TWI453839B - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

Info

Publication number
TWI453839B
TWI453839B TW096147388A TW96147388A TWI453839B TW I453839 B TWI453839 B TW I453839B TW 096147388 A TW096147388 A TW 096147388A TW 96147388 A TW96147388 A TW 96147388A TW I453839 B TWI453839 B TW I453839B
Authority
TW
Taiwan
Prior art keywords
pad
pads
semiconductor device
package
reference mark
Prior art date
Application number
TW096147388A
Other languages
English (en)
Chinese (zh)
Other versions
TW200828473A (en
Inventor
春日孝廣
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW200828473A publication Critical patent/TW200828473A/zh
Application granted granted Critical
Publication of TWI453839B publication Critical patent/TWI453839B/zh

Links

Classifications

    • H10W46/00—
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H10P72/741—
    • H10W46/301—
    • H10W46/601—
    • H10W46/607—
    • H10W72/07251—
    • H10W72/20—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
TW096147388A 2006-12-12 2007-12-12 半導體裝置及其製造方法 TWI453839B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006333998A JP5049573B2 (ja) 2006-12-12 2006-12-12 半導体装置

Publications (2)

Publication Number Publication Date
TW200828473A TW200828473A (en) 2008-07-01
TWI453839B true TWI453839B (zh) 2014-09-21

Family

ID=39517324

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096147388A TWI453839B (zh) 2006-12-12 2007-12-12 半導體裝置及其製造方法

Country Status (5)

Country Link
US (1) US7642662B2 (enExample)
JP (1) JP5049573B2 (enExample)
KR (1) KR101571075B1 (enExample)
CN (1) CN101202262B (enExample)
TW (1) TWI453839B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8618669B2 (en) * 2008-01-09 2013-12-31 Ibiden Co., Ltd. Combination substrate
US8415792B2 (en) * 2010-08-04 2013-04-09 International Business Machines Corporation Electrical contact alignment posts
JP5795196B2 (ja) 2011-06-09 2015-10-14 新光電気工業株式会社 半導体パッケージ
JP6207190B2 (ja) * 2013-03-22 2017-10-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US9343386B2 (en) 2013-06-19 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Alignment in the packaging of integrated circuits
KR102274742B1 (ko) * 2014-10-06 2021-07-07 삼성전자주식회사 패키지 온 패키지와 이를 포함하는 컴퓨팅 장치
US9953963B2 (en) * 2015-11-06 2018-04-24 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit process having alignment marks for underfill
US11456259B2 (en) * 2019-03-27 2022-09-27 Pyxis Cf Pte. Ltd. Panel level packaging for devices
US11393759B2 (en) * 2019-10-04 2022-07-19 International Business Machines Corporation Alignment carrier for interconnect bridge assembly
KR20240011486A (ko) * 2022-07-19 2024-01-26 삼성전자주식회사 기판

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278193B1 (en) * 1998-12-07 2001-08-21 International Business Machines Corporation Optical sensing method to place flip chips
TW457545B (en) * 2000-09-28 2001-10-01 Advanced Semiconductor Eng Substrate to form electronic package

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833174B2 (ja) * 1990-08-22 1998-12-09 セイコーエプソン株式会社 半導体素子及びその実装方法
JP3284048B2 (ja) 1996-05-31 2002-05-20 東芝マイクロエレクトロニクス株式会社 半導体装置およびその製造方法
JP3535683B2 (ja) * 1997-01-09 2004-06-07 株式会社ルネサステクノロジ 位置認識用マーク付半導体装置
US6668449B2 (en) * 2001-06-25 2003-12-30 Micron Technology, Inc. Method of making a semiconductor device having an opening in a solder mask
KR100416000B1 (ko) * 2001-07-11 2004-01-24 삼성전자주식회사 다수의 핀을 갖는 부품이 실장되는 인쇄회로기판
US6570263B1 (en) * 2002-06-06 2003-05-27 Vate Technology Co., Ltd. Structure of plated wire of fiducial marks for die-dicing package
JP4168331B2 (ja) * 2003-02-21 2008-10-22 ソニー株式会社 半導体装置及びその製造方法
JP3804649B2 (ja) 2003-09-19 2006-08-02 株式会社村田製作所 電子回路装置の製造方法および電子回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278193B1 (en) * 1998-12-07 2001-08-21 International Business Machines Corporation Optical sensing method to place flip chips
TW457545B (en) * 2000-09-28 2001-10-01 Advanced Semiconductor Eng Substrate to form electronic package

Also Published As

Publication number Publication date
TW200828473A (en) 2008-07-01
CN101202262B (zh) 2011-06-15
JP5049573B2 (ja) 2012-10-17
KR20080054347A (ko) 2008-06-17
US7642662B2 (en) 2010-01-05
CN101202262A (zh) 2008-06-18
KR101571075B1 (ko) 2015-11-23
US20080258287A1 (en) 2008-10-23
JP2008147472A (ja) 2008-06-26

Similar Documents

Publication Publication Date Title
TWI453839B (zh) 半導體裝置及其製造方法
US7884482B2 (en) Flip-chip mounting substrate
CN103094260A (zh) 层叠封装器件及封装半导体管芯的方法
US12438067B2 (en) Flip chip self-alignment features for substrate and leadframe applications and method of manufacturing the flip chip self-alignment features
US20080283994A1 (en) Stacked package structure and fabrication method thereof
CN101320696A (zh) 堆叠式封装结构及其制法
CN102044501B (zh) 集成电路结构
US8178971B2 (en) Semiconductor device and method of manufacturing the same
CN106463427A (zh) 半导体装置及其制造方法
US8098496B2 (en) Wiring board for semiconductor device
CN100401517C (zh) 半导体装置
JP4360873B2 (ja) ウエハレベルｃｓｐの製造方法
US20120086119A1 (en) Chip stacked structure
JP2008060483A (ja) 半導体装置の実装構造体およびその製造方法
CN102034786A (zh) 印刷电路板、凸点阵列封装件及其制造方法
CN202394890U (zh) 半导体基板构造
TWI575619B (zh) 半導體封裝結構及其製作方法
TWI582864B (zh) 半導體封裝結構及其製作方法
TW201017860A (en) Face-to-face flip-chip semiconductor package and method for manufacturing the same
KR100716868B1 (ko) 반도체패키지 및 그 제조 방법
TWI406377B (zh) 方向指示標記立體化之球格陣列封裝構造及其製造方法
KR100818079B1 (ko) 볼 그리드 어레이 패키지 제조방법
JP2012151361A (ja) 電子部品及びその製造方法、電子装置及びその製造方法
KR20130046678A (ko) 패키지 온 패키지 기판의 범프 형성방법
CN101369567A (zh) 以导线架形成阵列的封装结构