201130601 六、發明說明： 【發明所屬之技術領域】 本發明係關於磨削裝置及磨削方法以及薄板狀構件之 製造方法。 【先前技術】 磨削裝置，是用於進行大致方形之薄板狀的被加工物 0 等（例如行動電話等的可攜式終端機所使用之薄板玻璃）之 端面磨削。該可攜式終端機的螢幕，大多是使用薄板玻璃 。這種薄板玻璃，一般是從大形的玻璃板，以大槪的工件 形狀切出，將所切出之玻璃板的端面藉由磨削裝置正確地 磨削，而形成既定的形狀。特別是，在進行磨削時，同時 也進行去角加工，以防止薄板玻璃的端面發生缺口。 例如，專利文獻1揭示一種用來磨削薄板玻璃的端面 之磨削裝置（去角裝置）。專利文獻1所記載的磨削裝置， Q 是從薄板玻璃的上方藉由攝影機攝影薄板玻璃的端緣（外 緣），算出薄板玻璃之磨削位置和磨削量，並控制磨削工 具和平台（table)的動作，藉此對薄板玻璃的端面進行磨削（ 去角）。 如此般，藉由利用攝影機之攝影資料來磨削薄板玻璃 的端面，可提昇薄板玻璃的加工精度，而能提高薄板玻璃 的尺寸精度。此外’不須像仿形加工那樣準備構成樣板 (master)的治具，因此可確保寬廣的加工空間’而能謀求 磨削裝置的小型化。 -5- 201130601 然而，近年來，例如在行動電話等的可攜式終端機， 以可攜式終端機的整面或大致整面作爲顯示畫面的構造越 來越多。這種可攜式終端機，大多爲畫面成爲觸控面板的 情況，而將整面藉由薄板玻璃覆蓋之可攜式終端機越來越 多。 如此般將整面都用薄板玻璃覆蓋時，由於薄板玻璃的 形狀必須配合可攜式終端機的形狀，因此薄板玻璃必須配 合可攜式終端機之揚聲器等的形狀，而進行複雜形狀的磨 削。此外，該薄板玻璃，由於是作爲可攜式終端機的外表 面來使用，而有無法在玻璃表面施加凹部等的記號之限制 〇 在磨削這種可攜式終端機用的薄板玻璃的情況，例如 雖可考慮藉由仿形加工進行磨削的方法，但如前述般必須 使用樣板的治具，而存在著加工空間增加的問題，又在進 行內周加工（孔部之磨削加工）時，會有變得更麻煩的問題 〇 因此，如前述專利文獻1所示，可考慮利用攝影機之 攝影資料來對薄板玻璃進行磨削。如此般利用攝影機來進 行磨削，可提昇薄板玻璃之磨削精度，且能進行複雜的切 削加工。 然而，依據該專利文獻1的技術，必須在薄板玻璃的 表面附加「定位標記」。該技術是讀取定位標記來自動計 測加工尺寸。 然而如前述般，用於可攜式終端機之薄板玻璃，由於 -6- 201130601 是作爲外表面而能被看見，因此無法在表面上附加凹部等 的記號。於是，雖可考慮使用墨水等印刷於表面’但在磨 削加工後，必須另外除去墨水等，而帶來加工步驟增加的 問題。 〔專利文獻1〕日本特開2007-223005號公報 【發明內容】 0 於是，本發明的目的是爲了提供一種磨削裝置，是對 行動電話等的可攜式終端機之顯示畫面所使用之薄板玻璃 等的被加工物進行端面磨削之磨削裝置，藉由利用攝影機 之攝影資料來進行磨削加工以謀求高精度的加工，且不須 在被加工物的表面設置記號等就能進行磨削加工。並提供 磨削方法以及薄板狀構件之製造方法。 本發明的磨削裝置， 是用來進行薄板狀被加工物之端面磨削之磨削裝置， Q 係具備： 將上述被加工物以加工狀態予以保持之加工載台 (stage)、 設置於上述加工載台且構成所保持的被加工物進行加 工時的加工基準之基準部位、 設置在與上述被加工物大致正交的位置而用來攝影上 述被加工物及上述基準部位之攝影機、以及 用來磨削上述被加工物的端部之磨削主軸； 且具備： 201130601 事先儲存被加工物的工件模型資料之記憶手段、 根據上述攝影機所取得之基準部位的攝影資料來 加工載台的機械原點之機械原點算出手段、 根據上述攝影機所取得之被加工物的攝影資料來;^ & 被加工物的重心位置之重心位置算出手段、 將上述加工載台的機械原點和被加工物的重心位置作 比較而運算被加工物的偏差量之偏差量運算手段、 對應於該偏差量運算手段所運算出的偏差量來運算上 述磨削主軸的磨削路徑之磨削路徑運算手段、以及 根據該磨削路徑運算手段所運算出的磨削路徑來讓磨 削主軸動作之動作控制手段。 該磨削裝置，事先將工件模型的資料儲存於記憶手段 ，根據攝影機所取得之攝影資料來算出加工載台的機械原 點和被加工物（實際工件）之重心位置，將該機械原點和重 心位置作比較，藉此運算被加工物（實際工件）之偏差量（橫 方向的偏差量X、縱方向的偏差量Y'旋轉方向的偏差量 0 )。如此’對應於運算所求出的偏差量，運算磨削主軸 之磨削路徑，根據該磨削路徑讓磨削主軸動作，而進行被 加工物（實際工件）的端面磨削。 因此’即使不在被加工物本身形成「構成基準之標記 (記號）」等’仍能利用設置於加工載台之基準部位來求出 「機械原點」，以掌握被加工物之偏差量。依據所掌握的 偏差量，可對未形成標記（記號）等的被加工物進行正確地 磨削。 -8 - 201130601 此外，本發明的磨削方法’ 是將薄板狀的被加工物的端面藉由磨削主軸進行磨削 之磨削方法，係具有以下步驟： 將上述被加工物以加工狀態保持於加工載台之保持步 驟、 將設置於上述加工載台之基準部位和加工載台上所保 持的被加工物藉由攝影機進行攝影之攝影步驟、 根據上述攝影機所取得之基準部位的攝影資料來算出 加工載台的機械原點之機械原點算出步驟、 根據上述攝影機所取得之被加工物的攝影資料來求出 被加工物的重心位置之重心位置算出步驟、 將上述加工載台的機械原點和被加工物的重心位置作 比較而運算被加工物的偏差量之偏差量運算步驟、 對應於該偏差量運算步驟所運算出的偏差量來運算上 述磨削主軸的磨削路徑之磨削路徑運算步驟、以及 根據該磨削路徑運算步驟所運算出的磨削路徑來讓磨 削主軸動作之磨削步驟。 該磨削方法，先將工件模型的資料儲存於記憶手段， 根據攝影機所取得之攝影資料來算出加工載台的機械原點 和被加工物的重心位置，將該機械原點和重心位置作比較 ，藉此運算被加工物之偏差量。如此，對應於運算所求出 的偏差量，運算磨削主軸之磨削路徑，根據該磨削路徑讓 磨削主軸動作，而進行被加工物的端面磨削。因此，即使 不在被加工物本身形成「構成基準之標記（記號）」等，仍 201130601 能利用設置於加工載台之基準部位來求出「機械原點」， 以掌握被加工物之偏差量。依據所掌握的偏差量’可對未 形成標記（記號）等的被加工物進行正確地磨削。 此外，求出機械原點之「基準部位」’可以是朝向攝 影機側豎設之「基準銷」’也可以是讓加工載台的一部分 突出而構成之「基準突出部」。再者’亦可爲將一部分著 色而構成的「基準部」。此外，該「基準部位」爲了避免 受到工件的影響，宜設置在不與工件重疊的位置，亦即設 置在比工件的外形更外側。再者，在設有讓磨削主軸動作 之「動作控制裝置」的情況，讓該動作控制裝置與「加工 載台」同時動作，而讓磨削主軸和加工載台動作來進行被 加工物的磨削亦可。 在本發明較佳爲，讓上述重心位置算出手段所求出之 被加工物的重心位置和工件模型的重心位置一致，將被加 工物和工件模型作比較，藉由削去量運算手段來運算磨削 主軸之削去量。藉此，讓被加工物（實際工件）的重心位置 和工件模型的重心位置一致，將被加工物（實際工件）和工 件模型作比較，運算出應對被加工物（實際工件）實施的削 去程度，而決定其削去量。亦即，判斷被加工物（實際工 件）比工件模型大多少（例如，檢測出長度方向的差値和寬 度方向的差値，該「差値」的大小），對應於該大小來改 變削去量。 因此，可依每個工件來改變被加工物的削去量，而能 以更正確的形狀及尺寸進行被加工物的加工。 -10 - 201130601 如此，能更正確地掌握依每個工件而改變之被加工物 的削去量來進行磨削加工，因此可對複數個被加工物進行 高精度的加工。 此外，在本發明較佳爲，上述重心位置算出手段係具 備：求出被加工物的外形之重心位置的外形重心算出手段 、以及求出被加工物的孔部形狀之重心位置的孔部重心算 出手段。藉此，即使是具有孔部的薄板玻璃，仍能確實地 0 按照工件模型的形狀（孔部的位置等）來進行薄板玻璃的磨 削。如此，即使是具有孔部等之形狀複雜的薄板玻璃，仍 可正確地規定磨削位置，而高精度地進行薄板玻璃的磨削 〇 此外，在本發明較佳爲，上述基準部位的被攝影點離 攝影機的距離設定成和被加工物離攝機機的距離大致一致 。如此般，藉由使基準部位的被攝影點（例如基準銷的情 形是前端部）離攝影機的距離和被加工物離攝機機的距離 Q 大致一致，能讓攝影機的焦點對焦於兩者。藉此，可確實 地同時攝影基準部位和被加工物，而能更正確地運算被加 工物之偏差量。 此外，在本發明較佳爲，上述基準部位至少設置在隔 著被加工物之兩側位置。藉此，藉由將基準部位至少設置 在薄板玻璃的兩側位置’能以至少兩個基準部位的連結線 上所形成的點作爲「機械原點」，藉此能以接近被加工物 的重心位置之位置作爲機械原點。 因此可更正確地運算出被加工物的偏差量。亦即，由 -11 - 201130601 於「機械原點」接近被加工物的重心位置，可 運算時的誤差，如此可運算出正確的偏差量。 更高精度的被加工物之磨削加工。 此外，在本發明較佳爲，在上述加工載台 設置：可分別保持小型的被加工物之複數個第 可保持大型的被加工物之第二保持台之任一方 準部位配置於：在設置第一保持台時比第一保 持的小型被加工物的外形更外側，在設置第二 第二保持台上所保持的大型被加工物的外形更 藉此，由於能在加工載台設置複數個第一 是小型被加工物的話，可在一個加工載台上保 加工物。此外，由於能在加工載台上選擇性地 持台及第二保持台，藉由對應於被加工物的大 可適當且確實地保持被加工物。 再者，即使將第一保持台及第二保持台之 於加工載台的情況，由於基準部位位於比被加 更外側，因此基準部位不致被被加工物遮蔽。 第一保持台及第二保持台的一方變更爲另一方 不須更換如上述般位於大型及小型的被加工物 部位，而能使加工載台的構造變簡單。 此外，在本發明較佳爲，上述加工載台係 持被加工物之複數個保持台，上述基準部位設 該等複數個基準部位分別配置在上述複數個保 持的各被加工物的外形之外側。 減低偏差量 因此可進行 可選擇性地 一保持台、 :將上述基 持台上所保 保持台時比 π側。 保持台，若 持複數個被 設置第一保 小之保持台 任一者設置 工物的外形 如此，在將 而設置時， 外側之基準 具備分別保 有複數個， 持台上所保 -12- 201130601 藉此，可在加工載台設置複數個保持 加工載台上保持複數個被加工物。 此外，由於基準部位設置在各保持台 加工物之外側，可在接近被加工物的位置設 因此「機械原點」變得接近被加工物的重心 低運算偏差量時的誤差。 又本發明的對象不僅限於上述磨削裝置 0 其對象也包含具備上述磨削方法之薄板狀構 再者，在本發明，攝影機設置位置之「 致正交的位置」，不僅限於攝影機的攝影方 被加工物的平面完全正交的情況，也包含在 斜的情況。亦即，上述「大致正交」，是根 工精度和攝影機的攝影精度等的關係來決定 影機所攝影的攝影資料而如本發明般進行磨 Q 合所要求的端面加工精度的範圍，攝影機的 對於被加工物的平面呈傾斜亦可。 如以上所說明，在本發明，即使不在薄 加工物本身形成構成基準之標記（記號）等， 於加工載台之基準部位來求出「機械原點」 工物之偏差量。而且依據所掌握的偏差量， 記（記號）等的被加工物進行磨削加工。如此 行動電話等的可攜式終端機的顯示畫面所使 進行端面磨削的情況，藉由利用攝影機的攝 ，而能在一個 所保持的各被 置基準部位， 位置，而能減 及磨削方法， 件的製造方法 與被加工物大 向軸與薄板狀 一定範圍內傾 據所要求的加 ，只要利用攝 削的結果可符 攝影方向軸相 板玻璃等的被 仍能利用設置 ，以掌握被加 可對未形成標 ，例如即使對 用之薄板玻璃 影資料來進行 -13- 201130601 磨削加工，可實施高精度的加工，又不須在被加工物的表 面設置記號等而能進行磨削加工。 【實施方式】 以下，根據圖式來詳細敘述本發明的實施形態。 <第一實施形態> 首先，參照第1圖〜第3圖來說明磨削裝置之整體構 造。又在各圖中，雖未具體描繪出，在該磨削裝置也像周 知般，爲了確保作業者的安全性而在周圍設置保護板。 該磨削裝置Μ，如第2圖、第3圖所示，在下部具備 以大致矩形組裝成格子狀之基框1，在其上面設置用來進 行磨削加工之各種單元。 基框1，是將周知的鋼製角材1 1、1 2、1 3沿左右方向 、前後方向及上下方向組裝，而將上部的各單元予以強固 地支承。 在基框1的上面，載置固定著金屬製的平板材14。藉 由該平板材14，將基框1的鋼製角材1 1、1 2、1 3間予以 遮蔽，且能在基框1上設置各單元。 又在基框1內設置電子控制單元1 5，以控制用來進行 磨削加工之各單元。又雖未詳細記載，在該電子控制單元 15內具備可儲存加工資訊等之記億手段。再者，雖未圖示 出，也設有控制盤，以讓作業者Η對該電子控制單元15 輸入資訊。 -14- 201130601 如第1圖所示設置於磨削裝置Μ的上部（基框1上）之 單元係包含：設置於中央之搬運機械人2、設置於其周圍 之四個加工單元3入、38、30：、3〇、設置於搬運機械人2 的前方之投入取出載台4、設置在搬運機械人2的左右兩 側位置且往前後方向延伸之照明移動單元5。 上述搬運機械人2，是由可朝水平方向移動之三關節 的平面關節型機械人（SCARA robot)所構成。第1圖〜第3 0 圖係顯示搬運機械人2未動作之基準狀態。關於動作狀態 ，是參照第4圖〜第6圖而隨後作說明。 在搬運機械人2的前端設置上下滑動軸20。在該上下 滑動軸20的下端設置：用來吸附保持被加工物之大致方 形的薄板玻璃W(工件）之吸附手2 1。此外，在上下滑動軸 2〇的上端，透過安裝托架安裝影像取得用的攝影機23。 如此般，藉由安裝在搬運機械人2上，攝影機23攝影時 可移動至工件W之攝影部位（工件W的正上方）。 Q 該搬運機械人2，是將薄板玻璃W( Wo、Wi)從投入取 出載台4分別搬運至各加工單元3厶、38、3<：、30，又從 加工單元3A、3B'3C、3D分別搬運至投入取出載台4。 該工件W之搬運作業，是利用上述吸附手21來進行。此 外，該搬運機械人2,是藉由上述攝影機23,來從加工單 元3Α、3Β、3C、3D的上方攝影所載置保持之薄板玻璃W 〇 上述四個加工單元，分別設置於搬運機械人2之前後 左右，而作爲第一加工單元3Α、第二加工單元3Β、第三 -15- 201130601 加工單元3C、第四加工單元3D。 各加工單元3A、3B、3C、3D之構成要素設定成完全 相同，而能進行完全相同的磨削作業。例如，如第一加工 單元3A所示，構成要素是包含：將工件W以磨削狀態進 行吸附保持之加工載台3 0、從加工載台3 0的上方對工件 W進行磨削之磨削主軸31、鄰接於加工載台30而用來保 持複數個磨削工具（磨石）之工具庫32。 而且，其中在加工載台30上，設有讓中央的加工平 台33朝左右方向滑動移動之左右滑動機構34。在加工平 台33的左右兩側設置樹脂製的伸縮護蓋35(加工平台33 右側的伸縮護蓋，由於被磨削主軸等遮住而未圖示出）。 藉由該伸縮護蓋3 5，可防止磨削用冷卻水侵入左右滑動機 構34。此外，在加工平台33的上面，設置呈矩形箱狀且 上方開口之擋止盤36’藉由該擋止盤36來防止磨削用冷 卻水之飛濺。此外，雖未詳細地圖示出，用來對工件W 噴射磨削用冷卻水之冷卻水板3 7 ’是鄰接於擋止盤3 6而 設置。 此外，磨削主軸3 1，係具備可朝前後方向滑動移動之 前後滑動機構3 8。而且’在磨削主軸3 1和前後滑動機構 38之間，設置可朝上下方向移動的上下移動機構39。如 此，磨削主軸31不僅是前後方向，也能朝上下方向自由 地移動。 又前後滑動機構3 8 ’如第2圖所示’相對於朝前後方 向延伸的大型角材之側框1 6，是強固地固定著。藉此，可 -16 - 201130601 提昇磨削主軸31之支承剛性，而能提高磨削精度。 工具庫32，最多可保持五個磨削工具6(磨石，參照 第2、3圖）。在工具庫32，可保持直徑不同的磨石或硏磨 材不同的磨石等複數個磨削工具6。該等複數個磨削工具 6，是對應於加工內容而選擇性地安裝於磨削主軸31。又 複數個磨削工具6，是設置成可在磨削主軸31上自動更換 〇 & 上述投入取出載台4係具備：供作業者Η進行開閉操 〇 作之開閉門40、與開閉門40連動而動作之長方形的匣設 置台41、可裝卸地設置於匣設置台41之工件匣42。 開閉門4 0，是在下端設有朝水平方向延伸的鉸鏈軸 43 (參照第3圖）之橫長長方形之鋼板，在其上部外面，設 有俯視大致U字形的把手部44。作業者Η握住把手部44 以鉸鏈軸43爲中心將該開閉門40往前轉動，藉此將投入 取出載台4打開，而能對磨削裝置Μ內進行工件W之出 〇入。 匣設置台41的兩端側連結於連桿機構4 5 (連結在開閉 門40的上部）。此外，匣設置台41的下部’是可滑動地 載置於朝前後方向延伸的滑軌46 (參照第3圖）。因此’若 作業者Η對開閉門40實施打開操作，透過連桿機構45連 結於開閉門40之匣設置台4 1會朝磨削裝置Μ的外側方向 滑動移動。此外，若作業者Η對開閉門40實施關閉操作 ，匣設置台4 1會朝磨削裝置Μ的內側方向滑動移動。 工件匣42，爲了沿左右方向排列四列的工件w之積 -17- 201130601 層體，是具備四個藉由樹脂壁47區隔成的積層部48。其 中，在右側兩個積層部48上積層未加工的工件Wi’在左 側兩個積層部48上積層加工完畢的工件Wo。該工件匣 42在兩端設有搬運用的把持部49，以讓作業者Η容易從 匣設置台4 1卸下。 作業者Η，在該工件匣42上設置（載置）未加工的工件 W，將載置有該工件W之工件匣42放在匣設置台41上’ 藉由關閉開閉門40而完成加工前準備。 上述照明移動單元5係具備：在搬運機械人2的兩側 位置朝前後方向延伸之移動滑軌50、透過上下移動機構 51而藉由該移動滑軌50支承之大致四角形的照明框52。 該照明框52，在攝影時是作爲照明工件W之照明手段， 在本實施形態依據上述構造，將照明手段設置成可在攝影 時的照明位置和待機位置之間移動。 移動滑軌50，是將前端和後端分別透過支承托架5〇a 、50a來固定設置在金屬製的平板材14。該移動滑軌50 的後端，是延伸至後側的加工單元（第二加工單元3B及第 四加工單元3D)的工具庫32的位置。因此’照明框52可 大範圍地移動至磨削裝置Μ的後側，在不使用照明框52 之待機時點（例如各加工單元3Α、3Β、3C、3D進行磨削 加工的時點），可讓照明框52後退至後側位置。 照明框52，是在各框部 52a的內周面埋設複數個 LED(未圖示），藉此可照射框內。該照明框52，在藉由攝 影機23攝影工件W時，是移動至加工載台30的擋止盤 -18- 201130601 3 6，並利用LE D從側方照射工件W，藉此讓工件W的 形形狀（輪廊）浮現出’而容易進行工件W的攝影。 接著參照第4圖〜第6圖來說明搬運機械人2。 搬運機械人2，如上述般是由朝水平方向移動之三 節的平面關節型機械人所構成，其可朝水平方向移動。 體而言如第4(b)圖所示，搬運機械人2是設置成可在第 關節2Ja、第二關節2Jb、第三關節2Jc轉動，且可朝左 Q 方向移動。藉此，使前側臂24的前端之上下滑動軸20 朝水平方向移動。 該上下滑動軸20，是沿上下方向貫穿前側臂24的 端，而成爲也能朝上下方向滑動移動。 在上下滑動軸20的下端設置上述的吸附手21。該 附手21，是在長方形平板狀的底板25上’設置四個朝 下側的吸盤26。藉由讓負壓作用於該吸盤26以產生吸 力，而能吸附保持作爲工件之薄板玻璃W ° 〇 這四個吸盤26如第4(c)圖所示’是在左右兩處分 配設兩個。而藉由各兩個吸盤26來吸附保持一片工件 。因此，一個吸附手21 —次可搬運兩片的工件W° 此外，該吸附手21，在底板25的兩端設有向下突 的銷27。該銷27、27是與工件W抵接的抵接構件。亦 ，在搬運工件W之前，經由搬運機械人2的移動’藉 該銷27 —旦將工件W推入工件匣42內’而讓工件w 工件匣42內整齊地排列。 在上下滑動軸20的上端，如上述般設置攝影機23 外 關 具 右 能 刖 吸 向 附 別 W 出 即 由 在 -19- 201130601 該攝影機23，相對於吸附手2 1之工件W的保持位置（底 板25的突出部分），是設置在偏移約9 0°的位置。如此， 在藉由攝影機2 3進行攝影時，可避免受到底板2 5的阻礙 。該攝影機23，是由一般的CCD攝影機所構成，可取得 二維的影像資料。此外，上述攝影機23設置成，使其攝 影方向軸與攝影對象（薄板狀的工件W)之平面完全正交’ 而能攝影工件W。 此外，該攝影機23，是透過安裝托架22安裝在上下 滑動軸20。該安裝托架22係具備：稍微向下彎曲的腕部 22a、可調整上下方向位置之攝影機安裝部22b、以及固定 於上下滑動軸20之筒狀的軸固定部22c。攝影機23，是 透過腕部22a而固定於上下滑動軸20，因此是位於離開上 下滑動軸20的位置，在攝影時可防止攝入前側臂24。 接著，利用第5圖及第6圖來說明搬運機械人2進行 搬運時的動作。 如第5(a)圖所示，搬運機械人2，首先從基準狀態讓 各關節稍微朝逆時針方向轉動，而將工件匣42上所積層 的未加工之工件Wi利用吸附手2 1吸附。這時，藉由使上 下滑動軸2 0朝逆時針方向大幅地轉動，而讓吸附手2 1的 底板2 5轉動，以在左側的吸盤2 6上吸附未加工的工件 Wi。 然後，如第5 (b)圖所示，搬運機械人2讓各關節朝逆 時針方向大幅地轉動，而將工件W i搬運至第一加工單元 的加工載台30上。這時，工件Wi被搬運至大槪的位置， -20 - 201130601 而載置在加工載台30上。亦即，不進行嚴格的位置確認 ’而將工件Wi搬運至加工載台30，載置在大槪的位置。 接著，如第6(c)圖所示，搬運機械人2讓前側臂24 進一步朝逆時針方向轉動，且使上下滑動軸20朝順時針 方向轉動，藉此使攝影機23確實地位在工件W的上方（正 上方）且其攝影方向軸與工件Wi的平面正交的位置。如此 ，搬運機械人2，可利用攝影機23來攝影其本身所搬運而 0 載置於加工載台30之工件Wi。又工件W的攝影順序等隨 後敘述。 而且在上述工件Wi的攝影結束後，如第6(d)圖所示 ，爲了搬運下個未加工的工件W，搬運機械人2讓各關節 朝順時針方向轉動，而藉由底板2 5之左側的吸盤2 6來吸 附下個工件W。 然後，搬運機械人2反覆進行第5(b)圖的動作，而從 工件匣42將未加工的工件W搬運至下個加工載台。如此 Q ，在空的加工單元之加工載台上’依序搬運未加工的工件 W。 又雖未具體地圖示出，搬運機械人2是將加工結束後 之加工完畢的工件w 0 ’藉由右側的吸盤2 6之吸附’而從 加工載台30搬運至工件匣42°搬運機械人2’在第5(b) 圖的動作前’是從加工載台30接收加工完畢的工件wo， 以同時進行未加工的工件Wi之搬運和加工完畢的工件Wo 之搬運。 接著，主要參照第7圖〜第9圖來說明加工單元。 -21 - 201130601 加工單元3B(爲了方便，以第二加工單元作說明）如第 7圖所示係具備：用來保持上述工件w之加工載台30、 用來磨削工件W之磨削主軸31、用來保持磨削工具6之 工具庫32。 其中，在加工載台30設有：上述之矩形的加工平台 3 3(平台）、讓加工平台33左右移動之左右滑動機構34、 覆蓋左右滑動機構34之伸縮護蓋35、設置在加工平台33 的上面之擋止盤3 6、以及用來噴射磨削用冷卻水之冷卻水 板3 7。 再者，在該加工載台30，如第8圖所示進一步具備各 種的構成要素。 首先，在加工平台33的上面設有：用來在擋止盤36 的內側中央吸附保持工件W之吸附台70 (保持台）。該吸 附台70的上面（承接面）70a，是由長方形（參照第7圖）之 大致T字狀之塊狀台座所構成。在吸附台70的上面70a ，爲了賦予負壓而設有複數個吸氣口 7〇b(參照第10圖、 第1 1圖）。此外，爲了避免薄板玻璃（工件W)的表面受傷 ，是對吸附台70的上面70a實施平滑加工。 在上述吸附台70的周圍，朝向攝影機23側（上方側） 豎設：用來算出磨削加工時的機械原點之兩個基準銷71、 71。這兩個基準銷71、71’爲了在吸附台70上載置（保持 )工件W的狀態下能從上述攝影機23進行攝影，是配置在 不與工件W重疊的位置（工件W外形的外側）。此外，這 兩個基準銷7 1、7 1，是相對於工件W配置在對角的位置 -22- 201130601 。又虽工件W爲完全透明的情況，將基準銷的位置設置 成與工件W重疊亦可》 而且，基準銷71之被攝影點（前端部71a)如第8圖所 示’其高度hp設定成與吸附台7〇的上面70a之高度hs 相同。亦即’基準部位之被攝影點離攝影機的距離，是設 定成和被加工物離攝影機的距離大致一致。藉由如此般設 定’在藉由攝影機23進彳了攝影時，在工件w和基準銷71 0 之間不會產生焦點偏差，而能確實地進行影像資料的取得 〇 又上述「大致一致」是指，除了上述般基準銷71之 前端部71a的高度hp與吸附台70的上面70a之高度hs 相同的情況以外’還包含銷的前端部7 1 a的高度hp比吸 附台70的上面70a之高度低若干（例如lmm)的情況。亦 即’上述「大致一致」，是根據所要求的加工精度和攝影 機的攝影精度等的關係來決定，只要利用攝影機所攝影的 攝影資料而如後述般進行磨削的結果可符合所要求的端面 加工精度的範圍，攝影機離基準部位之被攝影點的距離和 攝影機離被加工物的距離不是完全一致亦可。 此外，在擋止板3 6的內部設置：高底且呈傾斜之大 致四角形的背景板72。該背景板72，是全面消光而塗黑 ’以防止攝入攝影機23時發生反射，而使工件W與基準 銷7 1之攝入變明顯。此外，藉由將背景板7 2設置成傾斜 ’能讓磨削用冷卻水馬上流掉。此外，在該背景板72形 成有：供基準銷71和吸附台70插通用的插通孔（未具體 -23- 201130601 地圖示）。 在擋止盤36的鄰接位置設有：用來將流到擋止盤36 之磨削用冷卻水排出之排水管73和排水溝槽74。藉由設 置該排水管73和排水溝槽74 ’可防止磨削用冷卻水滯留 於檔止盤3 6內。 左右滑動機構34，是藉由周知的LM導件，而使加工 平台33朝左右方向自由地滑動移動。而且，該左右滑動 機構34，是藉由步進馬達34M來控制滑動量。亦即，藉 由左右滑動機構34來控制加工平台33之左右方向的位置 。藉此，在進行後述的磨削加工時，藉由左右滑動機構3 4 ，來規定磨削路徑之左右位置。 伸縮護蓋35，是像手風琴般可朝左右方向伸縮。因此 ，即使加工平台33藉由左右滑動機構34而往左右移動， 仍不致在加工平台3 3和伸縮護蓋3 5之間產生間隙，而能 防止磨削用冷卻水流入左右滑動機構34。 擋止盤36，如上述般是形成上方開口之矩形箱狀，且 設定成磨削用冷卻水不會漏到外部。具體而言，如第8圖 所示，擋止盤36的側壁36a延伸至比基準銷71 (hp)和吸 附台7 0 (h s)更高的位置h c，而防止磨削用冷卻水漏出。 冷卻水板3 7，是設置成可沿左右方向出沒自如，在磨 削加工時，會突出到覆蓋擋止盤36上方的位置。而且， 在該冷卻水板37的中央設有：朝前後方向延伸之長孔狀 的磨削插通孔3 7 a。該磨削插通孔3 7 a，是爲了在磨削加 工時供磨削工具6插通。此外，雖未具體地圖示出，在冷 -24- 201130601 卻水板3 7的背面（下面）設有複數個噴射口，以讓流過冷卻 水板3 7內部之磨削用冷卻水往下方（工件W側）噴射。 磨削主軸3 1係具備：用來產生進行磨削時的旋轉驅 動力之電動馬達31a、用來在電動馬達31a的主軸上固定 磨削工具6(磨石）之夾頭31b。 磨削主軸31如上述般，係具備前後滑動機構38。該 前後滑動機構38係具備：朝前後方向延伸的滑軌38a、可 0 在該滑軌38a上移動之滑動件38b。該前後滑動機構38也 是，藉由步進馬達38M來控制滑動件38b的滑動量，又藉 由該前後滑動機構3 8來控制磨削主軸3 1的前後位置。如 此，在進行磨削加工時，藉由該前後滑動機構3 8來規定 磨削路徑之前後方向位置。 此外，磨削主軸3 1和前後滑動機構3 8之間，如上述 般設有上下導引機構39。該上下導引機構39也是具備： 朝上下方向延伸的軌道39a、可在軌道39a上移動之移動 Q 構件39b。再者，該上下導引機構39也是，藉由步進馬達 3 9M來控制移動機構39b的上下移動量。藉由該上下導引 機構3 9來控制磨削主軸3 1之上下位置。藉此，在將磨削 工具6對準工件W時，是使用該上下導引機構39來進行 位置調整。 工具庫32如上述般，最多可保持五個磨削工具6。具 體而言如第9圖所示，將用來保持磨削工具6之五個工具 保持部32a沿前後方向排成一列，在該工具保持部32a和 磨削主軸3 1之間自動進行磨削工具6的交接。 -25- 201130601 因此，在該磨削裝置Μ，可對應於磨削部位而自動更 換複數個磨削工具6，而能提昇磨削自由度。 參照第10圖及第11圖來說明磨削主軸31之磨削工 具6。 如上述般，該磨削主軸31，可藉由夾頭31b來進行磨 削工具6之裝卸，而能在第10圖所示的大徑磨削工具6A 和第1 1圖所示的小徑磨削工具6B之間進行切換。 第1 0圖所示的大徑磨削工具6 A，係具備：在表面附 著鑽石粒子60之大徑圓柱狀的加工部61 (磨石）、固定於 夾頭31b且朝上下方向延伸之軸部62;在加工部61的上 側設置往外變寬的凸緣部63。