TWI436855B - A grinding device and a grinding method, and a method for manufacturing the thin plate-like member - Google Patents
A grinding device and a grinding method, and a method for manufacturing the thin plate-like member Download PDFInfo
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Description
本發明係關於磨削裝置及磨削方法以及薄板狀構件之製造方法。The present invention relates to a grinding apparatus, a grinding method, and a method of manufacturing a thin plate member.
磨削裝置,是用於進行大致方形之薄板狀的被加工物等(例如行動電話等的可攜式終端機所使用之薄板玻璃)之端面磨削。該可攜式終端機的螢幕,大多是使用薄板玻璃。這種薄板玻璃,一般是從大形的玻璃板,以大概的工件形狀切出,將所切出之玻璃板的端面藉由磨削裝置正確地磨削,而形成既定的形狀。特別是,在進行磨削時,同時也進行去角加工,以防止薄板玻璃的端面發生缺口。The grinding device is used for end face grinding of a workpiece having a substantially square thin plate shape (for example, a thin plate glass used in a portable terminal such as a mobile phone). The screen of the portable terminal is mostly made of thin glass. Such a thin plate glass is generally cut out from a large-shaped glass plate in an approximate workpiece shape, and the end surface of the cut glass plate is correctly ground by a grinding device to form a predetermined shape. In particular, when grinding is performed, chamfering is also performed at the same time to prevent the end surface of the thin glass from being chipped.
例如,專利文獻1揭示一種用來磨削薄板玻璃的端面之磨削裝置(去角裝置)。專利文獻1所記載的磨削裝置,是從薄板玻璃的上方藉由攝影機攝影薄板玻璃的端緣(外緣),算出薄板玻璃之磨削位置和磨削量,並控制磨削工具和平台(table)的動作,藉此對薄板玻璃的端面進行磨削(去角)。For example, Patent Document 1 discloses a grinding device (bevel removing device) for grinding an end face of a thin plate glass. In the grinding apparatus described in Patent Document 1, the edge (outer edge) of the thin film glass is photographed from above the thin glass, and the grinding position and the amount of grinding of the thin glass are calculated, and the grinding tool and the platform are controlled ( The action of the table) is to grind (dehorn) the end face of the thin plate glass.
如此般,藉由利用攝影機之攝影資料來磨削薄板玻璃的端面,可提昇薄板玻璃的加工精度,而能提高薄板玻璃的尺寸精度。此外,不須像仿形加工那樣準備構成樣板(master)的治具,因此可確保寬廣的加工空間,而能謀求磨削裝置的小型化。In this way, by using the photographic data of the camera to grind the end faces of the thin glass, the processing precision of the thin glass can be improved, and the dimensional accuracy of the thin glass can be improved. Further, since it is not necessary to prepare a jig that constitutes a master as in the profiling process, a wide processing space can be secured, and the size of the grinding device can be reduced.
然而,近年來,例如在行動電話等的可攜式終端機,以可攜式終端機的整面或大致整面作為顯示畫面的構造越來越多。這種可攜式終端機,大多為畫面成為觸控面板的情況,而將整面藉由薄板玻璃覆蓋之可攜式終端機越來越多。However, in recent years, for example, in portable terminals such as mobile phones, there are more and more configurations in which the entire surface or substantially the entire surface of the portable terminal is used as a display screen. Most of the portable terminals are screens that become touch panels, and more and more portable terminals are covered by thin glass.
如此般將整面都用薄板玻璃覆蓋時,由於薄板玻璃的形狀必須配合可攜式終端機的形狀,因此薄板玻璃必須配合可攜式終端機之揚聲器等的形狀,而進行複雜形狀的磨削。此外,該薄板玻璃,由於是作為可攜式終端機的外表面來使用,而有無法在玻璃表面施加凹部等的記號之限制。When the entire surface is covered with a thin glass, since the shape of the thin glass must match the shape of the portable terminal, the thin glass must be shaped to match the shape of the speaker of the portable terminal, and the complex shape is ground. . Further, since the thin glass is used as the outer surface of the portable terminal, there is a limitation that the concave portion or the like cannot be applied to the surface of the glass.
在磨削這種可攜式終端機用的薄板玻璃的情況,例如雖可考慮藉由仿形加工進行磨削的方法,但如前述般必須使用樣板的治具,而存在著加工空間增加的問題,又在進行內周加工(孔部之磨削加工)時,會有變得更麻煩的問題。In the case of grinding the thin plate glass for the portable terminal device, for example, a method of grinding by profiling may be considered. However, as described above, it is necessary to use a jig of a template, and there is an increase in processing space. The problem is that when the inner peripheral processing (grinding of the hole portion) is performed, there is a problem that it becomes more troublesome.
因此,如前述專利文獻1所示,可考慮利用攝影機之攝影資料來對薄板玻璃進行磨削。如此般利用攝影機來進行磨削,可提昇薄板玻璃之磨削精度,且能進行複雜的切削加工。Therefore, as shown in the aforementioned Patent Document 1, it is conceivable to grind the thin plate glass by using the photographic data of the camera. By using the camera to grind in this way, the grinding precision of the thin plate glass can be improved, and complicated cutting processing can be performed.
然而,依據該專利文獻1的技術,必須在薄板玻璃的表面附加「定位標記」。該技術是讀取定位標記來自動計測加工尺寸。However, according to the technique of Patent Document 1, it is necessary to attach a "positioning mark" to the surface of the thin plate glass. The technique is to read the positioning marks to automatically measure the machining size.
然而如前述般,用於可攜式終端機之薄板玻璃,由於是作為外表面而能被看見,因此無法在表面上附加凹部等的記號。於是,雖可考慮使用墨水等印刷於表面,但在磨削加工後,必須另外除去墨水等,而帶來加工步驟增加的問題。However, as described above, the thin plate glass used for the portable terminal device can be seen as an outer surface, and therefore it is impossible to attach a mark such as a concave portion to the surface. Therefore, it is conceivable to use ink or the like to print on the surface. However, after the grinding process, it is necessary to additionally remove the ink or the like, which causes a problem that the number of processing steps increases.
[專利文獻1]日本特開2007-223005號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-223005
於是,本發明的目的是為了提供一種磨削裝置,是對行動電話等的可攜式終端機之顯示畫面所使用之薄板玻璃等的被加工物進行端面磨削之磨削裝置,藉由利用攝影機之攝影資料來進行磨削加工以謀求高精度的加工,且不須在被加工物的表面設置記號等就能進行磨削加工。並提供磨削方法以及薄板狀構件之製造方法。Then, an object of the present invention is to provide a grinding device which is a grinding device for performing end surface grinding on a workpiece such as a thin plate glass used for a display screen of a portable terminal such as a mobile phone. The photographic data of the camera is subjected to grinding processing for high-precision processing, and grinding can be performed without setting a mark or the like on the surface of the workpiece. A grinding method and a method of manufacturing a thin plate member are also provided.
本發明的磨削裝置,是用來進行薄板狀被加工物之端面磨削之磨削裝置,係具備:將上述被加工物以加工狀態予以保持之加工載台(stage)、設置於上述加工載台且構成所保持的被加工物進行加工時的加工基準之基準部位、設置在與上述被加工物大致正交的位置而用來攝影上述被加工物及上述基準部位之攝影機、以及用來磨削上述被加工物的端部之磨削主軸;且具備:事先儲存被加工物的工件模型資料之記憶手段、根據上述攝影機所取得之基準部位的攝影資料來算出加工載台的機械原點之機械原點算出手段、根據上述攝影機所取得之被加工物的攝影資料來求出被加工物的重心位置之重心位置算出手段、將上述加工載台的機械原點和被加工物的重心位置作比較而運算被加工物的偏差量之偏差量運算手段、對應於該偏差量運算手段所運算出的偏差量來運算上述磨削主軸的磨削路徑之磨削路徑運算手段、以及根據該磨削路徑運算手段所運算出的磨削路徑來讓磨削主軸動作之動作控制手段。The grinding device of the present invention is a grinding device for performing end surface grinding of a sheet-like workpiece, and includes a processing stage for holding the workpiece in a processed state, and is disposed in the processing. a reference portion of a processing standard for forming a workpiece to be processed, and a camera for photographing the workpiece and the reference portion at a position substantially perpendicular to the workpiece, and used for photographing Grinding the grinding spindle of the end portion of the workpiece; and providing a memory means for storing the workpiece model data of the workpiece in advance, and calculating a mechanical origin of the processing stage based on the photographic data of the reference portion obtained by the camera The machine origin calculation means and the gravity center position calculation means for obtaining the gravity center position of the workpiece based on the image data of the workpiece obtained by the camera, the machine origin of the processing stage, and the center of gravity of the workpiece Calculating the deviation amount calculation means for calculating the deviation amount of the workpiece, and calculating the deviation amount calculated by the deviation amount calculation means The grinding path calculation means of the grinding path of the grinding spindle and the operation control means for operating the grinding spindle based on the grinding path calculated by the grinding path calculation means.
該磨削裝置,事先將工件模型的資料儲存於記憶手段,根據攝影機所取得之攝影資料來算出加工載台的機械原點和被加工物(實際工件)之重心位置,將該機械原點和重心位置作比較,藉此運算被加工物(實際工件)之偏差量(橫方向的偏差量X、縱方向的偏差量Y、旋轉方向的偏差量θ)。如此,對應於運算所求出的偏差量,運算磨削主軸之磨削路徑,根據該磨削路徑讓磨削主軸動作,而進行被加工物(實際工件)的端面磨削。The grinding device stores the data of the workpiece model in the memory means in advance, and calculates the center of gravity of the machining stage and the center of gravity of the workpiece (actual workpiece) based on the photographic data acquired by the camera, and the machine origin and By comparing the positions of the center of gravity, the amount of deviation (the amount of deviation X in the lateral direction, the amount of deviation Y in the longitudinal direction, and the amount of deviation θ in the direction of rotation) of the workpiece (actual workpiece) is calculated. In this manner, the grinding path of the grinding spindle is calculated in accordance with the amount of deviation obtained by the calculation, and the grinding spindle is operated in accordance with the grinding path to perform end surface grinding of the workpiece (actual workpiece).
因此,即使不在被加工物本身形成「構成基準之標記(記號)」等,仍能利用設置於加工載台之基準部位來求出「機械原點」,以掌握被加工物之偏差量。依據所掌握的偏差量,可對未形成標記(記號)等的被加工物進行正確地磨削。Therefore, even if the "mark (mark) of the constituents is formed in the workpiece itself, the "machine origin" can be obtained by using the reference portion provided on the processing stage to grasp the amount of deviation of the workpiece. According to the amount of deviation that is grasped, it is possible to accurately grind a workpiece that is not formed with a mark (mark).
此外,本發明的磨削方法,是將薄板狀的被加工物的端面藉由磨削主軸進行磨削之磨削方法,係具有以下步驟:將上述被加工物以加工狀態保持於加工載台之保持步驟、將設置於上述加工載台之基準部位和加工載台上所保持的被加工物藉由攝影機進行攝影之攝影步驟、根據上述攝影機所取得之基準部位的攝影資料來算出加工載台的機械原點之機械原點算出步驟、根據上述攝影機所取得之被加工物的攝影資料來求出被加工物的重心位置之重心位置算出步驟、將上述加工載台的機械原點和被加工物的重心位置作比較而運算被加工物的偏差量之偏差量運算步驟、對應於該偏差量運算步驟所運算出的偏差量來運算上述磨削主軸的磨削路徑之磨削路徑運算步驟、以及根據該磨削路徑運算步驟所運算出的磨削路徑來讓磨削主軸動作之磨削步驟。Further, the grinding method of the present invention is a grinding method in which an end surface of a thin plate-shaped workpiece is ground by a grinding spindle, and has a step of holding the workpiece in a processing state on a processing stage. a holding step of calculating a processing stage by photographing a workpiece placed on the processing stage and the workpiece held on the processing stage by a camera, and calculating a processing stage based on the image data of the reference portion obtained by the camera a machine origin calculation step of the machine origin, a gravity center position calculation step of determining a position of a center of gravity of the workpiece based on the image data of the workpiece obtained by the camera, and a machining origin of the machining stage and machining Calculating a deviation amount calculation step of calculating a deviation amount of the workpiece, and calculating a grinding path calculation step of the grinding path of the grinding spindle corresponding to the deviation amount calculated by the deviation amount calculation step, And a grinding step for operating the grinding spindle according to the grinding path calculated by the grinding path calculation step.
該磨削方法,先將工件模型的資料儲存於記憶手段,根據攝影機所取得之攝影資料來算出加工載台的機械原點和被加工物的重心位置,將該機械原點和重心位置作比較,藉此運算被加工物之偏差量。如此,對應於運算所求出的偏差量,運算磨削主軸之磨削路徑,根據該磨削路徑讓磨削主軸動作,而進行被加工物的端面磨削。因此,即使不在被加工物本身形成「構成基準之標記(記號)」等,仍能利用設置於加工載台之基準部位來求出「機械原點」,以掌握被加工物之偏差量。依據所掌握的偏差量,可對未形成標記(記號)等的被加工物進行正確地磨削。In the grinding method, the data of the workpiece model is first stored in the memory means, and the mechanical origin of the processing stage and the position of the center of gravity of the workpiece are calculated based on the photographic data obtained by the camera, and the mechanical origin and the center of gravity are compared. Thereby, the amount of deviation of the workpiece is calculated. In this manner, the grinding path of the grinding spindle is calculated in accordance with the amount of deviation obtained by the calculation, and the grinding spindle is operated in accordance with the grinding path to perform end surface grinding of the workpiece. Therefore, even if the "mark (mark) of the constituents is formed in the workpiece itself, the "machine origin" can be obtained by using the reference portion provided on the processing stage to grasp the amount of deviation of the workpiece. According to the amount of deviation that is grasped, it is possible to accurately grind a workpiece that is not formed with a mark (mark).
