TWM569672U - Chamfer grinding device - Google Patents

Chamfer grinding device Download PDF

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Publication number
TWM569672U
TWM569672U TW106215274U TW106215274U TWM569672U TW M569672 U TWM569672 U TW M569672U TW 106215274 U TW106215274 U TW 106215274U TW 106215274 U TW106215274 U TW 106215274U TW M569672 U TWM569672 U TW M569672U
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Taiwan
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vermiculite
substrate
grinding
lower side
upper side
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TW106215274U
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Chinese (zh)
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白井明
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白井科技股份有限公司
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Publication of TWM569672U publication Critical patent/TWM569672U/en

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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

本創作提供一種倒角研磨裝置,在研磨基板邊緣的兩板面兩角之餘,能對研磨部位噴射冷卻水及洗滌用水的同時,將噴射水及霧氣或玻璃屑淤泥回收至蓋體內部。本創作採用如下構成,吸附保持基板a之工作台A,突出部5相互咬合地研磨基板a邊緣的上下板面的兩角,並連接馬達之上側砥石3及下側砥石4,包覆上側砥石3及下側砥石4並具有開口使基板a研磨部分崁入的蓋體7;面朝開口10噴出空氣與研削用冷卻水的混合流體、洗滌用水與空氣的混合流體之上側噴嘴11及下側噴嘴12,吸收導引蓋體內部的抽吸口20,以及使工作台A或蓋體7任一進退移動之移動機構B。The present invention provides a chamfering polishing apparatus which can spray water and mist or glass sludge sludge into the inside of the cover while spraying the cooling water and the washing water to the grinding portion while grinding the two sides of the two sides of the substrate. The present invention adopts a configuration in which the table A of the substrate a is sucked and held, and the protruding portions 5 are joined to each other to grind the two corners of the upper and lower plates of the edge of the substrate a, and are connected to the upper side vermiculite 3 and the lower side vermiculite 4 to cover the upper side vermiculite. 3 and the lower side vermiculite 4 and having a lid body 7 which is opened to open the polishing portion of the substrate a; a mixed fluid for jetting air and grinding cooling water toward the opening 10, and a mixed fluid upper side nozzle 11 and lower side of the washing water and air The nozzle 12 absorbs the suction port 20 inside the guide cover body and the moving mechanism B that moves the table A or the cover body 7 forward and backward.

Description

倒角研磨裝置Chamfer grinding device

本創作是一種研磨裝置,其係對玻璃基板、陶瓷板等基板邊緣之板面兩側的邊緣,進行倒角加工。The present invention is a polishing apparatus which performs chamfering processing on edges of both sides of a board surface of a substrate such as a glass substrate or a ceramic board.

習知技術中,有藉由磨輪(複數砥石),將板材端面的兩板面兩角進行倒角研削加工的方式(參專利文獻1)。In the prior art, there is a method in which the two corners of the end faces of the plate surface are chamfered by a grinding wheel (plural gangue) (refer to Patent Document 1).

專利文獻1:日本專利公開案第2007-223027號公報。Patent Document 1: Japanese Patent Laid-Open Publication No. 2007-223027.

[新型所欲解決之課題] 然而,基於先前技術1之研削加工的方式,將板材的端面兩角接觸於磨輪的周邊以進行倒角加工。[New Problem to be Solved] However, according to the grinding method of the prior art 1, the two corners of the end face of the plate are brought into contact with the periphery of the grinding wheel to perform chamfering.

這種方式由於沒有回收伴隨研削時飛散的汙泥或玻璃屑之手段,其汙泥或玻璃屑將附著於板材的板面,從而衍生出,在下個工程中必須將汙泥或玻璃屑進行除去的問題。In this way, since sludge or glass slag which is scattered with the grinding is not recovered, the sludge or glass swarf will adhere to the surface of the sheet, and thus the sludge or glass cullet must be removed in the next project. The problem.