此外，在加工部61的下部 形成三條呈條紋狀凹陷的凹部64。 藉由磨削主軸31使該大徑磨削工具6A旋轉，讓凹部 64抵接於工件W的外緣（外形）Wa ’藉此可對工件W進行 外形磨削或去角。又符號70爲吸附台。 如此般藉由大徑磨削工具6 A來磨削工件W ’由於在 磨削加工時磨削工具6A可穩定地進行磨削’因此可提昇 加工精度。此外，由於磨削工具6A爲大徑’可延長工具 壽命，而能大量地連續磨削工件W ° 第1 1圖所示的小徑磨削工具6 B ’係具備：在表面附 著鑽石粒子1 6 0之小徑圓柱狀的加工部1 6 1、固定於夾頭 3 1 b之軸部1 6 2 ;在加工部1 6 1的上側設置凸緣部1 6 3。此 外，在加工部1 6 1的下部形成三條呈條紋狀凹陷的凹部 -26- 164。 201130601 該小徑磨削工具6B由於直徑小，是將磨削工具6B插 入工件W的孔部Wb內，並讓凹部164抵接於孔部Wb的 內緣Wc，藉此對工件W的孔部Wb進行內形磨削或去角 〇 如此般藉由小徑磨削工具6 B來磨削工件W的孔部 Wb之內形，即使孔部Wb的口徑小而不容易加工的情況 ’仍能確實地進行磨削加工。 〇 接著’針對磨削裝置Μ之控制方法，首先參照第12 圖〜第1 4圖來說明運算工件W的磨削路徑時之控制方法 〇 如第1 2圖的流程圖所示，當起始後，首先在s 1，將 工件W的模型資料（外形、孔部等）輸入（安裝）於電子控制 單元15(輸入步驟）。在該輸入作業，例如是將加工完畢工 件Wo之設計資料（CAD資料）一旦使用其他軟體來轉換成 磨削路徑等的磨削資料後，再輸入（安裝）於電子控制單元 〇 15。 如此般的輸入作業結束後，接著在S2,將實際的工 件Wi(以下稱實際工件）載置（搬入）於加工載台30，在吸附 台70保持工件Wi(保持步驟）。該載置作業，是藉由上述 搬運機械人2來進行。藉由該載置作業，將未加工的實際 工件Wi載置在加工載台30的吸附台70上。 然後’在S 3，藉由攝影機23取得實際工件wi和基 準銷7 1、7 1的影像（攝影步驟）。第1 3圖係顯示該攝影機 之攝影狀知。如弟13圖所不，在磨削裝置μ，藉由安裝 -27- 201130601 在搬運機械人2(搬運工件Wi)之高位置的攝影機23，來攝 影加工載台3 0上之工件w i和基準銷7 1、7 1。如此般從 上方較遠的位置來攝影加工載台3 0，可儘量減少所取得的 工件Wi和基準銷71、71之影像資料的失真。 如此般取得的影像資料的例子如第1 4(a)圖所示。取 得工件Wi和兩個基準銷7 1、7 1之影像資料，而算出各個 的位置資料。 接著，在S4，根據基準銷71、71的位置來算出加工 載台30的機械原點C(機械原點算出步驟）。在此，機械原 點C是用來進行磨削加工之機械座標的基準，藉由規定此 機械原點C可進行正確的磨削加工。 機械原點C如第14(b)圖所示，是藉由兩個基準銷71 、7 1之連結線L的中點來決定。又作爲其他例，如虛線 所示’進一步追加兩個基準銷71，、71’，將所追加的兩個 基準銷71’、71’的連結線N和上述兩個基準銷71、71的 連結線L雙方的交點，規定爲機械原點c亦可。 接著，在S 5，根據所取得的實際工件Wi的資料，算 出實際工件Wi的外形Wa的重心位置P和孔部Wb的重心 位置Q(重心位置算出步驟）。在此，重心位置是指圖形的 重心位置，是根據工件W的外形形狀和孔部形狀來決定 。第l4(b)圖所示的黑圈P、Q，分別爲實際工件Wi的外 形W a的重心位置和孔部W b的重心位置。 然後在S6，讓實際工件Wi的重心位置（外形的重心 位置P及孔部的重心位置Q)和模型Wm的重心位置（外形 -28- 201130601 的重心位置Pm及孔部的重心位置Qm) —致。藉由使實際 工件Wi的重心位置P、Q和模型Wm的重心位置Pm、Qm 一致，能使實際工件Wi和模型Wm的差（位置資料差）變 明確。第14(c)圖所示的狀態，是實際工件Wi和模型Wm( 一點鏈線）的重心位置P、Q、Pm、Qm —致的狀態。如此 般使重心位置P、Q、Pm、Qm —致’能讓實際工件wi和 模型Wm的差變明確。 0 接著在S 7，將加工載台3 0的機械原點C和實際工件201130601 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a grinding apparatus, a grinding method, and a method of manufacturing a thin plate member. [Prior Art] The grinding device is used for end face grinding of a workpiece such as a substantially square thin plate-shaped workpiece 0 (for example, a thin plate glass used in a portable terminal such as a mobile phone). The screen of the portable terminal is mostly made of thin glass. Such a thin plate glass is generally cut out from a large-shaped glass plate in the shape of a large workpiece, and the end surface of the cut glass plate is correctly ground by a grinding device to form a predetermined shape. In particular, when grinding is performed, chamfering is also performed to prevent the end surface of the thin glass from being chipped. For example, Patent Document 1 discloses a grinding device (bevel removing device) for grinding an end surface of a thin plate glass. In the grinding apparatus described in Patent Document 1, Q is to calculate the grinding position and the amount of grinding of the thin glass by the edge (outer edge) of the thin film glass from above the thin glass, and to control the grinding tool and the platform. The action of (table) is to grind (dehorn) the end face of the thin glass. In this way, by using the photographic data of the camera to grind the end faces of the thin glass, the processing precision of the thin glass can be improved, and the dimensional accuracy of the thin glass can be improved. Further, the jig that constitutes the master is not required to be processed as in the profiling process, so that a wide processing space can be secured, and the size of the grinding device can be reduced. -5- 201130601 However, in recent years, for example, in a portable terminal such as a mobile phone, the entire or the entire surface of the portable terminal is used as a display screen. Most of these portable terminals are screens that become touch panels, and more and more portable terminals are covered by thin glass. When the entire surface is covered with a thin glass, since the shape of the thin glass must match the shape of the portable terminal, the thin glass must be shaped to match the shape of the speaker of the portable terminal, and the complex shape is ground. . In addition, the thin glass is used as the outer surface of the portable terminal, and there is a limitation that it is impossible to apply a concave portion or the like on the surface of the glass, and the thin glass for the portable terminal is ground. For example, although a method of grinding by profiling can be considered, it is necessary to use a jig for a sample as described above, and there is a problem that the processing space is increased, and the inner peripheral machining (grinding of the hole portion) is performed. At that time, there is a problem that it becomes more troublesome. Therefore, as shown in the aforementioned Patent Document 1, it is conceivable to grind the thin plate glass by using the photographic data of the camera. The use of a camera for grinding in this way improves the grinding accuracy of thin glass and enables complex cutting. However, according to the technique of Patent Document 1, it is necessary to attach a "positioning mark" to the surface of the thin plate glass. The technique is to read the positioning marks to automatically measure the machining size. However, as described above, the thin plate glass for the portable terminal device can be seen as the outer surface since -6-201130601, and therefore it is impossible to attach a mark such as a concave portion to the surface. Therefore, it is conceivable to print on the surface using ink or the like. However, after the grinding process, it is necessary to additionally remove the ink or the like, which causes an increase in the number of processing steps. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-223005 [Description of the Invention] Accordingly, an object of the present invention is to provide a grinding apparatus which is a thin plate used for a display screen of a portable terminal such as a mobile phone. A grinding device that performs end surface grinding on a workpiece such as glass, which is ground by using the photographic data of the camera to achieve high-precision machining, and can be ground without setting a mark on the surface of the workpiece. Cutting. A grinding method and a method of manufacturing a thin plate member are also provided. The grinding device of the present invention is a grinding device for performing end surface grinding of a thin plate-shaped workpiece, and the Q system includes: a processing stage for holding the workpiece in a processed state, and is provided in the above a reference portion of a processing standard for processing a workpiece and a workpiece to be processed, and a camera for photographing the workpiece and the reference portion at a position substantially perpendicular to the workpiece and used for photographing the workpiece Grinding the grinding spindle at the end of the workpiece; and having: 201130601 A memory means for storing the workpiece model data of the workpiece in advance, and a mechanical original for processing the stage based on the photographic data of the reference portion obtained by the camera Point mechanical origin calculation means, based on the photographic data of the workpiece obtained by the camera; ^ & the center of gravity position calculation means of the center of gravity of the workpiece, the machine origin of the processing stage, and the workpiece The calculation of the deviation amount of the deviation amount of the workpiece by comparison with the position of the center of gravity of the workpiece, and the calculation method corresponding to the deviation amount calculation means Grinding path deviation amount calculating means calculates out the above grinding path of the grinding spindle, and a grinding path computation based on the calculated means of the grinding operation of the grinding path to make the operation of the control spindle means. The grinding device stores the data of the workpiece model in the memory means in advance, and calculates the center of gravity of the machining stage and the center of gravity of the workpiece (actual workpiece) based on the photographic data acquired by the camera, and the machine origin and By comparing the positions of the center of gravity, the amount of deviation of the workpiece (actual workpiece) (the amount of deviation X in the lateral direction and the amount of deviation in the direction of rotation in the longitudinal direction Y' in the direction of rotation 0) is calculated. In this way, the grinding path of the grinding spindle is calculated in accordance with the amount of deviation obtained by the calculation, and the grinding spindle is operated in accordance with the grinding path to perform end surface grinding of the workpiece (actual workpiece). Therefore, the "mechanical origin" can be obtained by using the reference portion provided on the processing stage, so that the amount of deviation of the workpiece can be grasped by forming the "mark (mark)" or the like which is the basis of the workpiece. According to the amount of deviation, the workpiece can be accurately ground without forming marks (marks). -8 - 201130601 In addition, the grinding method of the present invention is a grinding method for grinding an end surface of a thin plate-shaped workpiece by a grinding spindle, and has the following steps: maintaining the workpiece in a processed state a step of holding the processing stage, a photographing step of photographing the workpiece held on the reference portion of the processing stage and the processing stage by a camera, and photographing data based on a reference portion obtained by the camera a machine origin calculation step of calculating a machine origin of the machining stage, a gravity center position calculation step of obtaining a gravity center position of the workpiece based on the image data of the workpiece obtained by the camera, and a mechanical machine of the machining stage Calculating a deviation amount calculation step of calculating a deviation amount of the workpiece from comparison with a position of a center of gravity of the workpiece, and calculating a grinding path of the grinding spindle in accordance with a deviation amount calculated by the deviation amount calculation step The path calculation step and the grinding path calculated by the grinding path calculation step to grind the grinding spindle step. In the grinding method, the data of the workpiece model is first stored in a memory means, and the mechanical origin of the processing stage and the position of the center of gravity of the workpiece are calculated based on the photographic data obtained by the camera, and the mechanical origin and the center of gravity are compared. Thereby, the amount of deviation of the workpiece is calculated. In this manner, the grinding path of the grinding spindle is calculated in accordance with the amount of deviation obtained by the calculation, and the grinding spindle is operated in accordance with the grinding path to perform end surface grinding of the workpiece. Therefore, even if the "marks (marks) of the constituents are formed in the workpiece itself, the "machine origin" can be obtained by using the reference portion provided on the processing stage to grasp the amount of deviation of the workpiece. According to the amount of deviation grasped, the workpiece to be processed such as the mark (mark) can be accurately ground. Further, the "reference portion" of the machine origin may be a "reference pin" erected toward the camera side, or may be a "reference protrusion" formed by projecting a part of the processing stage. Furthermore, it is also a "reference part" which is formed by coloring a part. Further, in order to avoid the influence of the workpiece, the "reference portion" is preferably provided at a position that does not overlap with the workpiece, that is, is disposed outside the outer shape of the workpiece. In addition, when the "motion control device" for operating the grinding spindle is provided, the motion control device and the "machining table" are simultaneously operated, and the grinding spindle and the processing stage are operated to perform the workpiece. Grinding is also possible. In the present invention, it is preferable that the position of the center of gravity of the workpiece obtained by the center-of-gravity position