixed to the ground and its work is added to the 硏 (refer to 8 -6-201219157 according to Japanese Patent Laid-Open No. 5 - 1 6205 5). However, in the case where the injection nozzle is provided in this way, a large number of injection nozzles must be provided depending on the size of the glass plate, and not only the problem of the cost of the manufacturing apparatus itself becoming high, but also the place where the injection nozzle is installed must be secured. Further, as another means for supplying the boring liquid, (3) a structure in which one of the injection nozzles follows the boring position of the grindstone to change the movement and the ejection direction is also conceivable. However, with this configuration, the following mechanism causes the device to be re-integrated, resulting in an increase in the cost of the honing device itself, and it is necessary to secure the installation space of the above-described follow-up mechanism. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. A boring device, a boring method, and a method of manufacturing a thin plate member that perform boring safely. The boring apparatus of the present invention includes: a stage on which a workpiece of a thin plate shape is placed; and a grinding stone having a boring surface that can boring an end surface of the workpiece on the outer circumference and rotatable, for boring by the boring surface a moving means for moving the grindstone and the workpiece relative to the end surface of the workpiece, a plurality of jet nozzles that are disposed around the grindstone at substantially equal angular intervals, and that eject the micronized liquid to the boring surface, and 201219157 The injection of the plurality of injection nozzles is controlled so as to control the liquid toward the rear of the grinding stone in the rotation direction of the grinding stone based on the boring position of the grindstone contacting the workpiece. In the boring device, the workpiece is placed on the stage, and the workpiece and the grindstone are relatively moved by the moving means, whereby the end surface of the workpiece can be honed by the grindstone. Further, in the boring operation, since the spray nozzle sprays the finely divided liquid toward the grindstone, the micronized liquid easily breaks through the air layer which is rotated by the rotation of the grindstone on the surface of the grindstone (the boring surface), which is easy. In addition, since the spray nozzle is used to spray the liquid in the direction of the rotation in comparison with the boring position, the liquid reaching the boring surface of the grindstone easily reaches the boring position with the rotation of the grindstone. . In particular, in the boring device, even if the relative position of the boring processing position and the grinding stone rotation axis is changed as the end face boring progresses, the injection of the injection nozzle can be controlled by the control means, and the boring of the grinding stone can be compared. The position ejects the liquid further in the direction of the rotation, so that it is not necessary to supply a large amount of liquid which is not necessary. Therefore, according to the boring device, it is possible to reduce the cost required for the liquid, and it is possible to prevent the occurrence of water accumulation around the grindstone. Further, since the ejection of the liquid is performed by the spray nozzles disposed around the grindstone, a plurality of spray nozzles are not required to be provided over the entire end portion of the workpiece. Therefore, compared with the case where the injection nozzle is provided over the entire end portion of the workpiece, the apparatus can reduce the number of injection nozzles, can reduce the cost of the manufacturing apparatus itself, and can easily ensure the installation place of the injection nozzle.

-8- 201219157 此外,本發明的硏削方法,是在藉由噴射噴嘴對磨石 噴射液體的狀態下,將薄板狀被加工物的端面藉由磨石進 行硏削之硏削方法,係具有硏削步驟及液體噴射步驟; 該硏削步驟,是讓上述磨石以與被加工物的平面大致 垂直的旋轉軸爲中心進行旋轉,並使上述磨石和噴射噴嘴 一起相對於被加工物進行相對移動,而將被加工物的端面 進行硏削; 該液體噴射步驟,是在進行上述硏削步驟時,以與上 述被加工物接觸之磨石的硏削加工位置爲基準,當與磨石 的旋轉軸之相對位置改變時,對比磨石的硏削加工位置更 靠旋轉方向後方噴射微粒子化的液體。 該方法中,在液體噴射步驟,從噴射噴嘴將微粒子化 的液體朝向磨石噴射,該微粒子化的液體容易突破在磨石 表面(硏削面)藉由磨石的旋轉而連帶旋轉的空氣層,容 易確實地供應至磨石的硏削面。此外,由於從噴射噴嘴朝 向比硏削加工位置更靠旋轉方向後方噴射液體,到達磨石 的硏削面之液體,容.易隨著磨石的旋轉而到達硏削加工位 置。 特別是在該硏削方法中,在液體噴射步驟當硏削加工 位置和磨石的旋轉軸之相對位置改變時,能對比磨石的硏 削加工位置更靠旋轉方向後方噴射液體,因此不須供應非 必要的大量液體》因此依據該硏削方法,可謀求降低液體 所需的成本,而且能防止在磨石周圍發生積水的狀況。 再者,該硏削方法,在硏削步驟是讓噴射噴嘴和磨石 -9 - 201219157 一起相對於被加工物進行相對移動,因此不須遍及被加工 物的端部全體而設置多數個噴射噴嘴。因此,相較於遍及 被加工物的端部全體設置噴射噴嘴的情況,可減少噴射噴 嘴數目,可謀求實施該硏削方法的裝置之成本降低,並較 容易確保噴射噴嘴的設置場所。 該發明中,作爲噴射噴嘴較佳爲採用將液體和氣體混 合噴射之二流體噴嘴。如此,所噴射之微粒子化的液體, 能確實地突破藉由磨石的旋轉所產生之磨石周圍的空氣層 〇 又該發明中,噴射噴嘴的噴射中心軸也能設置成沿著 磨石外周的切線方向,此外也能設置成與磨石的旋轉軸大 致交叉。 此外,該發明中,控制手段可採用以下構造,亦即在 硏削作業時,當上述硏削加工位置和磨石旋轉軸的相對位 置改變時,切換進行噴射的噴射噴嘴。如此,當硏削加工 位置和磨石旋轉軸的相對位置改變時,控制手段切換複數 個噴射噴嘴當中進行噴射的噴射噴嘴,因此能確實地對比 磨石的硏削加工位置更靠旋轉方向後方噴射液體》 又在採用上述構造時,可進一步具備:將上述磨石的 旋轉軸可旋轉地予以軸支承之磨石軸承構件、以及固定於 該磨石軸承構件之噴嘴架,且將上述複數個噴射噴嘴安裝 於噴嘴架。如此,能在固定於磨石軸承構件之噴嘴架上容 易且確實地安裝複數個噴射噴嘴,而使噴射噴嘴的設置變 容易。-8-201219157 In addition, the boring method of the present invention is a boring method in which an end surface of a thin plate-shaped workpiece is honed by a grindstone in a state in which a liquid is ejected to a grindstone by a spray nozzle. a boring step and a liquid ejecting step; the boring step is such that the grindstone rotates around a rotation axis substantially perpendicular to a plane of the workpiece, and the grindstone and the spray nozzle are opposed to each other with respect to the workpiece Moving, and boring the end surface of the workpiece; the liquid ejecting step is based on the boring position of the grindstone in contact with the workpiece when the boring step is performed, and When the relative position of the rotating shaft is changed, the pulverizing processing position of the grindstone is further sprayed with the micronized liquid behind the rotating direction. In the method, in the liquid ejecting step, the micronized liquid is ejected toward the grindstone from the spray nozzle, and the micronized liquid easily breaks through the air layer which is rotated by the rotation of the grindstone on the surface of the grindstone (the boring surface). It is easy to supply to the boring surface of the grindstone. Further, since the liquid is ejected from the injection nozzle toward the rear side in the rotational direction than the boring processing position, the liquid reaching the boring surface of the grindstone easily reaches the boring position with the rotation of the grindstone. In particular, in the boring method, when the relative position of the boring processing position and the rotating shaft of the grindstone is changed in the liquid ejecting step, the boring processing position of the grindstone can be injected more toward the rear of the rotating direction, so that it is not necessary According to the boring method, it is possible to reduce the cost required for the liquid, and it is possible to prevent the occurrence of water accumulation around the grindstone. Further, in the boring method, in the boring step, the jet nozzle and the grindstone -9 - 201219157 are relatively moved relative to the workpiece, so that it is not necessary to provide a plurality of spray nozzles over the entire end portion of the workpiece. . Therefore, the number of the injection nozzles can be reduced as compared with the case where the injection nozzles are provided over the entire end portions of the workpiece, and the cost of the apparatus for performing the boring method can be reduced, and the installation place of the injection nozzles can be easily secured. In the invention, it is preferable to use a two-fluid nozzle which sprays a liquid and a gas as the injection nozzle. In this way, the sprayed micronized liquid can surely break through the air layer around the grindstone generated by the rotation of the grindstone. In the invention, the injection center axis of the spray nozzle can also be set along the outer periphery of the grindstone. The tangential direction can also be set to substantially intersect the rotation axis of the grindstone. Further, in the invention, the control means may adopt a configuration in which, when the boring operation is performed, when the relative position of the boring processing position and the grinding stone rotating shaft is changed, the injection nozzle for performing the ejection is switched. In this way, when the relative position of the boring processing position and the grinding stone rotation axis is changed, the control means switches the injection nozzles that are ejected among the plurality of injection nozzles, so that the boring processing position of the grindstone can be surely injected further in the backward direction of the rotation direction. Further, in the above configuration, the liquid may further include: a grindstone bearing member that rotatably supports the rotating shaft of the grindstone, and a nozzle holder fixed to the grindstone bearing member, and the plurality of jets The nozzle is mounted to the nozzle holder. Thus, a plurality of injection nozzles can be easily and surely mounted on the nozzle holder fixed to the stone bearing member, and the arrangement of the injection nozzle can be made easy.

-10- 201219157 再者,在採用上述構造的情況,較佳爲控制成使同時 噴射的噴射噴嘴爲二個以內,如此可發揮藉由少量液體進 行確實的硏削作業之效果。 此外,在採用上述構造的情況,控制手段較佳爲實施 以下控制,亦即,當磨石相對於被加工物朝一方向進行相 對移動時從一個噴射噴嘴噴射液體,在該噴射後當磨石相 對於被加工物朝與上述一方向交叉之其他方向進行相對移 動時從其他的噴射噴嘴噴射液體,在從上述一方向的相對 移動切換至上述其他方向的相對移動的期間,從上述一個 噴射噴嘴及其他的噴射噴嘴雙方噴射液體。如此,在被加 工物的一方向的端面是從上述一個噴射噴嘴進行噴射,此 外在被加工物的其他方向的端面是從上述其他的噴射噴嘴 進行噴射,可確實地進行硏削作業,並在被加工物的一方 向的端面和其他方向的端面之間(例如角部),是從上述 —個噴射噴嘴及其他的噴射噴嘴雙方噴射液體,因此在該 部分也能確實地一邊供應液體一邊進行被加工物的硏削。 又本發明的對象除了上述硏削裝置及硏削方法以外, 還包括具備上述硏削方法之薄板狀構件之製造方法。 如以上所說明,在本發明,藉由噴射噴嘴能確實地讓 液體到達磨石的硏削加工位置而進行被加工物的硏削,因 此能將薄板狀被加工物的端面進行確實且安全地硏削加工 【實施方式】 -11 - 201219157 以下根據圖式詳細說明本發明的實施形態。 首先,參照第1圖〜第3圖說明硏削裝置的整體構造。 又在各圖中,雖未具體地畫出,該硏削裝置也是像周知那 樣,爲了確保作業者的安全性而在周圍設置保護板。 該硏削裝置Μ如第2圖、第3圖所示般,在下部具備大 致矩形之格子狀的底座1,在其上面設置用來進行硏削加 工之各種單元。 底座1,是將周知的鋼製方形材11,12,13沿左右方向 、前後方向、及上下方向組合,而將上部的各單元予以強 固地支承。 在底座1的上面載置固定鐵類製的平板材14。藉由該 平板材14,將底座1的方形材11,12,13間予以遮蔽,並能 在底座1上設置各單元。 又在底座1內設置電子控制單元15(控制手段),以 進行硏削加工用的各種單元的控制。此外,雖未詳細記載 ,在該電子控制單元15內設有用來儲存加工資訊等的儲存 手段。再者,雖未圖示,也設有讓作業者Η對該電子控制 單元15輸入資訊之控制盤。 如第1圖所示般,設置於硏削裝置Μ的上部(底座1上 )之單元係包含:設置於中央之搬運機械人2、設置於其 周圍之四個加工單元3Α、3Β、3C、3D、設置於搬運機械 人2的前方之投入取出台4、在搬運機械人2的左右兩側位 置設置成朝前後方向延伸之照明移動單元5。 上述搬運機械人2,是由所謂在水平方向移動之三關 -12- 201219157 節的水平關節型(SCAR A )機械人所構成。第1圖〜第3圖 是顯示搬運機械人2未動作的基準狀態,關於動作狀態, 是參照第4圖〜第6圖而隨後說明。 在搬運機械人2的前端設置上下滑動軸20。在該上下 滑動軸20的下端設置:用來吸附保持被加工物(工件)之 大致方形(大致多角形)薄板玻璃W之吸附手2 1。此外, 在上下滑動軸20的上端,透過安裝托架安裝影像取得用的 攝影機23。 該搬運機械人2,是將薄板玻璃W( Wo, Wi )從投入 取出台4往各加工單元3A,3B,3C,3D搬運,並從各加工單 元3A,3B,3C,3D往投入取出台4搬運。該工件W的搬運作 業,是利用上述吸附手21來進行。此外,在該搬運機械人 2’可藉由上述攝影機23從加工單元3A、3B、3C、3D上方 拍攝所載置的工件W。 上述四個加工單元,是分別設置於搬運機械人2的前 後左右之第一加工單元3A、第二加工單元3B、第三加工單 元3C、以及第四加工單元 各加工單元3A,3B,3C,3D的構成要素設定成完全相 同’而能進行相同的硏削作業。例如,如第一加工單元3 A 所示般’構成要素包括:以硏削狀態吸附保持工件W之加 工台30、從加工台30的上方進行工件W的硏削之硏削主軸 31'鄰接於加工台30而用來保持複數個硏削工具(磨石) 之工具匣32、朝向安裝於硏削主軸31之磨石噴射硏削液之 噴射噴嘴單元1 1 〇。 -13- 201219157 其中,在加工台30上,設置讓中央的加工載台33沿左 右方向滑動移動之左右滑動機構34(移動手段)。在加工 載台33的左右兩側設置樹脂製的伸縮蓋35 (加工載台33右 側的伸縮蓋被硏削主軸等遮住而未圖示出)。藉由該伸縮 蓋35,防止硏削液侵入左右滑動機構34。此外,在加工載 台33的上面設置矩形盒狀且上方開口之擋板36,利用該擋 板36防止硏削液飛濺。 此外,硏削主軸31係具備可沿前後方向滑動移動之前 後滑動機構38 (移動手段)。而且,在硏削主軸31和前後 滑動機構38之間設置可沿上下方向移動之上下導引機構39 。如此般,讓硏削主軸3 1不僅是前後方向,沿著上下方向 也能自由移動。 又前後滑動機構38如第2圖所示般,是強固地固定於 朝前後方向延伸之大型方形材的側座1 6。如此,可提高硏 削主軸3 1的支承剛性並提昇硏削精度。 工具匣32,最多可保持五根的硏削工具(磨石)6,… (參照第2圖、第3圖)。在工具匣32保持著直徑不同的磨 石、不同硏磨材的磨石等複數個硏削工具6。該等複數個 硏削工具6是按照加工內容而選擇性地安裝於硏削主軸3 1 〇 上述投入取出台4係具備:供作業者Η進行開閉操作之 開閉門40、與開閉門40連動而移動之長方形的匣設置台4 1 、以及可拆裝自如地設置於匣設置台41之工件匣42。 開閉門40,是由在下端設有朝水平方向延伸的鉸鏈軸 14- ⑧ 201219157 43(參照第3圖)之橫向長度較長的長方形的鋼板所構成 ,在上部外面設置俯視大致U字形的把手部44。作業者Η 握住把手部44以鉸鏈軸43爲中心往前側將開閉門40轉動, 可打開投入取出台4,而往硏削裝置Μ內進行工件W的取出 放入。 匣設置台4 1的兩側端,是與連結於開閉門40的上部之 連結機構45連結。此外,將匣設置台41的下部可滑動地載 置於朝前後方向延伸的滑軌46 (參照第3圖)。因此,若 作業者Η進行開閉門40的打開操作,透過連結機構45能使 連結於開閉門40之匣設置台41往硏削裝置Μ的外側方向滑 動移動。若作業者Η進行開閉門40的關閉操作,能使匣設 置台41往硏削裝置Μ的內側方向滑動移動。 工件匣42具備四個藉由樹脂壁47區隔成的積層部48, 而能沿左右方向排列四列的工件W積層體。其中設定成, 在右側二個積層部48積層未加工的工件Wi,在左側二個積 層部48積層加工完畢的工件Wo。該工件匣42在兩端設有 搬運時的把持部49,以便於作業者Η從匣設置台41卸下》 作業者Η在該工件匣42上裝設(載置)未加工的工件 W,將裝設有該工件W的工件匣42配置於匣設置台41,將 開閉門40關閉而完成加工前準備。 上述照明移動單元5係具備:在搬運機械人2的兩側位 置朝前後方向延伸之移動滑軌5〇、透過上下移動機構51而 藉由該移動滑軌50支承之大致四角形的照明框52。 