TWI459520B - 轉接板及其形成方法 - Google Patents

轉接板及其形成方法 Download PDF

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Publication number
TWI459520B
TWI459520B TW101101881A TW101101881A TWI459520B TW I459520 B TWI459520 B TW I459520B TW 101101881 A TW101101881 A TW 101101881A TW 101101881 A TW101101881 A TW 101101881A TW I459520 B TWI459520 B TW I459520B
Authority
TW
Taiwan
Prior art keywords
layer
hole
conductive
substrate
conductive layer
Prior art date
Application number
TW101101881A
Other languages
English (en)
Chinese (zh)
Other versions
TW201232726A (en
Inventor
楊銘堃
劉滄宇
何彥仕
Original Assignee
精材科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 精材科技股份有限公司 filed Critical 精材科技股份有限公司
Publication of TW201232726A publication Critical patent/TW201232726A/zh
Application granted granted Critical
Publication of TWI459520B publication Critical patent/TWI459520B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW101101881A 2011-01-31 2012-01-18 轉接板及其形成方法 TWI459520B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161438145P 2011-01-31 2011-01-31

Publications (2)

Publication Number Publication Date
TW201232726A TW201232726A (en) 2012-08-01
TWI459520B true TWI459520B (zh) 2014-11-01

Family

ID=46565188

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101101881A TWI459520B (zh) 2011-01-31 2012-01-18 轉接板及其形成方法

Country Status (4)

Country Link
US (1) US8692300B2 (enExample)
JP (1) JP6058268B2 (enExample)
CN (1) CN102625576B (enExample)
TW (1) TWI459520B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104703409B (zh) * 2013-12-09 2018-03-16 深南电路有限公司 电路板加工方法和相关装置
US9596768B2 (en) * 2014-03-04 2017-03-14 Qualcomm Incorporated Substrate with conductive vias
US10615111B2 (en) * 2014-10-31 2020-04-07 The Board Of Trustees Of The Leland Stanford Junior University Interposer for multi-chip electronics packaging
JP2016225360A (ja) * 2015-05-27 2016-12-28 大日本印刷株式会社 貫通電極基板並びに貫通電極基板を用いたインターポーザ及び半導体装置
CN106298732A (zh) * 2016-09-29 2017-01-04 中国电子科技集团公司第四十三研究所 一种用于系统级封装的转接板结构
CN107706173A (zh) * 2017-09-30 2018-02-16 成都嘉纳海威科技有限责任公司 硅通孔互联结构及其制备方法以及硅通孔射频传输结构
CN115442953A (zh) * 2022-07-30 2022-12-06 华为技术有限公司 转接板、中框结构和电子装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200810630A (en) * 2006-05-02 2008-02-16 Ibiden Co Ltd Circuit wiring board incorporating heat resistant substrate
TW201019427A (en) * 2008-11-07 2010-05-16 Phoenix Prec Technology Corp Package structure having semiconductor component embedded therein and fabrication method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5977257U (ja) * 1982-11-15 1984-05-25 オムロン株式会社 印刷配線板
JPS60116190A (ja) * 1983-11-28 1985-06-22 株式会社村田製作所 厚膜回路基板
JP3546823B2 (ja) * 2000-09-07 2004-07-28 インターナショナル・ビジネス・マシーンズ・コーポレーション スルーホール構造および該スルーホール構造を含むプリント基板
JP4214292B2 (ja) * 2001-01-30 2009-01-28 Ｔｄｋラムダ株式会社 プリント基板
JP4652230B2 (ja) * 2003-06-02 2011-03-16 日本電気株式会社 プリント回路基板用コンパクトビア伝送路およびその設計方法
US7276787B2 (en) * 2003-12-05 2007-10-02 International Business Machines Corporation Silicon chip carrier with conductive through-vias and method for fabricating same
JP4979213B2 (ja) * 2005-08-31 2012-07-18 オンセミコンダクター・トレーディング・リミテッド 回路基板、回路基板の製造方法および回路装置
US7719079B2 (en) * 2007-01-18 2010-05-18 International Business Machines Corporation Chip carrier substrate capacitor and method for fabrication thereof
JP2009076727A (ja) * 2007-09-21 2009-04-09 Mitsubishi Electric Corp プリント配線板、それを用いた電子機器、及びその製造方法
JP5464633B2 (ja) * 2007-10-17 2014-04-09 欣興電子股▲フン▼有限公司 パッケージ基板の製造方法
JP2009295859A (ja) * 2008-06-06 2009-12-17 Oki Semiconductor Co Ltd 半導体装置および半導体装置の製造方法
US8035198B2 (en) * 2008-08-08 2011-10-11 International Business Machines Corporation Through wafer via and method of making same
US8368152B2 (en) * 2011-04-18 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS device etch stop

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200810630A (en) * 2006-05-02 2008-02-16 Ibiden Co Ltd Circuit wiring board incorporating heat resistant substrate
TW201019427A (en) * 2008-11-07 2010-05-16 Phoenix Prec Technology Corp Package structure having semiconductor component embedded therein and fabrication method thereof

Also Published As

Publication number Publication date
US20120193811A1 (en) 2012-08-02
TW201232726A (en) 2012-08-01
CN102625576A (zh) 2012-08-01
JP6058268B2 (ja) 2017-01-11
CN102625576B (zh) 2014-10-29
JP2012160734A (ja) 2012-08-23
US8692300B2 (en) 2014-04-08

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