calculating means coincides with the position of the center of gravity of the workpiece model, and the workpiece and the workpiece model are compared, and the calculation is performed by the cutting amount calculation means. The amount of grinding of the grinding spindle. In this way, the position of the center of gravity of the workpiece (actual workpiece) is aligned with the position of the center of gravity of the workpiece model, and the workpiece (actual workpiece) is compared with the workpiece model, and the shaving performed on the workpiece (actual workpiece) is calculated. Degree, and determine the amount of cutting. That is, it is determined how much the workpiece (actual workpiece) is larger than the workpiece model (for example, the difference between the length direction and the width direction is detected, and the magnitude of the "equivalent" is changed), and the size is changed to be cut off. the amount. Therefore, the amount of the workpiece to be cut can be changed for each workpiece, and the workpiece can be processed with a more correct shape and size. -10 - 201130601 In this way, the grinding amount can be more accurately grasped by the amount of cutting of the workpiece to be changed for each workpiece. Therefore, it is possible to perform high-precision machining on a plurality of workpieces. Further, in the present invention, it is preferable that the gravity center position calculating means includes an outer gravity center calculating means for obtaining a center of gravity of the outer shape of the workpiece, and a center of gravity of the hole for determining a position of a center of gravity of the shape of the hole of the workpiece. Calculate the means. Thereby, even in the thin glass having the hole portion, the thin plate glass can be surely ground according to the shape of the workpiece model (the position of the hole portion, etc.). In this manner, even in the case of a thin plate glass having a complicated shape such as a hole portion, the grinding position can be accurately specified, and the thin plate glass can be ground with high precision. Further, in the present invention, it is preferable that the reference portion is photographed. The distance from the camera is set to be approximately the same as the distance from the workpiece to the camera. In this manner, by focusing the distance between the photographed point of the reference portion (for example, the front end portion of the reference pin) and the distance Q of the workpiece from the camera, the focus of the camera can be focused on both. Thereby, the reference portion and the workpiece can be photographed at the same time, and the amount of deviation of the workpiece can be calculated more accurately. Further, in the invention, it is preferable that the reference portion is provided at least at positions on both sides of the workpiece. Thereby, the point where the reference portion can be provided at least on both sides of the thin glass can be used as the "mechanical origin" at a point formed on the connecting line of at least two reference portions, whereby the position of the center of gravity of the workpiece can be approached. The position is used as the mechanical origin. Therefore, the amount of deviation of the workpiece can be calculated more accurately. In other words, from -11 to 201130601, the "machine origin" is close to the center of gravity of the workpiece, and the error at the time of calculation can be calculated, so that the correct amount of deviation can be calculated. Grinding of workpieces with higher precision. Further, in the present invention, it is preferable that at least one of the plurality of second holding stages capable of holding a large-sized workpiece that can hold a small workpiece is disposed on the processing stage: The first holding stage is located outside the outer shape of the first held small workpiece, and the outer shape of the large workpiece held on the second second holding stage is further increased, since a plurality of the processing stages can be provided. The first is a small workpiece, which can be processed on a processing stage. Further, since the stage and the second holding stage can be selectively held on the processing stage, the workpiece can be appropriately and surely held in accordance with the size of the workpiece. Further, even in the case where the first holding stage and the second holding stage are on the processing stage, since the reference portion is located outside the added portion, the reference portion is not blocked by the workpiece. One of the first holding stage and the second holding stage is changed to the other side. It is not necessary to replace the large and small workpieces as described above, and the structure of the processing stage can be simplified. Further, in the invention, it is preferable that the processing stage holds a plurality of holding stages of the workpiece, and the reference portion is provided with the plurality of reference portions disposed outside the outer shape of each of the plurality of held workpieces . By reducing the amount of deviation, it is possible to selectively maintain the stage, which is to maintain the stage on the above-mentioned base table by the π side. Hold the table, if there are a plurality of sets of the first set of small holdings, the shape of the workpiece is set, and when it is set, the outer reference has a plurality of separate holds, and the holdings are held -12-201130601 Thereby, a plurality of workpieces can be held on the processing stage by setting a plurality of holding processing stages. In addition, since the reference portion is provided on the outer side of the workpiece, it is possible to set the position close to the workpiece so that the "machine origin" becomes close to the center of gravity of the workpiece and the error is calculated. Further, the object of the present invention is not limited to the above-described grinding device 0. The object also includes a thin plate-like structure including the above-described grinding method. In the present invention, the "orthogonal position" of the camera installation position is not limited to the image capturing side of the camera. The case where the plane of the workpiece is completely orthogonal is also included in the case of skew. In other words, the above-mentioned "substantially orthogonal" is a range of end face machining accuracy required for the grinding and closing of the camera according to the relationship between the accuracy of the rooting and the accuracy of the camera, and the like. It is also possible to tilt the plane of the workpiece. As described above, in the present invention, the amount of deviation of the "machine origin" is obtained at the reference portion of the machining stage without forming a mark (mark) or the like which constitutes a reference in the thin workpiece itself. Further, the workpiece to be processed, such as (mark), is subjected to grinding processing in accordance with the amount of deviation. In the case where the end surface is grounded on the display screen of the portable terminal such as a mobile phone, the camera can capture the position of each of the held reference portions by the camera, and the grinding can be reduced. In the method, the manufacturing method of the workpiece and the workpiece are required to be applied in a certain range of the large-axis and the thin-plate shape, and the result of the cutting can be used in the direction of the photographing direction, and the glass can still be used to grasp the If the mark is not formed, for example, even if the glass material of the sheet is used for the grinding process -13-201130601, high-precision machining can be performed, and grinding can be performed without setting marks on the surface of the workpiece. machining. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. <First Embodiment> First, the overall configuration of the grinding apparatus will be described with reference to Figs. 1 to 3 . Further, although not specifically depicted in the drawings, the grinding device is provided with a protective plate around the inside in order to secure the safety of the operator. As shown in Fig. 2 and Fig. 3, the grinding device 具备 has a base frame 1 which is assembled in a substantially rectangular shape in a lower portion, and various units for performing a grinding process are provided on the upper surface. In the base frame 1, the known steel angle members 1 1 , 2 2, and 1 3 are assembled in the left-right direction, the front-rear direction, and the up-and-down direction, and the upper units are strongly supported. A flat plate material 14 made of metal is placed on the upper surface of the base frame 1. By the flat plate 14, the steel angle members 1 1 , 1 2 and 1 3 of the base frame 1 are shielded, and each unit can be placed on the base frame 1. Further, an electronic control unit 15 is provided in the base frame 1 to control the units for performing the grinding process. Further, although not described in detail, the electronic control unit 15 is provided with means for storing processing information and the like. Further, although not shown, a control panel is provided to allow the operator to input information to the electronic control unit 15. -14- 201130601 The unit provided on the upper part (base frame 1) of the grinding device 第 as shown in Fig. 1 includes: a transport robot 2 installed at the center, and four processing units 3 installed around it. 38, 30:, 3, an input/removal stage 4 provided in front of the transport robot 2, and an illumination moving unit 5 provided at the left and right sides of the transport robot 2 and extending in the front-rear direction. The transport robot 2 is composed of a plane joint robot (SCARA robot) that can move three joints in the horizontal direction. Fig. 1 to Fig. 3 show the reference state in which the transport robot 2 does not operate. The operation state is described later with reference to Figs. 4 to 6 . The upper and lower slide shafts 20 are provided at the front end of the transport robot 2. At the lower end of the upper and lower slide shafts 20, there is provided an adsorption hand 2 1 for sucking and holding a thin plate glass W (workpiece) having a substantially square shape of the workpiece. Further, a camera 23 for image acquisition is attached to the upper end of the vertical slide shaft 2〇 through the mounting bracket. In this manner, by being attached to the transport robot 2, the camera 23 can be moved to the photographing portion of the workpiece W (directly above the workpiece W) when photographing. Q The transport robot 2 transports the thin plate glass W (Wo, Wi) from the input/output loading table 4 to each of the processing units 3, 38, and 3. <:, 30, respectively, are transported from the processing units 3A, 3B', 3C, and 3D to the loading and unloading stage 4. The conveyance work of the workpiece W is performed by the above-described adsorption hand 21. Further, the transport robot 2 is mounted on the transport robot by the above-described camera 23, and the above-described four processing units are photographed and held from above the processing units 3Α, 3Β, 3C, and 3D. 2 before and after, as the first processing unit 3Α, the second processing unit 3Β, the third -15-201130601 processing unit 3C, and the fourth processing unit 3D. The constituent elements of the respective processing units 3A, 3B, 3C, and 3D are set to be completely the same, and the same grinding operation can be performed. For example, as shown in the first processing unit 3A, the constituent elements include a processing stage 30 that sucks and holds the workpiece W in a grinding state, and grinding the workpiece W from above the processing stage 30. The main shaft 31 is adjacent to the processing stage 30 and is used to hold a plurality of grinding tools (grinding stones) tool magazine 32. Further, in the processing stage 30, a left and right slide mechanism 34 for slidably moving the center processing table 33 in the left-right direction is provided. A resin telescopic cover 35 is provided on the left and right sides of the processing table 33 (the telescopic cover on the right side of the processing table 33 is not shown by being covered by a grinding spindle or the like). By