將移動滑軌50的前端和後端透過支承托架50a,50a固 -15- 201219157 設於金屬製的平板材14»該移動滑軌5 〇的後端延伸至後側 的加工單元(第二加工單元3Β、第四加工單元3D)之工具 匣3 2位置。因此,照明框52能往硏削裝置Μ的後側大幅度 移動,在不使用照明框52的待機時點(在各加工單元3Α、 3Β、3C、3D進行硏削加工等的時點),能讓照明框52退 避至後側的位置。 照明框52,是在各框部52a,...的內周面埋設未圖示的 複數個LED,藉此照亮框內。該照明框52,當攝影機23拍 攝工件W時’可移動至加工台30的擋板36上,利用LED從 側方照亮工件W ’使工件W的外形形狀(輪廓)浮現,而 能輕易地進行工件W的拍攝。 其次,針對搬運機械人2,利用第4圖〜第6圖進行說明 。第4圖係搬運機械人的三面圖,(a)爲前視圖,(b) 爲側視圖,(c )爲俯視圖。第5圖、第6圖係搬運機械人 進行搬運時的動作之說明圖,第5 (a)圖顯示從基準狀態 至工件保持開始狀態’第5 ( b )圖顯示從工件保持開始狀 態至前往加工台之工件搬運狀態,第6(c)圖顯示從前往 加工台之工件搬運狀態至攝影機拍攝狀態,第6(d)圖顯 示從攝影機拍攝狀態至下個工件的開始保持狀態。 搬運機械人2,是由上述般之沿水平方向移動之三關 節的水平關節型機械人所構成,而能沿水平方向移動。具 體而言’如第4(b)圖所示般,搬運機械人2是設置成可 在第一關節2Ja、第二關節2Jb及第三關節2JC轉動,且能沿 左右方向移動。如此,使前側臂24前端的上下滑動軸20能 ⑧ -16- 201219157 沿水平方向移動。 該上下滑動軸20,是沿上下方向貫穿前側臂24前端, 而沿上下方向也能進行滑動移動。 在上下滑動軸20的下端設置上述吸附手21。該吸附手 21,是在長方形的平板狀底板25上設置朝向下側之四個吸 盤26,...。讓負壓作用於該吸盤26而產生吸附力,藉此將 工件之薄板玻璃W予以吸附保持。 這四個吸盤26,…,如第4 ( c)圖所示般,是在左右 分別配設兩個。藉由這兩個吸盤26來吸附保持一片工件W 。因此,一個吸附手21—次可搬運兩片工件W。 此外,在該吸附手21,在底板25的兩端設置向下突出 的銷27。該銷27、27是抵接於工件W之抵接構件。亦即, 在搬運工件W前,經由搬運機械人2的移動而藉由該銷27 —旦將工件W推入工件匣42內,讓工件W在工件匣42內排 列整齊。 在上下滑動軸20的上端設置上述攝影機23。該攝影機 23,相對於吸附手21的工件W保持位置(底板25的突出部 分),是設置在偏移約90°的位置。這是因爲在攝影機23 進行拍攝時,避免受到底板25的阻擋。該攝影機23是由一 般的CCD攝影機所構成,可取得二維的影像資料。 此外,該攝影機23透過安裝托架22安裝於上下滑動軸 20。該安裝托架22係具備:稍向下彎曲的腕部22a、可調 整上下方向位置之攝影機安裝部22b、固定於上下滑動軸 20之筒狀的軸固定部22c。攝影機23是透過腕部22a固定於 -17- 201219157 上下滑動軸20,因此位於與上下滑動軸20分離的位置,在 拍攝時,可防止前側臂24映入。 接下來,利用第5圖及第6圖說明搬運機械人2進行搬 運時的動作。 如第5 (a)圖所示般,搬運機械人2,首先從基準狀 態讓各關節朝逆時針方向稍微轉動,將積層於工件匣42之 未加工的工件Wi藉由吸附手2 1吸附。這時,讓上下滑動軸 20大幅度地朝逆時針方向轉動,使吸附手21的底板25轉動 ,而藉由左側的吸盤26吸附未加工的工件Wi。 然後,如第5(b)圖所示般,搬運機械人2讓各關節 大幅度地朝逆時針方向轉動,將工件Wi搬運至第一加工單 元的加工台30。這時,工件Wi被搬運至大槪的位置而載置 於加工台3 0。亦即,未進行嚴格的位置確認,工件Wi被搬 運至加工台30而載置於大槪的位置。 接著,如第6 ( c )圖所示般,搬運機械人2讓前側臂 24進一步朝逆時針方向轉動,並使上下滑動軸20朝順時針 方向轉動,而讓攝影機23確實地位於工件Wi的上方(正上 方)。如此,搬運機械人2可將本身所搬運、載置的工件 Wi藉由攝影機23進行拍攝。又工件W的拍攝順序等隨後說 明。 最後,如第6 ( d )圖所示般,搬運機械人2在工件Wi 的拍攝結束後,爲了搬運下個未加工的工件W,讓各關節 朝順時針方向復位,藉由底板25之左側的吸盤26吸附下個 工件W。 ⑧ -18- 201219157 然後,搬運機械人2反覆進行第5(b)圖的動作,從 工件匣42將未加工的工件W搬運至下個加工台。如此,能 在空的加工單元之加工台上,陸續搬運未加工的工件W。 又雖未具體地圖示出,搬運機械人2將加工結束後之 加工完畢的工件W 〇藉由右側的吸盤2 6吸附,而從加工台 3 0搬運至工件匣42。搬運機械人2,在進行第5(b)圖的 動作前,從加工台30接收加工完畢的工件Wo,以同時進 行未加工的工件Wi之搬運及加工完畢的工件Wo之搬運。 接著說明加工單元。第7圖係加工單元的俯視圖,第8 圖係加工單元之包含一部分截面之前視圖,第9圖係加工 單元之包含一部分截面之側視圖。 加工單元3B (爲方便起見,以第二加工單元做說明) ,如第7圖所示般係具備:保持上述工件W之加工台30、 硏削工件W之硏削主軸31、以及保持硏削工具6之工具匣 32 ° 其中,在加工台30具備:上述矩形的加工載台33 (載 台)、讓加工載台33左右移動之左右滑動機構34、覆蓋左 右滑動機構34之伸縮蓋35、設置於加工載台33的上面之擋 板3 6、以及噴射硏削液之噴射噴嘴單元1 1 〇。 再者,該加工台30如第8圖所示般,進一步具備各種 構成要素。 首先,在加工載台33的上面,設置用來將工件W吸附 保持於擋板36的內側中央之吸附台70。該吸附台70 ’是由 上面(承接面)7〇a呈長方形(參照第7圖)之大致T字形 -19- 201219157 的塊狀台座所構成。在吸附台70的上面70a’爲了賦予負 壓而設有複數個吸氣口 7〇b (參照第10圖、第11圖此 外,爲了避免在薄板玻璃之工件W的表面發生損傷,是對 吸附台70的上面70a實施平滑加工。 ^ 在上述吸附台7 0的周圍,以朝向攝影機2 3側(上方側 )的方式豎設有用來算出硏削加工時的機械原點之兩個基 準銷71,71。該等基準銷71,71,爲了在吸附台70載置( 保持)著工件W的狀態下能藉由上述攝影機23進行拍攝, 是配置在與工件W不重疊的位置。此外,兩個基準銷71, 71,相對於工件W是配置於對角位置。又當工件W爲完全 透明的情況,基準銷的位置設定成與工件W重疊亦可。 而且,基準銷71的前端部71 a如第8圖所示般,其高度 hp設定成與吸附台70之上面70a的高度hs相同。藉由這樣 的設定,在攝影機23進行拍攝時,在工件W和基準銷71之 間不致發生焦點偏移,而能確實地進行影像資料的取得。 此外,在擋板36的內部,設置高底、傾斜1呈大致四 角形的背景板72。該背景板72的全面消光塗黒,以防止映 入攝影機23時的反射,而使工件W和基準銷71的映入更突 顯。此外,藉由將背景板72傾斜地設置,能讓硏削液馬上 往下流。此外,在該背景板72形成有:讓基準銷71及吸附 台70揷通之揷通孔(未具體地圖示)。 在擋板36的鄰接位置,設有將在擋板36往下流的硏削 液排出之排水管73和排水導管74。藉由設置該排水管73和 排水導管74可防止硏削液滯留於擋板36內。 ⑧ -20- 201219157 左右滑動機構34,是藉由周知的LM導件讓加工載台 33沿左右方向自由地滑動移動。而且,該左右滑動機構34 ,是藉由步進馬達34M來控制滑動量。亦即,藉由左右滑 動機構34控制加工載台33之左右方向的位置。如此,在進 行後述硏削加工時,左右滑動機構34可規定硏削路徑的左 右位置。 伸縮蓋3 5,是像所謂手風琴那樣可朝左右方向伸縮。 因此,即使加工載台33藉由左右滑動機構34而進行左右移 動,在加工載台33和伸縮蓋35之間也不會發生間隙,而能 防止硏削液流入左右滑動機構3 4。 擋板3 6,如上述般是形成上方開口的矩形箱狀,以避 免硏削液漏到外部。具體而言如第8圖所示般,擋板36的 側壁36a延伸到比基準銷71 ( hp )、吸附台70 ( hs )更高 的位置he,以防止硏削液漏出。 硏削主軸3 1係具備:產生進行硏削時的旋轉驅動力之 電動馬達31a、將硏削工具6 (磨石)固定於電動馬達31a 的主軸之夾頭3 lb * 硏削主軸31如上述般,係具備前後滑動機構38。該前 後滑動機構3 8包含:朝前後方向延伸之滑軌3 8 a、在滑軌 38a上移動之滑動件38b»該前後滑動機構38也是藉由步進 馬達38M控制滑動件38b的滑動量,藉由該前後滑動機構38 控制硏削主軸3 1的前後位置。如此,在硏削加工時’該前 後滑動機構38可規定硏削路徑的前後方向位置。 此外,在硏削主軸3 1和前後滑動機構3 8之間’如上述 -21 - 201219157 般設置上下導引機構39。該上下導引機構39也是包含:朝 上下方向延伸之軌道39a、在軌道上移動之移動構件39b。 再者’該上下導引機構39也是藉由步進馬達39M控制移動 構件39 b的上下移動量。藉由該上下導引機構39來控制硏 削主軸31的上下位置。如此,要讓硏削工具6對準工件W 時,是使用該上下導引機構39來調整位置。 此外,在固定於上述移動構件39b之磨石軸承構件100 (可旋轉地軸支承上述硏削主軸31)上,安裝後述噴射噴 嘴單元110的噴嘴架111。 工具匣32如上述般,可保持最多五根的硏削工具6,... 。具體而言如第9圖所示般,將用來保持硏削工具6,...之 五個工具保持部32a,...沿前後方向排成一列,在該工具保 持部32a和硏削主軸31之間可自動進行硏削工具6的交接。 因此,在該硏削裝置Μ,按照硏削部位,可將複數個 硏削工具6,...自動更換,而能提高硏削自由度。 使用第10圖、第11圖說明硏削主軸31的硏削工具6。 第1 0圖係使用大徑的硏削工具時之詳細側視圖,第1 1圖係 使用小徑的硏削工具時之詳細側視圖。 如上述般,該硏削主軸31,可藉由夾頭31b進行硏削 工具6的裝卸,而切換裝設第〗〇圖所示之大徑硏削工具6A 、或第1 1圖所示之小徑硏削工具6B。 第10圖所示之大徑的硏削工具6A’係具備:表面(硏 削面)附著有鑽石粒子60之大徑圓柱狀的加工部61 (磨石 )、固定於夾頭31b且朝上下方向延伸之軸部62’在加工 ⑧ -22- 201219157 部6 1的上側設置往外擴大的凸緣部63。此外,在加工部6 1 的下部形成有呈條帶狀凹陷之三條凹部64。 藉由硏削主軸31讓該大徑的硏削工具6 A旋轉,使凹部 64抵接於工件W的外緣(外形)Wa,藉此進行工件W的外 形硏削、去角。又7 0代表吸附台。 如此,藉由大徑的硏削工具6A將工件W硏削,在硏削 加工時硏削工具6A可穩定地進行硏削,因此能提高加工精 度。此外,由於硏削工具6A爲大徑。可延長工具的工具壽 命,而能將工件W大量地連續硏削。 第1 1圖所示之小徑的硏削工具6B係具備:讓鑽石粒子 1 60附著於表面(硏削面)之小徑圓柱狀的加工部1 6 1 (磨 石)、固定於夾頭31b之軸部162,在加工部161的上側設 置凸緣部163。此外,在加工部161的下部,形成有呈條帶 狀凹陷之三條凹部164。 該小徑的硏削工具6B由於直徑小,將硏削工具6插入 工件W的孔部Wb內且讓凹部164抵接於孔部Wb的內緣Wc, 藉此可對工件W的孔部Wb進行內形硏削、去角。 如此,藉由小徑的硏削工具6B將工件W之孔部Wb進行 內形硏削,即使孔部Wb 口徑小而不容易進行加工的情況 ,仍能確實地進行硏削加工。 使用第I5圖說明噴射噴嘴單元110。第15圖係用來說 明噴射噴嘴單元之示意俯視圖。 噴射噴嘴單元110係具備:上述般安裝於磨石軸承構 件100之噴嘴架111、安裝於該噴嘴架111之複數個噴射噴 -23- 201219157 嘴112。上述噴射噴嘴U2是以等角度間隔配設於磨石61 ( 加工部)的周圍。在本實施形態,該噴射噴嘴1 1 2是以包 圍磨石61外周的方式配置四個,這四個噴射噴嘴M2配設 成互相隔著90度的間隔。在本實施形態將噴射噴嘴1 1 2配 設成’使相對向的一對噴射噴嘴1 1 2所連結成的假想線與 工件W的邊(長邊)形成約45度的角度。又如第17圖所示 般,將噴射噴嘴112配設成使上述假想線與工件W的邊平 行亦可。 此外,在本實施形態,噴射噴嘴1 1 2朝向磨石6 1的旋 轉軸噴射硏削液,將噴射噴嘴1 1 2固定成,使噴射噴嘴1 1 2 的噴射中心軸與磨石61的旋轉軸交叉。又也能將噴射噴嘴 112固定成使其噴射中心軸沿著磨石外周的切線方向。此 外,也能將噴射噴嘴1 1 2設置成,爲了改變噴射中心軸的 方向(噴射方向)而能轉動,且其噴射中心軸的方向是藉 由上述電子控制單元1 5來控制。 各噴射噴嘴1 1 2分別藉由上述電子控制單元來控制其 噴射及停止。具體的控制方法隨後說明。 此外,各噴射噴嘴1 1 2,在本實施形態,是使用將液 體和氣體混合噴射之二流體噴嘴。該二流體噴嘴,是將以 高壓狀態供應之液體藉由壓縮空氣構成的高速氣流予以粉 碎、微粒子化後,將該液體和氣體一起噴射。此外,噴射 噴嘴單元110,係具備用來對各噴射噴嘴II2供應液體(硏 削液)及氣體(空氣)之液體連接口 113及氣體連接口 114 ,該液體連接口 113及氣體連接口 114分別連接於硏削液收 •⑧ -24- 201219157 容部(圖示省略)及壓縮機(圖示省略)。 再者,從上述噴射噴嘴112噴射的硏削液,可採用各 種硏削液。作爲硏削液,可具有冷卻磨石之冷卻功能、除 去硏削屑之洗淨功能、減低硏削阻力之潤滑功能、及防止 磨石生鏽之防鏽功能當中任一功能,或是同時具有複數種 功能。此外,可採用界面活性劑、乳化劑等所構成之透明 或半透明且在水中可溶之水溶系硏削液(水溶性型),煤 油等的單體或在其中混合有硫、氯等的極高壓添加劑而構 成等的油基系硏削液(礦物油型),礦物油、乳化劑以外 之合成系的物質等所構成而屬於上述水溶性系硏削液和油 基系硏削液的中間之乳液系硏削液等。這麼多種硏削液當 中,可按照硏削條件等採用適當者。 接著,針對硏削裝置Μ的控制方法,首先針對工件W 硏削路徑運算時的控制方法,使用第1 2圖~第1 4圖做說明 。第1 2圖係顯示硏削裝置的控制方法之流程圖,第丨3圖係 顯示攝影機拍攝加工台的狀態之側視圖,第1 4圖係說明所 拍攝的資料之處理及運算方法之說明圖。 如第12圖的流程圖所示般,起始後,首先,在si將工 件w的模型資料(外形、孔部等)輸入(input)電子控制 單元1 5。該輸入作業,例如將加工完畢工件Wo的設計資 料(CAD資料)一旦使用其他軟體而轉換成硏削路徑等的 硏削資料後,再輸入(input )電子控制單元1 5。 上述輸入作業結束後,接著在S2,將實際的工件Wi( 以下稱實際工件)載置(搬入)於加工台30。該載置作業 -25- 201219157 ,是藉由上述搬運機械人2來進行。藉由該載置作業,將 未加工的實際工件wi載置於加工台30的吸附台70。 然後,在S3,藉由攝影機23取得實際工件Wi和基準銷 7 1,7 1的影像。第1 3圖顯示該攝影機的拍攝狀態。如第1 3 圖所示般,在硏削裝置M’藉由安裝於搬運工件wi之搬運 機械人2的高處之攝影機23,拍攝加工台30的工件Wi和基 準銷7 1, 7 1。如此般從上方位置拍攝加工台3 0,可儘量減 少所取得的工件Wi、基準銷17,17的影像資料偏差。 如此般取得之影像資料的例子如第1 4 ( a )圖所示。 將工件Wi和兩個基準銷71,71以影像資料的形式取得而分 別算出位置資料。 接著,在S4,根據基準銷71,71的位置算出加工台30 的機械原點C。在此的機械原點C’是進行硏削加工之機械 座標的基準,藉由規定該機械原點c,可進行正確的硏削 加工。 機械原點C如第14(b)圖所示般’是藉由兩個基準銷 7 1,7 1之連結線L的中點而決定出。作爲其他例子’如虛線 所示般,進一步追加兩個基準銷7 1' 7K’將與這兩個基 準銷71', 71'的連結線N之交點設定爲機械原點C亦可。 接著,在S5,根據實際工件Wi的資料算出實際工件 Wi的外形Wa之重心位置P、孔部Wb的重心位置Q。在此’ 重心位置是指圖形的重心位置,是根據工件W的外形形狀 和孔部形狀來決定的。第.14(b)圖所不之黑圏P、Q爲實 際工件W的外形Wa之重心位置和孔部wb的重心位置。 -26- 201219157 然後,在S6,讓實際工件Wi的重心位置(外形的重心 位置P和孔部的重心位置Q )和模型w m的重心位置(外形 的重心位置P m和孔部的重心位置Q m )—致。藉由讓實際 工件W的重心位置P、Q和模型W m的重心位置p m、q m —致 ,能使實際工件Wi和模型Wm的差(位置資料的差)明確 化。第1 4 ( c )圖所示的狀態是讓實際工件Wi和模型Wm ( 一點鏈線.)的重心位置p、Q、Pm、Q m —致後的狀態。如 此般,藉由使重心位置P、Q、Pm、Qm —致,能使實際工 件Wi和模型Wm的差明確化。 接著,在S7,比較加工台30的機械原點C和實際工件 W i的重心位置P,算出機械原點C和實際工件Wi的重心位 置P之偏移量(橫方向的偏移量X、縱方向的偏移量Y、旋 轉方向的偏移量Θ)。此外’也將實際工件Wi和模型Wm做 比較,根據外形差算出削入量△%。如此能使實際工件Wi 的硏削量等明確化。 第14(d)圖係顯示各個偏移量和削入量。相對於加 工台機械原點C之實際工件Wi的重心位置P之偏移量’例 如圖示般,往左側偏移x '往上側偏移Y ’再者,往右側 傾斜Θ。 而且,關於削入量,寬度方向的削入量Δνν1 ’是從實 際工件Wi的寬度尺寸rl減去模型的寬度尺寸Τ1再除以2而 算出,長度方向的削入量Aw2 ’是從實際工件Wi的長度尺 寸r2減去模型的長度尺寸T2再除以2而算出。 如此般求出寬度方向和長度方向的削入量Δλν1、Aw2 -27- 201219157 後,以其中數値較大者當作最終削入量Aw。以這種方式決 定的原因在於,在進行硏削加工時,由於是以與模型形狀 相似的軌跡將工件全周以一定的削入量進行削入,藉由選 取較大的數値,能確實地進入削入,而硏削成更接近模型 形狀。 接著,在S8,按照X、Y、Θ偏移量、及削入量Aw,算 出工件Wi的硏削路徑。該硏削路徑,是依實際工件Wi的 形狀、實際工件Wi之載置位置的變動而改變,因此會依各 工件W而有不同。 然後,在S9,根據所算出的硏削路徑將實際工件Wi進 行硏削。該硏削作業,是讓硏削主軸3 1和加工台3 0 (加工 載台33 )分別移動來進行。在該工件W的硏削作業,是按 照硏削部位而使用上述大徑的硏削工具6A和小徑的硏削工 具6 B來進行。 接著,使用第16圖說明硏削作業時來自噴射噴嘴之硏 削液的噴射控制方法。第1 6圖係顯示工件硏削狀態之示意 俯視圖。又在第1 6圖中,爲了區別四個噴射噴嘴而使用 1 12a〜1 1 2d作爲噴射噴嘴的符號。 如第16 (a)圖所示般,在硏削工件W之一長邊的端面 時,是從比硏削加工位置(工件W端面與磨石6 1之接觸點 )更靠磨石6 1的旋轉方向後方側之第一噴射噴嘴1 1 2a噴射 硏削液。這時,從其他三個噴射噴嘴1 12b,…並未噴射硏 削液。 接著,如第16(b)圖所示般,在硏削工件W之上述 -28- ⑧ 201219157 一長邊和與該長邊鄰接的短邊間的角部時,不僅從上述第 —噴射噴嘴112a,從第二噴射噴嘴112b (比第一噴射噴嘴 112b更靠磨石61的旋轉方向後方側的噴射噴嘴)也噴射硏 削液。這時’從其他二個噴射噴嘴112c,112d並未噴射硏 削液。 接著’如第1 6 ( c )圖所示般,要硏削工件W的短邊時 ’停止進行從上述第一噴射噴嘴112a之硏削液的噴射,從 比硏削加工位置更靠磨石61的旋轉方向後方側之上述第二 噴射噴嘴1 1 2b噴射硏削液。這時,從其他二個噴射噴嘴 1 12c, 1 1 2d並未噴射硏削液。 如第16(d)圖所示般,要硏削工件W其他長邊的端 面時,是從比硏削加工位置更靠磨石6 1的旋轉方向後方側 之第三噴射噴嘴112c噴射硏削液。這時,從其他三個噴射 噴嘴U2a,…並未噴射硏削液。又在第16 ( c )及(d )圖 間之角部,與上述角部(第16(b)圖)同樣的,不僅從 上述第二噴射噴嘴11 2b,從第三噴射噴嘴1 12c也噴射硏削 液。 又在上述說明中,僅針對使用大徑的硏削工具6A進行 工件W外形硏削的情況做說明,關於使用小徑的硏削工具 6B而對工件W的孔部進行內形硏削的情況,也是藉由與上 述同樣的控制方法控制噴射及停止噴射而進行硏削作業。 亦即,可從比硏削加工位置更靠磨石的旋轉方向後方側之 一個噴射噴嘴噴射硏削液而進行硏削作業。此外,在角部 ,可從下個預定使用的噴射噴嘴和目前進行噴射之噴射噴 -29- 201219157 嘴雙方噴射硏削液而進行硏削作業。 最後,在S10,將實際工件Wi從加工台30取出(搬出 )。’該取出作業也是藉由上述搬運機械人2進行,將加工 完畢的工件Wo從加工台30取出。 接著,在S 1 1判斷作業是否結束,要繼續作業的情況 (判斷NO ),爲了進行下個工件W的加工而移到S2。另一 方面,要結束作業的情況(判斷YES:電源切斷的情況)則 直接移到結束。 藉由上述步驟控制本實施形態的硏削裝置Μ。 在本實施形態,在硏削步驟,由於二流體噴嘴構成的 噴射噴嘴1 1 2將微粒子化的硏削液朝向磨石6 1噴射,該微 粒子化的硏削液容易突破在磨石61表面(硏削面)藉由磨 石61旋轉而連帶旋轉的空氣層,容易確實地供應至磨石61 的硏削面》此外,由於從噴射噴嘴1 1 2對比硏削加工位置 更靠旋轉方向後方噴射硏削液,到達磨石61硏削面之液體 ,隨著磨石61的旋轉而容易到達硏削加工位置。 此外,從二流體噴嘴1 1 2噴射的硏削液,與之前到達 的硏削液之液體粒藉由磨石6 1產生的離心力排出時產生的 液體飛沫間之干涉較少’可效率良好地依序到達磨石6 1的 硏削面,而反覆碰撞磨石61的硏削面及硏削屑雙方。該碰 撞,對於磨石61之硏削面的磨粒間的空間內所存在之氣體 ,發揮與一般液體供應形態的情況(以全面遮蔽氣體的狀 態供應液體的情況)不同的作用。亦即,讓液體粒分別作 用於各空間內的氣體塊’可從磨粒間的空間將氣體推出, ⑧ -30- 201219157 而流生將滯留於空間之氣體置換成液體的效果。而且,到 達磨粒間之硏削液,利用其周邊的表面張力而停留在該空 間。因此,在磨粒間能穩定地保持適量的硏削液,保持有 硏削液的空間隨著磨石6 1的旋轉到達硏削加工位置,而將 空間內的硏削液進行穩定且有效地供應。 再者,只要該硏削液具有冷卻功能’能讓硏削加工位 置之磨粒的冷卻狀態變穩定,且從硏削加工位置的周圍將 硏削熱除去,結果能防止磨粒過熱,而減少其磨耗。再者 ,由於具備冷卻效果,可減少硏削屑的加熱,可防止發生 硏削屑熔接於磨粒或磨粒間的空間之現象,且使加工狀態 具有良好的熱穩定性。因此,在加工熱脆弱性或熱敏感性 的材料時,可實現穩定的加工品質。 此外,當硏削液具有潤滑功能等的情況,可將硏削液 充分供應至磨石6 1、磨粒及磨粒間的空間,藉由發揮非附 著性作用及潤滑作用,而獲得硏削屑的附著減少效果和磨 粒之防止加熱效果。 再者,依據該硏削裝置,利用液體粒之斷續地碰撞、 撞撃力可發揮洗淨效果。這是對藉由上述效果將附著於磨 粒間的現象減輕後的硏削屑,進一步掃出的效果。對於上 述般附著現象減輕後,仍繼續生成而發生滯留、附著之磨 粒間的空間內及磨粒面的硏削屑,藉由液體粒直接碰撞, 使硏削屑受到撞擊,而從所固定的部位剝離,和硏削液一 起高效率地掃出。此外,藉由具有上述潤滑功能之硏削液 的效果而減輕附著物的固接狀態,能對硏削屑的附著產生 -31 - 201219157 相乘效果。 此外,依據該硏削裝置,在硏削作業中當硏削加工位 置和磨石61的旋轉軸之相對位置改變時,藉由控制手段15 控制噴射噴嘴1 1 2的噴射,可確實地對比磨石6 1的硏削加 工位置更靠旋轉方向後方噴射硏削液,而不須供應非必要 的硏削液。因此,依據該硏削裝置,可謀求硏削液所需成 本的降低,而且能防止在磨石61周圍發生積水狀況。 再者,依據該硏削裝置,在硏削作業時使噴射噴嘴 112和磨石61 —起移動,因此不須遍及被加工物的端部全 體設置噴射噴嘴112。因此,相較於遍及被加工物的端部 全體設置噴射噴嘴的情況,可減少噴射噴嘴而謀求降低裝 置成本,且較容易確保噴射噴嘴的設置場所。而且,該硏 削裝置是以包圍磨石61外周的方式配設四個噴射噴嘴112 ,由於各噴射噴嘴112設置成與磨石61的旋轉軸之相對位 置不變,因此構造簡單,可謀求降低裝置成本,且容易確 保噴射噴嘴的設置場所。 此外,依據該硏削裝置,可按照工件W的長邊及短邊 而從適當的噴射噴嘴1 1 2噴射硏削液,可確實地進行硏削 作業,又由於在工件W的角部是從兩個噴射噴嘴112噴射 硏削液,在該部分也能確實地供應液體並進行被加工物的 硏削》此外,由於藉由控制手段1 5將同時進行噴射的噴射 噴嘴1 1 2控制在兩個以內,依據該硏削裝置利用少量的液 體可確實地進行硏削作業。 此外,各二流體噴嘴的流體個別(硏削液及空氣)的 ⑧ -32- 201219157 流體供應量比/壓力比、及混合流體的供應量、供應壓力 等,是對應於磨石的轉數、磨石種類、磨粒大小等的各條 件而適當地設定,依據本實施形態的硏削方法’在板厚 0.2mm~3.0mm之薄板玻璃的硏削加工中,能以端面磨削量 2 Ομιη以下進行高效率的硏削。相較於使用一般的硏削方法 進行的情況,能獲得約5倍〜1 0倍之硏削速度提高效果。 此外,本實施形態的硏削裝置Μ,是進行薄板玻璃( W)的端面硏削之硏削裝置Μ,事先安裝(儲存)薄板玻 璃模型Wm的資料(S1 ),根據攝影機23所取得之基準銷 71,71的拍攝資料算出加工台30的機械原點C(S4)。接 著,根據攝影機23所取得之薄板玻璃(實際工件Wi )的拍 攝資料,求出薄板玻璃(實際工件Wi )的重心位置P ( S5 ),將加工台30的機械原點C與薄板玻璃(W)的重心位 置P做比較,算出薄板玻璃的偏移量(縱方向的偏移量X、 橫方向的偏移量Y、旋轉方向的偏移量Θ) (S7),算出對 應於該偏移量之硏削路徑(S8 ),根據所算出的硏削路徑 讓硏削主軸31動作(S9 )。 因此,即使在薄板玻璃(W)本身未形成「成爲基準 之標記(記號)」等,藉由設置於加工台30之基準銷71, 71可求出「機械原點C」而掌握薄板玻璃(W)的偏移量 (X、Y ' Θ ),利用所掌握的偏移量,即使是未形成標記 (記號)等之薄板玻璃(W)也能正確地進行硏削加工。 如此,用於行動電話等的可攜式終端機之顯示畫面之 薄板玻璃(W)的端面研削用之硏削裝置Μ中,由於利用 -33- 201219157 攝影機23的拍攝資料進行硏削加工,可進行高精度地加工 ,即使在薄板玻璃(W )的表面未設置標記等也能進行硏 削加工。 又在本實施形態,機械原點雖是利用複數個基準銷 71, 71來求出,除此外,也能利用局部突出之基準突出部 求出機械原點,此外,也能利用局部著色的基準部求出機 械原點。 此外,在本實施形態,是讓薄板玻璃(W )的重心位 置P和模型Wm的重心位置Pm—致,將薄板玻璃(W )和模 型Wm做比較,而算出硏削主軸3 1的削入量Δνν。亦即,判 斷薄板玻璃(W )比模型Wm大多少(例如,測定出長度 方向的差和寬度方向的差,該「差」的大小),對應於該 大小而改變削入量Aw。 因此,薄板玻璃(W)的削入量Δχν可依工件而改變, 能以更正確的形狀及尺寸將薄板玻璃(W )加工。 如此,能更正確地掌握依工件而改變之薄板玻璃的削 入量Aw以進行硏削作業,因此能高精度地進行複數個薄板 玻璃的加工。 此外,在本實施形態,是求出薄板玻璃的外形Wa之重 心位置P和孔部Wb形狀的重心位置Q,而算出工件Wi的重 心位置。 如此,藉由算出薄板玻璃(W )的外形Wa之重心位置 P和薄板玻璃的孔部Wb形狀之重心位置Q,即使是具有孔 部的薄板玻璃,仍能確實地按照模型Wm的形狀進行硏削 -34 - ⑧ 201219157 如此,即使是具有孔部Wb之形狀複雜的薄板玻璃(W ),仍能正確地算出硏削路徑而進行高精度的硏削。 此外,在本實施形態,基準銷7 1,7 1是設置在薄板玻 璃(W)的兩側位置。 如此,形成於至少兩個基準銷7 1, 7 1的連結線L上之機 械原點C,能形成在接近薄板玻璃(W )之重心位置P的位 置。 因此,能更正確地算出薄板玻璃(W)的偏移量。亦 即,藉由使機械原點C接近薄板玻璃(W)的重心位置p’ 能減少偏移量算出時的誤差,而能算出正確的偏移量。 因此,能進行更高精度的硏削加工。 此外,在本實施形態,藉由將基準銷71的前端部71a 設定成與吸附台70的上面70a的高度相同(hp = hs ) ’使其 到攝影機23的距離,和薄板玻璃(W )到攝影機23的距離 大致一致。 如此,由於基準銷71之被拍攝點(前端部71a)和薄 板玻璃(W)的高度方向位置大致一致,能讓攝影機23的 焦點確實地對準兩者。 