此外,有時會發生伴隨研削時溫度升高導致之研削部燒焦的問題。In addition, there is a problem that the grinding portion is burnt due to an increase in temperature at the time of grinding.

且伴隨上述問題,板材的板面亦變得汙濁,為消除汙濁產生的不便,從而衍生出在下個工程中必須進行洗滌作業的問題。In addition to the above problems, the surface of the sheet material becomes dirty, which is inconvenient to eliminate the stain, thereby deriving the problem that the washing operation must be performed in the next project.

綜上所述,本創作提供了解決上述問題的研磨裝置。In summary, the present invention provides a grinding apparatus that solves the above problems.

為解決上述課題,本創作採用了以下構成:工作台,具吸附功能,以保持載置於其上方的基板;櫛齒狀的上側砥石及下側砥石,其突出部相互咬合地上下配置,以對該工作台前緣突出之該基板邊緣的上下板面的板角進行研磨;第一及第二馬達,連接該上側砥石及該下側砥石中心之驅動軸;蓋體,包覆該上側砥石及該下側砥石,且具有嵌入該基板的部分研磨邊緣之開口;上側噴嘴及下側噴嘴,自工作台突出之該基板邊緣的上下表面,朝該開口噴出空氣、研削用冷卻水的混合流體及洗滌用水、空氣的混合流體;抽吸口,吸收導引該蓋體內部;以及移動機構,設置為該工作台或該蓋體之任一,左右方向地進退行走。In order to solve the above problems, the present invention adopts a configuration in which a work table has an adsorption function to hold a substrate placed thereon, and a meandering vermiculite and a lower side vermiculite, the protruding portions of which are vertically engaged with each other to Grinding a plate angle of the upper and lower plate faces of the edge of the substrate protruding from the front edge of the table; first and second motors connecting the upper side vermiculite and the driving shaft of the lower side vermiculite; and a cover body covering the upper side vermiculite And the lower side vermiculite having an opening embedded in a portion of the polishing edge of the substrate; the upper nozzle and the lower nozzle, the upper and lower surfaces of the substrate edge protruding from the table, and the mixed fluid for jetting air and grinding cooling water toward the opening And a mixed fluid for washing water and air; a suction port for absorbing and guiding the inside of the cover; and a moving mechanism provided as any one of the work table or the cover body to advance and retreat in the left-right direction.

[新型之效果]如上所示,本創作的研磨裝置,將載置於工作台上方受吸附保持之基板的研磨邊緣自開口崁入蓋體內部,在這個狀況下,能使工作台隨基板藉由移動機構移動(亦可取代工作台,使上側砥石及下側砥石隨蓋體移動)。[New effect] As shown above, the polishing apparatus of the present invention inserts the polishing edge of the substrate held by the substrate held on the table from the opening into the inside of the cover. In this case, the table can be borrowed from the substrate. Moved by the moving mechanism (can also replace the workbench, so that the upper side vermiculite and the lower side meteorite move with the cover).

伴隨此移動,將空氣與供給冷卻水的混合流體、洗滌用水與空氣的混合流體,自上側噴嘴噴射至基板的上面,且自下側噴嘴噴射至基板的下面,同時,將上側砥石及下側砥石相互咬合之研磨突出部,分別接觸上角及下角,如此研磨邊緣的上角及下角,即可同時為兩角進行倒角研磨。With this movement, the mixed fluid of the air and the cooling water, the mixed fluid of the washing water and the air are sprayed from the upper nozzle onto the upper surface of the substrate, and are ejected from the lower nozzle to the lower surface of the substrate, while the upper side vermiculite and the lower side are simultaneously The grinding protrusions that the meteorites bite to each other contact the upper and lower corners respectively, so that the upper and lower corners of the edge are ground, and the chamfering of the two corners can be simultaneously performed.