the telescopic cover 35, it is possible to prevent the cooling water for grinding from intruding into the left and right slide mechanisms 34. Further, on the upper surface of the processing platform 33, a stopper disk 36' having a rectangular box shape and having an upper opening is provided to prevent splashing of the cooling water for grinding by the stopper disk 36. Further, although not shown in detail, the cooling water plate 3 7 ' for jetting the grinding cooling water to the workpiece W is provided adjacent to the stopper disk 36. Further, the grinding spindle 31 is provided with a front and rear slide mechanism 38 that is slidable in the front-rear direction. Further, between the grinding spindle 31 and the front and rear slide mechanisms 38, a vertical movement mechanism 39 that is movable in the vertical direction is provided. Thus, the grinding spindle 31 can move freely in the vertical direction as well as the front-rear direction. Further, the front and rear slide mechanism 3 8 ' is strongly fixed to the side frame 16 of the large angle member extending toward the front and rear as shown in Fig. 2 . Thereby, the support rigidity of the grinding spindle 31 can be improved by -16 - 201130601, and the grinding precision can be improved. The tool magazine 32 can hold up to five grinding tools 6 (grinding stones, see Figures 2 and 3). In the tool magazine 32, a plurality of grinding tools 6 having different diameters of grindstones or different grindstones can be held. The plurality of grinding tools 6 are selectively attached to the grinding spindle 31 in accordance with the processing contents. Further, the plurality of grinding tools 6 are provided so as to be automatically replaceable on the grinding spindle 31. The above-described loading/unloading stage 4 includes an opening and closing door 40 for opening and closing the operator, and an opening and closing door 40. The rectangular cymbal mounting table 41 that moves in conjunction with each other is detachably provided to the workpiece 匣 42 of the cymbal mounting table 41. The opening and closing door 40 is a horizontally long rectangular steel plate having a hinge shaft 43 (see Fig. 3) extending in the horizontal direction at the lower end, and a handle portion 44 having a substantially U-shaped shape in plan view is provided on the outer surface of the upper portion. The operator holds the handle portion 44 to rotate the opening and closing door 40 forward about the hinge shaft 43, thereby opening the loading/unloading stage 4, and the workpiece W can be plucked into the grinding device. Both end sides of the cymbal mounting table 41 are coupled to a link mechanism 4 5 (connected to an upper portion of the opening and closing door 40). Further, the lower portion ' of the crucible setting table 41 is slidably placed on the slide rail 46 extending in the front-rear direction (see Fig. 3). Therefore, if the operator performs the opening operation on the opening and closing door 40, the setting table 4 1 is slid in the outer direction of the grinding device 透过 by the link mechanism 45 connected to the opening and closing door 40. Further, when the operator performs the closing operation on the opening and closing door 40, the setting table 41 is slid and moved toward the inner side of the grinding device. The workpiece 匣42 has a laminate portion 48 separated by a resin wall 47 in order to arrange the product -17-201130601 layer of the workpiece w in four rows in the left-right direction. Here, the processed workpiece Wo is laminated on the two stacked portions 48 on the right side, and the processed workpiece Wo is laminated on the left two laminated portions 48. The workpiece 匣 42 is provided with grip portions 49 for conveyance at both ends so that the operator can easily detach it from the cymbal mounting table 41. The operator 设置 sets (places) the unprocessed workpiece W on the workpiece 匣42, and places the workpiece 匣42 on which the workpiece W is placed on the 匣 setting table 41' before the processing is completed by closing the opening and closing door 40. ready. The illumination moving unit 5 includes a moving rail 50 that extends in the front-rear direction on both sides of the transport robot 2, and a substantially square-shaped illumination frame 52 that is supported by the moving rail 50 by the vertical moving mechanism 51. The illumination frame 52 is an illumination means for illuminating the workpiece W at the time of photographing. In the present embodiment, the illumination means is provided to be movable between an illumination position and a standby position at the time of photographing in accordance with the above configuration. The moving rail 50 is fixed to the metal flat plate 14 by passing the front end and the rear end through the support brackets 5A and 50a, respectively. The rear end of the moving rail 50 is the position of the tool magazine 32 extending to the processing unit (the second processing unit 3B and the fourth processing unit 3D) on the rear side. Therefore, the 'lighting frame 52 can be moved to the rear side of the grinding device 大 in a wide range, and the standby point when the illumination frame 52 is not used (for example, the time when each processing unit 3Α, 3Β, 3C, 3D performs grinding processing) can be made The illumination frame 52 is retracted to the rear side position. In the illumination frame 52, a plurality of LEDs (not shown) are embedded in the inner peripheral surface of each frame portion 52a, whereby the inside of the frame can be illuminated. When the workpiece W is photographed by the camera 23, the illumination frame 52 is moved to the stopper disk 18-201130601 3 6 of the processing stage 30, and the workpiece W is irradiated from the side by the LE D, thereby allowing the workpiece W to be The shape (the corridor) emerges as 'the photographing of the workpiece W is easy. Next, the transport robot 2 will be described with reference to FIGS. 4 to 6 . As described above, the transport robot 2 is composed of three plane articulated robots that move in the horizontal direction, and is movable in the horizontal direction. As shown in Fig. 4(b), the transport robot 2 is provided to be rotatable in the first joint 2Ja, the second joint 2Jb, and the third joint 2Jc, and is movable in the left Q direction. Thereby, the front end arm 24 is moved upward and downward by the lower sliding shaft 20 in the horizontal direction. The vertical sliding shaft 20 is inserted through the front arm 24 in the vertical direction, and is slidably movable in the vertical direction. The above-described suction hand 21 is provided at the lower end of the upper and lower slide shafts 20. In the hand 21, four suction cups 26 on the lower side are provided on the rectangular flat bottom plate 25. By causing a negative pressure to act on the suction cup 26 to generate suction, it is possible to adsorb and hold the thin plate glass W° as a workpiece. The four suction cups 26 are as shown in Fig. 4(c), and are disposed at two places on the left and right sides. . The two suction cups 26 are used to suck and hold a workpiece. Therefore, one suction hand 21 can carry two pieces of workpiece W at a time. Further, the suction hand 21 is provided with a downwardly projecting pin 27 at both ends of the bottom plate 25. The pins 27 and 27 are abutting members that abut against the workpiece W. Further, before the workpiece W is conveyed, the workpiece w is placed neatly in the workpiece 匣 42 by the movement of the transport robot 2 by pushing the workpiece W into the workpiece 匣 42. At the upper end of the upper and lower sliding shafts 20, the camera 23 is provided as described above, and the outer closing member can suck to the attachment W, that is, the holding position of the workpiece 23 with respect to the workpiece W of the suction hand 2 1 at -19-201130601 ( The protruding portion of the bottom plate 25 is disposed at a position offset by about 90°. Thus, when photographing by the camera 23, it is possible to avoid being hindered by the bottom plate 25. The camera 23 is constituted by a general CCD camera and can acquire two-dimensional image data. Further, the camera 23 is provided such that the workpiece W can be imaged by making the shooting direction axis completely orthogonal to the plane of the object to be photographed (the thin workpiece W). Further, the camera 23 is attached to the upper and lower slide shafts 20 via a mounting bracket 22. The mounting bracket 22 includes a wrist portion 22a that is slightly curved downward, a camera mounting portion 22b that can adjust the position in the vertical direction, and a cylindrical shaft fixing portion 22c that is fixed to the vertical sliding shaft 20. Since the camera 23 is fixed to the vertical slide shaft 20 through the arm portion 22a, the camera 23 is located away from the upper and lower slide shafts 20, and the front arm 24 can be prevented from being ingested during shooting. Next, the operation when the transport robot 2 performs the transport will be described using Figs. 5 and 6 . As shown in Fig. 5(a), the transport robot 2 firstly rotates the joints slightly counterclockwise from the reference state, and the unprocessed workpiece Wi stacked on the workpiece 匣42 is sucked by the suction hand 2 1 . At this time, by rotating the upper and lower slide shafts 20 in the counterclockwise direction, the bottom plate 25 of the suction hand 2 1 is rotated to suck the unprocessed workpiece Wi on the suction cup 26 on the left side. Then, as shown in Fig. 5(b), the transport robot 2 causes the joints to rotate largely in the counterclockwise direction, and transports the workpiece W i to the processing stage 30 of the first processing unit. At this time, the workpiece Wi is transported to the large position, and is placed on the processing stage 30 at -20 - 201130601. In other words, the workpiece Wi is transported to the processing stage 30 without being subjected to strict position confirmation, and is placed at a large position. Next, as shown in Fig. 6(c), the transport robot 2 further rotates the front side arm 24 in the counterclockwise direction and rotates the upper and lower slide shaft 20 in the clockwise direction, whereby the camera 23 is surely positioned on the workpiece W. Above (directly above) and its photographing direction axis is orthogonal to the plane of the workpiece Wi. In this way, the transport robot 2 can use the camera 23 to photograph the workpiece Wi that is carried by itself and placed on the processing stage 30. The order of photographing of the workpiece W and the like will be described later. Further, after the photographing of the workpiece Wi is completed, as shown in Fig. 6(d), in order to convey the next unprocessed workpiece W, the transport robot 2 rotates the joints in the clockwise direction, and the bottom plate 25 The suction cup 26 on the left side sucks the next workpiece W. Then, the transport robot 2 repeatedly performs the operation of Fig. 5(b), and transports the unprocessed workpiece W from the workpiece 匣42 to the next processing stage. In this way, the unprocessed workpiece W is sequentially carried on the processing stage of the empty processing unit. Further, although not specifically shown, the transport robot 2 transports the processed workpiece w 0 ' after the machining is completed from the processing stage 30 to the workpiece by the suction of the right suction cup 26. The person 2' receives the processed workpiece wo from the processing stage 30 before the operation of the fifth drawing (b), and simultaneously conveys the unprocessed workpiece Wi and the processed workpiece Wo. Next, the processing unit will be mainly described with reference to FIGS. 7 to 9. -21 - 201130601 Machining unit 3B (for convenience, described by the second machining unit) as shown in Fig. 7 is provided with: a machining stage 30 for holding the workpiece w, and a grinding spindle for grinding the workpiece W 31. A tool magazine 32 for holding the grinding tool 6. The processing stage 30 is provided with: a rectangular processing platform 33 (platform), a left and right sliding mechanism 34 for moving the processing platform 33 to the left and right, a telescopic cover 35 covering the left and right sliding mechanism 34, and a processing platform 