如此,可確實地將基準銷7 1及薄板玻璃(W )同時拍 攝,而能更正確地算出薄板玻璃(W)的偏移量。 本發明並不限定於上述實施形,而包含可運用於所有 的硏削裝置之實施形態。 本實施形態的硏削裝置,作爲工件W是採用行動電話 -35- 201219157 用的薄板玻璃,例如亦可爲可攜式音響機器用的薄板玻璃 ,此外,亦可爲可攜式遊戲機用的薄板玻璃。再者,可攜 式導航機用的薄板玻璃、可攜式電視的薄板玻璃等亦可。 又在上述實施形態,由於設有四個噴射噴嘴112,大 致方形狀的各邊的端部可藉由各噴射噴嘴112確實地供應 液體並進行硏削作業,在本發明中噴射噴嘴個數並不限定 於四個。例如第1 8圖所示般,噴射噴嘴1 1 2也能設置八個 。在第1 8圖所示的硏削裝置,是以等角度間隔配設八個噴 射噴嘴112,具體而言配設在彼此間隔45度的位置。再者 ,將六個噴射噴嘴配設在彼此間隔60度的位置(等角度間 隔)亦可。 又該第18圖所示的硏削裝置,關於工件W的長邊及短 邊之硏削,是與上述實施形態同樣地分別從一個噴射噴嘴 1 1 2噴射硏削液》此外,在進行角部的硏削時,可僅從上 述長邊及短邊的硏削時分別使用的噴射噴嘴1 1 2之間所配 設的噴射噴嘴1 1 2噴射硏削液。 此外,即使是設有四個噴射噴嘴11 2的情況,也不限 定於上述實施形態(第1 6圖)及第1 7圖所示者,例如第1 9 圖所示般,能將噴射噴嘴1 1 2配設在’使相對向之一對噴 射噴嘴1 1 2所連結成的假想線與工件W的邊(長邊)成爲 既定角度的位置。在此,既定角度是指,關於工件w角部 的硏削也能確實地供應硏削液的位置’例如爲3 〇度。 再者,複數個噴射噴嘴1 1 2之控制手段的控制方法並 不限定於上述實施形態,在本發明所意圖的範圍內可進行 '⑧ -36- 201219157 適當的設計變更。 例如也能控制成,從位於比硏削加工位 旋轉方向前方側之噴射噴嘴1 1 2也噴射硏削 由上述旋轉方向前方側的噴射噴嘴1 1 2可將 面上所附著的硏削屑除去。 在此情況,相對於硏削加工位置更靠旋 側之噴射噴嘴1 1 2和後方側的噴射噴嘴1 1 2, 的硏削液(例如,將具有冷卻功能的硏削液 射噴嘴噴射,將具有洗淨功能的硏削液從前 嘴噴射)。但當磨石直徑小的情況,二種硏 干涉而影響功能,因此較佳爲僅在磨石直徑 上述二種硏削液的使用。 此外,在上述實施形態,作爲噴射噴嘴 二流體噴嘴者進行說明,例如也能使用超音 ,其是藉由超音波振盪器將超音波振動重疊 微粒子化的液體。 藉由採用超音波重疊式噴嘴,以從噴嘴 磨石的硏削面及工件)之噴射水流作爲超音 能將該硏削液所傳遞之超音波振動加速度所 作用力賦予磨石硏削面的附著物及磨粒間空 因此,依據超音波重疊式噴嘴,是讓附著物 的空氣層振動,藉由振動而讓硏削液有效地 的接觸點而產生楔入效果,利用該楔入效果 得置換效果。 置更靠磨石的 液,如此,藉 磨石.6 1的硏削 轉方向的前方 也能使用不同 從後方側的噴 方側的噴射噴 削液可能互相 大的情況採用 雖是針對使用 波重疊式噴嘴 於液體而噴射 朝向對象物( 波傳遞介質, 產生之強振動 間的空氣層。 及磨粒間空間 滲透至其周圍 進行掃出而獲 -37- 201219157 因此,在噴嘴附近必須設有超音波振盪器,且來自噴 嘴的水流到對象物之間不可中斷,因此裝置的設置方法( 超音波振盪器的收容容積、與對象物的距離等)及運用上 會產生限制,且包含超音波振盪裝置之裝置費用的負擔會 增多,而存在這些缺點。 再者,在上述實施形態,僅針對工件的外形之端面加 工及工件的孔部內形之端面加工進行說明,但藉由上述實 施形態的裝置,例如作爲硏削工具是使用鑽頭而進行鑽孔 加工亦可。又在鑽孔加工的情況,由於需要硏削液的硏削 加工位置位於被加工物的內部,在硏削加工中雖無法獲得 二流體噴嘴的直接效果,但將其運用在鑽孔加工後除去鑽 頭的阻塞時,可發揮二流體噴嘴的洗淨效果。此外,硏削 中所排出的硏削屑可能附著於被加工物的表面而造成品質 降低,藉由始終將具備二流體噴嘴效果的硏削液供應至加 工附近表面,可將硏削屑迅速地排除,能獲得維持表面品 質的效果。此外,利用二流體的撞擊力能讓鑽頭主本體產 生微小的振動,雖然振動量、振動數不是非常高,但能獲 得與上述超音波重疊噴嘴效果相同的作用效果,而能期待 一定的效果。 此外,在上述實施形態,在硏削作業時,是針對沿工 件W的長邊方向讓磨石61移動、沿工件W的短邊方向讓工 件W移動的情況進行說明,在該硏削裝置及硏削方法,只 要在工件W的平面方向上讓工件w和磨石61相對移動即可 ’例如讓磨石不僅在工件的長邊方向,在短邊方向也能移 •⑧ -38- 201219157 動亦可。 此外,關於硏削裝置的整體構造也是,並不限定於本 實施形態’例如也能運用於加工單元僅一個者,或是設有 五個、六個等更多的加工單元的情況。 再者’關於硏削工具6也是,並不限定於本實施形態 所列舉者,例如亦可爲球型的硏削工具、圓盤型的硏削工 具、或圓錐型的硏削工具。此外,關於磨石材料也是,並 不限定於鑽石。 如以上所說明,本發明之硏削裝置及硏削方法以及薄 板狀構件之製造方法,藉由噴射噴嘴可確實地讓液體到達 磨石的硏削加工位置而進行被加工物的硏削,因此可將薄 板狀被加工物的端面確實且安全地進行硏削加工。 【圖式簡單說明】 第1圖係顯示本發明的硏削裝置之一實施形態的俯視 圖。 第2圖係第1圖的硏削裝置之前視圖。 第3圖係第1圖的硏削裝置之側視圖。 第4圖係第1圖的硏削裝置之搬運機械人的三面圖,( a )爲前視圖,(b )爲側視圖,(c )爲俯視圖。 第5圖係第1圖的硏削裝置之搬運機械人進行搬運時的 動作之說明圖,(a )顯示從基準狀態至工件保持開始狀 態,(b )顯示從工件保持開始狀態至前往加工台之工件 搬運狀態。 -39- 201219157 第6圖係第1圖的硏削裝置之搬運機械人進行搬運時的 動作之說明圖,(c)顯示從前往加工台的工件搬運狀態 至攝影機拍攝狀態,(d)顯示從攝影機拍攝狀態至下個 工件的開始保持狀態》 第7圖係第1圖的硏削裝置之第二加工單元的俯視圖。 第8圖係第1圖的硏削裝置之第二加工單元之包含一部 分截面之前視圖。 第9圖係第1圖的硏削裝置之第二加工單元之包含一部 分截面之側視圖。 第10圖係在第1圖的硏削裝置使用大徑硏削工具時的 包含一部分截面之詳細側視圖。 第1 1圖係在第1圖的硏削裝置使用小徑硏削工具時的 包含一部分截面之詳細側視圖。 第1 2圖係顯示第1圖的硏削裝置控制方法之流程圖。 第1 3圖係顯示藉由第1圖的硏削裝置之攝影機拍攝加 工台的狀態之側視圖。 第14(a)〜(d)圖係說明第1圖的硏削裝置所拍攝的 資料之處理及運算方法之說明圖。 第15圖係說明第1圖的硏削裝置之噴射噴嘴單元的示 意俯視圖。 第16(a)〜(d)圖係顯示第1圖的硏削裝置之工件硏 削狀態的示意俯視圖。 第17(a)〜(d)圖係顯示本發明的硏削裝置之其他 實施形態之工件硏削狀態的示意俯視圖。 ⑧ -40- 201219157 第1 8 ( a ) ~ ( c )圖係顯示本發明的硏削裝置之其他 實施形態之工件硏削狀態的示意俯視圖。 第1 9 ( a )〜(d )圖係顯示本發明的硏削裝置之其他 實施形態之工件硏削狀態的示意俯視圖。 【主要元件符號說明】 Μ :硏削裝置 W :工件(薄板玻璃、被加工物)Further, in the case of the above configuration, it is preferable to control the injection nozzles to be simultaneously ejected to be two or less, so that the effect of performing a reliable boring operation with a small amount of liquid can be exerted. Further, in the case of employing the above configuration, the control means preferably performs the control of ejecting liquid from an injection nozzle when the grindstone is relatively moved in a direction with respect to the workpiece, after which the grindstone is relatively opposed When the workpiece is moved in the other direction crossing the one direction, the liquid is ejected from the other ejection nozzles, and the relative movement from the one direction to the relative movement in the other direction is performed from the one ejection nozzle and Both of the other injection nozzles eject liquid. In this way, the end surface in one direction of the workpiece is ejected from the one jet nozzle, and the end surface in the other direction of the workpiece is ejected from the other jet nozzle, so that the boring operation can be surely performed. Between the end surface in one direction of the workpiece and the end surface in the other direction (for example, a corner portion), since the liquid is ejected from both the ejection nozzle and the other ejection nozzles, the liquid can be surely supplied while the liquid is supplied. Boring of the workpiece. Further, in addition to the above-described boring apparatus and boring method, the object of the present invention further includes a method of manufacturing a thin plate-shaped member including the above-described boring method. As described above, according to the present invention, since the jet nozzle can reliably cause the liquid to reach the boring position of the grindstone and perform the boring of the workpiece, the end surface of the thin plate-shaped workpiece can be reliably and safely Boring Process [Embodiment] -11 - 201219157 Hereinafter, embodiments of the present invention will be described in detail based on the drawings. First, the overall structure of the boring device will be described with reference to Figs. 1 to 3 . Further, in each of the drawings, the boring device is also known as a well-known device, and a protective plate is provided around the inside in order to secure the safety of the operator. As shown in Figs. 2 and 3, the boring device has a substantially rectangular lattice-shaped base 1 at the lower portion, and various units for performing boring processing are provided on the boring. In the base 1, the known steel square members 11, 12, and 13 are combined in the left-right direction, the front-rear direction, and the up-and-down direction, and the upper units are strongly supported. A flat iron material 14 made of iron is placed on the upper surface of the base 1. The square plates 11, 12, 13 of the base 1 are shielded by the flat plate 14, and the units can be placed on the base 1. Further, an electronic control unit 15 (control means) is provided in the base 1 to control various units for boring processing. Further, although not described in detail, the electronic control unit 15 is provided with storage means for storing processing information and the like. Further, although not shown, a control panel for allowing the operator to input information to the electronic control unit 15 is also provided. As shown in Fig. 1, the unit provided on the upper portion (on the base 1) of the boring device 包含 includes: a transport robot 2 installed at the center, and four processing units 3Α, 3Β, 3C installed around the center. 3D. The loading/unloading table 4 provided in front of the transport robot 2 and the illumination moving unit 5 extending in the front-rear direction at the left and right sides of the transport robot 2 are provided. The transport robot 2 is composed of a horizontal joint type (SCAR A) robot that is called a three-way -12-201219157 section that moves in the horizontal direction. Fig. 1 to Fig. 3 show a reference state in which the transport robot 2 does not operate, and the operation state will be described later with reference to Figs. 4 to 6 . The upper and lower slide shafts 20 are provided at the front end of the transport robot 2. At the lower end of the upper and lower slide shafts 20, a suction hand 2 1 for sucking and holding a substantially square (substantially polygonal) thin plate glass W of a workpiece (workpiece) is provided. Further, at the upper end of the vertical slide shaft 20, a camera 23 for image acquisition is attached through the mounting bracket. In the transport robot 2, the thin plate glass W (Wo, Wi) is transported from the loading/unloading table 4 to the respective processing units 3A, 3B, 3C, and 3D, and is fed to the take-out table from each of the processing units 3A, 3B, 3C, and 3D. 4 handling. The conveyance operation of the workpiece W is performed by the suction hand 21. Further, the transport robot 2' can image the mounted workpiece W from above the processing units 3A, 3B, 3C, and 3D by the camera 23. The four processing units are respectively disposed in the first processing unit 3A, the second processing unit 3B, the third processing unit 3C, and the fourth processing unit 3A, 3B, 3C of the front, rear, left, and right of the transport robot 2, The components of 3D are set to be identical ', and the same boring operation can be performed. For example, as shown in the first processing unit 3 A, the constituent elements include a processing table 30 that adsorbs and holds the workpiece W in a boring state, and a boring spindle 31 ′ adjacent to the boring of the workpiece W from above the processing table 30 The tool table 32 for holding a plurality of boring tools (grinding stones), and the spray nozzle unit 1 1 朝向 for grinding the blasting liquid attached to the honing spindle 31. In the processing table 30, a left and right slide mechanism 34 (moving means) for sliding the center processing stage 33 in the left and right directions is provided. A resin telescopic cover 35 is provided on the left and right sides of the processing stage 33 (the telescopic cover on the right side of the processing stage 33 is covered by a boring spindle or the like and is not shown). The telescopic cover 35 prevents the blasting liquid from intruding into the left and right sliding mechanism 34. Further, a baffle plate 36 having a rectangular box shape and having an upper opening is provided on the upper surface of the processing stage 33, and the baffle is prevented from splashing by the baffle 36. Further, the boring main shaft 31 is provided with a rear slide mechanism 38 (moving means) which is slidably movable in the front-rear direction. Further, between the boring spindle 31 and the front and rear slide mechanisms 38, the upper and lower guide mechanisms 39 are movable in the up and down direction. In this way, the boring spindle 31 is freely movable not only in the front-rear direction but also in the up-and-down direction. Further, as shown in Fig. 2, the front and rear slide mechanism 38 is a side seat 16 that is strongly fixed to a large square material extending in the front-rear direction. In this way, the support rigidity of the boring spindle 31 can be improved and the boring precision can be improved. The tool 匣32 can hold up to five boring tools (grinding stones) 6, ... (refer to Fig. 2 and Fig. 3). A plurality of boring tools 6 such as grindstones having different diameters and grindstones having different honing materials are held in the tool cymbal 32. The plurality of boring tools 6 are selectively attached to the boring spindle 3 1 in accordance with the processing contents. The input/unloading table 4 includes an opening and closing door 40 for opening and closing the operator, and interlocking with the opening and closing door 40. The moving rectangular cymbal mounting table 4 1 and the workpiece 匣 42 detachably provided to the cymbal mounting table 41 are provided. The opening and closing door 40 is formed of a rectangular steel plate having a long lateral length of a hinge shaft 14-8 201219157 43 (see FIG. 3) extending in the horizontal direction at the lower end, and a handle having a substantially U-shaped shape in plan view is provided on the upper outer surface. Part 44. The operator 握 holds the handle portion 44 to rotate the opening and closing door 40 toward the front side around the hinge shaft 43 to open the loading/unloading table 4, and takes out the workpiece W into the boring device. Both side ends of the cymbal mounting table 41 are coupled to a coupling mechanism 45 connected to the upper portion of the opening and closing door 40. Further, the lower portion of the crucible setting table 41 is slidably placed on the slide rail 46 extending in the front-rear direction (see Fig. 3). Therefore, when the operator performs the opening operation of the opening and closing door 40, the transmission connecting mechanism 45 can slidably move the cymbal mounting base 41 connected to the opening and closing door 40 to the outer side of the boring device 。. When the operator 关闭 performs the closing operation of the opening