換句話說,達到了防止伴隨上下砥石研磨之際產生的燒焦、或研磨時達到研磨效率及研削速度的提升,並具有除去附著於研削部位之汙泥等效果的,亦能引出砥石使用的極限、減少打磨次數,並藉由蓋體內的吸力以避免水或汙泥的向外飛散以進行回收。In other words, it is possible to prevent the scorching caused by the grinding of the upper and lower vermiculite, or to improve the polishing efficiency and the grinding speed during polishing, and to remove the sludge adhering to the grinding portion, and to extract the use of the vermiculite. Limit, reduce the number of grindings, and avoid the water or sludge from scattering by the suction inside the cover to recover.

接著,藉由噴出洗滌水及空氣,免除基板面汙穢導致之不便,同時藉由蓋體內的吸力,對於蓋體內抽吸回收噴射出的洗滌水或汙水,從而避免汙水向外部飛散的困擾。Then, by spraying the washing water and the air, the inconvenience caused by the contamination of the substrate surface is eliminated, and the washing water or the sewage sprayed and recovered by the suction in the cover body is absorbed by the suction force in the cover body, thereby avoiding the problem that the sewage is scattered to the outside. .

藉由上述效果,可避免在伴隨研削而飛散到外部後之研削後的檢查(由相機判讀)中,因碎屑等的檢查錯誤而產生之不良品判斷的缺失。其原因是因抽吸蓋體內而無殘留水滴,換句話說,是因為設置有兩道流體噴嘴及包覆上下砥石的具抽吸功能之蓋體。According to the above-described effects, it is possible to avoid the lack of judgment of defective products due to an inspection error such as debris in the inspection after the grinding (the camera interpretation) after scattering to the outside with the grinding. The reason for this is that there is no residual water droplets in the suction cap body, in other words, because two fluid nozzles and a capping body covering the upper and lower vermiculite are provided.

此時,研磨(研削)產生之混合流體的霧氣及混入霧氣的玻璃屑也自開口向蓋體流入,且由於被洗滌用水、空氣的混合流體來沖洗,並由蓋體內部施加吸力朝抽吸口流動,而回收了蓋體內部的霧氣及玻璃屑,從而簡化了因飛散而附著於開口外側之基板板面的不便,亦即,簡化了汙穢或研磨後的附著物洗滌除去等作業。At this time, the mist of the mixed fluid generated by the grinding (grinding) and the glass frit mixed with the mist also flow from the opening to the lid, and are flushed by the mixed fluid of the washing water and the air, and suction is applied from the inside of the lid to the suction. When the mouth flows, the mist and the glass swarf inside the lid are recovered, which simplifies the inconvenience of adhering to the substrate surface on the outside of the opening due to scattering, that is, simplifies the work such as contamination or removal of the deposit after polishing.

以下,將基於圖示進行本創作的實施態樣說明。本創作的實施態樣,如圖一至圖四所示,工作台A具有吸附保持功能,保持其上方載置玻璃基板、陶瓷板等基板。Hereinafter, an embodiment of the present creation will be described based on the drawings. In the embodiment of the present invention, as shown in FIG. 1 to FIG. 4, the table A has an adsorption holding function, and a substrate such as a glass substrate or a ceramic plate is placed thereon.

此工作台A,如圖一所示,係由中空箱體1與其下方設置之抽吸口之吸引管(圖示省略)連接以對箱體1內部施加吸力,並由設置於箱體1的頂壁之小孔2的群組,來保持箱體1上方之基板a。As shown in FIG. 1 , the table A is connected by a suction tube (not shown) of the suction box provided under the hollow box 1 to apply suction force to the inside of the box 1 and is disposed on the box 1 . A group of small holes 2 in the top wall to hold the substrate a above the casing 1.

維持於工作台A上方之基板a的研磨邊緣,係自工作台A的邊緣向前突出。The polished edge of the substrate a maintained above the table A protrudes forward from the edge of the table A.

此外,工作台A的前方設置有圓形狀的上側砥石3及下側砥石4,其分別對基板a邊緣的上下緣進行研磨(研削)以倒角加工。Further, a circular upper side vermiculite 3 and a lower side vermiculite 4 are provided in front of the table A, and the upper and lower edges of the edge of the substrate a are respectively ground (grinded) by chamfering.