此外,求出機械原點之「基準部位」,可以是朝向攝影機側豎設之「基準銷」,也可以是讓加工載台的一部分突出而構成之「基準突出部」。再者,亦可為將一部分著色而構成的「基準部」。此外,該「基準部位」為了避免受到工件的影響,宜設置在不與工件重疊的位置,亦即設置在比工件的外形更外側。再者,在設有讓磨削主軸動作之「動作控制裝置」的情況,讓該動作控制裝置與「加工載台」同時動作,而讓磨削主軸和加工載台動作來進行被加工物的磨削亦可。Further, the "reference portion" of the machine origin may be obtained as a "reference pin" that is erected toward the camera side, or may be a "reference protrusion portion" that is formed by projecting a part of the processing stage. Further, it may be a "reference portion" formed by coloring a part. Further, in order to avoid the influence of the workpiece, the "reference portion" is preferably disposed at a position that does not overlap with the workpiece, that is, is disposed outside the outer shape of the workpiece. In addition, when the "motion control device" for operating the grinding spindle is provided, the motion control device and the "machining table" are simultaneously operated, and the grinding spindle and the processing stage are operated to perform the workpiece. Grinding is also possible.
在本發明較佳為,讓上述重心位置算出手段所求出之被加工物的重心位置和工件模型的重心位置一致,將被加工物和工件模型作比較,藉由削去量運算手段來運算磨削主軸之削去量。藉此,讓被加工物(實際工件)的重心位置和工件模型的重心位置一致,將被加工物(實際工件)和工件模型作比較,運算出應對被加工物(實際工件)實施的削去程度,而決定其削去量。亦即,判斷被加工物(實際工件)比工件模型大多少(例如,檢測出長度方向的差值和寬度方向的差值,該「差值」的大小),對應於該大小來改變削去量。In the present invention, it is preferable that the position of the center of gravity of the workpiece obtained by the center-of-gravity position calculating means coincides with the position of the center of gravity of the workpiece model, and the workpiece and the workpiece model are compared, and the calculation is performed by the cutting amount calculation means. The amount of grinding of the grinding spindle. In this way, the position of the center of gravity of the workpiece (actual workpiece) is aligned with the position of the center of gravity of the workpiece model, and the workpiece (actual workpiece) is compared with the workpiece model, and the shaving performed on the workpiece (actual workpiece) is calculated. Degree, and determine the amount of cutting. That is, it is determined how much the workpiece (actual workpiece) is larger than the workpiece model (for example, the difference between the length direction and the width direction is detected, and the magnitude of the "difference") is changed corresponding to the size. the amount.
因此,可依每個工件來改變被加工物的削去量,而能以更正確的形狀及尺寸進行被加工物的加工。Therefore, the amount of the workpiece to be cut can be changed for each workpiece, and the workpiece can be processed with a more correct shape and size.
如此,能更正確地掌握依每個工件而改變之被加工物的削去量來進行磨削加工,因此可對複數個被加工物進行高精度的加工。In this way, since the grinding amount can be more accurately grasped by the amount of cutting of the workpiece to be changed for each workpiece, it is possible to perform high-precision machining on a plurality of workpieces.
此外,在本發明較佳為,上述重心位置算出手段係具備:求出被加工物的外形之重心位置的外形重心算出手段、以及求出被加工物的孔部形狀之重心位置的孔部重心算出手段。藉此,即使是具有孔部的薄板玻璃,仍能確實地按照工件模型的形狀(孔部的位置等)來進行薄板玻璃的磨削。如此,即使是具有孔部等之形狀複雜的薄板玻璃,仍可正確地規定磨削位置,而高精度地進行薄板玻璃的磨削。Further, in the present invention, it is preferable that the gravity center position calculating means includes an outer gravity center calculating means for obtaining a center of gravity of the outer shape of the workpiece, and a center of gravity of the hole for determining a position of a center of gravity of the shape of the hole of the workpiece. Calculate the means. Thereby, the thin plate glass can be reliably ground in accordance with the shape of the workpiece model (the position of the hole portion, etc.) even in the thin plate glass having the hole portion. In this way, even in the case of a thin plate glass having a complicated shape such as a hole portion, the grinding position can be accurately specified, and the thin plate glass can be ground with high precision.
此外,在本發明較佳為,上述基準部位的被攝影點離攝影機的距離設定成和被加工物離攝機機的距離大致一致。如此般,藉由使基準部位的被攝影點(例如基準銷的情形是前端部)離攝影機的距離和被加工物離攝機機的距離大致一致,能讓攝影機的焦點對焦於兩者。藉此,可確實地同時攝影基準部位和被加工物,而能更正確地運算被加工物之偏差量。Further, in the invention, it is preferable that the distance between the photographed point of the reference portion and the camera is set to be substantially the same as the distance from the workpiece to the camera. In this manner, by focusing the distance between the photographed point of the reference portion (for example, the front end portion of the reference pin) and the distance from the camera to the camera, the focus of the camera can be focused on both. Thereby, the reference portion and the workpiece can be photographed at the same time, and the amount of deviation of the workpiece can be more accurately calculated.
此外,在本發明較佳為,上述基準部位至少設置在隔著被加工物之兩側位置。藉此,藉由將基準部位至少設置在薄板玻璃的兩側位置,能以至少兩個基準部位的連結線上所形成的點作為「機械原點」,藉此能以接近被加工物的重心位置之位置作為機械原點。Further, in the invention, it is preferable that the reference portion is provided at least at positions on both sides of the workpiece. Thereby, by providing at least the reference portions at the both side positions of the thin glass, the point formed on the connecting line of at least two reference portions can be used as the "mechanical origin", whereby the position of the center of gravity of the workpiece can be approached. The position is used as the mechanical origin.
因此可更正確地運算出被加工物的偏差量。亦即,由於「機械原點」接近被加工物的重心位置,可減低偏差量運算時的誤差,如此可運算出正確的偏差量。因此可進行更高精度的被加工物之磨削加工。Therefore, the amount of deviation of the workpiece can be calculated more accurately. In other words, since the "machine origin" is close to the center of gravity of the workpiece, the error in the calculation of the deviation amount can be reduced, so that the correct amount of deviation can be calculated. Therefore, it is possible to perform grinding processing of the workpiece with higher precision.
此外,在本發明較佳為,在上述加工載台可選擇性地設置:可分別保持小型的被加工物之複數個第一保持台、可保持大型的被加工物之第二保持台之任一方;將上述基準部位配置於:在設置第一保持台時比第一保持台上所保持的小型被加工物的外形更外側,在設置第二保持台時比第二保持台上所保持的大型被加工物的外形更外側。Further, in the invention, it is preferable that the processing stage is selectively provided with a plurality of first holding stages that can hold small workpieces separately, and a second holding stage that can hold large workpieces. One of the reference portions is disposed outside the outer shape of the small workpiece held on the first holding stage when the first holding stage is provided, and is held on the second holding stage when the second holding stage is provided The shape of the large workpiece is more outward.
藉此,由於能在加工載台設置複數個第一保持台,若是小型被加工物的話,可在一個加工載台上保持複數個被加工物。此外,由於能在加工載台上選擇性地設置第一保持台及第二保持台,藉由對應於被加工物的大小之保持台可適當且確實地保持被加工物。Thereby, since a plurality of first holding stages can be provided on the processing stage, if it is a small workpiece, a plurality of workpieces can be held on one processing stage. Further, since the first holding stage and the second holding stage can be selectively provided on the processing stage, the workpiece can be appropriately and surely held by the holding table corresponding to the size of the workpiece.
再者,即使將第一保持台及第二保持台之任一者設置於加工載台的情況,由於基準部位位於比被加工物的外形更外側,因此基準部位不致被被加工物遮蔽。如此,在將第一保持台及第二保持台的一方變更為另一方而設置時,不須更換如上述般位於大型及小型的被加工物外側之基準部位,而能使加工載台的構造變簡單。In addition, even if any of the first holding stage and the second holding stage is provided on the processing stage, since the reference portion is located outside the outer shape of the workpiece, the reference portion is not blocked by the workpiece. In this way, when one of the first holding stage and the second holding stage is changed to the other side, the structure of the processing stage can be replaced without replacing the reference portion located outside the large and small workpieces as described above. It becomes simple.
此外,在本發明較佳為,上述加工載台係具備分別保持被加工物之複數個保持台,上述基準部位設有複數個,該等複數個基準部位分別配置在上述複數個保持台上所保持的各被加工物的外形之外側。Further, in the invention, it is preferable that the processing stage includes a plurality of holding stages for holding the workpiece, wherein the plurality of reference portions are provided, and the plurality of reference portions are disposed on the plurality of holding stages. The outer side of the shape of each workpiece to be held.
藉此,可在加工載台設置複數個保持台,而能在一個加工載台上保持複數個被加工物。Thereby, a plurality of holding stages can be provided on the processing stage, and a plurality of workpieces can be held on one processing stage.
此外,由於基準部位設置在各保持台上所保持的各被加工物之外側,可在接近被加工物的位置設置基準部位,因此「機械原點」變得接近被加工物的重心位置,而能減低運算偏差量時的誤差。In addition, since the reference portion is provided on the outer side of each workpiece held by each holding table, the reference portion can be provided at a position close to the workpiece, and thus the "machine origin" becomes close to the center of gravity of the workpiece. It can reduce the error when calculating the deviation amount.
又本發明的對象不僅限於上述磨削裝置及磨削方法,其對象也包含具備上述磨削方法之薄板狀構件的製造方法。Further, the object of the present invention is not limited to the above-described grinding device and grinding method, and the object thereof also includes a method of manufacturing a thin plate-shaped member including the above-described grinding method.
再者,在本發明,攝影機設置位置之「與被加工物大致正交的位置」,不僅限於攝影機的攝影方向軸與薄板狀被加工物的平面完全正交的情況,也包含在一定範圍內傾斜的情況。亦即,上述「大致正交」,是根據所要求的加工精度和攝影機的攝影精度等的關係來決定,只要利用攝影機所攝影的攝影資料而如本發明般進行磨削的結果可符合所要求的端面加工精度的範圍,攝影機的攝影方向軸相對於被加工物的平面呈傾斜亦可。Further, in the present invention, the "position substantially perpendicular to the workpiece" at the camera installation position is not limited to the case where the imaging direction axis of the camera is completely orthogonal to the plane of the thin plate-shaped workpiece, and is also included in a certain range. Tilting situation. In other words, the above-mentioned "substantially orthogonal" is determined based on the relationship between the required machining accuracy and the photographing accuracy of the camera, and the result of grinding by the present invention by the photographing material photographed by the camera can meet the requirements. The range of the end face machining accuracy may be such that the camera's photographing direction axis is inclined with respect to the plane of the workpiece.
如以上所說明,在本發明,即使不在薄板玻璃等的被加工物本身形成構成基準之標記(記號)等,仍能利用設置於加工載台之基準部位來求出「機械原點」,以掌握被加工物之偏差量。而且依據所掌握的偏差量,可對未形成標記(記號)等的被加工物進行磨削加工。如此,例如即使對行動電話等的可攜式終端機的顯示畫面所使用之薄板玻璃進行端面磨削的情況,藉由利用攝影機的攝影資料來進行磨削加工,可實施高精度的加工,又不須在被加工物的表面設置記號等而能進行磨削加工。As described above, in the present invention, even if a mark (mark) or the like which constitutes a reference is formed in the workpiece itself such as a thin plate glass, the "machine origin" can be obtained by using the reference portion provided on the processing stage. Master the amount of deviation of the workpiece. Further, the workpiece to be processed such as a mark (mark) can be subjected to grinding processing in accordance with the amount of deviation that is grasped. In this way, for example, even if the thin plate glass used for the display screen of the portable terminal such as a mobile phone is subjected to end surface grinding, the grinding process can be performed by using the photographic data of the camera, and high-precision machining can be performed. Grinding can be performed without setting a mark or the like on the surface of the workpiece.
以下,根據圖式來詳細敘述本發明的實施形態。Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
首先,參照第1圖~第3圖來說明磨削裝置之整體構造。又在各圖中,雖未具體描繪出,在該磨削裝置也像周知般,為了確保作業者的安全性而在周圍設置保護板。First, the overall structure of the grinding apparatus will be described with reference to Figs. 1 to 3 . Further, although not specifically depicted in the drawings, the grinding device is provided with a protective plate around the inside in order to secure the safety of the operator.
該磨削裝置M,如第2圖、第3圖所示,在下部具備以大致矩形組裝成格子狀之基框1,在其上面設置用來進行磨削加工之各種單元。As shown in FIGS. 2 and 3, the grinding apparatus M includes a base frame 1 which is assembled in a substantially rectangular shape in a lower portion, and various units for performing grinding processing are provided on the upper surface thereof.
基框1,是將周知的鋼製角材11、12、13沿左右方向、前後方向及上下方向組裝,而將上部的各單元予以強固地支承。In the base frame 1, the known steel angle members 11, 12, and 13 are assembled in the left-right direction, the front-rear direction, and the up-and-down direction, and the upper units are strongly supported.
在基框1的上面,載置固定著金屬製的平板材14。藉由該平板材14,將基框1的鋼製角材11、12、13間予以遮蔽,且能在基框1上設置各單元。A flat plate material 14 made of metal is placed on the upper surface of the base frame 1. By the flat plate 14, the steel angle members 11, 12, and 13 of the base frame 1 are shielded, and each unit can be provided on the base frame 1.
又在基框1內設置電子控制單元15,以控制用來進行磨削加工之各單元。又雖未詳細記載,在該電子控制單元15內具備可儲存加工資訊等之記憶手段。再者,雖未圖示出,也設有控制盤,以讓作業者H對該電子控制單元15輸入資訊。Further, an electronic control unit 15 is provided in the base frame 1 to control the units for performing the grinding process. Although not described in detail, the electronic control unit 15 is provided with a memory means for storing processing information and the like. Further, although not shown, a control panel is also provided to allow the operator H to input information to the electronic control unit 15.
如第1圖所示設置於磨削裝置M的上部(基框1上)之單元係包含:設置於中央之搬運機械人2、設置於其周圍之四個加工單元3A、3B、3C、3D、設置於搬運機械人2的前方之投入取出載台4、設置在搬運機械人2的左右兩側位置且往前後方向延伸之照明移動單元5。The unit provided on the upper portion (the base frame 1) of the grinding apparatus M as shown in Fig. 1 includes: a transport robot 2 installed at the center, and four processing units 3A, 3B, 3C, and 3D disposed around the center. The input/unloading stage 4 provided in front of the transport robot 2 and the illumination moving unit 5 provided in the left and right sides of the transport robot 2 and extending in the front-rear direction.