33. The upper stopper plate 3 6 and the cooling water plate 37 for jetting the cooling water for grinding. Further, in the processing stage 30, as shown in Fig. 8, various components are further provided. First, on the upper surface of the processing platform 33, there is provided a suction stage 70 (holding stage) for sucking and holding the workpiece W at the inner center of the stopper disk 36. The upper surface (bearing surface) 70a of the suction stage 70 is constituted by a block-shaped pedestal having a substantially T-shape in a rectangular shape (see Fig. 7). In the upper surface 70a of the adsorption stage 70, a plurality of intake ports 7〇b are provided in order to impart a negative pressure (see Fig. 10 and Fig. 1 1). Further, in order to avoid surface damage of the thin plate glass (work piece W), smooth processing is performed on the upper surface 70a of the suction stage 70. Around the suction stage 70, two reference pins 71 and 71 for calculating the machine origin at the time of grinding processing are erected toward the camera 23 side (upper side). The two reference pins 71 and 71' are capable of being photographed from the camera 23 in a state where the workpiece W is placed (held) on the suction stage 70, and are disposed at a position that does not overlap the workpiece W (outside of the outer shape of the workpiece W). Further, the two reference pins 7 1 and 7 1 are disposed at diagonal positions -22 - 201130601 with respect to the workpiece W. Further, when the workpiece W is completely transparent, the position of the reference pin may be set to overlap with the workpiece W. Further, the photographed point (front end portion 71a) of the reference pin 71 is set as shown in Fig. 8 It is the same as the height hs of the upper surface 70a of the adsorption stage 7A. That is, the distance from the photographed point of the reference portion to the camera is set to substantially coincide with the distance from the workpiece to the camera. By setting in this way, when the photographing is performed by the camera 23, the focus deviation is not generated between the workpiece w and the reference pin 71 0, and the image data can be surely obtained. In addition to the case where the height hp of the front end portion 71a of the reference pin 71 is the same as the height hs of the upper surface 70a of the suction stage 70, the height hp of the front end portion 7 1 a of the pin is also larger than the upper surface 70a of the adsorption stage 70. The case where the height is low (for example, 1 mm). In other words, the above-mentioned "substantially identical" is determined based on the relationship between the required processing accuracy and the photographing accuracy of the camera, and the result of grinding as described later by the photographing material photographed by the camera can conform to the required end face. The range of processing accuracy may not be exactly the same distance between the camera and the distance from the photographed point of the reference portion and the distance from the camera to the workpiece. Further, inside the stopper plate 36, a background plate 72 having a high base and an inclined quadrangle is provided. The background plate 72 is completely matt and blackened to prevent reflection when the camera 23 is ingested, and the intake of the workpiece W and the reference pin 71 becomes conspicuous. Further, by setting the background plate 7 2 to be inclined ', the cooling water for grinding can be immediately discharged. Further, the background plate 72 is formed with an insertion hole through which the reference pin 71 and the suction stage 70 are inserted (not specifically -23-201130601 map). At a position adjacent to the stopper disk 36, a drain pipe 73 and a drain groove 74 for discharging the grinding cooling water flowing to the stopper disk 36 are provided. By providing the drain pipe 73 and the drain groove 74', the cooling water for grinding can be prevented from remaining in the stopper disk 36. The left and right slide mechanisms 34 are freely slidably moved in the left-right direction by a well-known LM guide. Further, the left and right slide mechanism 34 controls the amount of slip by the stepping motor 34M. That is, the position of the processing platform 33 in the left-right direction is controlled by the left and right sliding mechanism 34. Thereby, the left and right positions of the grinding path are defined by the right and left sliding mechanism 34 during the grinding process to be described later. The telescopic cover 35 is stretchable in the left-right direction like an accordion. Therefore, even if the processing platform 33 is moved to the left and right by the left and right sliding mechanisms 34, a gap is not formed between the processing platform 3 3 and the telescopic cover 35, and the cooling cooling water for grinding can be prevented from flowing into the left and right sliding mechanisms 34. As described above, the stopper disk 36 has a rectangular box shape in which the upper opening is formed, and is set so that the cooling water for grinding does not leak to the outside. Specifically, as shown in Fig. 8, the side wall 36a of the stopper disk 36 extends to a position hc higher than the reference pin 71 (hp) and the suction stage 70 (hs), and prevents the cooling water for grinding from leaking out. The cooling water plate 37 is provided so as to be freely movable in the left-right direction, and protrudes to a position above the cover stopper disk 36 during the grinding process. Further, a center of the cooling water plate 37 is provided with a long hole-shaped grinding insertion hole 3 7 a extending in the front-rear direction. The grinding insertion hole 3 7 a is for inserting the grinding tool 6 during the grinding process. In addition, although not specifically shown, a plurality of injection ports are provided on the back (lower side) of the water plate 37 from the cold-24-201130601 to allow the cooling water flowing through the inside of the cooling water plate 37 to Spray below (workpiece W side). The grinding spindle 31 includes an electric motor 31a for generating a rotational driving force for grinding, and a chuck 31b for fixing a grinding tool 6 (grinding stone) to the main shaft of the electric motor 31a. As described above, the grinding spindle 31 is provided with a front and rear slide mechanism 38. The front and rear slide mechanism 38 includes a slide rail 38a that extends in the front-rear direction, and a slider 38b that can move on the slide rail 38a. The front and rear slide mechanism 38 also controls the amount of sliding of the slider 38b by the stepping motor 38M, and the front and rear positions of the grinding spindle 31 are controlled by the front and rear slide mechanism 38. Thus, when the grinding process is performed, the front and rear direction positions of the grinding path are defined by the front and rear sliding mechanism 38. Further, between the grinding spindle 31 and the front and rear slide mechanisms 38, the upper and lower guide mechanisms 39 are provided as described above. The vertical guide mechanism 39 also includes a rail 39a extending in the vertical direction and a moving Q member 39b movable on the rail 39a. Further, the up-and-down guide mechanism 39 also controls the amount of up-and-down movement of the moving mechanism 39b by the stepping motor 39M. The upper and lower positions of the grinding spindle 31 are controlled by the upper and lower guiding mechanisms 39. Thereby, when the grinding tool 6 is aligned with the workpiece W, the vertical adjustment mechanism 39 is used for position adjustment. The tool magazine 32 can hold up to five grinding tools 6 as described above. Specifically, as shown in Fig. 9, the five tool holding portions 32a for holding the grinding tool 6 are arranged in a row in the front-rear direction, and the grinding is automatically performed between the tool holding portion 32a and the grinding spindle 31. The handover of tool 6. -25- 201130601 Therefore, in the grinding device, a plurality of grinding tools 6 can be automatically replaced in accordance with the grinding portion, and the degree of freedom of grinding can be improved. The grinding tool 6 of the grinding spindle 31 will be described with reference to Figs. 10 and 11. As described above, the grinding spindle 31 can be attached and detached by the chucking tool 31, and the large-diameter grinding tool 6A shown in Fig. 10 and the small diameter shown in Fig. 1 can be used. Switching between the grinding tools 6B. The large-diameter grinding tool 6 A shown in Fig. 10 includes a large-diameter cylindrical processed portion 61 (grinding stone) to which diamond particles 60 are adhered on the surface, and a shaft that is fixed to the chuck 31b and extends in the vertical direction. The portion 62 is provided with a flange portion 63 that is widened outward on the upper side of the processed portion 61. Further, three recessed portions 64 which are stripe-shaped recessed are formed in the lower portion of the processed portion 61. The large-diameter grinding tool 6A is rotated by the grinding spindle 31, and the concave portion 64 abuts against the outer edge (outer shape) Wa' of the workpiece W, whereby the workpiece W can be subjected to profile grinding or chamfering. Further, reference numeral 70 is an adsorption stage. Thus, the workpiece W ′ is ground by the large-diameter grinding tool 6 A. Since the grinding tool 6A can be stably ground during the grinding process, the machining accuracy can be improved. In addition, since the grinding tool 6A has a large diameter 'to extend the life of the tool, the workpiece can be continuously ground in a large amount. W ° The small-diameter grinding tool 6 B ' shown in Fig. 1 has: a diamond particle attached to the surface 1 The 60-degree small-diameter cylindrical processed portion 161 is fixed to the shaft portion 1 6 2 of the chuck 3 1 b; and the flange portion 163 is provided on the upper side of the processed portion 161. Further, three recessed portions -26-164 which are stripe-shaped recessed are formed in the lower portion of the processed portion 161. 201130601 The small diameter grinding tool 6B has a small diameter, and the grinding tool 6B is inserted into the hole portion Wb of the workpiece W, and the concave portion 164 abuts against the inner edge Wc of the hole portion Wb, thereby the hole portion of the workpiece W. Wb performs internal grinding or chamfering so that the inner shape of the hole portion Wb of the workpiece W is ground by the small-diameter grinding tool 6B, even if the diameter of the hole portion Wb is small and it is not easy to process. The grinding process is carried out reliably. 