and closing door 40, the sill setting table 41 can be slidably moved toward the inner side of the boring device 。. The workpiece 匣 42 is provided with four laminated portions 48 partitioned by a resin wall 47, and four workpiece W laminates can be arranged in the left-right direction. In this case, the unprocessed workpiece Wi is laminated on the right two laminated portions 48, and the processed workpiece Wo is laminated on the left two laminated portions 48. The workpiece 42 is provided at both ends with a grip portion 49 for conveyance so that the operator can remove the workpiece W from the crucible setting table. The operator mounts (places) the unprocessed workpiece W on the workpiece crucible 42. The workpiece 匣 42 on which the workpiece W is placed is placed on the cymbal mounting table 41, and the opening and closing door 40 is closed to complete preparation before processing. The illumination moving unit 5 includes a moving rail 5 that extends in the front-rear direction on both sides of the transport robot 2, and a substantially square-shaped illumination frame 52 that is supported by the moving rail 50 by the vertical movement mechanism 51. The front end and the rear end of the moving rail 50 are transmitted through the support brackets 50a, 50a, -15-201219157, and are disposed on the metal flat plate 14»the rear end of the moving rail 5 延伸 extends to the processing unit on the rear side (second The tool 匣3 2 position of the machining unit 3Β, the fourth machining unit 3D). Therefore, the illumination frame 52 can be largely moved to the rear side of the boring device ,, and the standby point when the illumination frame 52 is not used (at the time of boring processing in each of the processing units 3Α, 3Β, 3C, and 3D) allows The illumination frame 52 is retracted to the position on the rear side. The illumination frame 52 is in each frame portion 52a. . . A plurality of LEDs (not shown) are embedded in the inner peripheral surface to illuminate the inside of the frame. The illumination frame 52 can be moved to the shutter 36 of the processing table 30 when the camera 23 captures the workpiece W, and the workpiece W can be illuminated from the side by the LED to make the shape (profile) of the workpiece W appear, and the workpiece can be easily performed. W shooting. Next, the transport robot 2 will be described with reference to Figs. 4 to 6 . Fig. 4 is a three-side view of the transport robot, (a) is a front view, (b) is a side view, and (c) is a plan view. Fig. 5 and Fig. 6 are explanatory views of the operation when the transport robot performs the transport, and Fig. 5 (a) shows the state from the reference state to the workpiece hold start state. The fifth (b) diagram shows the progress from the workpiece holding start state to The workpiece conveyance state of the processing table, Fig. 6(c) shows the workpiece conveyance state to the processing table to the camera shooting state, and Fig. 6(d) shows the state from the camera shooting state to the next workpiece holding state. The transport robot 2 is composed of a horizontal joint type robot that moves in the horizontal direction as described above, and is movable in the horizontal direction. Specifically, as shown in Fig. 4(b), the transport robot 2 is provided to be rotatable in the first joint 2Ja, the second joint 2Jb, and the third joint 2JC, and is movable in the left-right direction. Thus, the vertical sliding shaft 20 at the front end of the front side arm 24 can be moved in the horizontal direction from 8 -16 to 201219157. The vertical sliding shaft 20 penetrates the front end of the front arm 24 in the vertical direction, and is also slidable in the vertical direction. The suction hand 21 is provided at the lower end of the upper and lower slide shafts 20. The suction hand 21 is provided with four suction cups 26 facing the lower side on a rectangular flat bottom plate 25. . . . The negative pressure is applied to the suction cup 26 to generate an adsorption force, whereby the sheet glass W of the workpiece is adsorbed and held. These four suction cups 26, ..., as shown in Fig. 4 (c), are provided with two on the left and right sides. The two workpieces W are adsorbed and held by the two suction cups 26. Therefore, one suction hand 21 can carry two pieces of workpiece W one time. Further, in the suction hand 21, pins 72 projecting downward are provided at both ends of the bottom plate 25. The pins 27 and 27 are abutting members that abut against the workpiece W. That is, before the workpiece W is transported, the workpiece W is pushed into the workpiece 匣42 by the pin 27 via the movement of the transport robot 2, and the workpiece W is aligned in the workpiece 匣42. The camera 23 described above is provided at the upper end of the vertical slide shaft 20. The camera 23 holds a position (the protruding portion of the bottom plate 25) with respect to the workpiece W of the suction hand 21, and is disposed at a position shifted by about 90°. This is because when the camera 23 performs photographing, it is prevented from being blocked by the bottom plate 25. The camera 23 is constituted by a general CCD camera and can acquire two-dimensional image data. Further, the camera 23 is attached to the vertical slide shaft 20 via a mounting bracket 22. The mounting bracket 22 includes a wrist portion 22a that is slightly curved downward, a camera mounting portion 22b that can adjust the position in the vertical direction, and a cylindrical shaft fixing portion 22c that is fixed to the vertical sliding shaft 20. Since the camera 23 is fixed to the upper and lower slide shafts 20 through the wrist portion 22a, it is located at a position separated from the vertical slide shaft 20, and the front arm 24 can be prevented from being reflected during shooting. Next, the operation when the transport robot 2 performs the transport will be described with reference to Figs. 5 and 6 . As shown in Fig. 5(a), the transport robot 2 first slightly rotates the joints in the counterclockwise direction from the reference state, and adsorbs the unprocessed workpiece Wi stacked on the workpiece 匣 42 by the suction hand 2 1 . At this time, the upper and lower slide shafts 20 are largely rotated counterclockwise to rotate the bottom plate 25 of the suction hand 21, and the unprocessed workpiece Wi is sucked by the suction cup 26 on the left side. Then, as shown in Fig. 5(b), the transport robot 2 rotates the joints in a counterclockwise direction to convey the workpiece Wi to the processing table 30 of the first processing unit. At this time, the workpiece Wi is transported to the position of the large cymbal and placed on the processing table 30. That is, the strict position confirmation is not performed, and the workpiece Wi is transported to the processing table 30 and placed at the position of the raft. Next, as shown in Fig. 6(c), the transport robot 2 rotates the front side arm 24 further in the counterclockwise direction, and rotates the up and down slide shaft 20 in the clockwise direction, so that the camera 23 is surely positioned on the workpiece Wi. Above (just above). In this way, the transport robot 2 can photograph the workpiece Wi carried and placed by the camera 23. Further, the order of photographing of the workpiece W and the like are described later. Finally, as shown in Fig. 6 (d), after the photographing of the workpiece Wi is completed, the transport robot 2 resets the joints in the clockwise direction in order to carry the next unprocessed workpiece W, by the left side of the bottom plate 25. The suction cup 26 sucks the next workpiece W. 8 -18- 201219157 Then, the transport robot 2 repeats the operation of Fig. 5(b), and the unprocessed workpiece W is transported from the workpiece 匣42 to the next processing stage. In this way, the unprocessed workpiece W can be continuously transported on the processing table of the empty processing unit. Further, although not specifically shown, the transport robot 2 transports the processed workpiece W after the machining is completed by the suction cup 26 on the right side, and transports it from the processing table 30 to the workpiece 匣42. The transport robot 2 receives the processed workpiece Wo from the processing table 30 before performing the operation of Fig. 5(b), and simultaneously transports the unprocessed workpiece Wi and transports the processed workpiece Wo. Next, the processing unit will be described. Fig. 7 is a plan view of the machining unit, Fig. 8 is a front view of a part of the machining unit, and Fig. 9 is a side view of the machining unit including a part of the section. The machining unit 3B (described as a second machining unit for convenience) has a processing table 30 for holding the workpiece W, a boring spindle 31 for boring the workpiece W, and holding 硏 as shown in Fig. 7 The tool 匣32° of the cutting tool 6 includes the rectangular processing stage 33 (stage), the left and right sliding mechanism 34 for moving the processing stage 33 to the left and right, and the telescopic cover 35 covering the left and right sliding mechanism 34. The baffle plate 36 disposed on the upper surface of the processing stage 33 and the jet nozzle unit 1 1 硏 for jetting the blasting liquid. Further, as shown in Fig. 8, the processing table 30 further includes various components. First, on the upper surface of the processing stage 33, a suction stage 70 for adsorbing and holding the workpiece W in the center of the inner side of the baffle 36 is provided. The suction stage 70' is composed of a block-shaped pedestal having a substantially T-shape -19-201219157 in which the upper surface (the receiving surface) 7a is rectangular (see Fig. 7). In the upper surface 70a' of the adsorption stage 70, a plurality of suction ports 7〇b are provided in order to impart a negative pressure (see Fig. 10 and Fig. 11 in addition, in order to avoid damage on the surface of the workpiece W of the thin glass, it is adsorption. The upper surface 70a of the stage 70 is subjected to smoothing processing. ^ Two reference pins 71 for calculating the mechanical origin at the time of boring processing are vertically disposed around the suction stage 70 so as to face the camera 23 side (upper side). 71. The reference pins 71, 71 are arranged to be imaged by the camera 23 in a state in which the workpiece W is placed (held) on the adsorption stage 70, and are disposed at positions that do not overlap the workpiece W. The reference pins 71, 71 are disposed at diagonal positions with respect to the workpiece W. Further, when the workpiece W is completely transparent, the position of the reference pin is set to overlap with the workpiece W. Further, the front end portion 71 of the reference pin 71 is provided. a, as shown in Fig. 8, the height hp is set to be the same as the height hs of the upper surface 70a of the adsorption stage 70. With such setting, when the camera 23 performs photographing, no occurrence occurs between the workpiece W and the reference pin 71. Focus shift, and can be faithfully Further, in the interior of the baffle 36, a background plate 72 having a high bottom and a substantially square shape inclined at 1. The background plate 72 is completely matted to prevent reflections reflected in the camera 23, thereby causing the workpiece The reflection of the W and the reference pin 71 is more prominent. Further, by setting the background plate 72 obliquely, the boring liquid can be immediately moved downward. Further, the background plate 72 is formed with the reference pin 71 and the suction stage 70. A through hole (not specifically shown) is provided. At a position adjacent to the baffle 36, a drain pipe 73 and a drain pipe 74 for discharging the cutting fluid flowing downward from the baffle 36 are provided. By providing the drain pipe 73 and the drain duct 74 prevent the boring liquid from remaining in the baffle 36. 