上述搬運機械人2,是由可朝水平方向移動之三關節的平面關節型機械人(SCARA robot)所構成。第1圖~第3圖係顯示搬運機械人2未動作之基準狀態。關於動作狀態,是參照第4圖~第6圖而隨後作說明。The transport robot 2 is composed of a plane joint robot (SCARA robot) that can move three joints in the horizontal direction. The first to third figures show the reference state in which the transport robot 2 does not operate. The operation state will be described later with reference to FIGS. 4 to 6 .
在搬運機械人2的前端設置上下滑動軸20。在該上下滑動軸20的下端設置:用來吸附保持被加工物之大致方形的薄板玻璃W(工件)之吸附手21。此外,在上下滑動軸20的上端,透過安裝托架安裝影像取得用的攝影機23。如此般,藉由安裝在搬運機械人2上,攝影機23攝影時可移動至工件W之攝影部位(工件W的正上方)。The upper and lower slide shafts 20 are provided at the front end of the transport robot 2. At the lower end of the vertical sliding shaft 20, an adsorption hand 21 for sucking and holding a substantially square thin plate glass W (workpiece) of the workpiece is provided. Further, at the upper end of the vertical slide shaft 20, a camera 23 for image acquisition is attached through the mounting bracket. In this manner, by being attached to the transport robot 2, the camera 23 can be moved to the photographing portion of the workpiece W (directly above the workpiece W) when photographing.
該搬運機械人2,是將薄板玻璃W(Wo、Wi)從投入取出載台4分別搬運至各加工單元3A、3B、3C、3D,又從加工單元3A、3B、3C、3D分別搬運至投入取出載台4。該工件W之搬運作業,是利用上述吸附手21來進行。此外,該搬運機械人2,是藉由上述攝影機23,來從加工單元3A、3B、3C、3D的上方攝影所載置保持之薄板玻璃W。In the transport robot 2, the thin plate glass W (Wo, Wi) is transported from the loading/unloading stage 4 to each of the processing units 3A, 3B, 3C, and 3D, and is transported from the processing units 3A, 3B, 3C, and 3D, respectively. The loading and unloading stage 4 is taken in. The conveyance work of the workpiece W is performed by the above-described adsorption hand 21. Further, the transport robot 2 photographs the sheet glass W held thereon from above the processing units 3A, 3B, 3C, and 3D by the camera 23.
上述四個加工單元,分別設置於搬運機械人2之前後左右,而作為第一加工單元3A、第二加工單元3B、第三加工單元3C、第四加工單元3D。The four processing units are respectively disposed before and after the transport robot 2, and are used as the first processing unit 3A, the second processing unit 3B, the third processing unit 3C, and the fourth processing unit 3D.
各加工單元3A、3B、3C、3D之構成要素設定成完全相同,而能進行完全相同的磨削作業。例如,如第一加工單元3A所示,構成要素是包含:將工件W以磨削狀態進行吸附保持之加工載台30、從加工載台30的上方對工件W進行磨削之磨削主軸31、鄰接於加工載台30而用來保持複數個磨削工具(磨石)之工具庫32。The constituent elements of the respective processing units 3A, 3B, 3C, and 3D are set to be identical, and the same grinding operation can be performed. For example, as shown in the first processing unit 3A, the constituent elements include a processing stage 30 that sucks and holds the workpiece W in a grinding state, and a grinding spindle 31 that grinds the workpiece W from above the processing stage 30. A tool magazine 32 for holding a plurality of grinding tools (grinding stones) adjacent to the processing stage 30.
而且,其中在加工載台30上,設有讓中央的加工平台33朝左右方向滑動移動之左右滑動機構34。在加工平台33的左右兩側設置樹脂製的伸縮護蓋35(加工平台33右側的伸縮護蓋,由於被磨削主軸等遮住而未圖示出)。藉由該伸縮護蓋35,可防止磨削用冷卻水侵入左右滑動機構34。此外,在加工平台33的上面,設置呈矩形箱狀且上方開口之擋止盤36,藉由該擋止盤36來防止磨削用冷卻水之飛濺。此外,雖未詳細地圖示出,用來對工件W噴射磨削用冷卻水之冷卻水板37,是鄰接於擋止盤36而設置。Further, in the processing stage 30, a left and right sliding mechanism 34 for sliding the central processing platform 33 in the left-right direction is provided. A resin telescopic cover 35 is provided on the left and right sides of the processing platform 33 (the telescopic cover on the right side of the processing platform 33 is not shown by being covered by a grinding spindle or the like). By the telescopic cover 35, it is possible to prevent the cooling water for grinding from intruding into the right and left slide mechanism 34. Further, on the upper surface of the processing platform 33, a stopper disk 36 having a rectangular box shape and having an upper opening is provided, and the stopper disk 36 prevents the splash of the cooling water for grinding. Further, although not shown in detail, the cooling water plate 37 for jetting the cooling water for grinding to the workpiece W is provided adjacent to the stopper disk 36.
此外,磨削主軸31,係具備可朝前後方向滑動移動之前後滑動機構38。而且,在磨削主軸31和前後滑動機構38之間,設置可朝上下方向移動的上下移動機構39。如此,磨削主軸31不僅是前後方向,也能朝上下方向自由地移動。Further, the grinding spindle 31 is provided with a rear sliding mechanism 38 that is slidable in the front-rear direction. Further, between the grinding spindle 31 and the front and rear slide mechanism 38, a vertical movement mechanism 39 that is movable in the vertical direction is provided. In this manner, the grinding spindle 31 can move freely in the vertical direction as well as the front-rear direction.
又前後滑動機構38,如第2圖所示,相對於朝前後方向延伸的大型角材之側框16,是強固地固定著。藉此,可提昇磨削主軸31之支承剛性,而能提高磨削精度。Further, as shown in Fig. 2, the front and rear slide mechanism 38 is firmly fixed to the side frame 16 of the large angle member extending in the front-rear direction. Thereby, the support rigidity of the grinding spindle 31 can be improved, and the grinding precision can be improved.
工具庫32,最多可保持五個磨削工具6(磨石,參照第2、3圖)。在工具庫32,可保持直徑不同的磨石或研磨材不同的磨石等複數個磨削工具6。該等複數個磨削工具6,是對應於加工內容而選擇性地安裝於磨削主軸31。又複數個磨削工具6,是設置成可在磨削主軸31上自動更換。The tool magazine 32 can hold up to five grinding tools 6 (grinding stones, see Figures 2 and 3). In the tool magazine 32, a plurality of grinding tools 6 having different diameters of grindstones or different grindstones can be held. The plurality of grinding tools 6 are selectively attached to the grinding spindle 31 in accordance with the processing contents. Further, a plurality of grinding tools 6 are provided to be automatically replaceable on the grinding spindle 31.
上述投入取出載台4係具備:供作業者H進行開閉操作之開閉門40、與開閉門40連動而動作之長方形的匣設置台41、可裝卸地設置於匣設置台41之工件匣42。The input/unloading stage 4 includes an opening and closing door 40 for opening and closing the operator H, a rectangular cymbal mounting table 41 that operates in conjunction with the opening and closing door 40, and a workpiece 匣 42 that is detachably provided to the cymbal mounting table 41.
開閉門40,是在下端設有朝水平方向延伸的鉸鏈軸43(參照第3圖)之橫長長方形之鋼板,在其上部外面,設有俯視大致U字形的把手部44。作業者H握住把手部44以鉸鏈軸43為中心將該開閉門40往前轉動,藉此將投入取出載台4打開,而能對磨削裝置M內進行工件W之出入。The opening and closing door 40 is a horizontally long rectangular steel plate having a hinge shaft 43 (see FIG. 3) extending in the horizontal direction at the lower end, and a handle portion 44 having a substantially U-shaped shape in plan view is provided on the outer surface of the upper portion. The operator H holds the handle portion 44 to rotate the opening and closing door 40 forward about the hinge shaft 43 to open the loading/unloading stage 4, and can move the workpiece W into and out of the grinding device M.
匣設置台41的兩端側連結於連桿機構45(連結在關閉門40的上部)。此外,匣設置台41的下部,是可滑動地載置於朝前後方向延伸的滑軌46(參照第3圖)。因此,若作業者H對開閉門40實施打開操作,透過連桿機構45連結於開閉門40之匣設置台41會朝磨削裝置M的外側方向滑動移動。此外,若作業者H對開閉門40實施關閉操作,匣設置台41會朝磨削裝置M的內側方向滑動移動。Both end sides of the cymbal mounting table 41 are connected to the link mechanism 45 (connected to the upper portion of the closing door 40). Further, the lower portion of the crucible setting table 41 is slidably placed on the slide rail 46 extending in the front-rear direction (see FIG. 3). Therefore, when the operator H performs an opening operation on the opening and closing door 40, the arranging table 41 connected to the opening and closing door 40 via the link mechanism 45 slides toward the outer side of the grinding device M. Further, when the operator H performs the closing operation on the opening and closing door 40, the crucible setting table 41 slides toward the inner side of the grinding device M.
工件匣42,為了沿左右方向排列四列的工件W之積層體,是具備四個藉由樹脂壁47區隔成的積層部48。其中,在右側兩個積層部48上積層未加工的工件Wi,在左側兩個積層部48上積層加工完畢的工件Wo。該工件匣42在兩端設有搬運用的把持部49,以讓作業者H容易從匣設置台41卸下。The workpiece 匣 42 has four laminated portions 48 partitioned by a resin wall 47 in order to arrange the stacked bodies of the workpieces W in four rows in the left-right direction. Among them, the unprocessed workpiece Wi is laminated on the right two laminated portions 48, and the processed workpiece Wo is laminated on the left two laminated portions 48. The workpiece 匣 42 is provided with grip portions 49 for conveyance at both ends so that the operator H can be easily detached from the cymbal mounting table 41.
作業者H,在該工件匣42上設置(載置)未加工的工件W,將載置有該工件W之工件匣42放在匣設置台41上,藉由關閉開閉門40而完成加工前準備。The operator H mounts (places) the unprocessed workpiece W on the workpiece 匣42, and places the workpiece 匣42 on which the workpiece W is placed on the cymbal mounting table 41, and completes the processing by closing the opening and closing door 40. ready.
上述照明移動單元5係具備:在搬運機械人2的兩側位置朝前後方向延伸之移動滑軌50、透過上下移動機構51而藉由該移動滑軌50支承之大致四角形的照明框52。該照明框52,在攝影時是作為照明工件W之照明手段,在本實施形態依據上述構造,將照明手段設置成可在攝影時的照明位置和待機位置之間移動。The illumination moving unit 5 includes a moving rail 50 that extends in the front-rear direction on both sides of the transport robot 2, and a substantially square-shaped illumination frame 52 that is supported by the moving rail 50 by the vertical moving mechanism 51. The illumination frame 52 is an illumination means for illuminating the workpiece W at the time of photographing. In the present embodiment, the illumination means is provided to be movable between an illumination position and a standby position at the time of photographing in accordance with the above configuration.
移動滑軌50,是將前端和後端分別透過支承托架50a、50a來固定設置在金屬製的平板材14。該移動滑軌50的後端,是延伸至後側的加工單元(第二加工單元3B及第四加工單元3D)的工具庫32的位置。因此,照明框52可大範圍地移動至磨削裝置M的後側,在不使用照明框52之待機時點(例如各加工單元3A、3B、3C、3D進行磨削加工的時點),可讓照明框52後退至後側位置。The moving rail 50 is fixed to the metal flat plate 14 by passing the front end and the rear end through the support brackets 50a and 50a, respectively. The rear end of the moving rail 50 is the position of the tool magazine 32 that extends to the processing units (the second processing unit 3B and the fourth processing unit 3D) on the rear side. Therefore, the illumination frame 52 can be moved to the rear side of the grinding device M in a wide range, and the standby point when the illumination frame 52 is not used (for example, the time when each processing unit 3A, 3B, 3C, 3D performs the grinding process) can be made The illumination frame 52 is retracted to the rear side position.
照明框52,是在各框部52a的內周面埋設複數個LED(未圖示),藉此可照射框內。該照明框52,在藉由攝影機23攝影工件W時,是移動至加工載台30的擋止盤36,並利用LED從側方照射工件W,藉此讓工件W的外形形狀(輪廓)浮現出,而容易進行工件W的攝影。In the illumination frame 52, a plurality of LEDs (not shown) are embedded in the inner peripheral surface of each frame portion 52a, whereby the inside of the frame can be illuminated. When the workpiece W is photographed by the camera 23, the illumination frame 52 is moved to the stopper disk 36 of the processing stage 30, and the workpiece W is irradiated from the side by the LED, whereby the outer shape (profile) of the workpiece W emerges. It is easy to take a picture of the workpiece W.
接著參照第4圖~第6圖來說明搬運機械人2。Next, the transport robot 2 will be described with reference to Figs. 4 to 6 .
搬運機械人2,如上述般是由朝水平方向移動之三關節的平面關節型機械人所構成,其可朝水平方向移動。具體而言如第4(b)圖所示,搬運機械人2是設置成可在第一關節2Ja、第二關節2Jb、第三關節2Jc轉動,且可朝左右方向移動。藉此,使前側臂24的前端之上下滑動軸20能朝水平方向移動。As described above, the transport robot 2 is constituted by a planar joint type robot that moves in three directions in the horizontal direction, and is movable in the horizontal direction. Specifically, as shown in FIG. 4(b), the transport robot 2 is provided to be rotatable in the first joint 2Ja, the second joint 2Jb, and the third joint 2Jc, and is movable in the left-right direction. Thereby, the front end upper and lower sliding shafts 20 of the front side arm 24 can be moved in the horizontal direction.
該上下滑動軸20,是沿上下方向貫穿前側臂24的前端,而成為也能朝上下方向滑動移動。The vertical slide shaft 20 penetrates the front end of the front arm 24 in the vertical direction, and is also slidable in the vertical direction.
在上下滑動軸20的下端設置上述的吸附手21。該吸附手21,是在長方形平板狀的底板25上,設置四個朝向下側的吸盤26。藉由讓負壓作用於該吸盤26以產生吸附力,而能吸附保持作為工件之薄板玻璃W。The above-described suction hand 21 is provided at the lower end of the upper and lower slide shafts 20. The suction hand 21 is provided with four suction cups 26 facing the lower side on a rectangular flat bottom plate 25. The thin plate glass W as a workpiece can be adsorbed and held by causing a negative pressure to act on the suction cup 26 to generate an adsorption force.