〇 Next, for the control method of the grinding device, first, referring to Fig. 12 to Fig. 14, the control method for calculating the grinding path of the workpiece W is as shown in the flowchart of Fig. 2, when starting Thereafter, first, at s 1, the model data (outer shape, hole portion, and the like) of the workpiece W is input (mounted) to the electronic control unit 15 (input step). In the input operation, for example, the design data (CAD data) of the processed workpiece Wo is converted into a grinding data such as a grinding path using another software, and then input (installed) in the electronic control unit 〇 15. After the completion of the input operation, the actual workpiece Wi (hereinafter referred to as the actual workpiece) is placed (loaded) on the processing stage 30, and the workpiece Wi is held by the adsorption stage 70 (holding step). This placing operation is performed by the above-described transport robot 2. The unprocessed actual workpiece Wi is placed on the suction stage 70 of the processing stage 30 by the mounting operation. Then, at S 3, the image of the actual workpiece wi and the reference pins 7 1 and 7 1 is obtained by the camera 23 (photographing step). Fig. 13 shows the photographic characteristics of the camera. In the grinding device μ, the workpiece wi and the reference on the processing stage 30 are photographed by the camera 23 at the high position of the transport robot 2 (handling workpiece Wi) at -27-201130601. Pin 7 1 and 7 1. Thus, the processing stage 30 is photographed from a position farther from the top, and the distortion of the obtained image data of the workpiece Wi and the reference pins 71, 71 can be minimized. An example of the image data thus obtained is shown in Fig. 14(a). The image data of the workpiece Wi and the two reference pins 7 1 and 7 1 are obtained, and each position data is calculated. Next, at S4, the machine origin C (machine origin calculation step) of the machining stage 30 is calculated based on the positions of the reference pins 71 and 71. Here, the machine origin C is a reference for the mechanical coordinates used for the grinding process, and the machine origin C is specified to perform the correct grinding process. The mechanical origin C is determined by the midpoint of the connecting line L of the two reference pins 71 and 71 as shown in Fig. 14(b). Further, as another example, as shown by a broken line, two further reference pins 71 and 71' are added, and the connection line N of the two additional reference pins 71' and 71' and the connection of the two reference pins 71 and 71 are connected. The intersection of both sides of the line L is defined as the mechanical origin c. Next, at S5, based on the acquired data of the actual workpiece Wi, the gravity center position P of the outer shape Wa of the actual workpiece Wi and the gravity center position Q of the hole portion Wb (the center of gravity position calculation step) are calculated. Here, the position of the center of gravity refers to the position of the center of gravity of the figure, which is determined according to the outer shape of the workpiece W and the shape of the hole. The black circles P and Q shown in Fig. 14(b) are the position of the center of gravity of the outer shape W a of the actual workpiece Wi and the position of the center of gravity of the hole portion W b , respectively. Then, at S6, the position of the center of gravity of the actual workpiece Wi (the position of the center of gravity P of the outer shape and the position of the center of gravity of the hole portion Q) and the position of the center of gravity of the model Wm (the center of gravity Pm of the shape -28-201130601 and the position of the center of gravity Qm of the hole portion) are given. To. By making the center-of-gravity positions P, Q of the actual workpiece Wi and the centroid positions Pm, Qm of the model Wm coincide, the difference (positional data difference) between the actual workpiece Wi and the model Wm can be made clear. The state shown in Fig. 14(c) is a state in which the actual workpiece Wi and the center of gravity position P, Q, Pm, and Qm of the model Wm (small chain line) are in agreement. Thus, the position of the center of gravity P, Q, Pm, Qm can cause the difference between the actual workpiece wi and the model Wm to be clear. 0 Next, at S 7, the machine origin C of the machining stage 30 and the actual workpiece will be machined.
Wi的重心位置P作比較，運算機械原點C和實際工件Wi 的重心位置P之偏差量（橫方向的偏差量X、縱方向的偏 差量Y、旋轉方向的偏差量0)(偏差量運算步驟）。此外， 也將實際工件Wi和模型Wm作比較，而根據外形差來運 算削去量Aw。如此能使實際工件Wi的磨削量等變明確。 弟1 4 ( d)圖係顯不各個偏差量和削去量。相對於加工 載台的機械原點C，實際工件Wi的重心位置P之偏差量 〇 例如該圖所示’朝左側偏差X，朝上側偏差γ，又朝右側 傾斜0。 而且’關於削去量，寬度方向的削去量Awl，是將實 際工件Wi的寬度尺寸rl減去模型的寬度尺寸T1除以2 而算出；長度方向的削去量A W2，是將實際工件Wi的長 度尺寸r2減去模型的長度尺寸T2除以2而算出。 如此般求出寬度方向和長度方向的削去量Δνν1、Aw2 後’將其中數値大者決定爲最終削去量AW。如此般決定的 理由在於’在進行磨削加工時，其軌跡與模型形狀相似， -29- 201130601 且將工件全周以一定的削去量削去，而藉由決定爲數値大 者，可確實地實施削去，而能磨削成更接近模型形狀的形 狀。 接著，在S8，對應於X、Y、0之偏差量及削去量Aw ，算出工件Wi的磨削路徑（磨削路徑算出步驟）。該磨削 路徑，會依實際工件Wi的形狀、實際工件Wi的載置位 置的變動而改變，因此在各個工件w是不同的。 然後，在S9，根據所算出的磨削路徑將實際工件Wi 磨削（磨削步驟）。該磨削作業，是藉由使磨削主軸3 1和加 工載台30(加工平台33)移動來進行。該工件W的磨削作 業，是使用上述大徑磨削工具6A或小徑磨削工具6B而對 應於磨削部位來進行。 最後，在s 1 0，將實際工件Wi從加工載台3 0取出（ 搬出步驟）。該取出作業也是藉由上述搬運機械人2來進 行，將加工完畢的工件Wo從加工載台3 0取出。 接下來，在S 11判斷作業是否結束。要繼續作業的情 況（判斷爲NO的情況），爲了加工下個工件W而再度前進 到上述S2。另一方面，在作業結束的情況（判斷爲YES的 情況，電源OFF的情況），就那樣前進到結束。 藉由以上步驟來控制第一實施形態的磨削裝置Μ。 如以上般，該第一實施形態的磨削裝置Μ，是進行薄 板玻璃（W)的端面磨削之磨削裝置Μ，事先安裝（儲存）薄 板玻璃的模型Wm的資料（S 1 )，根據攝影機23所取得的 基準銷71、71之攝影資料來算出加工載台30的機械原點 -30- 201130601 C(S4)。接著，根據攝影機23所取得的薄板玻璃（實際工 件Wi)之攝影資料來求出薄板玻璃（實際工件Wi)的重心位 置P(S5)，將加工載台30的機械原點C和薄板玻璃（W)的 重心位置P作比較來算出薄板玻璃的偏差量（橫方向的偏 差量X、縱方向的偏差量Y、旋轉方向的偏差量0)(S7)， 對應於該偏差量而運算磨削路徑（S 8)，根據所算出的磨削 路徑讓磨削主軸3 1動作（S9)。 0 因此，即使不在薄板玻璃（W)本身形成「構成基準之 標記（記號）」等，藉由設置在加工載台30之基準銷71、 71來求出「機械原點C」，可掌握薄板玻璃（W)之偏差量 (X、Y、0 )，根據所掌握的偏差量，即使是未形成標記（ 記號）等的薄板玻璃（W)也能進行正確的磨削加工。 如此，對行動電話等的可攜式終端機之顯示畫面所使 用之薄板玻璃（W)進行端面磨削之磨削裝置Μ，藉由利用 攝影機23之攝影資料來進行磨削加工可謀求高精度的加 Q 工’且不須在薄板玻璃（W)的表面設置記號等就能進行磨 削加工。 在本實施形態，雖是藉由複數個基準銷71、71來求 出機械原點，除此外，藉由讓一部分突出之基準突出部來 求出機械原點亦可，又藉由將一部分著色的基準部來求出 機械原點亦可。 又在本實施形態，是讓薄板玻璃（W)的重心位置Ρ和 模型Wm的重心位置Pm —致，將薄板玻璃（W)和模型Wm 作比較而運算磨削主軸3 1的削去量Aw。亦即，判斷薄板 -31 - 201130601 玻璃（W)比模型Wm大多少（例如檢測出長度方向的差値和 寬度方向的差値’該「差値」的大小），對應於該大小來 改變削去量Aw。 因此，能讓薄板玻璃（W)的削去量A w依各工件而改變 ’因此能以更正確的形狀及尺寸來將薄板玻璃（W)加工。 如此’能更正確地掌握依各工件而改變之薄板玻璃的削去 量Aw來進行磨削作業’藉此可高精度地加工複數個薄板 玻璃。 此外’在本實施形態，是求出薄板玻璃的外形W a之 重心位置P和孔部形狀Wb的重心位置Q來算出工件Wi 的重心位置。 如此’藉由算出薄板玻璃的外形W a之重心位置P和 孔部形狀Wb的重心位置Q，即使是具有孔部的薄板玻璃 ，仍能確實地按照工件模型Wm的形狀來進行磨削。如此 ，即使是具有孔部Wb之形狀複雜的薄板玻璃（w)，仍可 正確地運算磨削路徑而高精度地進行磨削。 又在本實施形態，將基準銷7 1、7 1設置在隔著薄板 玻璃（W)之兩側位置。 藉此，可將機械原點C至少設定在上述兩個基準銷 71、71之連結線L上，而能設定在接近薄板玻璃（W)的重 心位置P之位置。因此，能更正確地運算薄板玻璃（W)的 偏差量。亦即，藉由使機械原點C接近薄板玻璃（W)的重 心位置P，可減少偏差量運算時的誤差，如此可運算出正 確的偏差量。因此可進行更高精度的磨削加工。 -32- 201130601 此外，在本實施形態，藉由將基準銷7 1的前端部7 1 a 設定成與吸附台70的上面70a同高（hp = hs)，能使其離攝 影機23的距離和薄板玻璃（W)離攝影機23的距離大致一 致。 藉此，藉由使基準銷71的被攝影點（前端部71a)與薄 板玻璃（W)之高度方向的位置大致一致，能讓攝影機23的 焦點對焦於兩者。藉此，可確實地同時攝影基準銷71和 0 薄板玻璃（W)，而能更正確地運算薄板玻璃（W)之偏差量° <第二實施形態> 接著參照第15圖〜第21圖來說明本發明的第二實施 形態。又關於與上述第一實施形態相同的構造或具有相胃 功能的構件等，是省略其說明。 第二實施形態的磨削裝置Μ也是，如第1 5圖所示’ 與第一實施形態同樣的具有複數個（四個）加工單元3Α ' Q 3Β、3C、3D，但在第二實施形態，該等複數個加工單元 3Α、3Β、3C、3D是排列成一列（如第15圖所示沿橫方向 排列）。如此，藉由排成一列，由於加工單元3 A、3 Β、3 C 、3 D設置成接近磨削裝置Μ的外部側，比起第一實施形 態，更容易進行加工單元3 A、3 Β、3 C、3 D的維修等。 此外，複數個加工載台30設置成，可沿著與上述複 數個加工單元3A、3B、3C、3D的配設方向交叉（正交）的 方向（第15圖所示的縱方向）移動，具體而言，各加工載台 30是可滑動地載置在沿縱方向配設的載台用軌道1〇1上° -33- 201130601 而且，各加工載台30之軌道101的一側（第15圖的紙面 下側），是作爲藉由加工單元3A、3B、3C、3D來加工工 件的加工位置；又軌道1 〇 1的另一側（紙面上側），是作爲 待機位置。 此外，沿著與上述載台用軌道101交叉（正交）的方向（ 第15圖的橫方向）’ g受置將搬運機械人（圖不省略）安裝成 可滑動之搬運機械人用軌道103。藉此，使搬運機械人可 沿著複數個加工單元3 A、3 B、3 C、3 D的配設方向移動， 而且，搬運機械人可和位於待機位置之加工載台30進行 工件的交接。 此外，鄰接於上述複數個加工單元3A、3B、3C、3D 的側方，設置工件的投入取出載台4，在與該投入取出載 台4相對向的位置，也設有其他的投入取出載台4。上述 搬運機械人用軌道103延伸至該投入取出載台4的設置部 位附近’藉此’上述搬運機械人可和投入取出載台4進行 工件的交接。又上述兩個投入取出載台4當中，將一方當 作僅載置未加工的工件之投入載台，並將另一方當作僅載 置加工完畢的工件之取出載台亦可。 此外’在搬運機械人安裝：攝影時作爲照明工件的照 明手段之照明框（圖示省略）’在攝影時，藉由搬運機械人 之移動而使照明框移動至工件W的照明位置。 此外’用來攝影工件之影像取得用的攝影機（圖示省 略），是設置成可沿著複數個加工單元3A、3B、3C、3D 的配設方向移動，該攝影機’在攝影時可移動至待機位置 -34- 201130601 的加工載台3 0上之工件正上方。在此，攝影機，是在沿 著上述複數個加工載台3 0的待機位置而設置於待機位置 上方之攝影機用軌道（圖示省略）上，安裝成可滑動。該攝 影機及上述照明框的具體構造可使用與上述第一實施形態 相同的。又雖未具體圖示出，加工單元3Α、3Β、3C、3D 之具體構造和加工載台3 0的具體構造可和第一實施形態 大致相同。 q 此外，在第二實施形態，上述加工載台30係具備： 可滑動地載置在上述載台用軌道101上之載台基台105、 可裝卸地安裝於該載台基台105上之保持基台107。在該 保持基台107上，載置固定著用來吸附工件之吸附台70( 保持台）。 而且，在該載台基台105上，可裝卸地安裝複數種（ 三種）的保持基台107。具體而言，在該載台基台1〇5上可 選擇性地安裝第一保持基台1 07、第二保持基台1 07以及 Q 第三保持基台1〇7當中的一個。在該第一保持基台107， 如第1 6圖所示豎設固定著分別保持小型工件之三個第一 吸附台70。在該第二保持基台1〇7，如第17圖所示豎設 固定著用來保持一個大型工件之一個第二吸附台70。在該 第三保持基台107，如第18圖所示豎設固定著分別保持中 型工件之兩個第三吸附台70。亦即，在加工載台30可選 擇性地設置：分別保持小型工件的複數個第一吸附台7 0、 用來保持大型工件之第二吸附台70'分別保持中型工件的 複數個第三吸附台70當中任一者。又在各保持基台1〇7 -35- 201130601 上載置複數個磨削工具6。 在上述第一保持基台i〇7、第二保持基台107以及第 三保持基台107、和上述載台基台105，設有用來定位安 裝位置之定位手段。具體而言，保持基台107，是在各保 持基台107的下部具有大致相同形狀的基台板1〇9，在各 基台板1 〇 9之兩側附近穿設一對的定位孔部1丨i。而且， 在前述載台基台1〇5’突設可插通於該定位孔部111之定 位銷113。因此’藉由在上述定位孔部111插通定位銷 113，可將各保持基台107定位載置於載台基台1〇5上。 再者，在上述第一保持基台107、第二保持基台107 以及第三保持基台107、和上述載台基台1〇5，設有用來 將兩者固定之固定手段。具體而言，在各保持基台〗07的 基台板109上穿設複數個螺栓插通孔部（圖示省略），在前 述載台基台105上，在對應於該螺栓插通孔部的位置形成 供螺栓115螺合的母螺紋117。因此，藉由螺栓115，可 將定位載置於上述載台基台105上之保持基台107予以固 定。又藉由將螺栓115卸下，可讓保持基台1〇7脫離載台 基台1 0 5。 在上述載台基台1 05，朝攝影機側（上側）豎設複數個（ 八個）基準銷7 1 (基準部位）。該基準銷7 1如第1 6圖〜第 18圖所示，是配置在比設置在加工載台30之吸附台7〇的 上面（承接面）更外側的位置，而配置在比該吸附台70所保 持的工件外形更外側。又上述吸附台7 0的上面，其外形 設計成與工件外形大致相同的形狀，且比工件外形稍小。 -36- 201130601 更詳細的說’這八個基準銷71，是在載台基台1〇5上 面所固定的四個台座H9上分別固定一對。這四個台座 119,是分別配置在所要載置固定的保持基台1〇7的前方 、後方、右前方及左後方。此外，加工載台3 0係具有： 爲了防止水滴和灰塵等的附著而對各基準銷71噴吹空氣 之吹氣手段（圖示省略）。在上述台座119附設有：作爲該 吹氣手段之吹氣噴嘴、以及用來對該吹氣噴嘴供應空氣之 q 空氣供應連接口 121。 此外，基準銷71不僅是在上述載台基台1〇5上，也 形成在用來保持小型工件之第一保持基台1〇7。在該第一 保持基台107豎設兩個基準銷71。這兩個基準銷71配置 在中央吸附台7 〇的兩側，一方的基準銷71配置在前方側 ’另一方的基準銷7 1配置在後方側。此外，這二個基準 銷71也是固定在台座119(與上述台座119同樣的附設有 吹氣噴嘴及空氣供應連接口 121)。 Q 又上述各基準銷71，與第一實施形態同樣的設定成： 使被攝影點（前端部）的高度（上下方向的位置）與吸附台70 上面的高度相同。 此外，在各保持基台107的吸附台70上，與第一實 施形態同樣地設有吸氣口（圖示省略），且設有用來讓該吸 氣口成爲負壓之負壓連接口 123。在本實施形態，如第21 圖及第18圖所示，設置在第一保持基台107上之三個吸 附台70以及設置在第三保持基台107上之兩個吸附台70 ，其上面分別形成不同的大小。藉此，在同一保持基台 -37- 201130601 107上可保持多種形狀的工件。又使設置在第一保持基台 1 07上的三個吸附台70的上面成爲相同形狀，而讓各吸附 台70可保持相同形狀之複數個工件，也是屬於可適當設 計變更的事項。 在上述第二實施形態的磨削裝置，在加工載台3 0上 可選擇性地設置複數種的吸附台70，因此可對應於磨削對 象之工件大小，而選擇適當的吸附台來正確地進行磨削作 業。再者，在載置固定第一或第三保持基台107的情況， 可在加工載台30上設置複數個吸附台70。藉此，不須變 更保持基台1 07，可對應於工件大小而選擇更適當的吸附 台70來進行磨削作業。 此外’在上述第二實施形態，係具有複數個基準銷71 ’該等複數個基準銷71分別配置在吸附台70上所保持之 各工件外形的外側’因此可在接近工件的位置設置基準銷 7 1，如此使「機械原點」接近工件的重心位置，而能減少 運算偏差量時的誤差。再者，由於上述基準銷71位在隔 著各工件W之兩側位置，能以工件兩側的基準銷7 1之連 結線上所形成的點作爲「機械原點」，藉此能以接近工件 重心位置之位置作爲機械原點。而且，在上述第二實施形 態’由於是隔著工件而配置相對向之至少兩對的基準銷7 1 ’藉由以各對的基準銷7 1之連結線的交點作爲「機械原 點」，可讓該機械原點與工件的重心位置更接近。因此， 可更正確地運算工件的偏差量。 再者’豎設於上述基台板109之基準銷71，由於位在 -38- 201130601 吸附台7 0上所保持的工件外形的外側，基準銷7 1不致被 工件遮蔽，因此即使變更設置第一、第二、第三吸附台7〇 之任一者，仍不須更換該基準銷7 1，而能正確地進行攝影 作業。因此，能使加工載台的構造變簡單。 <其他實施形態> 又本發明並不限定於上述實施形態，在本發明所意圖 的範圍內可適當地進行設計變更。 上述實施形態之磨削裝置之工件W，雖是行動電話用 的薄板玻璃，但例如爲可攜式音響機器用的薄板玻璃亦可 ，又亦可爲可攜式遊戲機用的薄板玻璃。再者，亦可爲可 攜式導航機用的薄板玻璃、可攜式電視用的薄板玻璃等。 此外，關於磨削裝置的整體構造也是，並不限定於上 述實施形態，例如加工單元可爲一個，相反地具有五個六 個等更多的加工單元也是包含在本發明所意圖的範圍內。 再者，在上述第一實施形態雖是說明，在磨削作業時 ，沿工件W的長邊方向讓磨削主軸3 1移動，沿工件W的 短邊方向讓工件加工平台33(加工載台30)移動，但在本發 明’只要在工件W的平面方向讓工件W和磨削主軸3 1相 對移動即可。例如，僅磨削主軸3 1移動，亦即讓磨削主 軸31沿工件W的長邊方向及短邊方向的雙方向移動，以 進行工件W的磨削亦可。 再者’關於磨削工具6也是，並不限定於本實施形態 所列舉的情況，例如亦可爲球形的磨削工具、圓盤狀的磨 -39- 201130601 削工具、或圓錐狀的磨削工具等。此外，關於磨石材料也 是，並不限定於鑽石。 此外，在第二實施形態雖是說明，將具備複數個保持 台之一個保持基台安裝於載台基台，但例如將複數個保持 台分別安裝在載台基台亦可。在此情況，可在各保持台之 間，從載台基台的上面突設基準銷。此外，如此般在保持 台間從載台基台突設基準銷的情況，是將該基準銷可裝卸 地安裝於載台基台，或是在大型（或中型）的保持基台上形 成可收容該基準銷之孔部，而進行如此般的設計變更亦可 【圖式簡單說明】 第1圖係顯示本發明的磨削裝置之第一實施形態的俯 視圖。 第2圖係第1圖的磨削裝置之前視圖。 第3圖係第1圖的磨削裝置之側視圖。 第4圖係第1圖的磨削裝置之搬運機械人的三面圖’ U)爲前視圖，（b)爲側視圖，（C)爲俯視圖。 第5圖係第1圖的磨削裝置的搬運機械人之搬運時的 動作之說明圖；（a)顯示從基準狀態至工件保持開始狀態’ (b)顯示從工件保持開始狀態至朝向加工載台之工件搬運狀 態。 第6圖係第1圖的磨削裝置的搬運機械人之搬運時的 動作之說明圖；（c)顯示從朝向加工載台之工件搬運狀態至 -40- 201130601 攝影機攝影狀態，（d)顯示從攝影機攝影狀態至下個工件的 保持開始狀態。 第7圖係第1圖的磨削裝置之第二加工單元的俯視圖 〇 第8圖係第1圖的磨削裝置之第二加工單元之包含局 部截面的前視圖。 第9圖係第1圖的磨削裝置之第二加工單元之包含局 0 部截面的側視圖。. 第1 0圖係在第1圖的磨削裝置使用大徑磨削工具時 之包含局部截面之詳細側視圖。 第1 1圖係在第1圖的磨削裝置使用小徑磨削工具時 之包含局部截面之詳細側視圖。 第1 2圖係顯示第1圖的磨削裝置之控制方法的流程 圖。 第13圖係顯示第1圖的磨削裝置之藉由攝影機攝影 Q 加工載台的狀態之側視圖。 第14(a)〜（d)圖係第1圖的磨削裝置所攝影的資料之 處理及運算方法之說明圖。 第1 5圖係顯示本發明的磨削裝置的第二實施形態之 俯視圖。 第16圖係第15圖的磨削裝置之設置有第一吸附台的 加工載台之俯視圖。 第17圖係第15圖的磨削裝置之設置有第二吸附台的 加工載台之俯視圖。 -41 - 201130601 第1 8圖係第1 5圖的磨削裝置之設置有第三吸附台的 加工載台之俯視圖。 第1 9圖係第1 5圖的磨削裝置之吸附台脫離狀態之加 工載台的俯視圖。 第20圖係第15圖的磨削裝置之第一保持基台的俯視 圖。 第21圖係第15圖的磨削裝置之第一保持基台的前視 圖。 【主要元件符號說明】 Μ :磨削裝置 W :工件（薄板玻璃）The center of gravity P of the Wi is compared, and the amount of deviation between the machine origin C and the center of gravity P of the actual workpiece Wi (the amount of deviation X in the lateral direction, the amount of deviation Y in the longitudinal direction, and the amount of deviation in the direction of rotation 0) is calculated (deviation amount calculation) step). In addition, the actual workpiece Wi is compared with the model Wm, and the amount of shaving Aw is calculated based on the difference in shape. This makes it possible to clarify the amount of grinding of the actual workpiece Wi and the like. Brother 1 4 (d) The graph shows the amount of deviation and the amount of shaving. With respect to the machine origin C of the machining stage, the deviation amount of the center of gravity P of the actual workpiece Wi is 〇, for example, the deviation X toward the left side, the deviation γ toward the upper side, and the inclination 0 toward the right side. Moreover, regarding the amount of shaving, the amount of cut Awl in the width direction is calculated by subtracting the width dimension rl of the actual workpiece Wi from the width dimension T1 of the model by 2; the amount of shaving A W2 in the length direction is the actual workpiece. The length dimension r2 of the Wi is calculated by subtracting the length dimension T2 of the model by two. When the amount of cut-off Δνν1 and Aw2 in the width direction and the longitudinal direction is obtained in this way, the one of the largest number is determined as the final amount of cut AW. The reason for this decision is that 'when grinding, the trajectory is similar to the shape of the model, -29- 201130601 and the workpiece is cut off with a certain amount of cut, and the number is determined by the number of cuts. The cutting is carried out reliably, and it can be ground into a shape