TWI446482B - 靜電鉗微影裝置及製造靜電鉗之方法 - Google Patents

靜電鉗微影裝置及製造靜電鉗之方法 Download PDF

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Publication number
TWI446482B
TWI446482B TW097136226A TW97136226A TWI446482B TW I446482 B TWI446482 B TW I446482B TW 097136226 A TW097136226 A TW 097136226A TW 97136226 A TW97136226 A TW 97136226A TW I446482 B TWI446482 B TW I446482B
Authority
TW
Taiwan
Prior art keywords
electrostatic clamp
substrate
knob
knob segments
segments
Prior art date
Application number
TW097136226A
Other languages
English (en)
Chinese (zh)
Other versions
TW200929429A (en
Inventor
喬瑟夫 柯那勒斯 史哲班 安可
安卓爾 魯道夫 凡 安培 賈克
微瑟 雷默德
亨利卡斯 潔特斯 法雷森 喬漢納
楊 宗昆
裴爾斯 亞伯特
彼特 瑞傑瑪 亞伯特
Original Assignee
Ａｓｍｌ荷蘭公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ａｓｍｌ荷蘭公司 filed Critical Ａｓｍｌ荷蘭公司
Publication of TW200929429A publication Critical patent/TW200929429A/zh
Application granted granted Critical
Publication of TWI446482B publication Critical patent/TWI446482B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW097136226A 2007-09-21 2008-09-19 靜電鉗微影裝置及製造靜電鉗之方法 TWI446482B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/902,501 US7940511B2 (en) 2007-09-21 2007-09-21 Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp

Publications (2)

Publication Number Publication Date
TW200929429A TW200929429A (en) 2009-07-01
TWI446482B true TWI446482B (zh) 2014-07-21

Family

ID=39929545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097136226A TWI446482B (zh) 2007-09-21 2008-09-19 靜電鉗微影裝置及製造靜電鉗之方法

Country Status (8)

Country Link
US (2) US7940511B2 (https=)
EP (1) EP2208224B1 (https=)
JP (1) JP5524845B2 (https=)
KR (1) KR101533014B1 (https=)
CN (1) CN101803001B (https=)
NL (1) NL1035888A1 (https=)
TW (1) TWI446482B (https=)
WO (1) WO2009036995A1 (https=)

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KR102859857B1 (ko) * 2019-05-24 2025-09-12 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치, 기판 테이블 및 방법
WO2021095492A1 (ja) * 2019-11-15 2021-05-20 株式会社堀場エステック 流体抵抗素子及び流体制御装置
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Also Published As

Publication number Publication date
JP2010541196A (ja) 2010-12-24
EP2208224B1 (en) 2019-11-06
WO2009036995A1 (en) 2009-03-26
US20110170085A1 (en) 2011-07-14
CN101803001B (zh) 2012-11-07
KR20100075517A (ko) 2010-07-02
KR101533014B1 (ko) 2015-07-01
US7940511B2 (en) 2011-05-10
US8098475B2 (en) 2012-01-17
CN101803001A (zh) 2010-08-11
US20090079525A1 (en) 2009-03-26
NL1035888A1 (nl) 2009-03-24
TW200929429A (en) 2009-07-01
EP2208224A1 (en) 2010-07-21
JP5524845B2 (ja) 2014-06-18

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