TWI454654B - Film thickness measuring device and method for measuring film thickness - Google Patents
Film thickness measuring device and method for measuring film thickness Download PDFInfo
- Publication number
- TWI454654B TWI454654B TW098115660A TW98115660A TWI454654B TW I454654 B TWI454654 B TW I454654B TW 098115660 A TW098115660 A TW 098115660A TW 98115660 A TW98115660 A TW 98115660A TW I454654 B TWI454654 B TW I454654B
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- Taiwan
- Prior art keywords
- film thickness
- layer
- wavelength
- tested
- light
- Prior art date
Links
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- 238000005259 measurement Methods 0.000 claims description 123
- 238000006243 chemical reaction Methods 0.000 claims description 73
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 3
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- 229910000420 cerium oxide Inorganic materials 0.000 description 1
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/59—Transmissivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008162046A JP5309359B2 (ja) | 2008-06-20 | 2008-06-20 | 膜厚測定装置および膜厚測定方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201007117A TW201007117A (en) | 2010-02-16 |
| TWI454654B true TWI454654B (zh) | 2014-10-01 |
Family
ID=41584174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098115660A TWI454654B (zh) | 2008-06-20 | 2009-05-12 | Film thickness measuring device and method for measuring film thickness |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5309359B2 (enExample) |
| KR (1) | KR101582357B1 (enExample) |
| TW (1) | TWI454654B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5756733B2 (ja) * | 2011-10-20 | 2015-07-29 | 倉敷紡績株式会社 | 干渉式膜厚計 |
| JP5660026B2 (ja) * | 2011-12-28 | 2015-01-28 | 信越半導体株式会社 | 膜厚分布測定方法 |
| JP6363819B2 (ja) * | 2012-09-11 | 2018-07-25 | 大塚電子株式会社 | 膜厚測定方法及び膜厚測定装置 |
| US10429320B2 (en) | 2013-06-04 | 2019-10-01 | Kla-Tencor Corporation | Method for auto-learning tool matching |
| JP6399873B2 (ja) * | 2014-09-17 | 2018-10-03 | 株式会社荏原製作所 | 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法 |
| JP6404172B2 (ja) * | 2015-04-08 | 2018-10-10 | 株式会社荏原製作所 | 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置 |
| TWI548875B (zh) * | 2015-06-11 | 2016-09-11 | Landrex Technologies Co Ltd | Optical needle detection system and method |
| JP6869648B2 (ja) * | 2016-06-07 | 2021-05-12 | 日東電工株式会社 | 多層膜の成膜方法 |
| JP6762221B2 (ja) | 2016-12-19 | 2020-09-30 | 大塚電子株式会社 | 光学特性測定装置および光学特性測定方法 |
| JP6487579B1 (ja) * | 2018-01-09 | 2019-03-20 | 浜松ホトニクス株式会社 | 膜厚計測装置、膜厚計測方法、膜厚計測プログラム、及び膜厚計測プログラムを記録する記録媒体 |
| JP7210200B2 (ja) * | 2018-09-21 | 2023-01-23 | 株式会社ディスコ | 厚み計測装置、及び厚み計測装置を備えた研削装置 |
| JP6758736B1 (ja) * | 2020-04-08 | 2020-09-23 | 大塚電子株式会社 | 光学測定システムおよび光学測定方法 |
| JP6925062B1 (ja) * | 2020-04-14 | 2021-08-25 | 大塚電子株式会社 | 光学測定システム、多層膜製造装置および光学測定方法 |
| KR102801221B1 (ko) | 2020-04-29 | 2025-04-30 | 삼성전자주식회사 | 웨이퍼 검사 장치 및 방법 |
| TR202008917A2 (tr) * | 2020-06-09 | 2021-01-21 | Tuerkiye Bilimsel Ve Teknolojik Arastirma Kurumu Tuebitak | Çok amaçli spektroskopi̇k, hi̇perspektral ve di̇ji̇tal görüntüleme ci̇hazi |
| JP7705723B2 (ja) * | 2021-03-24 | 2025-07-10 | 株式会社Ｓｃｒｅｅｎホールディングス | 検査装置および検査方法 |