上述上側砥石3及下側砥石4,如圖二、圖三及圖四所示,係研磨基板a上下板面的上下兩角之研磨用環狀的突出部5,呈現相互咬合(崁入)、並以櫛齒狀並列設置(所謂並列,依圖二及圖三所示,上側砥石3設置兩個突出部5、下側砥石4則設置一個突出部5,但不以此為限,在並列突出的時候,形成突出部5之圓板狀的砥石之間有間隔物6介入,以形成前述櫛齒狀)。As shown in FIG. 2, FIG. 3 and FIG. 4, the upper side vermiculite 3 and the lower side vermiculite 4 are polishing the annular protruding portions 5 for polishing the upper and lower corners of the upper and lower plates of the substrate a, and are engaged with each other (intrusion). And arranged in a zigzag shape (so-called parallel, as shown in FIG. 2 and FIG. 3, the upper side vermiculite 3 is provided with two protruding portions 5, and the lower side vermiculite 4 is provided with one protruding portion 5, but not limited thereto, When juxtaposed, the spacers 6 are interposed between the disc-shaped vermiculite forming the protruding portion 5 to form the aforementioned serration.

上述上側砥石3及下側砥石係裝設於蓋體7內而軸承,且上側砥石3及下側砥石4的中心連接有第一馬達8及第二馬達9的驅動軸21,藉此上側砥石3由安裝於蓋體7的第一馬達8於圖一中逆時鐘方向旋轉,而下側砥石4由安裝於蓋體7的第二馬達9於圖一中順時鐘方向旋轉。The upper side vermiculite 3 and the lower side vermiculite are mounted in the lid body 7 to be bearings, and the drive shaft 21 of the first motor 8 and the second motor 9 is connected to the center of the upper side vermiculite 3 and the lower side vermiculite 4, whereby the upper side vermiculite 3, the first motor 8 attached to the cover body 7 rotates in the counterclockwise direction in Fig. 1, and the lower side vermiculite 4 is rotated in the clockwise direction in Fig. 1 by the second motor 9 attached to the cover body 7.

蓋體7之工作台A的前緣及其相對位置,設置有崁入基板a研磨前緣的開口10,藉此由上側砥石3及下側砥石4的兩突出部5,對自開口10插入之邊緣的上下兩板面的角進行研磨。 The front edge of the table A of the cover 7 and its relative position are provided with an opening 10 that breaks into the polishing front edge of the substrate a, whereby the two protrusions 5 of the upper side vermiculite 3 and the lower side vermiculite 4 are inserted into the opening 10 The corners of the upper and lower plates of the edge are ground.

此外,設置有設於蓋體7之上側噴嘴11及下側噴嘴12,藉此自開口10對上述上側砥石3及下側砥石4的外圍,亦即對由突出部5研磨(研削)之基板a邊緣的上側板面及下側板面,噴射後述之混和壓送流體。 Further, a nozzle 11 and a lower nozzle 12 provided on the upper side of the lid body 7 are provided, and the outer periphery of the upper side vermiculite 3 and the lower side vermiculite 4, that is, the substrate polished (grinded) by the protruding portion 5, is opened from the opening 10. The upper side surface and the lower side surface of the edge of a are sprayed with a mixed pressure feed fluid to be described later.

上側噴嘴11及下側噴嘴12的末端側,設置有插通中空的貯存部13。 The end side of the upper nozzle 11 and the lower nozzle 12 is provided with a storage portion 13 that is inserted into the hollow.