8 -20- 201219157 The left and right slide mechanism 34 allows the processing stage 33 to freely slide in the left-right direction by a well-known LM guide. The left and right slide mechanism 34 controls the amount of slip by the stepping motor 34M. That is, the left and right slide mechanism 34 controls the position of the machining stage 33 in the left-right direction. Thus, when the boring processing described later is performed, the left and right slides are performed. Agency 34 may specify a boring road The left and right positions of the diameter of the telescopic cover 35 are expandable in the left-right direction like the so-called accordion. Therefore, even if the processing stage 33 is moved left and right by the left and right sliding mechanism 34, between the processing stage 33 and the telescopic cover 35 The gap does not occur, and the boring liquid can be prevented from flowing into the left and right sliding mechanism 34. The baffle 3 6, as described above, is formed in a rectangular box shape with an upper opening to prevent the blasting liquid from leaking to the outside. Specifically, As shown in Fig. 8, the side wall 36a of the baffle 36 extends to a position higher than the reference pin 71 (hp) and the suction stage 70 (hs) to prevent leakage of the boring liquid. The boring spindle 31 has: The electric motor 31a that performs the rotational driving force during boring, and the chuck 3 lb that fixes the boring tool 6 (grinding stone) to the main shaft of the electric motor 31a. The boring main shaft 31 has the front and rear sliding mechanism 38 as described above. The front and rear sliding mechanism 38 includes: a sliding rail 38 8 a extending in the front-rear direction, and a sliding member 38b on the sliding rail 38a. The front and rear sliding mechanism 38 also controls the sliding amount of the sliding member 38b by the stepping motor 38M. The front and rear positions of the boring spindle 31 are controlled by the front and rear slide mechanism 38. Thus, the front and rear slide mechanism 38 can define the position in the front-rear direction of the boring path during the boring process. Further, between the boring main shaft 3 1 and the front and rear slide mechanism 38, the upper and lower guide mechanisms 39 are provided as in the above -21 - 201219157. The vertical guide mechanism 39 also includes a rail 39a extending in the vertical direction and a moving member 39b moving on the rail. Further, the up-and-down guide mechanism 39 controls the amount of vertical movement of the moving member 39b by the stepping motor 39M. The vertical position of the boring spindle 31 is controlled by the vertical guide mechanism 39. Thus, when the boring tool 6 is aligned with the workpiece W, the vertical guide mechanism 39 is used to adjust the position. Further, the nozzle holder 111 of the injection nozzle unit 110 to be described later is attached to the grindstone bearing member 100 fixed to the moving member 39b (rotatably axially supporting the above-described boring spindle 31). The tool 匣 32 can hold up to five boring tools 6 as described above. . .  . Specifically, as shown in Figure 9, it will be used to maintain the boring tool 6, . . . The five tool holding parts 32a,. . . The boring tool 6 is automatically transferred between the tool holding portion 32a and the boring spindle 31 in a row in the front-rear direction. Therefore, in the boring device, a plurality of boring tools 6 can be used according to the boring portion. . . Automatic replacement, which increases the freedom of boring. The boring tool 6 of the boring spindle 31 will be described using Figs. 10 and 11 . Figure 10 shows a detailed side view of a large-diameter boring tool. Figure 1 shows a detailed side view of a boring tool with a small diameter. As described above, the boring spindle 31 can be attached or detached by the boring tool 6 by the chuck 31b, and the large-diameter boring tool 6A shown in Fig. 1 or the first embodiment shown in Fig. 1 can be switched. Small diameter boring tool 6B. The large-diameter boring tool 6A' shown in Fig. 10 is provided with a large-diameter cylindrical processing portion 61 (grinding stone) to which the diamond particles 60 are adhered on the surface (the boring surface), and is fixed to the chuck 31b in the vertical direction. The extended shaft portion 62' is provided with an outwardly enlarged flange portion 63 on the upper side of the processing 8-22-201219157 portion 61. Further, three recessed portions 64 which are strip-shaped recessed are formed in the lower portion of the processed portion 6 1 . The large-diameter boring tool 6A is rotated by the boring main shaft 31, and the concave portion 64 is brought into contact with the outer edge (outer shape) Wa of the workpiece W, whereby the external shape boring and chamfering of the workpiece W are performed. Another 70 represents the adsorption stage. In this way, the workpiece W is boring by the large-diameter boring tool 6A, and the boring tool 6A can be boring stably during the boring process, so that the machining accuracy can be improved. Further, since the boring tool 6A is a large diameter. The tool life of the tool can be extended, and the workpiece W can be continuously boring in large quantities. The boring tool 6B having a small diameter shown in Fig. 1 is provided with a small-diameter cylindrical processing portion 1 6 1 (grinding stone) for attaching the diamond particles 1 60 to the surface (the boring surface), and is fixed to the chuck 31b. The shaft portion 162 is provided with a flange portion 163 on the upper side of the processed portion 161. Further, in the lower portion of the processed portion 161, three recessed portions 164 which are recessed in a strip shape are formed. The small-diameter boring tool 6B has a small diameter, and the boring tool 6 is inserted into the hole portion Wb of the workpiece W and the concave portion 164 abuts against the inner edge Wc of the hole portion Wb, whereby the hole portion Wb of the workpiece W can be Perform internal shape boring and chamfering. As described above, the hole portion Wb of the workpiece W is internally boring by the boring tool 6B having a small diameter, and the boring process can be surely performed even if the hole portion Wb has a small diameter and is not easily processed. The spray nozzle unit 110 will be described using FIG. Fig. 15 is a schematic plan view showing the spray nozzle unit. The jet nozzle unit 110 includes a nozzle holder 111 that is attached to the grindstone bearing member 100 as described above, and a plurality of jets -23-201219157 that are attached to the nozzle holder 111. The injection nozzle U2 is disposed around the grindstone 61 (processed portion) at equal angular intervals. In the present embodiment, the injection nozzles 1 1 2 are disposed so as to surround the outer circumference of the grindstone 61, and the four injection nozzles M2 are disposed at intervals of 90 degrees from each other. In the present embodiment, the injection nozzles 1 1 2 are disposed such that the imaginary line connecting the pair of opposed injection nozzles 1 1 2 forms an angle of about 45 degrees with the side (long side) of the workpiece W. Further, as shown in Fig. 17, the injection nozzle 112 is disposed such that the imaginary line is parallel to the side of the workpiece W. Further, in the present embodiment, the injection nozzle 1 1 2 sprays the blasting liquid toward the rotation axis of the grindstone 61, and fixes the injection nozzle 1 1 2 so that the injection center axis of the injection nozzle 1 1 2 and the grinding stone 61 rotate. The axes intersect. Further, the injection nozzle 112 can be fixed such that its injection center axis is along the tangential direction of the outer circumference of the grindstone. Further, the injection nozzle 1 1 2 can be set to be rotatable in order to change the direction (ejection direction) of the injection center axis, and the direction of the injection center axis is controlled by the above-described electronic control unit 15. Each of the injection nozzles 112 is controlled to be ejected and stopped by the above-described electronic control unit. The specific control method is explained later. Further, in the present embodiment, each of the injection nozzles 1 1 2 is a two-fluid nozzle that mixes a liquid and a gas. The two-fluid nozzle pulverizes and pulverizes a liquid supplied in a high-pressure state by a high-speed air stream composed of compressed air, and then ejects the liquid together with the gas. In addition, the spray nozzle unit 110 is provided with a liquid connection port 113 and a gas connection port 114 for supplying liquid (crushing liquid) and gas (air) to each of the injection nozzles II2, and the liquid connection port 113 and the gas connection port 114 are respectively Connected to the boring fluid. • 8 -24- 201219157 Capacity (not shown) and compressor (not shown). Further, various boring solutions can be used for the blasting liquid sprayed from the injection nozzle 112. As the boring liquid, it may have any function of cooling the cooling stone, cleaning function for removing swarf, lubricating function for reducing boring resistance, and rust preventing function for preventing rusting of the stone, or both A variety of functions. Further, a water-soluble boring liquid (water-soluble type) which is transparent or translucent and soluble in water, which is composed of a surfactant, an emulsifier, or the like, a monomer such as kerosene or a mixture of sulfur, chlorine or the like may be used. An oil-based boring liquid (mineral oil type) composed of an extremely high-pressure additive, a synthetic oil other than mineral oil or an emulsifier, and the like, and belongs to the water-soluble boring liquid and the oil-based boring liquid. The emulsion in the middle is a boring solution or the like. In the case of such a plurality of boring solutions, appropriate ones may be employed in accordance with the boring conditions. Next, the control method for the boring device , is first described with reference to FIGS. 2 to 14 in the control method for the workpiece W boring path calculation. Fig. 1 is a flow chart showing the control method of the boring device, and Fig. 3 is a side view showing the state of the camera processing table, and Fig. 14 is an explanatory view showing the processing and calculation method of the captured data. . As shown in the flowchart of Fig. 12, after starting, first, the model data (shape, hole, etc.) of the workpiece w is input to the electronic control unit 15 at si. In the input operation, for example, the design information (CAD data) of the processed workpiece Wo is converted into a boring data such as a boring path using another software, and then the electronic control unit 15 is input. After the above-described input operation is completed, the actual workpiece Wi (hereinafter referred to as an actual workpiece) is placed (loaded) on the processing table 30 at S2. This mounting operation -25 - 201219157 is performed by the transport robot 2 described above. By this mounting operation, the unprocessed actual workpiece wi is placed on the suction stage 70 of the processing table 30. Then, at S3, the image of the actual workpiece Wi and the reference pins 71, 71 is obtained by the camera 23. Figure 13 shows the shooting status of the camera. As shown in Fig. 1, the boring device M' is photographed by the camera 23 attached to the upper portion of the transport robot 2 that transports the workpiece wi, and the workpiece Wi and the reference pins 71, 71 of the processing table 30 are taken. By photographing the processing table 30 from the upper position as described above, it is possible to minimize the variation of the image data of the obtained workpiece Wi and the reference pins 17 and 17. An example of the image data thus obtained is shown in Figure 14 (a). The workpiece Wi and the two reference pins 71, 71 are acquired as image data to calculate position data, respectively. Next, at S4, the machine origin C of the processing table 30 is calculated based on the positions of the reference pins 71, 71. Here, the machine origin C' is a reference for the mechanical coordinate of the boring process, and by correcting the machine origin c, the correct boring process can be performed. The mechanical origin C is determined by the midpoint of the connecting line L of the two reference pins 7 1, 7 1 as shown in Fig. 14(b). As another