| CN114935313B (zh) * | 2022-04-26 | 2023-09-15 | 香港中文大学（深圳） | 薄膜厚度测量方法、装置、设备和计算机可读存储介质 |
| CN116086329B (zh) * | 2023-01-10 | 2025-09-26 | 深圳市埃芯半导体科技有限公司 | 一种薄膜参数的获取方法、获取装置及终端设备 |
| US20240418501A1 (en) * | 2023-06-19 | 2024-12-19 | Tokyo Electron Limited | Optical sensor for film thickness measurement |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0755435A (ja) * | 1993-08-20 | 1995-03-03 | Dainippon Screen Mfg Co Ltd | 多層膜試料の膜厚測定方法 |
| JP2000310512A (ja) * | 1999-04-28 | 2000-11-07 | Hitachi Ltd | 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置 |
| JP2003240515A (ja) * | 2002-02-15 | 2003-08-27 | Toray Ind Inc | 膜厚測定方法およびシートの製造方法 |
| US20040263868A1 (en) * | 2003-06-30 | 2004-12-30 | Sumitomo Mitsubishi Silicon Corporation | Method for measuring thickness of thin film-like material during surface polishing, and surface polishing method and surface polishing apparatus |
| TW201007116A (en) * | 2008-06-20 | 2010-02-16 | Otsuka Denshi Kk | Film thickness measuring apparatus |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6271804A (ja) * | 1985-09-26 | 1987-04-02 | Nippon Kogaku Kk <Nikon> | 膜厚測定装置 |
| JP2914009B2 (ja) * | 1992-04-28 | 1999-06-28 | 信越半導体株式会社 | Ｓｏｉ基板における単結晶薄膜の膜厚測定方法 |
| JP2855964B2 (ja) * | 1992-04-28 | 1999-02-10 | 信越半導体株式会社 | Ｓｏｉ基板における単結晶薄膜の膜厚測定方法 |
| JPH07294220A (ja) * | 1994-04-27 | 1995-11-10 | Mitsubishi Chem Corp | 多層薄膜の膜厚検出方法および装置 |
| JPH10125634A (ja) * | 1996-10-19 | 1998-05-15 | Nikon Corp | 研磨装置 |
| JP2002228420A (ja) * | 2001-01-31 | 2002-08-14 | Matsushita Electric Works Ltd | シリコン薄膜の膜厚測定方法並びにその方法によりシリコン薄膜の膜厚が測定される半導体素子及び半導体装置 |
| JP3944693B2 (ja) * | 2001-10-04 | 2007-07-11 | オムロン株式会社 | 膜厚測定装置 |
| JP2004119452A (ja) * | 2002-09-24 | 2004-04-15 | Toshiba Corp | 薄膜測定方法とその装置 |
| JP2004205242A (ja) * | 2002-12-24 | 2004-07-22 | Sharp Corp | 膜厚測定装置およびこれを用いた電子部品の製造方法 |
| JP2005201634A (ja) * | 2004-01-07 | 2005-07-28 | Toppan Printing Co Ltd | 膜厚測定方法、及び装置 |
-
2008
- 2008-06-20 JP JP2008162046A patent/JP5309359B2/ja active Active
-
2009
- 2009-05-12 TW TW098115660A patent/TWI454654B/zh active
- 2009-06-19 KR KR1020090054696A patent/KR101582357B1/ko active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0755435A (ja) * | 1993-08-20 | 1995-03-03 | Dainippon Screen Mfg Co Ltd | 多層膜試料の膜厚測定方法 |
| JP2000310512A (ja) * | 1999-04-28 | 2000-11-07 | Hitachi Ltd | 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置 |
| JP2003240515A (ja) * | 2002-02-15 | 2003-08-27 | Toray Ind Inc | 膜厚測定方法およびシートの製造方法 |
| US20040263868A1 (en) * | 2003-06-30 | 2004-12-30 | Sumitomo Mitsubishi Silicon Corporation | Method for measuring thickness of thin film-like material during surface polishing, and surface polishing method and surface polishing apparatus |
| TW201007116A (en) * | 2008-06-20 | 2010-02-16 | Otsuka Denshi Kk | Film thickness measuring apparatus |
Non-Patent Citations (1)
| Title |
|---|
| U * |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090132537A (ko) | 2009-12-30 |
| JP5309359B2 (ja) | 2013-10-09 |
| JP2010002327A (ja) | 2010-01-07 |
| TW201007117A (en) | 2010-02-16 |
| KR101582357B1 (ko) | 2016-01-04 |
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