TWI447536B - 微影設備及商品之製造方法 - Google Patents

微影設備及商品之製造方法 Download PDF

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Publication number
TWI447536B
TWI447536B TW100117231A TW100117231A TWI447536B TW I447536 B TWI447536 B TW I447536B TW 100117231 A TW100117231 A TW 100117231A TW 100117231 A TW100117231 A TW 100117231A TW I447536 B TWI447536 B TW I447536B
Authority
TW
Taiwan
Prior art keywords
substrate
mark
detecting
regions
shot regions
Prior art date
Application number
TW100117231A
Other languages
English (en)
Chinese (zh)
Other versions
TW201142549A (en
Inventor
Shinichiro Koga
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW201142549A publication Critical patent/TW201142549A/zh
Application granted granted Critical
Publication of TWI447536B publication Critical patent/TWI447536B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
TW100117231A 2010-05-31 2011-05-17 微影設備及商品之製造方法 TWI447536B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010124614A JP5597031B2 (ja) 2010-05-31 2010-05-31 リソグラフィ装置及び物品の製造方法

Publications (2)

Publication Number Publication Date
TW201142549A TW201142549A (en) 2011-12-01
TWI447536B true TWI447536B (zh) 2014-08-01

Family

ID=45021002

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100117231A TWI447536B (zh) 2010-05-31 2011-05-17 微影設備及商品之製造方法

Country Status (4)

Country Link
US (1) US20110290136A1 (enExample)
JP (1) JP5597031B2 (enExample)
KR (1) KR101454063B1 (enExample)
TW (1) TWI447536B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5938218B2 (ja) 2012-01-16 2016-06-22 キヤノン株式会社 インプリント装置、物品の製造方法およびインプリント方法
JP6066565B2 (ja) * 2012-01-31 2017-01-25 キヤノン株式会社 インプリント装置、および、物品の製造方法
NL2010166A (en) * 2012-02-22 2013-08-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5868215B2 (ja) * 2012-02-27 2016-02-24 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6029495B2 (ja) * 2012-03-12 2016-11-24 キヤノン株式会社 インプリント方法およびインプリント装置、それを用いた物品の製造方法
JP6180131B2 (ja) * 2012-03-19 2017-08-16 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP6188382B2 (ja) 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP5989610B2 (ja) 2013-08-05 2016-09-07 株式会社東芝 マスクセット設計方法およびマスクセット設計プログラム
US10005200B2 (en) 2014-03-06 2018-06-26 Cnh Industrial Canada, Ltd. Apparatus and method for removing holes in production of biocomposite materials
JP6401501B2 (ja) * 2014-06-02 2018-10-10 キヤノン株式会社 インプリント装置、および物品の製造方法
US10331027B2 (en) 2014-09-12 2019-06-25 Canon Kabushiki Kaisha Imprint apparatus, imprint system, and method of manufacturing article
JP6506521B2 (ja) * 2014-09-17 2019-04-24 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP6555868B2 (ja) * 2014-09-30 2019-08-07 キヤノン株式会社 パターン形成方法、および物品の製造方法
JP6457773B2 (ja) * 2014-10-07 2019-01-23 キヤノン株式会社 インプリント方法、インプリント装置及び物品製造方法
JP6799397B2 (ja) * 2015-08-10 2020-12-16 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6726987B2 (ja) * 2016-03-17 2020-07-22 キヤノン株式会社 インプリント装置および物品製造方法
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
EP3521932A4 (en) * 2016-09-30 2020-05-27 Nikon Corporation MEASURING SYSTEM, SUBSTRATE PROCESSING SYSTEM AND DEVICE MANUFACTURING METHOD
KR102477736B1 (ko) * 2016-12-08 2022-12-14 가부시키가이샤 브이 테크놀로지 근접 노광 장치 및 근접 노광 방법
JP2019102537A (ja) * 2017-11-29 2019-06-24 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
JP7116605B2 (ja) * 2018-06-28 2022-08-10 キヤノン株式会社 インプリント材のパターンを形成するための方法、インプリント装置、インプリント装置の調整方法、および、物品製造方法
US10901327B2 (en) 2018-12-20 2021-01-26 Canon Kabushiki Kaisha Automatic defect analyzer for nanoimprint lithography using image analysis
JP7324051B2 (ja) * 2019-05-28 2023-08-09 キヤノン株式会社 リソグラフィ装置、物品の製造方法及び制御方法
JP7433925B2 (ja) * 2020-01-20 2024-02-20 キヤノン株式会社 インプリント方法、インプリント装置、および物品製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007509769A (ja) * 2003-10-02 2007-04-19 モレキュラー・インプリンツ・インコーポレーテッド 単一位相流体インプリント・リソグラフィ法
CN101059650A (zh) * 2006-04-18 2007-10-24 佳能株式会社 图案转印设备、压印设备和图案转印方法

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JPH04237112A (ja) * 1991-01-22 1992-08-25 Nec Corp 露光装置における位置合わせ方法
JPH08330214A (ja) * 1995-06-01 1996-12-13 Nikon Corp アライメント精度評価方法
JP4109736B2 (ja) * 1997-11-14 2008-07-02 キヤノン株式会社 位置ずれ検出方法
JP2004006527A (ja) * 2002-05-31 2004-01-08 Canon Inc 位置検出装置及び位置検出方法、露光装置、デバイス製造方法並びに基板
JP4958614B2 (ja) * 2006-04-18 2012-06-20 キヤノン株式会社 パターン転写装置、インプリント装置、パターン転写方法および位置合わせ装置
JP5121549B2 (ja) * 2008-04-21 2013-01-16 株式会社東芝 ナノインプリント方法
JP2010080631A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法
JP2010080630A (ja) * 2008-09-25 2010-04-08 Canon Inc 押印装置および物品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007509769A (ja) * 2003-10-02 2007-04-19 モレキュラー・インプリンツ・インコーポレーテッド 単一位相流体インプリント・リソグラフィ法
CN101059650A (zh) * 2006-04-18 2007-10-24 佳能株式会社 图案转印设备、压印设备和图案转印方法

Also Published As

Publication number Publication date
JP5597031B2 (ja) 2014-10-01
KR101454063B1 (ko) 2014-10-27
US20110290136A1 (en) 2011-12-01
JP2011253839A (ja) 2011-12-15
TW201142549A (en) 2011-12-01
KR20110132238A (ko) 2011-12-07

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