example, as shown by a broken line, two reference pins 7 1 ' 7K' may be further added to the intersection of the connecting lines N of the two reference pins 71', 71' as the machine origin C. Next, at S5, the gravity center position P of the outer shape Wa of the actual workpiece Wi and the gravity center position Q of the hole portion Wb are calculated based on the data of the actual workpiece Wi. Here, the center of gravity position refers to the position of the center of gravity of the figure, which is determined according to the outer shape of the workpiece W and the shape of the hole. First. The black 圏 P and Q which are not shown in Fig. 14(b) are the position of the center of gravity of the outer shape Wa of the actual workpiece W and the position of the center of gravity of the hole portion wb. -26- 201219157 Then, at S6, the position of the center of gravity of the actual workpiece Wi (the center of gravity P of the outer shape and the position of the center of gravity Q of the hole) and the position of the center of gravity of the model wm (the position of the center of gravity P m of the outer shape and the position of the center of gravity of the hole portion Q) m)--- By making the center-of-gravity positions P, Q of the actual workpiece W and the centroid positions p m and q m of the model W m uniform, the difference between the actual workpiece Wi and the model Wm (difference in positional data) can be made clear. The state shown in Figure 1 4 (c) is to let the actual workpiece Wi and the model Wm (a little chain line. The position of the center of gravity p, Q, Pm, Q m is the state after the change. As a result, the difference between the actual workpiece Wi and the model Wm can be made clear by making the center-of-gravity positions P, Q, Pm, and Qm uniform. Next, at S7, the machine origin C of the machining table 30 and the center of gravity P of the actual workpiece W i are compared, and the offset amount of the center of gravity C of the machine origin C and the actual workpiece Wi is calculated (the amount of shift X in the lateral direction, The amount of shift Y in the longitudinal direction and the amount of shift in the direction of rotation Θ). In addition, the actual workpiece Wi and the model Wm are also compared, and the amount of shaving Δ% is calculated based on the difference in the shape. In this way, the amount of squeezing of the actual workpiece Wi can be clarified. Figure 14(d) shows the various offsets and amounts of cut. The offset amount of the center of gravity P of the actual workpiece Wi with respect to the mechanical origin C of the processing table is exemplified as shown in the figure, and is shifted to the left side by shifting from the left side to the left side by Y', and is tilted to the right side. Further, regarding the amount of shaving, the amount of Δνν1 ' in the width direction is calculated by subtracting the width dimension Τ1 of the model from the width dimension rl of the actual workpiece Wi and dividing by 2, and the amount of cutting Aw2' in the longitudinal direction is from the actual workpiece. The length dimension r2 of Wi is subtracted from the length dimension T2 of the model and divided by 2. When the amount of cut in the width direction and the length direction Δλν1, Aw2 -27-201219157 is obtained in this way, the larger one is used as the final amount of cut Aw. The reason for this determination is that, in the boring process, since the workpiece is cut by a certain amount of cutting in the entire circumference of the workpiece in a trajectory similar to the shape of the model, it is possible to select a larger number of ridges. The ground enters the sharpening and is slashed closer to the shape of the model. Next, at S8, the boring path of the workpiece Wi is calculated in accordance with the X, Y, Θ offset, and the amount of cut Aw. Since the boring path changes depending on the shape of the actual workpiece Wi and the position at which the actual workpiece Wi is placed, it varies depending on the workpiece W. Then, at S9, the actual workpiece Wi is boring based on the calculated boring path. This boring operation is performed by moving the boring spindle 3 1 and the machining table 30 (machining stage 33) separately. The boring operation of the workpiece W is performed by using the above-described large-diameter boring tool 6A and the small-diameter boring tool 6 B in accordance with the boring portion. Next, an injection control method of the squeegee from the injection nozzle at the time of the boring operation will be described using Fig. 16. Figure 16 shows a schematic top view of the workpiece boring state. Further, in Fig. 16, in order to distinguish four injection nozzles, 1 12a to 1 1 2d are used as the symbols of the injection nozzles. As shown in Fig. 16(a), when the end face of one of the long sides of the workpiece W is boring, it is more than the grindstone 6 1 from the boring position (the contact point between the end face of the workpiece W and the grindstone 6 1). The first injection nozzle 1 1 2a on the rear side in the direction of rotation sprays the boring fluid. At this time, the dicing fluid is not ejected from the other three injection nozzles 1 12b, .... Next, as shown in Fig. 16(b), when the corner portion between the long side of the -28-8201219157 and the short side adjacent to the long side of the workpiece W is boring, not only the first jet nozzle but also 112a, the blasting liquid is also injected from the second injection nozzle 112b (the injection nozzle on the rear side in the rotation direction of the grindstone 61 from the first injection nozzle 112b). At this time, the dicing liquid is not ejected from the other two injection nozzles 112c, 112d. Then, as shown in Fig. 16(c), when the short side of the workpiece W is to be boring, 'the ejection of the boring liquid from the first injection nozzle 112a is stopped, and the grinding stone is made more than the boring position. The second injection nozzle 1 1 2b on the rear side in the rotation direction of the 61 jets the blasting liquid. At this time, the dicing fluid is not ejected from the other two injection nozzles 1 12c, 1 1 2d. As shown in Fig. 16(d), when the end faces of the other long sides of the workpiece W are to be boring, the nip is sprayed from the third injection nozzle 112c on the rear side in the rotational direction of the grindstone 6 1 than the boring processing position. liquid. At this time, the dicing fluid is not ejected from the other three injection nozzles U2a, .... Further, in the corner portion between the sixteenth (c) and (d), the same as the above-described corner portion (Fig. 16(b)), not only from the second injection nozzle 11 2b but also from the third injection nozzle 1 12c Spray the boring fluid. In the above description, only the case where the workpiece W is boring is performed using the boring tool 6A having a large diameter, and the hole portion of the workpiece W is internally boring using the boring tool 6B having a small diameter. The boring operation is also performed by controlling the injection and stopping the injection by the same control method as described above. That is, the boring operation can be performed by injecting the blasting liquid from one of the injection nozzles on the rear side in the rotation direction of the grindstone than the boring processing position. Further, at the corner portion, the boring operation can be performed by jetting the blasting liquid from the next predetermined injection nozzle and the injection jet -29-201219157 which is currently being sprayed. Finally, at S10, the actual workpiece Wi is taken out (moved out) from the processing table 30. The take-out operation is also performed by the transport robot 2, and the processed workpiece Wo is taken out from the processing table 30. Next, in S1 1, it is judged whether or not the job is completed, and if the job is to be continued (NO), the process proceeds to S2 in order to perform the machining of the next workpiece W. On the other hand, if the job is to be ended (judgment YES: the power is turned off), it is directly moved to the end. The boring device 本 of the present embodiment is controlled by the above steps. In the present embodiment, in the boring step, since the jetting nozzle 1 1 2 composed of the two-fluid nozzle sprays the fine-grained blasting liquid toward the grindstone 61, the micronized dicing liquid easily breaks over the surface of the grindstone 61 ( The boring surface) is easily supplied to the boring surface of the grindstone 61 by the rotation of the grindstone 61 in conjunction with the rotating air layer. In addition, the boring is further injected from the jet nozzle 1 1 2 in the direction of the rotation relative to the boring position. The liquid reaches the liquid of the grinding surface of the grindstone 61, and it is easy to reach the boring processing position as the grindstone 61 rotates. Further, the squeegee sprayed from the two-fluid nozzle 112 is less likely to interfere with the liquid droplets generated when the liquid granules of the previously obtained blasting liquid are discharged by the centrifugal force generated by the grindstone 61. The boring surface of the grindstone 6 1 is sequentially reached, and the boring surface of the grindstone 61 and the boring chip are repeatedly collided. This collision has a different effect on the gas existing in the space between the abrasive grains of the boring surface of the grindstone 61 in the case of the general liquid supply form (in the case where the liquid is supplied in a state where the gas is completely shielded). That is, the gas granules which are used for the respective liquid particles in the respective spaces can push out the gas from the space between the abrasive grains, and the effect of replacing the gas remaining in the space with the liquid is generated by the flow of 8 -30 to 201219157. Further, the squeegee between the abrasive grains is retained in the space by the surface tension of the periphery. Therefore, it is possible to stably maintain an appropriate amount of the boring liquid between the abrasive grains, and to maintain the space of the boring liquid to reach the boring processing position with the rotation of the grinding stone 61, and to stabilize the boring liquid in the space stably and efficiently. supply. Further, as long as the boring liquid has a cooling function, the cooling state of the abrasive grains at the boring processing position can be stabilized, and the boring heat is removed from the periphery of the boring processing position, thereby preventing the abrasive grains from being overheated and reduced. Its wear. Further, since the cooling effect is provided, the heating of the swarf chip can be reduced, and the phenomenon that the swarf chip is welded to the space between the abrasive grains or the abrasive grains can be prevented, and the processing state has good thermal stability. Therefore, stable processing quality can be achieved when processing materials with thermal fragility or heat sensitivity. In addition, when the boring liquid has a lubricating function or the like, the boring liquid can be sufficiently supplied to the space between the grindstone 61, the abrasive grains and the abrasive grains, and the boring can be obtained by exerting non-adhesive action and lubricating action. The effect of reducing the adhesion of the chips and the heating effect of the abrasive grains. Further, according to the boring device, the washing effect can be exhibited by intermittent collision and collision force of the liquid particles. This is an effect of further sweeping out the swarf shavings which are alleviated by the above-described effect of the phenomenon of adhesion between the abrasive grains. After the above-mentioned adhesion phenomenon is alleviated, the smashing debris in the space between the abrasive grains and the abrasive grain surface which are retained and adhered is still generated, and the smashing debris is directly collided by the liquid particles, and the swarf swarf is hit and fixed. The part is peeled off and is efficiently swept out together with the boring liquid. Further, by