closer to the shape of the model. Next, at S8, the grinding path of the workpiece Wi (grinding path calculation step) is calculated corresponding to the amount of deviation of X, Y, and 0 and the amount of cut Aw. Since the grinding path changes depending on the shape of the actual workpiece Wi and the position at which the actual workpiece Wi is placed, the workpiece w is different. Then, at S9, the actual workpiece Wi is ground (grinding step) based on the calculated grinding path. This grinding operation is performed by moving the grinding spindle 31 and the processing stage 30 (machining stage 33). The grinding operation of the workpiece W is performed by using the large-diameter grinding tool 6A or the small-diameter grinding tool 6B in accordance with the grinding portion. Finally, at s 1 0, the actual workpiece Wi is taken out from the processing stage 30 (the carry-out step). This take-out operation is also performed by the transport robot 2, and the processed workpiece Wo is taken out from the processing stage 30. Next, it is judged at S 11 whether or not the job is over. In the case where the work is to be continued (in the case of NO), the next workpiece W is processed to proceed to the above S2. On the other hand, in the case where the work is completed (when the determination is YES, the power is turned off), the process proceeds to the end. The grinding apparatus 第一 of the first embodiment is controlled by the above steps. As described above, the grinding device 第一 according to the first embodiment is a grinding device for performing end surface grinding of the thin plate glass (W), and the material (S 1 ) of the model Wm of the thin plate glass is attached (stored) in advance, according to The machine origin of the reference pins 71 and 71 acquired by the camera 23 calculates the machine origin -30-201130601 C of the processing stage 30 (S4). Then, based on the photographic data of the thin plate glass (actual workpiece Wi) obtained by the camera 23, the center of gravity position P of the thin plate glass (actual workpiece Wi) is obtained (S5), and the machine origin C and the thin plate glass of the processing stage 30 are The center of gravity P of the W) is compared to calculate the amount of deviation of the thin glass (the amount of deviation X in the lateral direction, the amount of deviation Y in the longitudinal direction, and the amount of deviation in the direction of rotation 0) (S7), and the grinding is performed in accordance with the amount of deviation. The path (S8) causes the grinding spindle 31 to operate based on the calculated grinding path (S9). Therefore, even if the "marking mark (symbol)" or the like is formed in the thin glass (W) itself, the "machine origin C" can be obtained by the reference pins 71 and 71 provided on the processing stage 30, so that the thin plate can be grasped. The amount of deviation (X, Y, 0) of the glass (W) can be accurately ground even if the sheet glass (W) is not formed with a mark (mark) or the like based on the amount of deviation. In this way, the grinding device for performing end surface grinding on the thin glass (W) used for the display screen of the portable terminal such as a mobile phone can achieve high precision by grinding using the photographic data of the camera 23. The addition of Q can be performed without setting a mark on the surface of the thin glass (W). In the present embodiment, the machine origin is obtained by a plurality of reference pins 71 and 71. In addition, the mechanical origin can be obtained by allowing a part of the protruding protrusions to be protruded, and a part is colored. The reference point can be used to determine the mechanical origin. Further, in the present embodiment, the position of the center of gravity of the thin plate glass (W) and the position of the center of gravity Pm of the model Wm are compared, and the amount of the cutting of the grinding spindle 31 is calculated by comparing the thin plate glass (W) with the model Wm. . That is, it is judged how much the thin plate -31 - 201130601 glass (W) is larger than the model Wm (for example, the difference between the length direction and the width direction is detected as the size of the "difference"), and the size is changed corresponding to the size. Go to Aw. Therefore, the amount of cut Aw of the thin plate glass (W) can be changed depending on each workpiece. Therefore, the thin plate glass (W) can be processed in a more correct shape and size. Thus, the grinding operation can be performed by more accurately grasping the amount of cut Aw of the thin glass which is changed depending on each workpiece. Thus, a plurality of thin glass sheets can be processed with high precision. Further, in the present embodiment, the position of the center of gravity of the workpiece Wi is calculated by determining the position C of the center of gravity P of the outer shape W a of the thin glass and the center of gravity Q of the hole shape Wb. By calculating the center-of-gravity position P of the outer shape W a of the thin glass and the center-of-gravity position Q of the hole shape Wb, the thin plate glass having the hole portion can be surely ground in accordance with the shape of the workpiece model Wm. As described above, even in the case of the thin plate glass (w) having a complicated shape of the hole portion Wb, the grinding path can be accurately calculated and the grinding can be performed with high precision. Further, in the present embodiment, the reference pins 7 1 and 7 1 are disposed at positions on both sides of the thin plate glass (W). Thereby, the machine origin C can be set at least on the connecting line L of the two reference pins 71 and 71, and can be set to a position close to the center of gravity P of the thin plate glass (W). Therefore, the amount of deviation of the thin plate glass (W) can be calculated more accurately. That is, by bringing the machine origin C close to the center of gravity P of the thin plate glass (W), the error in the calculation of the deviation amount can be reduced, so that the correct amount of deviation can be calculated. Therefore, higher precision grinding can be performed. Further, in the present embodiment, by setting the front end portion 7 1 a of the reference pin 7 1 to be the same height (hp = hs) as the upper surface 70a of the suction stage 70, the distance from the camera 23 can be made. The distance between the thin glass (W) and the camera 23 is substantially the same. Thereby, by focusing the position of the photographed point (front end portion 71a) of the reference pin 71 and the position of the thin plate glass (W) substantially in the height direction, the focus of the camera 23 can be focused on both. Thereby, the reference pin 71 and the 0 thin plate glass (W) can be photographed at the same time, and the deviation amount of the thin plate glass (W) can be calculated more accurately. <Second embodiment> Next, referring to Fig. 15 to Fig. 21 The figure illustrates a second embodiment of the present invention. Further, the same configuration as that of the above-described first embodiment or a member having a gastric phase function or the like is omitted. The grinding apparatus 第二 of the second embodiment also has a plurality of (four) processing units 3 Α 'Q 3 Β, 3C, 3D as in the first embodiment as shown in Fig. 15. However, in the second embodiment The plurality of processing units 3Α, 3Β, 3C, and 3D are arranged in a line (arranged in the horizontal direction as shown in FIG. 15). Thus, by arranging the rows, since the machining units 3 A, 3 Β, 3 C , 3 D are disposed close to the outer side of the grinding device ,, the machining units 3 A, 3 are easier to perform than the first embodiment Β , 3 C, 3 D maintenance, etc. Further, the plurality of processing stages 30 are disposed so as to be movable in a direction (orthogonal direction shown in FIG. 15) that intersects (orthogonally) with the arrangement direction of the plurality of processing units 3A, 3B, 3C, and 3D. Specifically, each of the processing stages 30 is slidably placed on the stage rail 1〇1 disposed in the vertical direction by −33- 201130601, and the side of the rail 101 of each processing stage 30 (the The lower side of the paper surface of Fig. 15 is a processing position for processing the workpiece by the machining units 3A, 3B, 3C, and 3D; and the other side (side of the paper) of the rail 1 〇1 serves as a standby position. In addition, a transport robot (not shown) is attached to a slidable transport robot track 103 in a direction (orthogonal direction) of the intersection (or orthogonal) of the stage rail 101. . Thereby, the transport robot can be moved along the arrangement direction of the plurality of processing units 3 A, 3 B, 3 C, and 3 D, and the transport robot can perform the transfer of the workpiece with the processing stage 30 at the standby position. . Further, adjacent to the plurality of processing units 3A, 3B, 3C, and 3D, a workpiece loading/unloading stage 4 is provided, and other input and output loading positions are provided at positions facing the input/unloading stage 4. Taiwan 4. The transport robot rail 103 extends to the vicinity of the installation portion of the input/unloading stage 4, whereby the transport robot can transfer the workpiece to and from the take-up stage 4. Further, among the two input/output take-up stages 4, one of them may be regarded as an input stage on which only an unprocessed workpiece is placed, and the other may be regarded as a take-out stage on which only the processed workpiece is placed. Further, the lighting frame (not shown) which is a lighting means for illuminating the workpiece during photographing is mounted. When the photographing is performed, the lighting frame is moved to the lighting position of the workpiece W by the movement of the transport robot. Further, the camera (not shown) for acquiring the image for photographing the workpiece is arranged to be movable along the arrangement direction of the plurality of processing units 3A, 3B, 3C, and 3D, and the camera 'movable to The standby position -34- 201130601 is directly above the workpiece on the processing stage 30. Here, the camera is slidably attached to a camera rail (not shown) which is disposed above the standby position along the standby position of the plurality of processing stages 30. The specific structure of the camera and the above illumination frame can be the same as that of the first embodiment described above. Further, although not specifically illustrated, the specific structures of the machining units 3A, 3B, 3C, and 3D and the specific structure of the processing stage 30 can be substantially the same as those of the first embodiment. Further, in the second embodiment, the processing stage 30 includes a stage base 105 that is slidably placed on the stage rail 101, and is detachably attached to the stage base 105. The base 107 is maintained. On the holding base 107, a suction stage 70 (holding stage) for adsorbing a workpiece is placed and fixed. Further, a plurality of (three types) holding bases 107 are detachably attached to the stage base 105. Specifically, one of the first holding base 107, the second holding base 107, and the Q holding base 1〇7 can be selectively mounted on the stage base 1〇5. In the first holding base 107, as shown in Fig. 16, three first adsorption stages 70 each holding a small workpiece are vertically fixed. At the second holding base 1'7, as shown in Fig. 17, a second suction stage 70 for holding a large workpiece is vertically fixed. In the third holding base 107, as shown in Fig. 18, two third suction stages 70 respectively holding the medium-sized workpieces are vertically fixed. That is, the processing stage 30 can be selectively provided with a plurality of first adsorption stages 70 for holding small workpieces, and a plurality of third adsorption stages for holding the medium-sized workpieces by the second adsorption stage 70' for holding large workpieces. Any of the stations 70. Further, a plurality of grinding tools 6 are placed on each of the holding bases 1〇7 - 35 - 201130601. The first holding base unit i7, the second holding base 107, the third holding base 107, and the stage base 105 are provided with positioning means for positioning the mounting position. Specifically, the holding base 107 is a base plate 1〇9 having substantially the same shape in the lower portion of each holding base 107, and a pair of positioning holes are formed in the vicinity of both sides of each of the base plates 1 to 9. 