這四個吸盤26如第4(c)圖所示,是在左右兩處分別配設兩個。而藉由各兩個吸盤26來吸附保持一片工件W。因此,一個吸附手21一次可搬運兩片的工件W。As shown in Fig. 4(c), the four suction cups 26 are provided at two places on the left and the right. The two workpieces W are adsorbed and held by the two suction cups 26. Therefore, one suction hand 21 can carry two pieces of the workpiece W at a time.
此外,該吸附手21,在底板25的兩端設有向下突出的銷27。該銷27、27是與工件W抵接的抵接構件。亦即,在搬運工件W之前,經由搬運機械人2的移動,藉由該銷27一旦將工件W推入工件匣42內,而讓工件W在工件匣42內整齊地排列。Further, the suction hand 21 is provided with pins 27 projecting downward at both ends of the bottom plate 25. The pins 27 and 27 are abutting members that abut against the workpiece W. That is, before the workpiece W is conveyed, the workpiece W is pushed into the workpiece 42 by the movement of the transport robot 2, and the workpiece W is neatly arranged in the workpiece 42.
在上下滑動軸20的上端,如上述般設置攝影機23。該攝影機23,相對於吸附手21之工件W的保持位置(底板25的突出部分),是設置在偏移約90°的位置。如此,在藉由攝影機23進行攝影時,可避免受到底板25的阻礙。該攝影機23,是由一般的CCD攝影機所構成,可取得二維的影像資料。此外,上述攝影機23設置成,使其攝影方向軸與攝影對象(薄板狀的工件W)之平面完全正交,而能攝影工件W。At the upper end of the upper and lower slide shafts 20, the camera 23 is set as described above. The camera 23 is disposed at a position shifted by about 90 with respect to the holding position of the workpiece W of the suction hand 21 (the protruding portion of the bottom plate 25). Thus, when photographing by the camera 23, it is possible to avoid being hindered by the bottom plate 25. The camera 23 is constituted by a general CCD camera and can acquire two-dimensional image data. Further, the camera 23 is provided so that the workpiece W can be imaged so that the imaging direction axis is completely orthogonal to the plane of the object to be photographed (the thin workpiece W).
此外,該攝影機23,是透過安裝托架22安裝在上下滑動軸20。該安裝托架22係具備:稍微向下彎曲的腕部22a、可調整上下方向位置之攝影機安裝部22b、以及固定於上下滑動軸20之筒狀的軸固定部22c。攝影機23,是透過腕部22a而固定於上下滑動軸20,因此是位於離開上下滑動軸20的位置,在攝影時可防止攝入前側臂24。Further, the camera 23 is attached to the vertical slide shaft 20 via a mounting bracket 22. The mounting bracket 22 includes a wrist portion 22a that is slightly curved downward, a camera mounting portion 22b that can adjust the position in the vertical direction, and a cylindrical shaft fixing portion 22c that is fixed to the vertical sliding shaft 20. Since the camera 23 is fixed to the vertical slide shaft 20 through the arm portion 22a, the camera 23 is located away from the vertical slide shaft 20, and the front arm 24 can be prevented from being ingested during shooting.
接著,利用第5圖及第6圖來說明搬運機械人2進行搬運時的動作。Next, the operation when the transport robot 2 performs the transport will be described with reference to FIGS. 5 and 6 .
如第5(a)圖所示,搬運機械人2,首先從基準狀態讓各關節稍微朝逆時針方向轉動,而將工件匣42上所積層的未加工之工件Wi利用吸附手21吸附。這時,藉由使上下滑動軸20朝逆時針方向大幅地轉動,而讓吸附手21的底板25轉動,以在左側的吸盤26上吸附未加工的工件Wi。As shown in Fig. 5(a), the transport robot 2 firstly rotates the joints slightly counterclockwise from the reference state, and the unprocessed workpiece Wi stacked on the workpiece 匣42 is sucked by the suction hand 21. At this time, by rotating the vertical sliding shaft 20 in the counterclockwise direction, the bottom plate 25 of the suction hand 21 is rotated to suck the unprocessed workpiece Wi on the suction cup 26 on the left side.
然後,如第5(b)圖所示,搬運機械人2讓各關節朝逆時針方向大幅地轉動,而將工件Wi搬運至第一加工單元的加工載台30上。這時,工件Wi被搬運至大概的位置,而載置在加工載台30上。亦即,不進行嚴格的位置確認,而將工件Wi搬運至加工載台30,載置在大概的位置。Then, as shown in Fig. 5(b), the transport robot 2 causes the joints to rotate largely in the counterclockwise direction, and transports the workpiece Wi to the processing stage 30 of the first processing unit. At this time, the workpiece Wi is transported to an approximate position and placed on the processing stage 30. In other words, the workpiece Wi is transported to the processing stage 30 without being subjected to strict position confirmation, and is placed at an approximate position.
接著,如第6(c)圖所示,搬運機械人2讓前側臂24進一步朝逆時針方向轉動,且使上下滑動軸20朝順時針方向轉動,藉此使攝影機23確實地位在工件W的上方(正上方)且其攝影方向軸與工件Wi的平面正交的位置。如此,搬運機械人2,可利用攝影機23來攝影其本身所搬運而載置於加工載台30之工件Wi。又工件W的攝影順序等隨後敘述。Next, as shown in Fig. 6(c), the transport robot 2 rotates the front side arm 24 further in the counterclockwise direction, and rotates the upper and lower slide shafts 20 in the clockwise direction, whereby the camera 23 is surely positioned on the workpiece W. Above (directly above) and its photographing direction axis is orthogonal to the plane of the workpiece Wi. In this manner, the transport robot 2 can use the camera 23 to photograph the workpiece Wi that is transported by itself and placed on the processing stage 30. Further, the photographing order of the workpiece W and the like will be described later.
而且在上述工件Wi的攝影結束後,如第6(d)圖所示,為了搬運下個未加工的工件W,搬運機械人2讓各關節朝順時針方向轉動,而藉由底板25之左側的吸盤26來吸附下個工件W。Further, after the end of the photographing of the workpiece Wi, as shown in Fig. 6(d), in order to convey the next unprocessed workpiece W, the transport robot 2 rotates the joints in the clockwise direction, and the left side of the bottom plate 25 The suction cup 26 sucks the next workpiece W.
然後,搬運機械人2反覆進行第5(b)圖的動作,而從工件匣42將未加工的工件W搬運至下個加工載台。如此,在空的加工單元之加工載台上,依序搬運未加工的工件W。Then, the transport robot 2 repeatedly performs the operation of FIG. 5(b), and transports the unprocessed workpiece W from the workpiece 匣42 to the next processing stage. In this manner, the unprocessed workpiece W is sequentially transported on the processing stage of the empty processing unit.
又雖未具體地圖示出,搬運機械人2是將加工結束後之加工完畢的工件Wo,藉由右側的吸盤26之吸附,而從加工載台30搬運至工件匣42。搬運機械人2,在第5(b)圖的動作前,是從加工載台30接收加工完畢的工件Wo,以同時進行未加工的工件Wi之搬運和加工完畢的工件Wo之搬運。Further, although not specifically illustrated, the transport robot 2 transports the processed workpiece Wo after the processing is completed, and is transported from the processing stage 30 to the workpiece cassette 42 by the suction of the suction cup 26 on the right side. Before the operation of the fifth robot (b), the transport robot 2 receives the processed workpiece Wo from the processing stage 30, and simultaneously transports the unprocessed workpiece Wi and transports the processed workpiece Wo.
接著,主要參照第7圖~第9圖來說明加工單元。Next, the processing unit will be described mainly with reference to Figs. 7 to 9 .
加工單元3B(為了方便,以第二加工單元作說明)如第7圖所示係具備:用來保持上述工件W之加工載台30、用來磨削工件W之磨削主軸31、用來保持磨削工具6之工具庫32。The processing unit 3B (for convenience, described by the second processing unit) has a processing stage 30 for holding the workpiece W, and a grinding spindle 31 for grinding the workpiece W, as shown in FIG. The tool magazine 32 of the grinding tool 6 is maintained.
其中,在加工載台30設有:上述之矩形的加工平台33(平台)、讓加工平台33左右移動之左右滑動機構34、覆蓋左右滑動機構34之伸縮護蓋35、設置在加工平台33的上面之擋止盤36、以及用來噴射磨削用冷卻水之冷卻水板37。The processing stage 30 is provided with: a rectangular processing platform 33 (platform), a left and right sliding mechanism 34 for moving the processing platform 33 to the left and right, a telescopic cover 35 covering the left and right sliding mechanism 34, and a processing platform 33. The upper stopper disk 36 and the cooling water plate 37 for jetting the cooling water for grinding.
再者,在該加工載台30,如第8圖所示進一步具備各種的構成要素。Further, the processing stage 30 further includes various components as shown in Fig. 8.
首先,在加工平台33的上面設有:用來在擋止盤36的內側中央吸附保持工件W之吸附台70(保持台)。該吸附台70的上面(承接面)70a,是由長方形(參照第7圖)之大致T字狀之塊狀台座所構成。在吸附台70的上面70a,為了賦予負壓而設有複數個吸氣口70b(參照第10圖、第11圖)。此外,為了避免薄板玻璃(工件W)的表面受傷,是對吸附台70的上面70a實施平滑加工。First, on the upper surface of the processing platform 33, there is provided an adsorption stage 70 (holding stage) for sucking and holding the workpiece W at the inner center of the stopper disk 36. The upper surface (bearing surface) 70a of the adsorption stage 70 is constituted by a block-shaped pedestal having a substantially T-shape in a rectangular shape (see Fig. 7). In the upper surface 70a of the adsorption stage 70, a plurality of intake ports 70b are provided in order to impart a negative pressure (see Fig. 10 and Fig. 11). Further, in order to avoid surface damage of the thin plate glass (work piece W), smooth processing is performed on the upper surface 70a of the suction stage 70.
在上述吸附台70的周圍,朝向攝影機23側(上方側)豎設:用來算出磨削加工時的機械原點之兩個基準銷71、71。這兩個基準銷71、71,為了在吸附台70上載置(保持)工件W的狀態下能從上述攝影機23進行攝影,是配置在不與工件W重疊的位置(工件W外形的外側)。此外,這兩個基準銷71、71,是相對於工件W配置在對角的位置。又當工件W為完全透明的情況,將基準銷的位置設置成與工件W重疊亦可。Around the adsorption stage 70, two reference pins 71 and 71 for calculating the mechanical origin at the time of grinding processing are erected toward the camera 23 side (upper side). The two reference pins 71 and 71 are capable of being photographed from the camera 23 in a state in which the workpiece W is placed (held) on the suction stage 70, and are disposed at a position that does not overlap the workpiece W (outside of the outer shape of the workpiece W). Further, the two reference pins 71 and 71 are disposed at diagonal positions with respect to the workpiece W. Further, when the workpiece W is completely transparent, the position of the reference pin may be set to overlap the workpiece W.
而且,基準銷71之被攝影點(前端部71a)如第8圖所示,其高度hp設定成與吸附台70的上面70a之高度hs相同。亦即,基準部位之被攝影點離攝影機的距離,是設定成和被加工物離攝影機的距離大致一致。藉由如此般設定,在藉由攝影機23進行攝影時,在工件W和基準銷71之間不會產生焦點偏差,而能確實地進行影像資料的取得。Further, as shown in Fig. 8, the photographed point (front end portion 71a) of the reference pin 71 has a height hp set to be the same as the height hs of the upper surface 70a of the suction stage 70. That is, the distance between the photographed point of the reference portion and the camera is set to be substantially the same as the distance from the workpiece to the camera. With such a setting, when the camera 23 performs the photographing, the focus deviation does not occur between the workpiece W and the reference pin 71, and the image data can be reliably obtained.
又上述「大致一致」是指,除了上述般基準銷71之前端部71a的高度hp與吸附台70的上面70a之高度hs相同的情況以外,還包含銷的前端部71a的高度hp比吸附台70的上面70a之高度低若干(例如1mm)的情況。亦即,上述「大致一致」,是根據所要求的加工精度和攝影機的攝影精度等的關係來決定,只要利用攝影機所攝影的攝影資料而如後述般進行磨削的結果可符合所要求的端面加工精度的範圍,攝影機離基準部位之被攝影點的距離和攝影機離被加工物的距離不是完全一致亦可。In addition, the above-mentioned "substantially identical" means that the height hp of the front end portion 71a of the reference pin 71 is the same as the height hs of the upper surface 70a of the suction stage 70, and the height hp of the tip end portion 71a of the pin is more than the adsorption stage. The case where the height 70a of the upper portion 70 is lower (for example, 1 mm). In other words, the above-mentioned "substantially identical" is determined based on the relationship between the required processing accuracy and the photographing accuracy of the camera, and the result of grinding as described later by the photographing material photographed by the camera can conform to the required end face. The range of processing accuracy may not be exactly the same distance between the camera and the distance from the photographed point of the reference portion and the distance from the camera to the workpiece.
此外,在擋止板36的內部設置:高底且呈傾斜之大致四角形的背景板72。該背景板72,是全面消光而塗黑,以防止攝入攝影機23時發生反射,而使工件W與基準銷71之攝入變明顯。此外,藉由將背景板72設置成傾斜,能讓磨削用冷卻水馬上流掉。此外,在該背景板72形成有:供基準銷71和吸附台70插通用的插通孔(未具體地圖示)。Further, inside the stopper plate 36, a background plate 72 having a high base and an inclined substantially square shape is provided. The background plate 72 is completely matt and blackened to prevent reflection when the camera 23 is ingested, and the intake of the workpiece W and the reference pin 71 becomes conspicuous. Further, by setting the background plate 72 to be inclined, the cooling water for grinding can be immediately discharged. Further, in the background plate 72, an insertion hole (not specifically shown) for inserting the reference pin 71 and the suction stage 70 is formed.
