TWI443691B - 電感裝置 - Google Patents

電感裝置 Download PDF

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Publication number
TWI443691B
TWI443691B TW097129780A TW97129780A TWI443691B TW I443691 B TWI443691 B TW I443691B TW 097129780 A TW097129780 A TW 097129780A TW 97129780 A TW97129780 A TW 97129780A TW I443691 B TWI443691 B TW I443691B
Authority
TW
Taiwan
Prior art keywords
insulating film
conductive member
semiconductor substrate
inductive device
conductive
Prior art date
Application number
TW097129780A
Other languages
English (en)
Chinese (zh)
Other versions
TW200915358A (en
Inventor
Fujii Tomoharu
Sunohara Masahiro
Nakamura Manabu
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200915358A publication Critical patent/TW200915358A/zh
Application granted granted Critical
Publication of TWI443691B publication Critical patent/TWI443691B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/20—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/32—Insulating of coils, windings, or parts thereof
    • H01F27/323—Insulation between winding turns, between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/122—Insulating between turns or between winding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Coils Or Transformers For Communication (AREA)
TW097129780A 2007-08-06 2008-08-06 電感裝置 TWI443691B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007204325A JP5348862B2 (ja) 2007-08-06 2007-08-06 インダクタ素子

Publications (2)

Publication Number Publication Date
TW200915358A TW200915358A (en) 2009-04-01
TWI443691B true TWI443691B (zh) 2014-07-01

Family

ID=40345926

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097129780A TWI443691B (zh) 2007-08-06 2008-08-06 電感裝置

Country Status (4)

Country Link
US (1) US7791446B2 (enExample)
JP (1) JP5348862B2 (enExample)
KR (1) KR101436037B1 (enExample)
TW (1) TWI443691B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8008987B2 (en) * 2008-09-10 2011-08-30 Advanced Semiconductor Engineering, Inc. Balun circuit manufactured by integrate passive device process
US8049589B2 (en) * 2008-09-10 2011-11-01 Advanced Semiconductor Engineering, Inc. Balun circuit manufactured by integrate passive device process
US7994873B2 (en) * 2008-09-10 2011-08-09 Advanced Semiconductor Engineering, Inc. Balun device
US9190201B2 (en) * 2009-03-04 2015-11-17 Qualcomm Incorporated Magnetic film enhanced inductor
WO2011033496A1 (en) * 2009-09-16 2011-03-24 Maradin Technologies Ltd. Micro coil apparatus and manufacturing methods therefor
KR101179386B1 (ko) 2010-04-08 2012-09-03 성균관대학교산학협력단 패키지 기판의 제조방법
US8664745B2 (en) * 2010-07-20 2014-03-04 Triune Ip Llc Integrated inductor
US9287344B2 (en) * 2010-08-23 2016-03-15 The Hong Kong University Of Science And Technology Monolithic magnetic induction device
US8470612B2 (en) 2010-10-07 2013-06-25 Infineon Technologies Ag Integrated circuits with magnetic core inductors and methods of fabrications thereof
CN103377795B (zh) * 2012-04-24 2016-01-27 乾坤科技股份有限公司 电磁器件及其制作方法
US8963671B2 (en) * 2012-08-31 2015-02-24 Advanced Semiconductor Engineering, Inc. Semiconductor transformer device and method for manufacturing the same
JP6115147B2 (ja) 2013-01-22 2017-04-19 富士通株式会社 配線基板及びその設計方法
US9767957B2 (en) * 2013-08-12 2017-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing a tunable three dimensional inductor
CN105244367A (zh) * 2014-06-24 2016-01-13 日月光半导体制造股份有限公司 衬底结构及其制造方法
KR101681200B1 (ko) 2014-08-07 2016-12-01 주식회사 모다이노칩 파워 인덕터
KR101686989B1 (ko) 2014-08-07 2016-12-19 주식회사 모다이노칩 파워 인덕터
US9607748B2 (en) * 2014-09-03 2017-03-28 Teledyne Scientific & Imaging, Llc Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereof
KR101662207B1 (ko) * 2014-09-11 2016-10-06 주식회사 모다이노칩 파워 인덕터
JP6557468B2 (ja) * 2014-12-25 2019-08-07 ローム株式会社 チップ部品
US20170236790A1 (en) * 2016-02-12 2017-08-17 Semtech Corporation Semiconductor Device on Leadframe with Integrated Passive Component
JP6838328B2 (ja) * 2016-09-15 2021-03-03 大日本印刷株式会社 インダクタおよびインダクタの製造方法
US11094447B2 (en) 2017-03-30 2021-08-17 Rohm Co., Ltd. Chip inductor and method for manufacturing the same
JP2018174306A (ja) * 2017-03-30 2018-11-08 ローム株式会社 チップインダクタおよびその製造方法
JP6908112B2 (ja) * 2017-06-30 2021-07-21 株式会社村田製作所 電子部品モジュール及びその製造方法
US10861840B2 (en) * 2017-08-30 2020-12-08 Advanced Semiconductor Engineering, Inc. Integrated passive component and method for manufacturing the same
TWI685858B (zh) * 2017-12-04 2020-02-21 希華晶體科技股份有限公司 薄型化扼流器的量產方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729732A (ja) * 1993-07-09 1995-01-31 Fuji Electric Co Ltd 薄膜磁気素子
JPH0897375A (ja) * 1994-07-26 1996-04-12 Toshiba Corp マイクロ波集積回路装置及びその製造方法
JPH0963847A (ja) * 1995-08-25 1997-03-07 Nec Corp インダクタ素子及びその製造方法
JPH11251143A (ja) * 1998-03-02 1999-09-17 Toshiba Corp 平面インダクタおよびその製造方法および平面コイルパターンの形成方法
FR2830683A1 (fr) * 2001-10-10 2003-04-11 St Microelectronics Sa Realisation d'inductance et de via dans un circuit monolithique
JP2005079286A (ja) 2003-08-29 2005-03-24 Canon Inc インダクタ及びその製造方法
JP2006173525A (ja) * 2004-12-20 2006-06-29 Sanyo Electric Co Ltd 半導体装置
TWI336922B (en) * 2007-01-12 2011-02-01 Via Tech Inc Spiral inductor with multi-trace structure

Also Published As

Publication number Publication date
US20090039999A1 (en) 2009-02-12
US7791446B2 (en) 2010-09-07
JP2009043777A (ja) 2009-02-26
KR101436037B1 (ko) 2014-09-01
TW200915358A (en) 2009-04-01
KR20090014964A (ko) 2009-02-11
JP5348862B2 (ja) 2013-11-20

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