如圖一及圖五所示,來自連通兩條一組的第一通路14之洗滌用水,以及自第二通路15之研磨用冷卻水,個別提供給上側貯存部13及下側貯存部13,藉此:自設置於上述第一通路14及第二通路15途中之氣壓入口16的壓送空氣讓洗滌用水及研磨用冷卻水的流速更為高速化;伴隨此高速化的流出噴射大幅度減少因洗滌或研磨導致之升溫;除洗滌效率、研磨(研削)效率顯著提升外,亦可促進流入(或回收自)蓋體7。 As shown in FIG. 1 and FIG. 5, the washing water from the first passage 14 that connects the two groups and the cooling water for polishing from the second passage 15 are individually supplied to the upper storage portion 13 and the lower storage portion 13, Thereby, the pressure air supplied from the air pressure inlet 16 in the middle of the first passage 14 and the second passage 15 speeds up the flow rate of the washing water and the polishing cooling water, and the outflow injection with the high speed is greatly reduced. The temperature rises due to washing or grinding; in addition to the significant improvement in washing efficiency and grinding (grinding) efficiency, the inflow (or recycling) of the lid body 7 can also be promoted.

上述蓋體7的內部,霧氣及研磨伴隨的研磨粉粒體於沖洗同時回收,其係經由連接蓋體7底部的抽吸口20之噴管(圖示省略)來回收,從而避免基板a的汙穢或殘留於板面的玻璃屑等諸多不便。當然,亦可藉由自上側噴嘴11及下側噴嘴12噴出之流體,來洗滌上側砥石3及下側砥石4。 In the inside of the lid body 7, the mist and the polishing powder accompanying the polishing are collected at the same time as the rinsing, and are recovered by a nozzle (not shown) that connects the suction port 20 at the bottom of the lid body 7, thereby avoiding the substrate a. A lot of inconvenience such as stains or glass shards remaining on the board surface. Of course, the upper side vermiculite 3 and the lower side vermiculite 4 may be washed by the fluid ejected from the upper nozzle 11 and the lower nozzle 12.

上述兩條一組的第一通路14及第二通路15,如圖五所示,由於上側砥石3的突出部5具有兩個故左右兩組並列設置,而下側砥石4的突出部5僅具有一個故設置一組,各突出部5以洗滌用水或冷卻用冷卻水來充分地洗遍,但不以此為限,亦可由上側噴嘴11及下側噴嘴12的噴射範圍,來達到良好的洗淨範圍。 As shown in FIG. 5, the first passage 14 and the second passage 15 of the two sets of the above two groups have two protrusions 5 of the upper side vermiculite 3, so that the left and right two sets are juxtaposed, and the protrusions 5 of the lower side vermiculite 4 are only One set is provided, and each of the protrusions 5 is sufficiently washed with washing water or cooling cooling water, but not limited thereto, and the injection range of the upper nozzle 11 and the lower nozzle 12 can be used to achieve good results. Washing range.

又,工作台A或蓋體7之任一,係以進退移動機構B來左右方向地往返移動。 Further, either the table A or the lid 7 is reciprocated in the right and left direction by the advancing and retracting movement mechanism B.

上述移動機構B係設置為,如圖所示,讓工作台A移動,但不以此為限,移動機構B亦可與蓋體7下方之支撐部22替換,讓蓋體7進行移動(圖未示)。 The moving mechanism B is arranged to move the table A as shown in the figure, but not limited thereto, the moving mechanism B can also be replaced with the support portion 22 under the cover 7 to move the cover 7 (Fig. Not shown).

上述移動機構B係設置為,如圖所示,左右方向的軌道17與設置於箱體1下方之滑軌18自由地配合,並以設置於軌道17及滑軌18之滑動面的線性馬達19來進退移動,但不以此為限,亦可為其他構成的移動方式。 The moving mechanism B is provided such that, as shown in the drawing, the rails 17 in the left-right direction are freely engaged with the slide rails 18 disposed under the casing 1, and the linear motors 19 are provided on the sliding surfaces of the rails 17 and the slide rails 18 To move forward and backward, but not limited to this, it can also be used for other forms of movement.