在擋止盤36的鄰接位置設有:用來將流到擋止盤36之磨削用冷卻水排出之排水管73和排水溝槽74。藉由設置該排水管73和排水溝槽74,可防止磨削用冷卻水滯留於擋止盤36內。At a position adjacent to the stopper disk 36, a drain pipe 73 and a drain groove 74 for discharging the cooling water for grinding to the stopper disk 36 are provided. By providing the drain pipe 73 and the drain groove 74, it is possible to prevent the cooling water for grinding from remaining in the stopper disk 36.
左右滑動機構34,是藉由周知的LM導件,而使加工平台33朝左右方向自由地滑動移動。而且,該左右滑動機構34,是藉由步進馬達34M來控制滑動量。亦即,藉由左右滑動機構34來控制加工平台33之左右方向的位置。藉此,在進行後述的磨削加工時,藉由左右滑動機構34,來規定磨削路徑之左右位置。The left and right slide mechanisms 34 are freely slidably moved in the left-right direction by a well-known LM guide. Further, the left and right slide mechanism 34 controls the amount of slip by the stepping motor 34M. That is, the position of the processing platform 33 in the left-right direction is controlled by the left and right sliding mechanism 34. Thereby, the left and right positions of the grinding path are defined by the right and left sliding mechanism 34 during the grinding process to be described later.
伸縮護蓋35,是像手風琴般可朝左右方向伸縮。因此,即使加工平台33藉由左右滑動機構34而往左右移動,仍不致在加工平台33和伸縮護蓋35之間產生間隙,而能防止磨削用冷卻水流入左右滑動機構34。The telescopic cover 35 is stretchable in the left-right direction like an accordion. Therefore, even if the processing platform 33 is moved to the left and right by the left and right sliding mechanisms 34, a gap is not formed between the processing platform 33 and the telescopic cover 35, and the cooling cooling water for grinding can be prevented from flowing into the left and right sliding mechanisms 34.
擋止盤36,如上述般是形成上方開口之矩形箱狀,且設定成磨削用冷卻水不會漏到外部。具體而言,如第8圖所示,擋止盤36的側壁36a延伸至比基準銷71(hp)和吸附台70(hs)更高的位置hc,而防止磨削用冷卻水漏出。As described above, the stopper disk 36 has a rectangular box shape in which the upper opening is formed, and is set so that the cooling water for grinding does not leak to the outside. Specifically, as shown in Fig. 8, the side wall 36a of the stopper disk 36 extends to a position hc higher than the reference pin 71 (hp) and the suction stage 70 (hs), and prevents the cooling water for grinding from leaking.
冷卻水板37,是設置成可沿左右方向出沒自如,在磨削加工時,會突出到覆蓋擋止盤36上方的位置。而且,在該冷卻水板37的中央設有:朝前後方向延伸之長孔狀的磨削插通孔37a。該磨削插通孔37a,是為了在磨削加工時供磨削工具6插通。此外,雖未具體地圖示出,在冷卻水板37的背面(下面)設有複數個噴射口,以讓流過冷卻水板37內部之磨削用冷卻水往下方(工件W側)噴射。The cooling water plate 37 is provided so as to be freely movable in the left-right direction, and protrudes to a position above the cover stopper disk 36 during the grinding process. Further, a center of the cooling water plate 37 is provided with a long hole-shaped grinding insertion hole 37a extending in the front-rear direction. The grinding insertion hole 37a is for inserting the grinding tool 6 during the grinding process. Further, although not specifically shown, a plurality of injection ports are provided on the back surface (lower surface) of the cooling water plate 37 to allow the cooling water flowing through the inside of the cooling water plate 37 to be sprayed downward (the workpiece W side). .
磨削主軸31係具備:用來產生進行磨削時的旋轉驅動力之電動馬達31a、用來在電動馬達31a的主軸上固定磨削工具6(磨石)之夾頭31b。The grinding spindle 31 includes an electric motor 31a for generating a rotational driving force for grinding, and a chuck 31b for fixing a grinding tool 6 (grinding stone) to the main shaft of the electric motor 31a.
磨削主軸31如上述般,係具備前後滑動機構38。該前後滑動機構38係具備:朝前後方向延伸的滑軌38a、可在該滑軌38a上移動之滑動件38b。該前後滑動機構38也是,藉由步進馬達38M來控制滑動件38b的滑動量,又藉由該前後滑動機構38來控制磨削主軸31的前後位置。如此,在進行磨削加工時,藉由該前後滑動機構38來規定磨削路徑之前後方向位置。As described above, the grinding spindle 31 is provided with a front and rear slide mechanism 38. The front and rear slide mechanism 38 includes a slide rail 38a extending in the front-rear direction and a slider 38b movable on the slide rail 38a. The front and rear slide mechanism 38 also controls the amount of sliding of the slider 38b by the stepping motor 38M, and the front and rear positions of the grinding spindle 31 are controlled by the front and rear slide mechanism 38. In this manner, when the grinding process is performed, the front and rear direction positions of the grinding path are defined by the front and rear sliding mechanism 38.
此外,磨削主軸31和前後滑動機構38之間,如上述般設有上下導引機構39。該上下導引機構39也是具備:朝上下方向延伸的軌道39a、可在軌道39a上移動之移動構件39b。再者,該上下導引機構39也是,藉由步進馬達39M來控制移動機構39b的上下移動量。藉由該上下導引機構39來控制磨削主軸31之上下位置。藉此,在將磨削工具6對準工件W時,是使用該上下導引機構39來進行位置調整。Further, between the grinding spindle 31 and the front and rear slide mechanisms 38, the upper and lower guide mechanisms 39 are provided as described above. The vertical guide mechanism 39 also includes a rail 39a extending in the vertical direction and a moving member 39b movable on the rail 39a. Further, the vertical guide mechanism 39 also controls the amount of vertical movement of the moving mechanism 39b by the stepping motor 39M. The upper and lower positions of the grinding spindle 31 are controlled by the upper and lower guide mechanisms 39. Thereby, when the grinding tool 6 is aligned with the workpiece W, the vertical adjustment mechanism 39 is used for position adjustment.
工具庫32如上述般,最多可保持五個磨削工具6。具體而言如第9圖所示,將用來保持磨削工具6之五個工具保持部32a沿前後方向排成一列,在該工具保持部32a和磨削主軸31之間自動進行磨削工具6的交接。The tool magazine 32 can hold up to five grinding tools 6 as described above. Specifically, as shown in Fig. 9, the five tool holding portions 32a for holding the grinding tool 6 are arranged in a row in the front-rear direction, and the grinding tool is automatically performed between the tool holding portion 32a and the grinding spindle 31. 6 handover.
因此,在該磨削裝置M,可對應於磨削部位而自動更換複數個磨削工具6,而能提昇磨削自由度。Therefore, in the grinding device M, a plurality of grinding tools 6 can be automatically replaced in accordance with the grinding portion, and the degree of freedom in grinding can be improved.
參照第10圖及第11圖來說明磨削主軸31之磨削工具6。The grinding tool 6 of the grinding spindle 31 will be described with reference to Figs. 10 and 11.
如上述般,該磨削主軸31,可藉由夾頭31b來進行磨削工具6之裝卸,而能在第10圖所示的大徑磨削工具6A和第11圖所示的小徑磨削工具6B之間進行切換。As described above, the grinding spindle 31 can be attached and detached by the chucking tool 31, and the large-diameter grinding tool 6A shown in Fig. 10 and the small-diameter grinding machine shown in Fig. 11 can be used. Switch between the cutting tools 6B.
第10圖所示的大徑磨削工具6A,係具備:在表面附著鑽石粒子60之大徑圓柱狀的加工部61(磨石)、固定於夾頭31b且朝上下方向延伸之軸部62;在加工部61的上側設置往外變寬的凸緣部63。此外,在加工部61的下部形成三條呈條紋狀凹陷的凹部64。The large-diameter grinding tool 6A shown in Fig. 10 includes a large-diameter cylindrical processed portion 61 (grinding stone) to which diamond particles 60 are attached to the surface, and a shaft portion 62 that is fixed to the chuck 31b and extends in the vertical direction. A flange portion 63 that widens outward is provided on the upper side of the processed portion 61. Further, three recessed portions 64 which are stripe-shaped recessed are formed in the lower portion of the processed portion 61.
藉由磨削主軸31使該大徑磨削工具6A旋轉,讓凹部64抵接於工件W的外緣(外形)Wa,藉此可對工件W進行外形磨削或去角。又符號70為吸附台。The large-diameter grinding tool 6A is rotated by the grinding spindle 31, and the concave portion 64 abuts against the outer edge (outer shape) Wa of the workpiece W, whereby the workpiece W can be subjected to external shape grinding or chamfering. Further, reference numeral 70 is an adsorption stage.
如此般藉由大徑磨削工具6A來磨削工件W,由於在磨削加工時磨削工具6A可穩定地進行磨削,因此可提昇加工精度。此外,由於磨削工具6A為大徑,可延長工具壽命,而能大量地連續磨削工件W。Thus, the workpiece W is ground by the large-diameter grinding tool 6A, and since the grinding tool 6A can be stably ground during the grinding process, the machining accuracy can be improved. Further, since the grinding tool 6A has a large diameter, the tool life can be extended, and the workpiece W can be continuously ground in a large amount.
第11圖所示的小徑磨削工具6B,係具備:在表面附著鑽石粒子160之小徑圓柱狀的加工部161、固定於夾頭31b之軸部162;在加工部161的上側設置凸緣部163。此外,在加工部161的下部形成三條呈條紋狀凹陷的凹部164。The small-diameter grinding tool 6B shown in Fig. 11 includes a small-diameter cylindrical processed portion 161 to which diamond particles 160 are attached to the surface, a shaft portion 162 fixed to the chuck 31b, and a convex portion on the upper side of the processed portion 161. Edge 163. Further, three recessed portions 164 which are stripe-shaped recessed are formed in the lower portion of the processed portion 161.
該小徑磨削工具6B由於直徑小,是將磨削工具6B插入工件W的孔部Wb內,並讓凹部164抵接於孔部Wb的內緣Wc,藉此對工件W的孔部Wb進行內形磨削或去角。Since the small diameter grinding tool 6B has a small diameter, the grinding tool 6B is inserted into the hole portion Wb of the workpiece W, and the concave portion 164 abuts against the inner edge Wc of the hole portion Wb, thereby the hole portion Wb of the workpiece W. Perform internal grinding or chamfering.
如此般藉由小徑磨削工具6B來磨削工件W的孔部Wb之內形,即使孔部Wb的口徑小而不容易加工的情況,仍能確實地進行磨削加工。Thus, the inner shape of the hole portion Wb of the workpiece W is ground by the small-diameter grinding tool 6B, and even if the diameter of the hole portion Wb is small and it is not easy to process, the grinding process can be surely performed.
接著,針對磨削裝置M之控制方法,首先參照第12圖~第14圖來說明運算工件W的磨削路徑時之控制方法。Next, with respect to the control method of the grinding apparatus M, first, a control method for calculating the grinding path of the workpiece W will be described with reference to FIGS. 12 to 14 .
如第12圖的流程圖所示,當起始後,首先在S1,將工件W的模型資料(外形、孔部等)輸入(安裝)於電子控制單元15(輸入步驟)。在該輸入作業,例如是將加工完畢工件Wo之設計資料(CAD資料)一旦使用其他軟體來轉換成磨削路徑等的磨削資料後,再輸入(安裝)於電子控制單元15。As shown in the flowchart of Fig. 12, after starting, first, at S1, the model data (outer shape, hole portion, and the like) of the workpiece W is input (mounted) to the electronic control unit 15 (input step). In the input operation, for example, the design data (CAD data) of the processed workpiece Wo is converted into a grinding material such as a grinding path using another software, and then input (installed) to the electronic control unit 15.
如此般的輸入作業結束後,接著在S2,將實際的工件Wi(以下稱實際工件)載置(搬入)於加工載台30,在吸附台70保持工件Wi(保持步驟)。該載置作業,是藉由上述搬運機械人2來進行。藉由該載置作業,將未加工的實際工件Wi載置在加工載台30的吸附台70上。After the completion of such an input operation, the actual workpiece Wi (hereinafter referred to as the actual workpiece) is placed (loaded) on the processing stage 30 in S2, and the workpiece Wi is held on the adsorption stage 70 (holding step). This mounting work is performed by the transport robot 2 described above. By this mounting operation, the unprocessed actual workpiece Wi is placed on the adsorption stage 70 of the processing stage 30.
然後,在S3,藉由攝影機23取得實際工件Wi和基準銷71、71的影像(攝影步驟)。第13圖係顯示該攝影機之攝影狀態。如第13圖所示,在磨削裝置M,藉由安裝在搬運機械人2(搬運工件Wi)之高位置的攝影機23,來攝影加工載台30上之工件Wi和基準銷71、71。如此般從上方較遠的位置來攝影加工載台30,可儘量減少所取得的工件Wi和基準銷71、71之影像資料的失真。Then, at S3, the image of the actual workpiece Wi and the reference pins 71, 71 is obtained by the camera 23 (photographing step). Figure 13 shows the photographing state of the camera. As shown in Fig. 13, in the grinding apparatus M, the workpiece Wi and the reference pins 71 and 71 on the processing stage 30 are imaged by the camera 23 attached to the high position of the transport robot 2 (transporting workpiece Wi). By photographing the processing stage 30 from a position farther from above, the distortion of the obtained image data of the workpiece Wi and the reference pins 71 and 71 can be minimized.
如此般取得的影像資料的例子如第14(a)圖所示。取得工件Wi和兩個基準銷71、71之影像資料,而算出各個的位置資料。An example of the image data thus obtained is shown in Fig. 14(a). The image data of the workpiece Wi and the two reference pins 71 and 71 are obtained, and each position data is calculated.
接著,在S4,根據基準銷71、71的位置來算出加工載台30的機械原點C(機械原點算出步驟)。在此,機械原點C是用來進行磨削加工之機械座標的基準,藉由規定此機械原點C可進行正確的磨削加工。Next, at S4, the machine origin C of the machining stage 30 is calculated based on the positions of the reference pins 71 and 71 (machine origin calculation step). Here, the machine origin C is a reference for the mechanical coordinates used for the grinding process, and the machine origin C can be specified to perform the correct grinding process.
