KR101582357B1 - 막 두께 측정 장치 및 막 두께 측정 방법 - Google Patents

막 두께 측정 장치 및 막 두께 측정 방법 Download PDF

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KR101582357B1
KR101582357B1 KR1020090054696A KR20090054696A KR101582357B1 KR 101582357 B1 KR101582357 B1 KR 101582357B1 KR 1020090054696 A KR1020090054696 A KR 1020090054696A KR 20090054696 A KR20090054696 A KR 20090054696A KR 101582357 B1 KR101582357 B1 KR 101582357B1
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layer
film thickness
wavelength
reflectance
wave number
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KR20090132537A (ko
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다다요시 후지모리
요시미 사와무라
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오츠카 일렉트로닉스 가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020090054696A 2008-06-20 2009-06-19 막 두께 측정 장치 및 막 두께 측정 방법 Active KR101582357B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-162046 2008-06-20
JP2008162046A JP5309359B2 (ja) 2008-06-20 2008-06-20 膜厚測定装置および膜厚測定方法

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KR20090132537A KR20090132537A (ko) 2009-12-30
KR101582357B1 true KR101582357B1 (ko) 2016-01-04

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JP (1) JP5309359B2 (enExample)
KR (1) KR101582357B1 (enExample)
TW (1) TWI454654B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220133084A (ko) * 2021-03-24 2022-10-04 가부시키가이샤 스크린 홀딩스 검사 장치 및 검사 방법
US11579096B2 (en) 2020-04-29 2023-02-14 Samsung Electronics Co., Ltd. Wafer inspection apparatus and method

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* Cited by examiner, † Cited by third party
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JP5756733B2 (ja) * 2011-10-20 2015-07-29 倉敷紡績株式会社 干渉式膜厚計
JP5660026B2 (ja) 2011-12-28 2015-01-28 信越半導体株式会社 膜厚分布測定方法
JP6363819B2 (ja) * 2012-09-11 2018-07-25 大塚電子株式会社 膜厚測定方法及び膜厚測定装置
US10429320B2 (en) * 2013-06-04 2019-10-01 Kla-Tencor Corporation Method for auto-learning tool matching
JP6399873B2 (ja) * 2014-09-17 2018-10-03 株式会社荏原製作所 膜厚信号処理装置、研磨装置、膜厚信号処理方法、及び、研磨方法
JP6404172B2 (ja) * 2015-04-08 2018-10-10 株式会社荏原製作所 膜厚測定方法、膜厚測定装置、研磨方法、および研磨装置
TWI548875B (zh) * 2015-06-11 2016-09-11 Landrex Technologies Co Ltd Optical needle detection system and method
JP6869648B2 (ja) 2016-06-07 2021-05-12 日東電工株式会社 多層膜の成膜方法
JP6762221B2 (ja) 2016-12-19 2020-09-30 大塚電子株式会社 光学特性測定装置および光学特性測定方法
JP6487579B1 (ja) 2018-01-09 2019-03-20 浜松ホトニクス株式会社 膜厚計測装置、膜厚計測方法、膜厚計測プログラム、及び膜厚計測プログラムを記録する記録媒体
JP7210200B2 (ja) * 2018-09-21 2023-01-23 株式会社ディスコ 厚み計測装置、及び厚み計測装置を備えた研削装置
JP6758736B1 (ja) * 2020-04-08 2020-09-23 大塚電子株式会社 光学測定システムおよび光学測定方法
JP6925062B1 (ja) * 2020-04-14 2021-08-25 大塚電子株式会社 光学測定システム、多層膜製造装置および光学測定方法
TR202008917A2 (tr) * 2020-06-09 2021-01-21 Tuerkiye Bilimsel Ve Teknolojik Arastirma Kurumu Tuebitak Çok amaçli spektroskopi̇k, hi̇perspektral ve di̇ji̇tal görüntüleme ci̇hazi
CN114935313B (zh) * 2022-04-26 2023-09-15 香港中文大学（深圳） 薄膜厚度测量方法、装置、设备和计算机可读存储介质
CN116086329B (zh) * 2023-01-10 2025-09-26 深圳市埃芯半导体科技有限公司 一种薄膜参数的获取方法、获取装置及终端设备
US20240418501A1 (en) * 2023-06-19 2024-12-19 Tokyo Electron Limited Optical sensor for film thickness measurement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000310512A (ja) 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
JP2003240515A (ja) * 2002-02-15 2003-08-27 Toray Ind Inc 膜厚測定方法およびシートの製造方法

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JPS6271804A (ja) * 1985-09-26 1987-04-02 Nippon Kogaku Kk <Nikon> 膜厚測定装置
JP2914009B2 (ja) * 1992-04-28 1999-06-28 信越半導体株式会社 Ｓｏｉ基板における単結晶薄膜の膜厚測定方法
JP2855964B2 (ja) * 1992-04-28 1999-02-10 信越半導体株式会社 Ｓｏｉ基板における単結晶薄膜の膜厚測定方法
JP2840181B2 (ja) * 1993-08-20 1998-12-24 大日本スクリーン製造株式会社 多層膜試料の膜厚測定方法
JPH07294220A (ja) * 1994-04-27 1995-11-10 Mitsubishi Chem Corp 多層薄膜の膜厚検出方法および装置
JPH10125634A (ja) * 1996-10-19 1998-05-15 Nikon Corp 研磨装置
JP2002228420A (ja) * 2001-01-31 2002-08-14 Matsushita Electric Works Ltd シリコン薄膜の膜厚測定方法並びにその方法によりシリコン薄膜の膜厚が測定される半導体素子及び半導体装置
JP3944693B2 (ja) * 2001-10-04 2007-07-11 オムロン株式会社 膜厚測定装置
JP2004119452A (ja) * 2002-09-24 2004-04-15 Toshiba Corp 薄膜測定方法とその装置
JP2004205242A (ja) * 2002-12-24 2004-07-22 Sharp Corp 膜厚測定装置およびこれを用いた電子部品の製造方法
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
JP2005201634A (ja) * 2004-01-07 2005-07-28 Toppan Printing Co Ltd 膜厚測定方法、及び装置
JP2010002328A (ja) * 2008-06-20 2010-01-07 Otsuka Denshi Co Ltd 膜厚測定装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000310512A (ja) 1999-04-28 2000-11-07 Hitachi Ltd 薄膜の膜厚計測方法及びその装置並びにそれを用いた薄膜デバイスの製造方法及びその装置
JP2003240515A (ja) * 2002-02-15 2003-08-27 Toray Ind Inc 膜厚測定方法およびシートの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11579096B2 (en) 2020-04-29 2023-02-14 Samsung Electronics Co., Ltd. Wafer inspection apparatus and method
KR20220133084A (ko) * 2021-03-24 2022-10-04 가부시키가이샤 스크린 홀딩스 검사 장치 및 검사 방법
KR102745509B1 (ko) * 2021-03-24 2024-12-20 가부시키가이샤 스크린 홀딩스 검사 장치 및 검사 방법

Also Published As

Publication number Publication date
KR20090132537A (ko) 2009-12-30
JP2010002327A (ja) 2010-01-07
TW201007117A (en) 2010-02-16
TWI454654B (zh) 2014-10-01
JP5309359B2 (ja) 2013-10-09

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