如此一來,可藉由伴隨基板a移動之上側砥石3及下側砥石4的各突出部5,來對基板a上下面的兩角同時倒角研磨。如圖所示,支撐部22支持蓋體7,下側砥石4具有定位轉環23。 In this manner, the upper and lower corners of the substrate a can be simultaneously chamfered by moving the respective protruding portions 5 of the upper side vermiculite 3 and the lower side vermiculite 4 with the substrate a. As shown, the support portion 22 supports the cover body 7, and the lower side vermiculite 4 has a positioning swivel 23.

此外,如圖二所示,上側噴嘴11及下側噴嘴12的噴出範圍(左右方向),大於相互咬合的兩側突出部5之並列間隔,藉由這個大範圍,來達到較基板A的上下研磨(研削)範圍更為寬廣地噴出。 Further, as shown in FIG. 2, the discharge range (left-right direction) of the upper nozzle 11 and the lower nozzle 12 is larger than the parallel spacing of the side protrusions 5 which are engaged with each other, and this large range is used to achieve the upper and lower sides of the substrate A. The grinding (grinding) range is more widely sprayed.

依上述構造,藉由上策噴嘴11及下側噴嘴12噴射出的冷卻水,來防止了上側砥石3及下側砥石4於研磨(研削)之際產生的燒焦,因此,在追尋研磨效果提升的同時,亦達到了研磨速度的上升。此外,具有除去依附於研削部位的淤泥等效果的同時,激發出砥石的使用極限、減少打磨次數,並在蓋體7內部的吸力下,免於向外飛濺的水或淤泥等並完成回收。 According to the above configuration, the cooling water sprayed by the upper nozzle 11 and the lower nozzle 12 prevents the scorching of the upper vermiculite 3 and the lower vermiculite 4 during polishing (grinding), thereby improving the polishing effect. At the same time, it also achieved an increase in the grinding speed. Further, it has the effect of removing sludge adhering to the grinding portion, and the use limit of the vermiculite is accelerated, the number of times of grinding is reduced, and the water or sludge which is splashed outside is recovered under the suction force inside the lid body 7.

第一通路14之洗滌水及空氣的噴射,洗淨基板a表面的汙穢,而免除了髒污產生的不便,同時在蓋體7內部的吸力下,避免汙水向外飛濺(洗滌用水的)且可就其完成回收。 The washing of the first passage 14 and the spraying of the air wash the dirt on the surface of the substrate a, thereby avoiding the inconvenience caused by the dirt, and at the same time, under the suction inside the cover 7, the sewage is prevented from splashing outward (washing water) And it can be recycled for it.

從而,可避免在飛散到外部後,導致於研削後的檢查(由相機判讀)中,有因碎屑等的檢查錯誤而誤判為不良品的缺失。其主要原因為,在蓋體7內部的吸力下並無水滴殘留的緣故,亦及,兩種噴射流體被具有吸附功能之蓋體7抽吸。如此一來,可配合由搭載相機(圖式省略)機能的檢查來加以實行。 Therefore, it is possible to avoid the erroneous determination of the defective product due to an inspection error such as debris in the inspection after the grinding (interpretation by the camera) after scattering to the outside. The main reason for this is that no water droplets remain under the suction force inside the lid body 7, and the two types of ejection fluid are sucked by the lid body 7 having the adsorption function. In this way, it can be carried out in conjunction with an inspection performed by a camera (omitted from the drawings).