機械原點C如第14(b)圖所示,是藉由兩個基準銷71、71之連結線L的中點來決定。又作為其他例,如虛線所示,進一步追加兩個基準銷71’、71’,將所追加的兩個基準銷71’、71’的連結線N和上述兩個基準銷71、71的連結線L雙方的交點,規定為機械原點C亦可。The mechanical origin C is determined by the midpoint of the connecting line L of the two reference pins 71 and 71 as shown in Fig. 14(b). Further, as another example, as shown by a broken line, two reference pins 71' and 71' are further added, and the connection line N of the two additional reference pins 71' and 71' and the connection of the two reference pins 71 and 71 are connected. The intersection of both sides of the line L is defined as the mechanical origin C.
接著,在S5,根據所取得的實際工件Wi的資料,算出實際工件Wi的外形Wa的重心位置P和孔部Wb的重心位置Q(重心位置算出步驟)。在此,重心位置是指圖形的重心位置,是根據工件W的外形形狀和孔部形狀來決定。第14(b)圖所示的黑圈P、Q,分別為實際工件Wi的外形Wa的重心位置和孔部Wb的重心位置。Next, in S5, based on the acquired data of the actual workpiece Wi, the gravity center position P of the outer shape Wa of the actual workpiece Wi and the gravity center position Q of the hole portion Wb (the gravity center position calculation step) are calculated. Here, the position of the center of gravity refers to the position of the center of gravity of the figure, and is determined according to the outer shape of the workpiece W and the shape of the hole. The black circles P and Q shown in Fig. 14(b) are the position of the center of gravity of the outer shape Wa of the actual workpiece Wi and the position of the center of gravity of the hole portion Wb.
然後在S6,讓實際工件Wi的重心位置(外形的重心位置P及孔部的重心位置Q)和模型Wm的重心位置(外形的重心位置Pm及孔部的重心位置Qm)一致。藉由使實際工件Wi的重心位置P、Q和模型Wm的重心位置Pm、Qm一致,能使實際工件Wi和模型Wm的差(位置資料差)變明確。第14(c)圖所示的狀態,是實際工件Wi和模型Wm(一點鏈線)的重心位置P、Q、Pm、Qm一致的狀態。如此般使重心位置P、Q、Pm、Qm一致,能讓實際工件Wi和模型Wm的差變明確。Then, in S6, the position of the center of gravity of the actual workpiece Wi (the center of gravity P of the outer shape and the position of the center of gravity Q of the hole) and the position of the center of gravity of the model Wm (the center of gravity Pm of the outer shape and the position of the center of gravity Qm of the hole) are matched. By matching the center-of-gravity positions P and Q of the actual workpiece Wi with the centroid positions Pm and Qm of the model Wm, the difference (positional data difference) between the actual workpiece Wi and the model Wm can be made clear. The state shown in Fig. 14(c) is a state in which the actual workpiece Wi and the center of gravity positions P, Q, Pm, and Qm of the model Wm (single chain line) match. In this way, the center-of-gravity positions P, Q, Pm, and Qm are made uniform, and the difference between the actual workpiece Wi and the model Wm can be made clear.
接著在S7,將加工載台30的機械原點C和實際工件Wi的重心位置P作比較,運算機械原點C和實際工件Wi的重心位置P之偏差量(橫方向的偏差量X、縱方向的偏差量Y、旋轉方向的偏差量θ)(偏差量運算步驟)。此外,也將實際工件Wi和模型Wm作比較,而根據外形差來運算削去量Δw。如此能使實際工件Wi的磨削量等變明確。Next, at S7, the machine origin C of the machining stage 30 is compared with the center of gravity position P of the actual workpiece Wi, and the deviation amount of the center of gravity C between the machine origin C and the actual workpiece Wi is calculated (the amount of deviation X in the lateral direction, vertical) The amount of deviation Y in the direction and the amount of deviation θ in the direction of rotation (the amount of deviation calculation step). Further, the actual workpiece Wi is compared with the model Wm, and the amount of cut Δw is calculated based on the difference in the shape. This makes it possible to clarify the amount of grinding of the actual workpiece Wi and the like.
第14(d)圖係顯示各個偏差量和削去量。相對於加工載台的機械原點C,實際工件Wi的重心位置P之偏差量例如該圖所示,朝左側偏差X,朝上側偏差Y,又朝右側傾斜θ。Figure 14(d) shows the amount of deviation and the amount of clipping. With respect to the machine origin C of the machining stage, the deviation amount of the center-of-gravity position P of the actual workpiece Wi is, for example, shown in the figure, with the deviation X toward the left side, the deviation Y toward the upper side, and the inclination θ toward the right side.
而且,關於削去量,寬度方向的削去量Δw1,是將實際工件Wi的寬度尺寸r1減去模型的寬度尺寸T1除以2而算出;長度方向的削去量Δw2,是將實際工件Wi的長度尺寸r2減去模型的長度尺寸T2除以2而算出。Further, regarding the amount of shaving, the amount of cut-off Δw1 in the width direction is calculated by dividing the width dimension r1 of the actual workpiece Wi by the width dimension T1 of the model by 2; the amount of cut-off Δw2 in the longitudinal direction is the actual workpiece Wi The length dimension r2 is calculated by subtracting the length dimension T2 of the model by two.
如此般求出寬度方向和長度方向的削去量Δw1、Δw2後,將其中數值大者決定為最終削去量Δw。如此般決定的理由在於,在進行磨削加工時,其軌跡與模型形狀相似,且將工件全周以一定的削去量削去,而藉由決定為數值大者,可確實地實施削去,而能磨削成更接近模型形狀的形狀。When the amounts of cut Δw1 and Δw2 in the width direction and the longitudinal direction are obtained in this manner, the larger value is determined as the final amount of cut Δw. The reason for this determination is that when the grinding process is performed, the trajectory is similar to the shape of the model, and the workpiece is cut off with a certain amount of cutting off the entire circumference, and by determining the value is large, the cutting can be surely performed. And can be ground into a shape closer to the shape of the model.
接著,在S8,對應於X、Y、θ之偏差量及削去量Δw,算出工件Wi的磨削路徑(磨削路徑算出步驟)。該磨削路徑,會依實際工件Wi的形狀、實際工件Wi的載置位置的變動而改變,因此在各個工件W是不同的。Next, in S8, the grinding path (grinding path calculation step) of the workpiece Wi is calculated corresponding to the amount of deviation of X, Y, and θ and the amount of cut Δw. Since the grinding path changes depending on the shape of the actual workpiece Wi and the position at which the actual workpiece Wi is placed, the workpiece W is different.
然後,在S9,根據所算出的磨削路徑將實際工件Wi磨削(磨削步驟)。該磨削作業,是藉由使磨削主軸31和加工載台30(加工平台33)移動來進行。該工件W的磨削作業,是使用上述大徑磨削工具6A或小徑磨削工具6B而對應於磨削部位來進行。Then, at S9, the actual workpiece Wi is ground (grinding step) based on the calculated grinding path. This grinding operation is performed by moving the grinding spindle 31 and the processing stage 30 (machining stage 33). The grinding operation of the workpiece W is performed in accordance with the grinding portion by using the large-diameter grinding tool 6A or the small-diameter grinding tool 6B.
最後,在S10,將實際工件Wi從加工載台30取出(搬出步驟)。該取出作業也是藉由上述搬運機械人2來進行,將加工完畢的工件Wo從加工載台30取出。Finally, at S10, the actual workpiece Wi is taken out from the processing stage 30 (the carry-out step). This take-out operation is also performed by the transport robot 2 described above, and the processed workpiece Wo is taken out from the processing stage 30.
接下來,在S11判斷作業是否結束。要繼續作業的情況(判斷為NO的情況),為了加工下個工件W而再度前進到上述S2。另一方面,在作業結束的情況(判斷為YES的情況,電源OFF的情況),就那樣前進到結束。Next, it is judged at S11 whether or not the job is ended. In the case where the work is to be continued (in the case of NO), the next workpiece W is processed to proceed to the above S2. On the other hand, in the case where the work is completed (when the determination is YES, the power is turned off), the process proceeds to the end.
藉由以上步驟來控制第一實施形態的磨削裝置M。The grinding apparatus M of the first embodiment is controlled by the above steps.
如以上般,該第一實施形態的磨削裝置M,是進行薄板玻璃(W)的端面磨削之磨削裝置M,事先安裝(儲存)薄板玻璃的模型Wm的資料(S1),根據攝影機23所取得的基準銷71、71之攝影資料來算出加工載台30的機械原點C(S4)。接著,根據攝影機23所取得的薄板玻璃(實際工件Wi)之攝影資料來求出薄板玻璃(實際工件Wi)的重心位置P(S5),將加工載台30的機械原點C和薄板玻璃(W)的重心位置P作比較來算出薄板玻璃的偏差量(橫方向的偏差量X、縱方向的偏差量Y、旋轉方向的偏差量θ)(S7),對應於該偏差量而運算磨削路徑(S8),根據所算出的磨削路徑讓磨削主軸31動作(S9)。As described above, the grinding apparatus M of the first embodiment is a grinding device M that performs end surface grinding of thin glass (W), and preliminarily mounts (stores) the data of the model Wm of the thin glass (S1), according to the camera. The mechanical origin C of the processing stage 30 is calculated by the obtained photographic data of the reference pins 71 and 71 (S4). Then, based on the photographic data of the thin plate glass (actual workpiece Wi) obtained by the camera 23, the center of gravity position P of the thin plate glass (actual workpiece Wi) is obtained (S5), and the machine origin C and the thin plate glass of the processing stage 30 are The center of gravity P of the W) is compared to calculate the amount of deviation of the thin glass (the amount of deviation X in the lateral direction, the amount of deviation Y in the longitudinal direction, and the amount of deviation θ in the direction of rotation) (S7), and the grinding is performed in accordance with the amount of deviation. In the path (S8), the grinding spindle 31 is operated in accordance with the calculated grinding path (S9).
因此,即使不在薄板玻璃(W)本身形成「構成基準之標記(記號)」等,藉由設置在加工載台30之基準銷71、71來求出「機械原點C」,可掌握薄板玻璃(W)之偏差量(X、Y、θ),根據所掌握的偏差量,即使是未形成標記(記號)等的薄板玻璃(W)也能進行正確的磨削加工。Therefore, even if the "marking mark (symbol)" or the like is formed in the thin glass (W) itself, the "machine origin C" can be obtained by the reference pins 71 and 71 provided on the processing stage 30, and the thin glass can be grasped. The amount of deviation (X, Y, θ) of (W) can be accurately ground even if the sheet glass (W) is not formed with a mark (mark) or the like based on the amount of deviation.
如此,對行動電話等的可攜式終端機之顯示畫面所使用之薄板玻璃(W)進行端面磨削之磨削裝置M,藉由利用攝影機23之攝影資料來進行磨削加工可謀求高精度的加工,且不須在薄板玻璃(W)的表面設置記號等就能進行磨削加工。In this way, the grinding device M that performs end surface grinding on the thin glass (W) used for the display screen of the portable terminal such as a mobile phone can achieve high precision by grinding using the photographic data of the camera 23. The processing can be performed without setting a mark or the like on the surface of the thin glass (W).
在本實施形態,雖是藉由複數個基準銷71、71來求出機械原點,除此外,藉由讓一部分突出之基準突出部來求出機械原點亦可,又藉由將一部分著色的基準部來求出機械原點亦可。In the present embodiment, the machine origin is obtained by a plurality of reference pins 71 and 71. In addition, the mechanical origin can be obtained by allowing a part of the protruding protrusions to be protruded, and a part is colored. The reference point can be used to determine the mechanical origin.
又在本實施形態,是讓薄板玻璃(W)的重心位置P和模型Wm的重心位置Pm一致,將薄板玻璃(W)和模型Wm作比較而運算磨削主軸31的削去量Δw。亦即,判斷薄板玻璃(W)比模型Wm大多少(例如檢測出長度方向的差值和寬度方向的差值,該「差值」的大小),對應於該大小來改變削去量Δw。Further, in the present embodiment, the center of gravity P of the thin plate glass (W) is aligned with the center of gravity Pm of the model Wm, and the amount of cut Δw of the grinding spindle 31 is calculated by comparing the thin plate glass (W) with the model Wm. That is, it is judged how much the thin plate glass (W) is larger than the model Wm (for example, the difference between the length direction and the width direction is detected, and the magnitude of the "difference"), and the amount of cut Δw is changed corresponding to the size.
因此,能讓薄板玻璃(W)的削去量Δw依各工件而改變,因此能以更正確的形狀及尺寸來將薄板玻璃(W)加工。如此,能更正確地掌握依各工件而改變之薄板玻璃的削去量Δw來進行磨削作業,藉此可高精度地加工複數個薄板玻璃。Therefore, the amount of cut Δw of the thin plate glass (W) can be changed depending on each workpiece, so that the thin plate glass (W) can be processed with a more accurate shape and size. In this way, the grinding operation can be performed by accurately grasping the amount of cut Δw of the thin glass which is changed depending on each workpiece, whereby a plurality of thin glass sheets can be processed with high precision.
此外,在本實施形態,是求出薄板玻璃的外形Wa之重心位置P和孔部形狀Wb的重心位置Q來算出工件Wi的重心位置。Further, in the present embodiment, the position of the center of gravity of the workpiece Wi is calculated by determining the position C of the center of gravity P of the outer shape Wa of the thin glass and the center of gravity Q of the hole shape Wb.
如此,藉由算出薄板玻璃的外形Wa之重心位置P和孔部形狀Wb的重心位置Q,即使是具有孔部的薄板玻璃,仍能確實地按照工件模型Wm的形狀來進行磨削。如此,即使是具有孔部Wb之形狀複雜的薄板玻璃(W),仍可正確地運算磨削路徑而高精度地進行磨削。By calculating the center-of-gravity position P of the outer shape Wa of the thin glass and the center-of-gravity position Q of the hole shape Wb, the thin plate glass having the hole portion can be surely ground in accordance with the shape of the workpiece model Wm. As described above, even in the case of the thin plate glass (W) having a complicated shape of the hole portion Wb, the grinding path can be accurately calculated and the grinding can be performed with high precision.
又在本實施形態,將基準銷71、71設置在隔著薄板玻璃(W)之兩側位置。Further, in the present embodiment, the reference pins 71 and 71 are provided at positions on both sides of the thin plate glass (W).
