KR101533014B1 - 정전기 클램프, 리소그래피 장치, 및 정전기 클램프를 제조하는 방법 - Google Patents

정전기 클램프, 리소그래피 장치, 및 정전기 클램프를 제조하는 방법 Download PDF

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KR101533014B1
KR101533014B1 KR1020107008658A KR20107008658A KR101533014B1 KR 101533014 B1 KR101533014 B1 KR 101533014B1 KR 1020107008658 A KR1020107008658 A KR 1020107008658A KR 20107008658 A KR20107008658 A KR 20107008658A KR 101533014 B1 KR101533014 B1 KR 101533014B1
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South Korea
Prior art keywords
burls
support
clamp
lithographic apparatus
electrostatic
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Korean (ko)
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KR20100075517A (ko
Inventor
안코 요제프 코르넬루스 시벤
타르코 아드리안 루돌프 반 엠펠
레이몬드 비세르
요한네스 헨드리쿠스 게르트루디스 프란센
종콴 양
알베르트 브랄스
알베르트 피터르 리프마
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에이에스엠엘 네델란즈 비.브이.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1020107008658A 2007-09-21 2008-09-19 정전기 클램프, 리소그래피 장치, 및 정전기 클램프를 제조하는 방법 Active KR101533014B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/902,501 US7940511B2 (en) 2007-09-21 2007-09-21 Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
US11/902,501 2007-09-21
PCT/EP2008/007916 WO2009036995A1 (en) 2007-09-21 2008-09-19 Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp

Publications (2)

Publication Number Publication Date
KR20100075517A KR20100075517A (ko) 2010-07-02
KR101533014B1 true KR101533014B1 (ko) 2015-07-01

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KR1020107008658A Active KR101533014B1 (ko) 2007-09-21 2008-09-19 정전기 클램프, 리소그래피 장치, 및 정전기 클램프를 제조하는 방법

Country Status (8)

Country Link
US (2) US7940511B2 (https=)
EP (1) EP2208224B1 (https=)
JP (1) JP5524845B2 (https=)
KR (1) KR101533014B1 (https=)
CN (1) CN101803001B (https=)
NL (1) NL1035888A1 (https=)
TW (1) TWI446482B (https=)
WO (1) WO2009036995A1 (https=)

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WO2012076207A1 (en) * 2010-12-08 2012-06-14 Asml Holding N.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
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EP2490073B1 (en) * 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
WO2012110144A1 (en) * 2011-02-18 2012-08-23 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method.
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NL2009487A (en) * 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP3683627A1 (en) 2012-02-03 2020-07-22 ASML Netherlands B.V. Substrate holder and lithographic apparatus
EP2839506B1 (en) 2012-02-29 2016-08-24 ASML Netherlands B.V. Electrostatic clamp
WO2014012749A1 (en) * 2012-07-17 2014-01-23 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method
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US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
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TWI656596B (zh) 2014-08-26 2019-04-11 Asml Holding N. V. 靜電夾具及其製造方法
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
EP3262677B1 (en) * 2015-02-23 2025-11-26 II-VI Delaware, Inc. Film electrode for electrostatic chuck
JP6650345B2 (ja) * 2016-05-26 2020-02-19 日本特殊陶業株式会社 基板保持装置及びその製造方法
US20180374736A1 (en) * 2017-06-22 2018-12-27 Applied Materials, Inc. Electrostatic carrier for die bonding applications
DE102018116463A1 (de) * 2018-07-06 2020-01-09 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Elektrostatische Haltevorrichtung und Verfahren zu deren Herstellung
KR102928856B1 (ko) * 2019-02-08 2026-02-20 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치에서 사용하기 위한 컴포넌트, 컴포넌트의 제조 방법, 및 리소그래피 장치에서 테이블을 보호하는 방법
DE102019108855B4 (de) * 2019-04-04 2020-11-12 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Elektrostatische Haltevorrichtung mit einer Schichtverbund-Elektrodeneinrichtung und Verfahren zu deren Herstellung
KR102859857B1 (ko) * 2019-05-24 2025-09-12 에이에스엠엘 홀딩 엔.브이. 리소그래피 장치, 기판 테이블 및 방법
WO2021095492A1 (ja) * 2019-11-15 2021-05-20 株式会社堀場エステック 流体抵抗素子及び流体制御装置
US11817293B2 (en) * 2020-01-10 2023-11-14 The Research Foundation For The State University Of New York Photoresist layers of semiconductor components including electric fields, system, and methods of forming same
US11538714B2 (en) * 2020-05-21 2022-12-27 Applied Materials, Inc. System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
US11875967B2 (en) 2020-05-21 2024-01-16 Applied Materials, Inc. System apparatus and method for enhancing electrical clamping of substrates using photo-illumination
EP3923077A1 (en) * 2020-06-11 2021-12-15 ASML Netherlands B.V. Object holder, electrostatic sheet and method for making an electrostatic sheet
EP4002010A1 (en) * 2020-11-18 2022-05-25 ASML Netherlands B.V. Electrostatic clamp
WO2022144144A1 (en) * 2020-12-29 2022-07-07 Asml Holding N.V. Vacuum sheet bond fixturing and flexible burl applications for substrate tables
EP4053634A1 (en) 2021-03-02 2022-09-07 ASML Netherlands B.V. Substrate restraining system
TW202243107A (zh) * 2021-03-18 2022-11-01 荷蘭商Ａｓｍｌ荷蘭公司 用於經改良疊對之夾具電極修改
EP4105720A1 (en) * 2021-06-16 2022-12-21 ASML Netherlands B.V. Substrate holder and method
EP4386478A1 (en) 2022-12-12 2024-06-19 ASML Netherlands B.V. Apparatus and method for electrostatically clamping a substrate
KR20250123776A (ko) 2022-12-13 2025-08-18 에이에스엠엘 네델란즈 비.브이. 뒤틀린 기판을 클램핑하기 위한 진공 테이블 및 방법

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JP2007221101A (ja) * 2005-12-21 2007-08-30 Asml Netherlands Bv リソグラフィ装置およびリソグラフィ装置用静電クランプの製造方法

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Also Published As

Publication number Publication date
JP2010541196A (ja) 2010-12-24
EP2208224B1 (en) 2019-11-06
WO2009036995A1 (en) 2009-03-26
US20110170085A1 (en) 2011-07-14
TWI446482B (zh) 2014-07-21
CN101803001B (zh) 2012-11-07
KR20100075517A (ko) 2010-07-02
US7940511B2 (en) 2011-05-10
US8098475B2 (en) 2012-01-17
CN101803001A (zh) 2010-08-11
US20090079525A1 (en) 2009-03-26
NL1035888A1 (nl) 2009-03-24
TW200929429A (en) 2009-07-01
EP2208224A1 (en) 2010-07-21
JP5524845B2 (ja) 2014-06-18

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