A‧‧‧工作台 A‧‧‧Workbench

a‧‧‧基板 A‧‧‧substrate

B‧‧‧移動機構 B‧‧‧Mobile agencies

1‧‧‧箱體 1‧‧‧ cabinet

2‧‧‧小孔 2‧‧‧ hole

3‧‧‧上側砥石 3‧‧‧Upper side meteorite

4‧‧‧下側砥石 4‧‧‧Lower side meteorite

5‧‧‧突出部 5‧‧‧Protruding

6‧‧‧間隔物 6‧‧‧ spacers

7‧‧‧蓋體 7‧‧‧ Cover

8‧‧‧第一馬達 8‧‧‧First motor

9‧‧‧第二馬達 9‧‧‧second motor

10‧‧‧開口 10‧‧‧ openings

11‧‧‧上側噴嘴 11‧‧‧Upper nozzle

12‧‧‧下側噴嘴 12‧‧‧ lower nozzle

13‧‧‧貯存部 13‧‧‧Storage Department

14‧‧‧第一通路 14‧‧‧First access

15‧‧‧第二通路 15‧‧‧second pathway

16‧‧‧氣壓入口 16‧‧‧Air inlet

17‧‧‧軌道 17‧‧‧ Track

18‧‧‧滑軌 18‧‧‧Slide rails

19‧‧‧線性馬達 19‧‧‧Linear motor

20‧‧‧抽吸口 20‧‧ ‧ suction port

21‧‧‧驅動軸 21‧‧‧Drive shaft

22‧‧‧支撐部 22‧‧‧Support

23‧‧‧定位轉環 23‧‧‧ Positioning swivel

圖一為呈現本創作實施態樣之部分切面側面圖。 圖二為呈現本創作實施態樣之部分切面側面圖。 圖三為呈現部分旋轉砥石的部分切面後視圖。 圖四為呈現部分噴嘴及旋轉的部分切口放大側面圖。 圖五為呈現供給混合流體的前視圖。Figure 1 is a side elevational view of a portion of the depiction of the present embodiment. Figure 2 is a side elevational view of a portion of the depiction of the present embodiment. Figure 3 is a rear elevational view of a portion of the section showing a partially rotated vermiculite. Figure 4 is an enlarged side elevational view showing a portion of the nozzle and a portion of the rotation. Figure 5 is a front view showing the supply of a mixed fluid.

Claims (1)

一種倒角研磨裝置,包含有:工作台,具吸附機能,以保持載置於該工作台上方之基板;櫛齒狀的上側砥石及下側砥石,其突出部相互咬合地上下配置於該工作台前方,以對從該工作台前緣突出之該基板邊緣的上下板面的兩角進行研磨;第一及第二馬達,具有連接該上側砥石及該下側砥石中心之驅動軸;蓋體,包覆該上側砥石及該下側砥石,且具有開口以使該基板的部分研磨邊緣嵌入於該工作台之周壁側;上側噴嘴及下側噴嘴,自從該工作台突出之該基板邊緣的上下表面,朝該開口噴出空氣與研削用冷卻水的混合流體、及洗滌用水與空氣的混合流體;抽吸口,抽吸該蓋體內部;以及移動機構,設置為使該工作台或該蓋體之任一,左右方向地進退行走。A chamfering grinding device comprising: a workbench having an adsorption function to hold a substrate placed above the workbench; a serpentine upper side vermiculite and a lower side vermiculite, wherein the protruding portions are vertically engaged with each other in the work a front side of the table for polishing the two corners of the upper and lower plate faces of the edge of the substrate protruding from the front edge of the table; the first and second motors having a drive shaft connecting the upper side vermiculite and the lower side vermiculite; the cover body Covering the upper side vermiculite and the lower side vermiculite, and having an opening such that a portion of the polished edge of the substrate is embedded on a peripheral wall side of the table; an upper side nozzle and a lower side nozzle, the upper and lower sides of the substrate protruding from the table a surface, a mixed fluid of air and grinding cooling water, and a mixed fluid of washing water and air; a suction port for sucking the inside of the cover; and a moving mechanism configured to make the table or the cover Any one of them moves forward and backward in the left and right direction.
TW106215274U 2017-04-14 2017-10-17 Chamfer grinding device TWM569672U (en)

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JP2017001694U JP3211125U (en) 2017-04-14 2017-04-14 Chamfer polishing machine
JP2017-001694 2017-04-14

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CN (1) CN207448100U (en)
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Publication number Priority date Publication date Assignee Title
CN109848810A (en) * 2018-12-24 2019-06-07 福州东旭光电科技有限公司 Glass substrate grinders
CN114952495B (en) * 2022-06-01 2024-06-14 广州福耀玻璃有限公司 Glass edging device

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