藉此,可將機械原點C至少設定在上述兩個基準銷71、71之連結線L上,而能設定在接近薄板玻璃(W)的重心位置P之位置。因此,能更正確地運算薄板玻璃(W)的偏差量。亦即,藉由使機械原點C接近薄板玻璃(W)的重心位置P,可減少偏差量運算時的誤差,如此可運算出正確的偏差量。因此可進行更高精度的磨削加工。Thereby, the machine origin C can be set at least on the connection line L of the two reference pins 71 and 71, and can be set to a position close to the center of gravity P of the thin plate glass (W). Therefore, the amount of deviation of the thin plate glass (W) can be calculated more accurately. That is, by bringing the machine origin C closer to the center of gravity P of the thin plate glass (W), the error in the calculation of the deviation amount can be reduced, and thus the correct amount of deviation can be calculated. Therefore, higher precision grinding can be performed.
此外,在本實施形態,藉由將基準銷71的前端部71a設定成與吸附台70的上面70a同高(hp=hs),能使其離攝影機23的距離和薄板玻璃(W)離攝影機23的距離大致一致。Further, in the present embodiment, by setting the distal end portion 71a of the reference pin 71 to be the same height (hp = hs) as the upper surface 70a of the adsorption stage 70, the distance from the camera 23 and the thin glass (W) can be separated from the camera. The distance between 23 is roughly the same.
藉此,藉由使基準銷71的被攝影點(前端部71a)與薄板玻璃(W)之高度方向的位置大致一致,能讓攝影機23的焦點對焦於兩者。藉此,可確實地同時攝影基準銷71和薄板玻璃(W),而能更正確地運算薄板玻璃(W)之偏差量。Thereby, by focusing the position of the photographed point (front end portion 71a) of the reference pin 71 and the position of the thin plate glass (W) substantially in the height direction, the focus of the camera 23 can be focused on both. Thereby, the reference pin 71 and the thin plate glass (W) can be photographed at the same time, and the amount of deviation of the thin plate glass (W) can be calculated more accurately.
接著參照第15圖~第21圖來說明本發明的第二實施形態。又關於與上述第一實施形態相同的構造或具有相同功能的構件等,是省略其說明。Next, a second embodiment of the present invention will be described with reference to Figs. 15 to 21 . The same components as those of the above-described first embodiment or members having the same functions and the like are omitted.
第二實施形態的磨削裝置M也是,如第15圖所示,與第一實施形態同樣的具有複數個(四個)加工單元3A、3B、3C、3D,但在第二實施形態,該等複數個加工單元3A、3B、3C、3D是排列成一列(如第15圖所示沿橫方向排列)。如此,藉由排成一列,由於加工單元3A、3B、3C、3D設置成接近磨削裝置M的外部側,比起第一實施形態,更容易進行加工單元3A、3B、3C、3D的維修等。The grinding apparatus M of the second embodiment also has a plurality of (four) processing units 3A, 3B, 3C, and 3D as in the first embodiment, as shown in Fig. 15, but in the second embodiment, The plurality of processing units 3A, 3B, 3C, and 3D are arranged in a line (arranged in the horizontal direction as shown in Fig. 15). Thus, by arranging the rows, since the machining units 3A, 3B, 3C, and 3D are disposed close to the outer side of the grinding apparatus M, it is easier to perform maintenance of the machining units 3A, 3B, 3C, and 3D than the first embodiment. Wait.
此外,複數個加工載台30設置成,可沿著與上述複數個加工單元3A、3B、3C、3D的配設方向交叉(正交)的方向(第15圖所示的縱方向)移動,具體而言,各加工載台30是可滑動地載置在沿縱方向配設的載台用軌道101上。而且,各加工載台30之軌道101的一側(第15圖的紙面下側),是作為藉由加工單元3A、3B、3C、3D來加工工件的加工位置;又軌道101的另一側(紙面上側),是作為待機位置。Further, the plurality of processing stages 30 are disposed so as to be movable in a direction (orthogonal direction shown in FIG. 15) that intersects (orthogonally) with the arrangement direction of the plurality of processing units 3A, 3B, 3C, and 3D. Specifically, each of the processing stages 30 is slidably placed on the stage rail 101 disposed in the longitudinal direction. Further, one side of the rail 101 of each processing stage 30 (the lower side of the paper surface of Fig. 15) is a processing position for processing the workpiece by the machining units 3A, 3B, 3C, and 3D; and the other side of the rail 101 (on the side of the paper), it is used as a standby position.
此外,沿著與上述載台用軌道101交叉(正交)的方向(第15圖的橫方向),設置將搬運機械人(圖示省略)安裝成可滑動之搬運機械人用軌道103。藉此,使搬運機械人可沿著複數個加工單元3A、3B、3C、3D的配設方向移動,而且,搬運機械人可和位於待機位置之加工載台30進行工件的交接。In addition, in a direction (horizontal direction of FIG. 15) that intersects (orthogonally) with the stage rail 101, a transport robot rail 103 that mounts a transport robot (not shown) to be slidable is provided. Thereby, the transport robot can be moved along the arrangement direction of the plurality of processing units 3A, 3B, 3C, and 3D, and the transport robot can perform the transfer of the workpiece with the processing stage 30 located at the standby position.
此外,鄰接於上述複數個加工單元3A、3B、3C、3D的側方,設置工件的投入取出載台4,在與該投入取出載台4相對向的位置,也設有其他的投入取出載台4。上述搬運機械人用軌道103延伸至該投入取出載台4的設置部位附近,藉此,上述搬運機械人可和投入取出載台4進行工件的交接。又上述兩個投入取出載台4當中,將一方當作僅載置未加工的工件之投入載台,並將另一方當作僅載置加工完畢的工件之取出載台亦可。Further, the input/removal stage 4 of the workpiece is provided adjacent to the side of the plurality of processing units 3A, 3B, 3C, and 3D, and other input and extraction loads are provided at positions facing the input/unloading stage 4. Taiwan 4. The transport robot rail 103 extends to the vicinity of the installation site of the input/unloading stage 4, whereby the transport robot can transfer the workpiece to and from the take-up stage 4. Further, among the two input/output loading stages 4, one of them may be regarded as an input stage on which only an unprocessed workpiece is placed, and the other may be regarded as a take-out stage on which only the processed workpiece is placed.
此外,在搬運機械人安裝:攝影時作為照明工件的照明手段之照明框(圖示省略),在攝影時,藉由搬運機械人之移動而使照明框移動至工件W的照明位置。Further, the transport robot mounts an illumination frame (not shown) that serves as an illumination means for illuminating the workpiece during photographing, and moves the illumination frame to the illumination position of the workpiece W by the movement of the transport robot during photographing.
此外,用來攝影工件之影像取得用的攝影機(圖示省略),是設置成可沿著複數個加工單元3A、3B、3C、3D的配設方向移動,該攝影機,在攝影時可移動至待機位置的加工載台30上之工件正上方。在此,攝影機,是在沿著上述複數個加工載台30的待機位置而設置於待機位置上方之攝影機用軌道(圖示省略)上,安裝成可滑動。該攝影機及上述照明框的具體構造可使用與上述第一實施形態相同的。又雖未具體圖示出,加工單元3A、3B、3C、3D之具體構造和加工載台30的具體構造可和第一實施形態大致相同。Further, a camera (not shown) for acquiring a video for photographing a workpiece is provided so as to be movable along an arrangement direction of a plurality of processing units 3A, 3B, 3C, and 3D, and the camera can be moved to a position during photographing. The workpiece on the processing stage 30 in the standby position is directly above. Here, the camera is slidably attached to a camera rail (not shown) that is disposed above the standby position along the standby position of the plurality of processing stages 30. The specific structure of the camera and the illumination frame can be the same as that of the first embodiment described above. Although not specifically illustrated, the specific structure of the machining units 3A, 3B, 3C, and 3D and the specific structure of the processing stage 30 can be substantially the same as those of the first embodiment.
此外,在第二實施形態,上述加工載台30係具備:可滑動地載置在上述載台用軌道101上之載台基台105、可裝卸地安裝於該載台基台105上之保持基台107。在該保持基台107上,載置固定著用來吸附工件之吸附台70(保持台)。Further, in the second embodiment, the processing stage 30 includes a stage base 105 that is slidably placed on the stage rail 101, and is detachably attached to the stage base 105. Abutment 107. On the holding base 107, a suction stage 70 (holding stage) for adsorbing a workpiece is placed and fixed.
而且,在該載台基台105上,可裝卸地安裝複數種(三種)的保持基台107。具體而言,在該載台基台105上可選擇性地安裝第一保持基台107、第二保持基台107以及第三保持基台107當中的一個。在該第一保持基台107,如第16圖所示豎設固定著分別保持小型工件之三個第一吸附台70。在該第二保持基台107,如第17圖所示豎設固定著用來保持一個大型工件之一個第二吸附台70。在該第三保持基台107,如第18圖所示豎設固定著分別保持中型工件之兩個第三吸附台70。亦即,在加工載台30可選擇性地設置:分別保持小型工件的複數個第一吸附台70、用來保持大型工件之第二吸附台70、分別保持中型工件的複數個第三吸附台70當中任一者。又在各保持基台107上載置複數個磨削工具6。Further, a plurality of (three types) holding bases 107 are detachably attached to the stage base 105. Specifically, one of the first holding base 107, the second holding base 107, and the third holding base 107 can be selectively mounted on the stage base 105. In the first holding base 107, as shown in Fig. 16, three first suction stages 70 each holding a small workpiece are vertically fixed. In the second holding base 107, as shown in Fig. 17, a second suction stage 70 for holding a large workpiece is vertically fixed. In the third holding base 107, as shown in Fig. 18, two third suction stages 70 respectively holding the medium-sized workpieces are vertically fixed. That is, the processing stage 30 can be selectively provided with a plurality of first adsorption stages 70 for holding small workpieces, a second adsorption stage 70 for holding large workpieces, and a plurality of third adsorption stages for respectively holding medium-sized workpieces. 70 of any. Further, a plurality of grinding tools 6 are placed on each of the holding bases 107.
在上述第一保持基台107、第二保持基台107以及第三保持基台107、和上述載台基台105,設有用來定位安裝位置之定位手段。具體而言,保持基台107,是在各保持基台107的下部具有大致相同形狀的基台板109,在各基台板109之兩側附近穿設一對的定位孔部111。而且,在前述載台基台105,突設可插通於該定位孔部111之定位銷113。因此,藉由在上述定位孔部111插通定位銷113,可將各保持基台107定位載置於載台基台105上。The first holding base 107, the second holding base 107, the third holding base 107, and the stage base 105 are provided with positioning means for positioning the mounting position. Specifically, the holding base 107 is a base plate 109 having substantially the same shape in the lower portion of each of the holding bases 107, and a pair of positioning hole portions 111 are bored in the vicinity of both sides of each of the base plates 109. Further, a positioning pin 113 that can be inserted into the positioning hole portion 111 is protruded from the stage base 105. Therefore, each of the holding bases 107 can be positioned and placed on the stage base 105 by inserting the positioning pins 113 in the positioning hole portions 111.
再者,在上述第一保持基台107、第二保持基台107以及第三保持基台107、和上述載台基台105,設有用來將兩者固定之固定手段。具體而言,在各保持基台107的基台板109上穿設複數個螺栓插通孔部(圖示省略),在前述載台基台105上,在對應於該螺栓插通孔部的位置形成供螺栓115螺合的母螺紋117。因此,藉由螺栓115,可將定位載置於上述載台基台105上之保持基台107予以固定。又藉由將螺栓115卸下,可讓保持基台107脫離載台基台105。Further, the first holding base 107, the second holding base 107, the third holding base 107, and the stage base 105 are provided with fixing means for fixing the both. Specifically, a plurality of bolt insertion hole portions (not shown) are bored in the base plate 109 of each holding base 107, and the carrier base 105 corresponds to the bolt insertion hole portion. The position forms a female thread 117 for the bolt 115 to be screwed. Therefore, the holding base 107 which is placed on the stage base 105 can be fixed by the bolts 115. Further, the retaining base 107 can be detached from the stage base 105 by removing the bolts 115.
在上述載台基台105,朝攝影機側(上側)豎設複數個(八個)基準銷71(基準部位)。該基準銷71如第16圖~第18圖所示,是配置在比設置在加工載台30之吸附台70的上面(承接面)更外側的位置,而配置在比該吸附台70所保持的工件外形更外側。又上述吸附台70的上面,其外形設計成與工件外形大致相同的形狀,且比工件外形稍小。On the stage base 105, a plurality of (eight) reference pins 71 (reference portions) are erected toward the camera side (upper side). As shown in FIGS. 16 to 18, the reference pin 71 is disposed at a position outside the upper surface (the receiving surface) of the suction stage 70 provided on the processing stage 30, and is disposed to be held by the suction stage 70. The shape of the workpiece is more lateral. Further, the upper surface of the adsorption stage 70 is shaped to have substantially the same shape as the outer shape of the workpiece, and is slightly smaller than the outer shape of the workpiece.
更詳細的說,這八個基準銷71,是在載台基台105上面所固定的四個台座119上分別固定一對。這四個台座119,是分別配置在所要載置固定的保持基台107的前方、後方、右前方及左後方。此外,加工載台30係具有:為了防止水滴和灰塵等的附著而對各基準銷71噴吹空氣之吹氣手段(圖示省略)。在上述台座119附設有:作為該吹氣手段之吹氣噴嘴、以及用來對該吹氣噴嘴供應空氣之空氣供應連接口121。More specifically, the eight reference pins 71 are respectively fixed to a pair of four pedestals 119 fixed on the stage base 105. The four pedestals 119 are respectively disposed in front, rear, right front, and left rear of the holding base 107 to be placed and fixed. Further, the processing stage 30 has an air blowing means (not shown) for blowing air to each of the reference pins 71 in order to prevent adhesion of water droplets, dust, or the like. The pedestal 119 is provided with an air blowing nozzle as the air blowing means and an air supply connecting port 121 for supplying air to the air blowing nozzle.