the effect of the boring liquid having the above-described lubricating function, the adhesion state of the attached matter can be reduced, and the multiplication effect of the adhesion of the swarf to the swarf can be generated. Further, according to the boring device, when the relative position of the boring processing position and the rotating shaft of the grindstone 61 is changed in the boring operation, the injection of the injection nozzle 1 12 is controlled by the control means 15, and the grinding can be surely compared The boring position of the stone 6 1 is further sprayed with the boring fluid in the direction of the rotation, without the need to supply the unnecessary boring fluid. Therefore, according to the boring device, the cost required for the boring fluid can be reduced, and the water accumulation state around the grindstone 61 can be prevented. Further, according to the boring device, the jetting nozzle 112 and the grindstone 61 are moved together during the boring operation, so that it is not necessary to integrally provide the jetting nozzle 112 over the end portion of the workpiece. Therefore, compared with the case where the injection nozzle is provided over the entire end portion of the workpiece, the injection nozzle can be reduced to reduce the apparatus cost, and it is easier to secure the installation place of the injection nozzle. Further, the boring device is provided with four injection nozzles 112 so as to surround the outer circumference of the grindstone 61. Since each of the injection nozzles 112 is disposed at a position opposite to the rotation axis of the grindstone 61, the structure is simple and can be reduced. The cost of the device is easy to ensure the installation place of the spray nozzle. Further, according to the boring device, the boring liquid can be ejected from the appropriate injection nozzle 1 1 2 in accordance with the long side and the short side of the workpiece W, so that the boring operation can be surely performed, and since the corner portion of the workpiece W is The two injection nozzles 112 spray the blasting liquid, and the liquid can be surely supplied and boring the workpiece in this portion. Further, since the injection nozzles 1 1 2 that simultaneously perform the injection are controlled by the control means 15 Within a range, the boring operation can be performed reliably using a small amount of liquid. In addition, the fluid supply ratio/pressure ratio of the individual fluids (crushing liquid and air) of each two-fluid nozzle, the supply ratio of the mixed fluid, the supply pressure, etc., correspond to the number of revolutions of the grindstone, The conditions of the grindstone type, the abrasive grain size, and the like are appropriately set, and the boring method according to the present embodiment is 0. 2mm~3. In the boring of 0 mm thin plate glass, high-efficiency boring can be performed with an end face grinding amount of 2 Ομηη or less. Compared with the case of using a general boring method, a boring speed improvement effect of about 5 times to 10 times can be obtained. Further, the boring device 本 of the present embodiment is a boring device that performs boring of the end face of the thin plate glass (W), and the data (S1) of the thin glass model Wm is attached (stored) in advance, and the reference obtained by the camera 23 is used. The photographing data of the pins 71, 71 calculates the machine origin C of the processing table 30 (S4). Then, based on the photographing data of the thin plate glass (actual workpiece Wi) obtained by the camera 23, the center of gravity position P (S5) of the thin plate glass (actual workpiece Wi) is obtained, and the machine origin C of the processing table 30 and the thin plate glass (W) are obtained. When the center of gravity P is compared, the offset amount of the thin glass (the offset amount X in the vertical direction, the shift amount Y in the lateral direction, and the shift amount 旋转 in the rotational direction) is calculated (S7), and the offset is calculated. The amount of the boring path (S8) causes the boring spindle 31 to operate based on the calculated boring path (S9). Therefore, even if the "marked mark (mark)" or the like is not formed in the thin plate glass (W) itself, the "machine origin C" can be obtained by the reference pins 71, 71 provided on the processing table 30, and the thin plate glass can be grasped ( The offset amount (X, Y ' Θ ) of W) can be accurately boring even with a thin plate glass (W) in which no mark (mark) is formed by the offset amount. In the boring device for the end face grinding of the sheet glass (W) for the display screen of the portable terminal such as a mobile phone, the boring processing is performed by using the photographing data of the camera 23 of -33-201219157. High-precision machining is performed, and boring can be performed even if no mark or the like is provided on the surface of the thin glass (W). Further, in the present embodiment, the machine origin is obtained by using a plurality of reference pins 71 and 71. In addition, the machine origin can be obtained by using the locally protruding reference protrusion, and the local coloring reference can also be used. The department finds the mechanical origin. Further, in the present embodiment, the center of gravity P of the thin plate glass (W) and the center of gravity Pm of the model Wm are compared, and the thin plate glass (W) and the model Wm are compared to calculate the cutting of the boring spindle 3 1 . The amount Δνν. In other words, it is determined how much the sheet glass (W) is larger than the model Wm (for example, the difference between the length direction and the width direction is measured, and the magnitude of the "difference"), and the amount of cut Aw is changed in accordance with the size. Therefore, the amount of cut-in Δχν of the thin plate glass (W) can be changed depending on the workpiece, and the thin plate glass (W) can be processed in a more correct shape and size. In this way, the amount of cutting Aw of the thin glass which is changed depending on the workpiece can be more accurately grasped to perform the boring operation, so that the processing of the plurality of thin glass can be performed with high precision. Further, in the present embodiment, the gravity center position P of the outer shape Wa of the thin glass and the gravity center position Q of the shape of the hole portion Wb are obtained, and the center of gravity of the workpiece Wi is calculated. By calculating the gravity center position P of the outer shape Wa of the thin plate glass (W) and the gravity center position Q of the shape of the hole portion Wb of the thin plate glass, even the thin glass having the hole portion can be surely shaped according to the shape of the model Wm. In the case of the thin glass (W) having a complicated shape of the hole portion Wb, the boring path can be accurately calculated and the boring with high precision can be performed. Further, in the present embodiment, the reference pins 7 1, 7 1 are provided on both sides of the thin glass (W). Thus, the mechanical origin C formed on the connecting line L of the at least two reference pins 71, 7 1 can be formed at a position close to the center of gravity P of the thin plate glass (W). Therefore, the offset amount of the thin glass (W) can be calculated more accurately. In other words, by making the machine origin C close to the center of gravity position p' of the thin plate glass (W), the error at the time of calculation of the offset amount can be reduced, and the correct offset amount can be calculated. Therefore, it is possible to perform boring processing with higher precision. Further, in the present embodiment, the tip end portion 71a of the reference pin 71 is set to be the same as the height of the upper surface 70a of the suction stage 70 (hp = hs) 'to the distance from the camera 23, and the thin plate glass (W) is The distance of the camera 23 is substantially the same. As described above, since the position of the photographed point (front end portion 71a) of the reference pin 71 and the position of the sheet glass (W) in the height direction substantially coincide, the focus of the camera 23 can be surely aligned. Thus, the reference pin 7 1 and the thin plate glass (W) can be photographed at the same time, and the offset amount of the thin plate glass (W) can be more accurately calculated. The present invention is not limited to the above embodiment, but includes an embodiment that can be applied to all boring devices. The boring device of the present embodiment is a thin plate glass used for a mobile phone-35-201219157 as a workpiece W, and may be, for example, a thin plate glass for a portable audio device, or a portable game machine. Sheet glass. Furthermore, thin glass for portable navigation machines, thin glass for portable televisions, and the like can also be used. Further, in the above-described embodiment, since the four injection nozzles 112 are provided, the end portions of the substantially square sides can be surely supplied with liquid and boring by the respective injection nozzles 112, and the number of nozzles is sprayed in the present invention. Not limited to four. For example, as shown in Fig. 18, eight injection nozzles 1 2 can be provided. In the boring apparatus shown in Fig. 18, eight injection nozzles 112 are disposed at equal angular intervals, specifically, at positions spaced apart from each other by 45 degrees. Further, the six injection nozzles may be disposed at positions spaced apart from each other by 60 degrees (equal angular interval). In the boring apparatus shown in Fig. 18, the boring of the long side and the short side of the workpiece W is performed by jetting the blasting liquid from one injection nozzle 1 1 2 in the same manner as in the above embodiment. In the boring of the portion, the blasting liquid can be sprayed only from the injection nozzles 1 1 2 disposed between the injection nozzles 1 1 2 used for the boring of the long side and the short side. Further, even in the case where four injection nozzles 11 2 are provided, it is not limited to those shown in the above-described embodiments (Fig. 16) and 17th. For example, as shown in Fig. 9, the injection nozzle can be used. 1 1 2 is disposed at a position where the imaginary line connecting the pair of opposing spray nozzles 1 1 2 and the side (long side) of the workpiece W are at a predetermined angle. Here, the predetermined angle means that the position at which the boring of the workpiece w can be surely supplied to the boring liquid is, for example, 3 〇. Further, the method of controlling the plurality of injection nozzles 1 1 2 is not limited to the above embodiment, and an appropriate design change of '8 - 36 - 201219157 can be performed within the scope of the present invention. For example, it is also possible to control the squeegee attached to the surface from the injection nozzle 1 1 2 located on the front side in the direction of rotation of the boring machine to nip the injection nozzle 1 1 2 on the front side in the rotation direction. . In this case, the blasting liquid of the injection nozzle 1 1 2 on the rotary side and the injection nozzle 1 1 2 on the rear side with respect to the boring processing position (for example, the blasting liquid injection nozzle having the cooling function is sprayed, The boring fluid with the cleaning function is sprayed from the front nozzle). However, when the diameter of the grindstone is small, the two kinds of 硏 interfere with each other to affect the function, so it is preferable to use only the above two kinds of boring solutions in the diameter of the grindstone. Further, in the above embodiment, a description will be given of a two-fluid nozzle of the injection nozzle. For example, a supersonic wave, which is a liquid in which ultrasonic vibration is superimposed and superimposed by an ultrasonic oscillator, can be used. By using an ultrasonic superimposed nozzle, the jetted water flow from the boring surface of the nozzle grindstone and the workpiece is used as a supersonic energy to impart the force of the ultrasonic vibration acceleration