TWI455658B - Rolled copper foil and its manufacturing method - Google Patents

Rolled copper foil and its manufacturing method Download PDF

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Publication number
TWI455658B
TWI455658B TW101108438A TW101108438A TWI455658B TW I455658 B TWI455658 B TW I455658B TW 101108438 A TW101108438 A TW 101108438A TW 101108438 A TW101108438 A TW 101108438A TW I455658 B TWI455658 B TW I455658B
Authority
TW
Taiwan
Prior art keywords
copper foil
rolling
rolled copper
less
rolled
Prior art date
Application number
TW101108438A
Other languages
English (en)
Chinese (zh)
Other versions
TW201309121A (zh
Inventor
Tatsuya Kawano
Ikuya Kurosaki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201309121A publication Critical patent/TW201309121A/zh
Application granted granted Critical
Publication of TWI455658B publication Critical patent/TWI455658B/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B37/00Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
    • B21B37/74Temperature control, e.g. by cooling or heating the rolls or the product
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW101108438A 2011-03-25 2012-03-13 Rolled copper foil and its manufacturing method TWI455658B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011067473A JP5411192B2 (ja) 2011-03-25 2011-03-25 圧延銅箔及びその製造方法

Publications (2)

Publication Number Publication Date
TW201309121A TW201309121A (zh) 2013-02-16
TWI455658B true TWI455658B (zh) 2014-10-01

Family

ID=46857517

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101108438A TWI455658B (zh) 2011-03-25 2012-03-13 Rolled copper foil and its manufacturing method

Country Status (4)

Country Link
JP (1) JP5411192B2 (ja)
KR (1) KR101420490B1 (ja)
CN (1) CN102691878B (ja)
TW (1) TWI455658B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822669B2 (ja) 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法
JP5475897B1 (ja) * 2012-05-11 2014-04-16 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2014037577A (ja) * 2012-08-16 2014-02-27 Jx Nippon Mining & Metals Corp グラフェン製造用圧延銅箔、及びグラフェンの製造方法
JP6078024B2 (ja) 2014-06-13 2017-02-08 Jx金属株式会社 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法
KR101942621B1 (ko) * 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP6170516B2 (ja) * 2015-03-18 2017-07-26 Jx金属株式会社 圧延銅箔及びその製造方法、銅張積層板、並びにフレキシブルプリント基板及び電子機器
US9673646B1 (en) * 2016-08-19 2017-06-06 Chang Chun Petrochemical Co., Ltd. Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board
JP6611751B2 (ja) * 2017-03-31 2019-11-27 Jx金属株式会社 リチウムイオン電池集電体用圧延銅箔及びリチウムイオン電池
JP6643287B2 (ja) * 2017-08-03 2020-02-12 Jx金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
CN116967285B (zh) * 2023-09-22 2023-12-15 江苏铭丰电子材料科技有限公司 一种铜箔压延装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200806811A (en) * 2006-06-12 2008-02-01 Nippon Mining & Amp Metals Co Ltd Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
TW200936817A (en) * 2007-10-31 2009-09-01 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing the electrolytic copper foil
CN101932194A (zh) * 2009-06-22 2010-12-29 日立电线株式会社 轧制铜箔

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100226299B1 (ko) * 1995-01-21 1999-10-15 에모또 간지 방향성규소 강판의 냉간 압연방법 및 이냉간압연 방법에 사용되는 냉간압연기의 롤러 냉각 제어장치
JP3009383B2 (ja) * 1998-03-31 2000-02-14 日鉱金属株式会社 圧延銅箔およびその製造方法
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001152267A (ja) * 1999-11-18 2001-06-05 Kobe Steel Ltd 銅合金圧延箔
JP3911173B2 (ja) * 2002-02-27 2007-05-09 日鉱金属株式会社 銅張積層板用圧延銅箔及びその製造方法(2)
JP3824593B2 (ja) * 2003-02-27 2006-09-20 日鉱金属株式会社 高い伸びを有する圧延銅箔
JP2006283078A (ja) * 2005-03-31 2006-10-19 Nikko Kinzoku Kk 銅張積層板用圧延銅箔及びその製造方法
JP4401998B2 (ja) * 2005-03-31 2010-01-20 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔及びその製造方法
CN101146933B (zh) * 2005-03-31 2010-11-24 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
JP4522972B2 (ja) * 2005-04-28 2010-08-11 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200806811A (en) * 2006-06-12 2008-02-01 Nippon Mining & Amp Metals Co Ltd Rolled copper or copper alloy foil with roughened surface and method of roughening rolled copper or copper alloy foil
TW200936817A (en) * 2007-10-31 2009-09-01 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing the electrolytic copper foil
CN101932194A (zh) * 2009-06-22 2010-12-29 日立电线株式会社 轧制铜箔

Also Published As

Publication number Publication date
JP5411192B2 (ja) 2014-02-12
CN102691878B (zh) 2017-03-01
CN102691878A (zh) 2012-09-26
TW201309121A (zh) 2013-02-16
KR101420490B1 (ko) 2014-08-13
JP2012201926A (ja) 2012-10-22
KR20120109360A (ko) 2012-10-08

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