1丨i. Further, a positioning pin 113 that can be inserted into the positioning hole portion 111 is protruded from the stage base 1'5'. Therefore, each of the holding bases 107 can be positioned and placed on the stage base 1〇5 by inserting the positioning pins 113 in the positioning hole portions 111. Further, the first holding base 107, the second holding base 107, the third holding base 107, and the stage base 1b are provided with fixing means for fixing the both. Specifically, a plurality of bolt insertion holes (not shown) are bored in the base plate 109 of each of the holding bases 07, and the insert bases 105 correspond to the bolt insertion holes. The position forms a female thread 117 for the bolt 115 to be screwed. Therefore, the retaining base 107 which is placed on the stage base 105 can be fixed by the bolts 115. Further, by removing the bolt 115, the holding base 1〇7 can be separated from the stage base 105. On the stage base 105, a plurality of (eight) reference pins 7 1 (reference portions) are erected toward the camera side (upper side). As shown in FIGS. 16 to 18, the reference pin 71 is disposed at a position outside the upper surface (the receiving surface) of the adsorption stage 7A provided on the processing stage 30, and is disposed at a position higher than the adsorption stage. The 70 held workpieces are more outwardly shaped. Further, the upper surface of the adsorption stage 70 is shaped to have substantially the same shape as the outer shape of the workpiece, and is slightly smaller than the outer shape of the workpiece. -36- 201130601 In more detail, the eight reference pins 71 are fixed to each of the four seats H9 fixed on the upper surface of the stage base 1〇5. The four pedestals 119 are disposed in front, rear, right front, and left rear of the holding bases 1 to 7 to be fixed. Further, the processing stage 30 has an air blowing means (not shown) for blowing air to each of the reference pins 71 in order to prevent adhesion of water droplets, dust, or the like. The pedestal 119 is provided with an air blowing nozzle as the air blowing means and a q air supply connecting port 121 for supplying air to the air blowing nozzle. Further, the reference pin 71 is formed not only on the stage base 1〇5 but also on the first holding base 1〇7 for holding a small workpiece. Two reference pins 71 are erected on the first holding base 107. The two reference pins 71 are disposed on both sides of the center adsorption stage 7A, and one of the reference pins 71 is disposed on the front side. The other reference pin 7 1 is disposed on the rear side. Further, the two reference pins 71 are also fixed to the pedestal 119 (the same air blowing nozzle and air supply connection port 121 as the pedestal 119). Further, each of the reference pins 71 described above is set such that the height (the position in the vertical direction) of the photographed point (front end portion) is the same as the height on the upper surface of the suction stage 70, as in the first embodiment. Further, in the adsorption stage 70 of each holding base 107, an intake port (not shown) is provided in the same manner as in the first embodiment, and a negative pressure connection port 123 for making the intake port a negative pressure is provided. . In the present embodiment, as shown in Figs. 21 and 18, three adsorption stages 70 provided on the first holding base 107 and two adsorption stages 70 provided on the third holding base 107 are formed thereon. Different sizes are formed separately. Thereby, workpieces of various shapes can be held on the same holding base -37-201130601 107. Further, the upper surfaces of the three adsorption stages 70 provided on the first holding base 107 are formed into the same shape, and the plurality of workpieces in which the adsorption stages 70 can be held in the same shape are also items which can be appropriately designed and changed. In the grinding apparatus according to the second embodiment, a plurality of types of adsorption stages 70 can be selectively provided on the processing stage 30. Therefore, an appropriate adsorption stage can be selected to accurately correspond to the size of the workpiece to be ground. Grinding work. Further, in the case where the first or third holding base 107 is fixed, a plurality of suction stages 70 may be provided on the processing stage 30. Thereby, the base station 107 can be maintained without changing, and a more appropriate adsorption stage 70 can be selected for the grinding operation in accordance with the size of the workpiece. Further, in the second embodiment described above, the plurality of reference pins 71 are provided, and the plurality of reference pins 71 are disposed outside the outer shape of each workpiece held on the suction table 70. Therefore, the reference pin can be disposed at a position close to the workpiece. 7 1, so that the "machine origin" is close to the center of gravity of the workpiece, and the error in calculating the deviation amount can be reduced. Further, since the reference pin 71 is positioned at both sides of the workpiece W, the point formed on the connecting line of the reference pins 7 1 on both sides of the workpiece can be used as the "mechanical origin", thereby being able to approach the workpiece. The position of the center of gravity is used as the mechanical origin. Further, in the second embodiment, the reference pin 7 1 ' at least two pairs facing each other with the workpiece interposed therebetween is referred to as the "mechanical origin" by the intersection of the connecting lines of the pair of reference pins 7 1 . This machine origin can be brought closer to the center of gravity of the workpiece. Therefore, the amount of deviation of the workpiece can be calculated more accurately. Further, the reference pin 71 erected on the base plate 109 is placed outside the outer shape of the workpiece held on the adsorption stage 70 of the -38-201130601, and the reference pin 71 is not obscured by the workpiece, so even if the setting is changed First, any of the second and third adsorption stages 7〇 does not need to be replaced with the reference pin 7 1, and the photographing operation can be performed correctly. Therefore, the configuration of the processing stage can be simplified. <Other Embodiments> The present invention is not limited to the above-described embodiments, and design changes can be appropriately made within the scope of the present invention. The workpiece W of the grinding apparatus of the above-described embodiment is a thin plate glass for a mobile phone, but may be, for example, a thin plate glass for a portable audio device, or a thin plate glass for a portable game machine. Further, it may be a thin plate glass for a portable navigation machine or a thin plate glass for a portable television. Further, the overall configuration of the grinding device is not limited to the above embodiment. For example, the number of processing units may be one, and conversely, having five or more processing units is also included in the scope of the present invention. Further, in the first embodiment, the grinding spindle 31 is moved in the longitudinal direction of the workpiece W during the grinding operation, and the workpiece processing platform 33 is placed along the short side direction of the workpiece W (processing stage) 30) Movement, but in the present invention, it is only necessary to relatively move the workpiece W and the grinding spindle 31 in the plane direction of the workpiece W. For example, only the grinding spindle 31 moves, that is, the grinding spindle 31 is moved in both the longitudinal direction and the short-side direction of the workpiece W to perform grinding of the workpiece W. In addition, the grinding tool 6 is not limited to the case described in the embodiment, and may be, for example, a spherical grinding tool, a disc-shaped grinding-39-201130601 cutting tool, or a conical grinding. Tools, etc. In addition, the stone material is not limited to diamonds. Further, in the second embodiment, a holding base having a plurality of holding stages is attached to the stage base. For example, a plurality of holding stages may be attached to the stage base, respectively. In this case, the reference pin can be protruded from the upper surface of the stage base between the holding stages. Further, in the case where the reference pin is protruded from the stage base between the holding stages, the reference pin is detachably attached to the stage base or formed on a large (or medium-sized) holding base. The hole portion of the reference pin is accommodated, and such a design change can be made. [Brief Description] FIG. 1 is a plan view showing a first embodiment of the grinding apparatus of the present invention. Fig. 2 is a front view of the grinding apparatus of Fig. 1. Figure 3 is a side view of the grinding apparatus of Figure 1. Fig. 4 is a front view of a transport robot of the grinding apparatus of Fig. 1; U) is a front view, (b) is a side view, and (C) is a plan view. Fig. 5 is an explanatory view of the operation of the transport robot of the grinding apparatus of Fig. 1; (a) shows the state from the reference state to the workpiece holding start state (b) shows the state from the workpiece holding start state to the machining load The workpiece handling status of the table. Fig. 6 is an explanatory view showing the operation of the transport robot of the grinding apparatus of Fig. 1; (c) shows the conveyance state of the workpiece from the processing stage to -40 to 201130601, the photographing state of the camera, and (d) display. From the camera shooting state to the holding start state of the next workpiece. Fig. 7 is a plan view of a second processing unit of the grinding apparatus of Fig. 1 〇 Fig. 8 is a front view of a second processing unit of the grinding apparatus of Fig. 1 including a partial cross section. Fig. 9 is a side view showing a section of the second processing unit of the grinding apparatus of Fig. 1 including a section of the section. Fig. 10 is a detailed side view showing a partial cross section when the large-diameter grinding tool is used in the grinding apparatus of Fig. 1. Fig. 1 is a detailed side view showing a partial cross section when the grinding device of Fig. 1 uses a small-diameter grinding tool. Fig. 12 is a flow chart showing a control method of the grinding apparatus of Fig. 1. Fig. 13 is a side view showing a state in which the stage is processed by the camera Q of the grinding apparatus of Fig. 1. Fig. 14 (a) to (d) are explanatory views of processing and calculation methods of data photographed by the grinding apparatus of Fig. 1. Fig. 15 is a plan view showing a second embodiment of the grinding apparatus of the present invention. Fig. 16 is a plan view showing a processing stage in which the first adsorption stage is provided in the grinding apparatus of Fig. 15. Fig. 17 is a plan view showing a processing stage in which the second adsorption stage is provided in the grinding apparatus of Fig. 15. -41 - 201130601 Fig. 18 is a plan view of the processing stage in which the third adsorption stage is provided with the grinding apparatus of Fig. 15. Fig. 19 is a plan view of the processing stage in which the adsorption stage of the grinding apparatus of Fig. 15 is disengaged. Figure 20 is a plan view of the first holding base of the grinding apparatus of Figure 15. Figure 21 is a front elevational view of the first holding base of the grinding apparatus of Figure 15. [Description of main component symbols] Μ : Grinding device W : Workpiece (thin plate glass)
Wi ··未加工的工件 W 〇 :加工完畢的工件 Wm :工件模型 1 5 :電子控制單元 2 3 :攝影機 3 0 :加工載台 3 1 :磨削主軸 7 1 :基準銷 C :機械原點 P :工件外形的重心位置 Q :孔部形狀的重心位置 -42-Wi · Unmachined workpiece W 〇: Machined workpiece Wm : Workpiece model 1 5 : Electronic control unit 2 3 : Camera 3 0 : Machining stage 3 1 : Grinding spindle 7 1 : Reference pin C : Machine origin P : position of the center of gravity of the workpiece shape Q: position of the center of gravity of the shape of the hole - 42-