transmitted by the boring fluid to the attachment of the grindstone boring surface. Therefore, according to the ultrasonic superimposed nozzle, the air layer of the attached object is vibrated, and the wedge point effect is generated by the effective contact point of the boring liquid by the vibration, and the replacement effect is obtained by the wedge effect. . Set the grinding stone, so, by grinding stone. In the case of the front side of the boring and turning direction, the jetting liquid from the side of the spray side on the rear side may be different from each other, and the liquid is sprayed toward the object using the wave-overlapping nozzle. , the air layer between the strong vibrations generated and the space between the abrasive grains permeated to the periphery for sweeping out -37- 201219157 Therefore, an ultrasonic oscillator must be provided near the nozzle, and the water from the nozzle flows to the object Since there is no interruption between the installation method (the storage volume of the ultrasonic oscillator, the distance from the object, etc.) and the operation, there is a limit, and the burden of the device including the ultrasonic oscillation device increases, and these disadvantages exist. Further, in the above-described embodiment, only the end surface processing of the outer shape of the workpiece and the end surface processing of the inner shape of the hole portion of the workpiece will be described. However, the apparatus of the above-described embodiment is used as a boring tool for drilling a drill using a drill. Machining is also possible. In the case of drilling, the boring position where the boring fluid is required is located inside the workpiece. Although the direct effect of the two-fluid nozzle cannot be obtained in the boring process, it can be used to remove the clogging of the drill after drilling, and the cleaning effect of the two-fluid nozzle can be exhibited. The shavings may adhere to the surface of the workpiece to cause a decrease in quality. By always supplying the boring liquid having the effect of the two-fluid nozzle to the surface near the processing, the swarf cuttings can be quickly removed, and the surface quality can be maintained. In addition, the impact force of the two fluids can cause the main body of the drill to generate minute vibrations. Although the amount of vibration and the number of vibrations are not very high, the same effects as those of the supersonic overlapping nozzles can be obtained, and a certain effect can be expected. In the above-described embodiment, the boring operation is described in the case where the grinding stone 61 is moved in the longitudinal direction of the workpiece W and the workpiece W is moved in the short-side direction of the workpiece W. And the boring method, as long as the workpiece w and the grindstone 61 are relatively moved in the plane direction of the workpiece W, for example, the grindstone is not only in the longitudinal direction of the workpiece In addition, the entire structure of the boring device is also limited to the present embodiment. For example, it can be applied to only one of the processing units, or it can be set. There are five or six more processing units. Further, the boring tool 6 is not limited to those described in the embodiment, and may be, for example, a ball type boring tool or a disk type. The boring tool or the conical boring tool. The grinding stone material is not limited to the diamond. As described above, the boring device, the boring method, and the method of manufacturing the thin plate member of the present invention, Since the jet nozzle can reliably cause the liquid to reach the boring position of the grindstone and perform the boring of the workpiece, the end surface of the thin plate-shaped workpiece can be boring reliably and safely. Fig. 1 is a plan view showing an embodiment of a boring device of the present invention. Figure 2 is a front view of the boring device of Figure 1. Figure 3 is a side view of the boring apparatus of Figure 1. Fig. 4 is a three-side view of the transport robot of the boring apparatus of Fig. 1, (a) is a front view, (b) is a side view, and (c) is a plan view. Fig. 5 is an explanatory view showing an operation when the transport robot of the boring apparatus of Fig. 1 performs the conveyance, (a) shows the state from the reference state to the workpiece holding start state, and (b) shows the state from the workpiece holding start state to the processing table. The workpiece handling state. -39- 201219157 Fig. 6 is an explanatory view showing the operation of the transport robot of the boring apparatus of Fig. 1 when the transport robot performs the transport, and (c) shows the transport state from the workpiece to the processing table to the camera photographing state, and (d) shows the display from The photographing state of the camera to the start holding state of the next workpiece" Fig. 7 is a plan view of the second processing unit of the boring device of Fig. 1. Fig. 8 is a front cross-sectional view showing a second processing unit of the boring apparatus of Fig. 1; Fig. 9 is a side elevational view, partly in section, of the second processing unit of the boring apparatus of Fig. 1. Fig. 10 is a detailed side view showing a part of the cross section when the large-diameter boring tool is used in the boring apparatus of Fig. 1. Fig. 1 is a detailed side view showing a part of the cross section when the boring apparatus of Fig. 1 uses a small-diameter boring tool. Fig. 12 is a flow chart showing the control method of the boring device of Fig. 1. Fig. 13 is a side view showing a state in which the processing table is photographed by the camera of the boring device of Fig. 1. Fig. 14 (a) to (d) are explanatory views for explaining processing and calculation methods of data captured by the boring device of Fig. 1. Fig. 15 is a schematic plan view showing the injection nozzle unit of the boring device of Fig. 1. Fig. 16 (a) to (d) are schematic plan views showing the workpiece boring state of the boring device of Fig. 1. Fig. 17 (a) to (d) are schematic plan views showing the state of the workpiece boring in the other embodiment of the boring device of the present invention. 8 - 40 - 201219157 The first 8 (a) to (c) are schematic plan views showing the workpiece boring state of the other embodiment of the boring device of the present invention. The nineteenth (a) to (d) drawings show schematic plan views of the workpiece boring state of the other embodiment of the boring device of the present invention. [Description of main component symbols] Μ : boring device W : Workpiece (thin plate glass, workpiece)

Wi :未加工的工件 Wo:加工完畢的工件 Wm :工件模型 1 5 :電子控制單元(控制手段) 23 :攝影機 3 0 :加工台 3 1 :硏削主軸 3 3 :加工載台(載台) 6 1,1 6 1 :加工部(磨石) 71 :基準銷 1〇〇 :磨石軸承構件 1 1 0 :噴射噴嘴單元 112(112a〜112d):噴射噴嘴 C :機械原點 P =工件外形的重心位置 Q :孔部形狀的重心位置 -41 -Wi : Unmachined workpiece Wo: Machined workpiece Wm : Workpiece model 1 5 : Electronic control unit (control means) 23 : Camera 3 0 : Processing table 3 1 : Boring spindle 3 3 : Processing stage (stage) 6 1,1 6 1 :Machining section (grinding stone) 71 : Reference pin 1〇〇: Grindstone bearing member 1 1 0 : Injection nozzle unit 112 (112a to 112d): Injection nozzle C: Mechanical origin P = Workpiece profile Center of gravity position Q: Center of gravity position of the hole shape -41 -

Claims (1)

201219157 七、申請專利範圍: 1. 一種硏削裝置,係具備: 載置薄板狀的被加工物之載台、 在外周具有可硏削被加工物的端面之硏削面且能旋轉 之磨石、 爲了藉由該硏削面硏削被加工物的端面而讓磨石及被 加工物進行相對移動之移動手段、 以大致等角度間隔配設於磨石的周圍而對硏削面噴射 微粒子化的液體之複數個噴射噴嘴、以及 將上述複數個噴射噴嘴的噴射控制成以接觸上述被加 工物之磨石的硏削加工位置爲基準而朝向磨石的旋轉方向 後方噴射液體之控制手段。 2. 如申請專利範圍第1項所述之硏削裝置,其中, 上述噴射噴嘴是將液體和氣體混合噴射之二流體噴嘴 〇 3 .如申請專利範圍第1項所述之硏削裝置,其中, 上述噴射噴嘴的噴射中心軸設置成沿著磨石外周的切 線方向。 4·如申請專利範圍第1項所述之硏削裝置,其中, 上述噴射噴嘴的噴射中心軸設置成與磨石的旋轉軸大 致交叉。 5 .如申請專利範圍第1項所述之硏削裝置,其中, 上述控制手段是控制成,在硏削作業時,當上述硏削 加工位置和磨石旋轉軸的相對位置改變時,切換進行噴射201219157 VII. Patent application scope: 1. A boring device comprising: a stage on which a sheet-like workpiece is placed, and a honing surface on the outer circumference which can boring the end surface of the workpiece and which can be rotated, In order to boring the end surface of the workpiece by the boring surface, a moving means for relatively moving the grindstone and the workpiece is disposed at approximately equiangular intervals around the grindstone to eject the micronized liquid to the boring surface. The plurality of injection nozzles and the control means for controlling the injection of the plurality of injection nozzles to inject the liquid toward the rear side in the rotation direction of the grindstone based on the boring processing position of the grindstone contacting the workpiece. 2. The boring device according to claim 1, wherein the blasting nozzle is a two-fluid nozzle that mixes a liquid and a gas, and the boring device according to claim 1, wherein The injection center axis of the injection nozzle is disposed along a tangential direction of the outer circumference of the grindstone. 4. The boring apparatus according to claim 1, wherein the injection center axis of the injection nozzle is disposed to substantially intersect the rotation axis of the grindstone. 5. The boring apparatus according to claim 1, wherein the control means is controlled to switch between the boring processing position and the relative position of the grinding stone rotating shaft during the boring operation. injection -42- 201219157 的噴射噴嘴。 6.如申請專利範圍第5項所述之硏削裝置,其中, 進一步具備:將上述磨石的旋轉軸可旋轉地予以軸支 承之磨石軸承構件、以及固定於該磨石軸承構件之噴嘴架 J 且將上述複數個噴射噴嘴安裝於噴嘴架。 7·如申請專利範圍第5項所述之硏削裝置,其中, 上述控制手段控制成使同時噴射的噴射噴嘴爲兩個以 內。 8.如申請專利範圍第5項所述之硏削裝置,其中, 上述控制手段是控制成,當磨石相對於被加工物朝一 方向進行相對移動時從一個噴射噴嘴噴射液體,在該噴射 後當磨石相對於被加工物朝與上述一方向交叉之其他方向 進行相對移動時從其他的噴射噴嘴噴射液體,在從上述一 方向的相對移動切換至上述其他方向的相對移動的期間, 從上述一個噴射噴嘴及其他的噴射噴嘴雙方噴射液體。 9- 一種硏削方法,是在藉由噴射噴嘴對磨石噴射液 體的狀態下,將薄板狀被加工物的端面藉由磨石進行硏削 之硏削方法,係具有硏削步驟及液體噴射步驟; 該硏削步驟,是讓上述磨石以與被加工物的平面大致 垂直的旋轉軸爲中心進行旋轉,並使上述磨石和噴射噴嘴 一起相對於被加工物進行相對移動,而將被加工物的端面 進行硏削; 該液體噴射步驟,是在進行上述硏削步驟時,以與上 -43- 201219157 述被加工物接觸之磨石的硏削加工位置爲基準,當與磨石 的旋轉軸之相對位置改變時,對比磨石的硏削加工位置更 靠旋轉方向後方噴射微粒子化的液體。 10. 一種薄板狀構件之製造方法,其特徵在於,係具 備藉由如申請專利範圍第9項所述之硏削方法將端面硏削 的步驟。 ⑧ -44--42- 201219157 spray nozzle. 6. The boring apparatus according to claim 5, further comprising: a grindstone bearing member that rotatably supports a rotating shaft of the grindstone, and a nozzle fixed to the grindstone bearing member The rack J is mounted to the nozzle holder by the plurality of spray nozzles. The boring apparatus according to claim 5, wherein the control means is controlled such that the injection nozzles simultaneously ejected are within two. 8. The boring apparatus according to claim 5, wherein the control means is controlled to eject a liquid from an injection nozzle when the grindstone relatively moves in a direction with respect to the workpiece, after the jetting When the grindstone moves relative to the workpiece in the other direction intersecting with the one direction, the liquid is ejected from the other jet nozzles, and the relative movement from the one direction to the relative movement in the other direction is from the above. A jet nozzle and other spray nozzles eject liquid. 9- A boring method is a boring method in which an end face of a thin plate-shaped workpiece is honed by a grindstone in a state in which a liquid is ejected by a spray nozzle, and has a boring step and a liquid jet The boring step is such that the grindstone rotates around a rotation axis substantially perpendicular to a plane of the workpiece, and the grindstone and the spray nozzle are relatively moved with respect to the workpiece, and are processed. The end face of the object is boring; the liquid ejecting step is based on the boring position of the grindstone in contact with the workpiece described in the above-mentioned -43-201219157 when the boring step is performed, and the rotation with the grindstone When the relative position of the shaft is changed, the boring processing position of the grindstone is further injected with the micronized liquid behind the rotating direction. A method of producing a thin plate-like member, characterized in that the step of boring the end face by the boring method as described in claim 9 of the patent application is provided. 8 -44-
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