此外,基準銷71不僅是在上述載台基台105上,也形成在用來保持小型工件之第一保持基台107。在該第一保持基台107豎設兩個基準銷71。這兩個基準銷71配置在中央吸附台70的兩側,一方的基準銷71配置在前方側,另一方的基準銷71配置在後方側。此外,這二個基準銷71也是固定在台座119(與上述台座119同樣的附設有吹氣噴嘴及空氣供應連接口121)。Further, the reference pin 71 is formed not only on the stage base 105 but also on the first holding base 107 for holding a small workpiece. Two reference pins 71 are erected on the first holding base 107. The two reference pins 71 are disposed on both sides of the center adsorption stage 70, and one of the reference pins 71 is disposed on the front side, and the other reference pin 71 is disposed on the rear side. Further, the two reference pins 71 are also fixed to the pedestal 119 (the same air blowing nozzle and air supply connection port 121 as the pedestal 119).
又上述各基準銷71,與第一實施形態同樣的設定成:使被攝影點(前端部)的高度(上下方向的位置)與吸附台70上面的高度相同。Further, each of the reference pins 71 is set such that the height (the position in the vertical direction) of the photographed point (front end portion) is the same as the height on the upper surface of the suction stage 70, as in the first embodiment.
此外,在各保持基台107的吸附台70上,與第一實施形態同樣地設有吸氣口(圖示省略),且設有用來讓該吸氣口成為負壓之負壓連接口123。在本實施形態,如第21圖及第18圖所示,設置在第一保持基台107上之三個吸附台70以及設置在第三保持基台107上之兩個吸附台70,其上面分別形成不同的大小。藉此,在同一保持基台107上可保持多種形狀的工件。又使設置在第一保持基台107上的三個吸附台70的上面成為相同形狀,而讓各吸附台70可保持相同形狀之複數個工件,也是屬於可適當設計變更的事項。Further, in the adsorption stage 70 of each holding base 107, an intake port (not shown) is provided in the same manner as in the first embodiment, and a negative pressure connection port 123 for making the intake port a negative pressure is provided. . In the present embodiment, as shown in Figs. 21 and 18, three adsorption stages 70 provided on the first holding base 107 and two adsorption stages 70 provided on the third holding base 107 are provided thereon. Different sizes are formed separately. Thereby, workpieces of various shapes can be held on the same holding base 107. Further, the upper surfaces of the three adsorption stages 70 provided on the first holding base 107 have the same shape, and the plurality of workpieces in which the adsorption stages 70 can hold the same shape are also suitable for design change.
在上述第二實施形態的磨削裝置,在加工載台30上可選擇性地設置複數種的吸附台70,因此可對應於磨削對象之工件大小,而選擇適當的吸附台來正確地進行磨削作業。再者,在載置固定第一或第三保持基台107的情況,可在加工載台30上設置複數個吸附台70。藉此,不須變更保持基台107,可對應於工件大小而選擇更適當的吸附台70來進行磨削作業。In the grinding apparatus according to the second embodiment, a plurality of types of adsorption stages 70 can be selectively provided on the processing stage 30. Therefore, an appropriate adsorption stage can be selected to accurately perform the size of the workpiece to be ground. Grinding work. Further, in the case where the first or third holding base 107 is fixed, a plurality of suction stages 70 may be provided on the processing stage 30. Thereby, it is possible to select a more appropriate suction stage 70 to perform the grinding operation in accordance with the size of the workpiece without changing the holding base 107.
此外,在上述第二實施形態,係具有複數個基準銷71,該等複數個基準銷71分別配置在吸附台70上所保持之各工件外形的外側,因此可在接近工件的位置設置基準銷71,如此使「機械原點」接近工件的重心位置,而能減少運算偏差量時的誤差。再者,由於上述基準銷71位在隔著各工件W之兩側位置,能以工件兩側的基準銷71之連結線上所形成的點作為「機械原點」,藉此能以接近工件重心位置之位置作為機械原點。而且,在上述第二實施形態,由於是隔著工件而配置相對向之至少兩對的基準銷71,藉由以各對的基準銷71之連結線的交點作為「機械原點」,可讓該機械原點與工件的重心位置更接近。因此,可更正確地運算工件的偏差量。Further, in the second embodiment described above, the plurality of reference pins 71 are disposed, and the plurality of reference pins 71 are disposed outside the outer shape of each of the workpieces held by the suction table 70. Therefore, the reference pin can be disposed at a position close to the workpiece. 71. In this way, the "machine origin" is approached to the center of gravity of the workpiece, and the error in calculating the deviation amount can be reduced. Further, since the reference pin 71 is positioned at both sides of the workpiece W, the point formed on the connecting line of the reference pins 71 on both sides of the workpiece can be used as the "mechanical origin", thereby being able to approach the center of gravity of the workpiece. The position of the position is used as the machine origin. Further, in the second embodiment, the reference pin 71 facing at least two pairs is disposed with the workpiece interposed therebetween, and the intersection of the connecting lines of the pair of reference pins 71 is used as the "mechanical origin". The mechanical origin is closer to the center of gravity of the workpiece. Therefore, the amount of deviation of the workpiece can be calculated more accurately.
再者,豎設於上述基台板109之基準銷71,由於位在吸附台70上所保持的工件外形的外側,基準銷71不致被工件遮蔽,因此即使變更設置第一、第二、第三吸附台70之任一者,仍不須更換該基準銷71,而能正確地進行攝影作業。因此,能使加工載台的構造變簡單。Further, the reference pin 71 erected on the base plate 109 is placed outside the outer shape of the workpiece held on the suction stage 70, and the reference pin 71 is not shielded by the workpiece, so even if the first, second, and second settings are changed The third adsorption stage 70 does not need to replace the reference pin 71, and the photographing operation can be performed correctly. Therefore, the configuration of the processing stage can be simplified.
又本發明並不限定於上述實施形態,在本發明所意圖的範圍內可適當地進行設計變更。Further, the present invention is not limited to the above-described embodiments, and design changes can be appropriately made within the scope of the invention.
上述實施形態之磨削裝置之工件W,雖是行動電話用的薄板玻璃,但例如為可攜式音響機器用的薄板玻璃亦可,又亦可為可攜式遊戲機用的薄板玻璃。再者,亦可為可攜式導航機用的薄板玻璃、可攜式電視用的薄板玻璃等。The workpiece W of the grinding apparatus of the above-described embodiment is a thin plate glass for a mobile phone, but may be, for example, a thin plate glass for a portable audio device, or a thin plate glass for a portable game machine. Furthermore, it may be a thin plate glass for a portable navigation machine or a thin plate glass for a portable television.
此外,關於磨削裝置的整體構造也是,並不限定於上述實施形態,例如加工單元可為一個,相反地具有五個六個等更多的加工單元也是包含在本發明所意圖的範圍內。Further, the overall configuration of the grinding device is not limited to the above embodiment, and for example, one processing unit may be provided. Conversely, having five or more processing units is also included in the scope of the present invention.
再者,在上述第一實施形態雖是說明,在磨削作業時,沿工件W的長邊方向讓磨削主軸31移動,沿工件W的短邊方向讓工件加工平台33(加工載台30)移動,但在本發明,只要在工件W的平面方向讓工件W和磨削主軸31相對移動即可。例如,僅磨削主軸31移動,亦即讓磨削主軸31沿工件W的長邊方向及短邊方向的雙方向移動,以進行工件W的磨削亦可。Further, in the first embodiment, the grinding spindle 31 is moved in the longitudinal direction of the workpiece W during the grinding operation, and the workpiece processing table 33 is placed in the short side direction of the workpiece W (the processing stage 30) The movement is, but in the present invention, the workpiece W and the grinding spindle 31 are relatively moved in the plane direction of the workpiece W. For example, only the grinding spindle 31 is moved, that is, the grinding spindle 31 is moved in both directions in the longitudinal direction and the short-side direction of the workpiece W to perform grinding of the workpiece W.
再者,關於磨削工具6也是,並不限定於本實施形態所列舉的情況,例如亦可為球形的磨削工具、圓盤狀的磨削工具、或圓錐狀的磨削工具等。此外,關於磨石材料也是,並不限定於鑽石。Further, the grinding tool 6 is not limited to the case described in the embodiment, and may be, for example, a spherical grinding tool, a disk-shaped grinding tool, or a conical grinding tool. In addition, the grinding stone material is also not limited to diamonds.
此外,在第二實施形態雖是說明,將具備複數個保持台之一個保持基台安裝於載台基台,但例如將複數個保持台分別安裝在載台基台亦可。在此情況,可在各保持台之間,從載台基台的上面突設基準銷。此外,如此般在保持台間從載台基台突設基準銷的情況,是將該基準銷可裝卸地安裝於載台基台,或是在大型(或中型)的保持基台上形成可收容該基準銷之孔部,而進行如此般的設計變更亦可。Further, in the second embodiment, although one holding base having a plurality of holding stages is attached to the stage base, for example, a plurality of holding stages may be attached to the stage base, respectively. In this case, the reference pin can be protruded from the upper surface of the stage base between the holding stages. Further, in the case where the reference pin is protruded from the stage base between the holding stages, the reference pin is detachably attached to the stage base or formed on a large (or medium-sized) holding base. It is also possible to accommodate such a design change by accommodating the hole portion of the reference pin.
M...磨削裝置M. . . Grinding device
W...工件(薄板玻璃)W. . . Workpiece (thin plate glass)
Wi...未加工的工件Wi. . . Unprocessed workpiece
Wo...加工完畢的工件Wo. . . Processed workpiece
Wm...工件模型Wm. . . Workpiece model
15...電子控制單元15. . . Electronic control unit
23...攝影機twenty three. . . camera
30...加工載台30. . . Processing stage
31...磨削主軸31. . . Grinding spindle
71...基準銷71. . . Benchmark
C...機械原點C. . . Mechanical origin
P...工件外形的重心位置P. . . Center of gravity of the workpiece shape
Q...孔部形狀的重心位置Q. . . Center of gravity of the shape of the hole
第1圖係顯示本發明的磨削裝置之第一實施形態的俯視圖。Fig. 1 is a plan view showing a first embodiment of the grinding apparatus of the present invention.
第2圖係第1圖的磨削裝置之前視圖。Fig. 2 is a front view of the grinding apparatus of Fig. 1.
第3圖係第1圖的磨削裝置之側視圖。Figure 3 is a side view of the grinding apparatus of Figure 1.
第4圖係第1圖的磨削裝置之搬運機械人的三面圖,(a)為前視圖,(b)為側視圖,(c)為俯視圖。Fig. 4 is a three-side view of the transport robot of the grinding apparatus of Fig. 1, (a) is a front view, (b) is a side view, and (c) is a plan view.
第5圖係第1圖的磨削裝置的搬運機械人之搬運時的動作之說明圖;(a)顯示從基準狀態至工件保持開始狀態,(b)顯示從工件保持開始狀態至朝向加工載台之工件搬運狀態。Fig. 5 is an explanatory view showing the operation of the transport robot of the grinding apparatus of Fig. 1; (a) shows the state from the reference state to the workpiece holding start state, and (b) shows the state from the workpiece holding start state to the machining load. The workpiece handling status of the table.
第6圖係第1圖的磨削裝置的搬運機械人之搬運時的動作之說明圖;(c)顯示從朝向加工載台之工件搬運狀態至攝影機攝影狀態,(d)顯示從攝影機攝影狀態至下個工件的保持開始狀態。Fig. 6 is an explanatory view showing the operation of the transport robot of the grinding apparatus of Fig. 1; (c) shows the conveyance state from the workpiece toward the processing stage to the photographing state of the camera, and (d) shows the photographing state from the camera. The hold state to the next workpiece.
第7圖係第1圖的磨削裝置之第二加工單元的俯視圖。Figure 7 is a plan view of a second processing unit of the grinding apparatus of Figure 1.
第8圖係第1圖的磨削裝置之第二加工單元之包含局部截面的前視圖。Figure 8 is a front elevational view, partially in section, of a second processing unit of the grinding apparatus of Figure 1.
第9圖係第1圖的磨削裝置之第二加工單元之包含局部截面的側視圖。Figure 9 is a side elevational view, partially in section, of a second processing unit of the grinding apparatus of Figure 1.
第10圖係在第1圖的磨削裝置使用大徑磨削工具時之包含局部截面之詳細側視圖。Fig. 10 is a detailed side view showing a partial cross section when the large-diameter grinding tool is used in the grinding apparatus of Fig. 1.
第11圖係在第1圖的磨削裝置使用小徑磨削工具時之包含局部截面之詳細側視圖。Fig. 11 is a detailed side view showing a partial cross section when the grinding device of Fig. 1 uses a small-diameter grinding tool.
第12圖係顯示第1圖的磨削裝置之控制方法的流程圖。Fig. 12 is a flow chart showing a control method of the grinding apparatus of Fig. 1.
第13圖係顯示第1圖的磨削裝置之藉由攝影機攝影加工載台的狀態之側視圖。Fig. 13 is a side view showing a state in which the stage is processed by a camera in the grinding apparatus of Fig. 1.
第14(a)~(d)圖係第1圖的磨削裝置所攝影的資料之處理及運算方法之說明圖。Fig. 14 (a) to (d) are explanatory views of processing and calculation methods of data photographed by the grinding apparatus of Fig. 1.
第15圖係顯示本發明的磨削裝置的第二實施形態之俯視圖。Fig. 15 is a plan view showing a second embodiment of the grinding apparatus of the present invention.
第16圖係第15圖的磨削裝置之設置有第一吸附台的加工載台之俯視圖。Fig. 16 is a plan view showing a processing stage in which the first adsorption stage is provided in the grinding apparatus of Fig. 15.
第17圖係第15圖的磨削裝置之設置有第二吸附台的加工載台之俯視圖。Fig. 17 is a plan view showing a processing stage in which the second adsorption stage is provided in the grinding apparatus of Fig. 15.
第18圖係第15圖的磨削裝置之設置有第三吸附台的加工載台之俯視圖。Fig. 18 is a plan view showing a processing stage in which a third adsorption stage is provided in the grinding apparatus of Fig. 15.
第19圖係第15圖的磨削裝置之吸附台脫離狀態之加工載台的俯視圖。Fig. 19 is a plan view showing a processing stage in which the adsorption stage of the grinding apparatus of Fig. 15 is separated.
第20圖係第15圖的磨削裝置之第一保持基台的俯視圖。Figure 20 is a plan view of the first holding base of the grinding apparatus of Figure 15.
第21圖係第15圖的磨削裝置之第一保持基台的前視圖。Figure 21 is a front elevational view of the first holding base of the grinding apparatus of Figure 15.
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