TWI459467B - 用於無機材料之選擇區域沈積之有機矽氧材料 - Google Patents
用於無機材料之選擇區域沈積之有機矽氧材料 Download PDFInfo
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- TWI459467B TWI459467B TW097136917A TW97136917A TWI459467B TW I459467 B TWI459467 B TW I459467B TW 097136917 A TW097136917 A TW 097136917A TW 97136917 A TW97136917 A TW 97136917A TW I459467 B TWI459467 B TW I459467B
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- JMBPWMGVERNEJY-UHFFFAOYSA-N helium;hydrate Chemical compound [He].O JMBPWMGVERNEJY-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005358 mercaptoalkyl group Chemical group 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 238000013206 minimal dilution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000001356 surgical procedure Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000004950 trifluoroalkyl group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Surface Treatment Of Glass (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/861,705 US8017183B2 (en) | 2007-09-26 | 2007-09-26 | Organosiloxane materials for selective area deposition of inorganic materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200926299A TW200926299A (en) | 2009-06-16 |
| TWI459467B true TWI459467B (zh) | 2014-11-01 |
Family
ID=40377367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097136917A TWI459467B (zh) | 2007-09-26 | 2008-09-25 | 用於無機材料之選擇區域沈積之有機矽氧材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8017183B2 (enExample) |
| EP (1) | EP2193218B1 (enExample) |
| JP (1) | JP2011501779A (enExample) |
| CN (1) | CN101809187B (enExample) |
| AT (1) | ATE542929T1 (enExample) |
| TW (1) | TWI459467B (enExample) |
| WO (1) | WO2009042054A2 (enExample) |
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| US20080166880A1 (en) * | 2007-01-08 | 2008-07-10 | Levy David H | Delivery device for deposition |
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| GB0718839D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | method of patterning a mesoporous nano particulate layer |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
| US7972898B2 (en) * | 2007-09-26 | 2011-07-05 | Eastman Kodak Company | Process for making doped zinc oxide |
| EP2159304A1 (en) * | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
| KR101691560B1 (ko) * | 2009-11-24 | 2017-01-10 | 삼성디스플레이 주식회사 | 표시기판 및 이의 제조방법 |
| EP2360293A1 (en) | 2010-02-11 | 2011-08-24 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for depositing atomic layers on a substrate |
| EP2362002A1 (en) | 2010-02-18 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Continuous patterned layer deposition |
| EP2362411A1 (en) | 2010-02-26 | 2011-08-31 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Apparatus and method for reactive ion etching |
| JP5618588B2 (ja) * | 2010-03-24 | 2014-11-05 | キヤノン株式会社 | インプリント方法 |
| WO2011130509A1 (en) * | 2010-04-15 | 2011-10-20 | The Board Of Trustees Of The University Of Illinois | Mutants of l-arabinitol 4-dehydrogenase from neurospora crassa |
| WO2012161051A1 (ja) * | 2011-05-20 | 2012-11-29 | 住友商事株式会社 | パターン構造体の製造方法 |
| US8273654B1 (en) | 2011-09-29 | 2012-09-25 | Eastman Kodak Company | Producing a vertical transistor including reentrant profile |
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| US8791023B2 (en) * | 2012-08-31 | 2014-07-29 | Eastman Kodak Company | Patterned thin film dielectric layer formation |
| US8927434B2 (en) * | 2012-08-31 | 2015-01-06 | Eastman Kodak Company | Patterned thin film dielectric stack formation |
| US20140065838A1 (en) * | 2012-08-31 | 2014-03-06 | Carolyn R. Ellinger | Thin film dielectric layer formation |
| US8846545B2 (en) | 2012-08-31 | 2014-09-30 | Eastman Kodak Company | Method of forming patterned thin film dielectric stack |
| JP5432396B1 (ja) | 2013-02-28 | 2014-03-05 | 三井造船株式会社 | 成膜装置及びインジェクタ |
| JP5432395B1 (ja) * | 2013-02-28 | 2014-03-05 | 三井造船株式会社 | 成膜装置及び成膜方法 |
| US8921236B1 (en) | 2013-06-21 | 2014-12-30 | Eastman Kodak Company | Patterning for selective area deposition |
| US9425078B2 (en) * | 2014-02-26 | 2016-08-23 | Lam Research Corporation | Inhibitor plasma mediated atomic layer deposition for seamless feature fill |
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| US9142647B1 (en) | 2014-03-06 | 2015-09-22 | Eastman Kodak Company | VTFT formation using selective area deposition |
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| CN110791747A (zh) * | 2019-10-15 | 2020-02-14 | 江苏卓高新材料科技有限公司 | 一种用于薄膜材料表面沉积的沉积装置及沉积方法 |
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| KR102254394B1 (ko) * | 2020-07-16 | 2021-05-24 | 솔브레인 주식회사 | 박막 형성용 성장 억제제, 이를 이용한 박막 형성 방법 및 이로부터 제조된 반도체 기판 |
| CN116648301A (zh) * | 2020-11-10 | 2023-08-25 | 卢米瑞德思英国有限公司 | 用于检测液体样本中的靶标的系统 |
| KR20230032924A (ko) * | 2021-08-31 | 2023-03-07 | 에이에스엠 아이피 홀딩 비.브이. | 억제제를 사용하는 갭 증착용 방법 및 시스템 |
| CN118434908A (zh) * | 2021-12-16 | 2024-08-02 | 朗姆研究公司 | 使用含卤素沉积抑制剂的凹陷特征中的金属沉积 |
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-
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- 2008-09-17 JP JP2010526903A patent/JP2011501779A/ja active Pending
- 2008-09-17 CN CN200880109095.3A patent/CN101809187B/zh not_active Expired - Fee Related
- 2008-09-17 EP EP08833324A patent/EP2193218B1/en not_active Not-in-force
- 2008-09-17 WO PCT/US2008/010824 patent/WO2009042054A2/en not_active Ceased
- 2008-09-17 AT AT08833324T patent/ATE542929T1/de active
- 2008-09-25 TW TW097136917A patent/TWI459467B/zh not_active IP Right Cessation
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2193218B1 (en) | 2012-01-25 |
| WO2009042054A3 (en) | 2009-06-04 |
| US20090081374A1 (en) | 2009-03-26 |
| EP2193218A2 (en) | 2010-06-09 |
| CN101809187A (zh) | 2010-08-18 |
| TW200926299A (en) | 2009-06-16 |
| WO2009042054A2 (en) | 2009-04-02 |
| JP2011501779A (ja) | 2011-01-13 |
| CN101809187B (zh) | 2013-02-13 |
| ATE542929T1 (de) | 2012-02-15 |
| US8017183B2 (en) | 2011-09-13 |
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