TWI443058B - 工件處理裝置 - Google Patents

工件處理裝置 Download PDF

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Publication number
TWI443058B
TWI443058B TW100137848A TW100137848A TWI443058B TW I443058 B TWI443058 B TW I443058B TW 100137848 A TW100137848 A TW 100137848A TW 100137848 A TW100137848 A TW 100137848A TW I443058 B TWI443058 B TW I443058B
Authority
TW
Taiwan
Prior art keywords
workpiece
carry
cassette
processing apparatus
transport
Prior art date
Application number
TW100137848A
Other languages
English (en)
Chinese (zh)
Other versions
TW201242867A (en
Inventor
Hiroaki Tsukimoto
Hayato Ikeda
Original Assignee
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tazmo Co Ltd filed Critical Tazmo Co Ltd
Publication of TW201242867A publication Critical patent/TW201242867A/zh
Application granted granted Critical
Publication of TWI443058B publication Critical patent/TWI443058B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
TW100137848A 2010-10-28 2011-10-19 工件處理裝置 TWI443058B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010241748 2010-10-28

Publications (2)

Publication Number Publication Date
TW201242867A TW201242867A (en) 2012-11-01
TWI443058B true TWI443058B (zh) 2014-07-01

Family

ID=45993618

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100137848A TWI443058B (zh) 2010-10-28 2011-10-19 工件處理裝置

Country Status (3)

Country Link
JP (1) JP5606546B2 (ja)
TW (1) TWI443058B (ja)
WO (1) WO2012056893A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011311B2 (ja) * 2012-12-18 2016-10-19 日本電気硝子株式会社 ワーク搬送装置およびワーク搬送方法
CN109625744A (zh) * 2019-01-29 2019-04-16 佛山市新泓达机械有限公司 一种玻璃仓储系统及控制方法
CN211034290U (zh) * 2019-10-14 2020-07-17 苏州赛腾精密电子股份有限公司 一种输送装置及检测系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0834234B2 (ja) * 1986-07-25 1996-03-29 株式会社ニコン ウェハ搬送装置
JPH01321257A (ja) * 1988-06-21 1989-12-27 Nitto Denko Corp 薄板と粘着テープの貼着方法
JP2752965B2 (ja) * 1997-02-07 1998-05-18 株式会社日立製作所 真空処理装置
JP2000012652A (ja) * 1998-06-24 2000-01-14 Sony Corp 半導体ウェハ搬送装置

Also Published As

Publication number Publication date
JPWO2012056893A1 (ja) 2014-03-20
JP5606546B2 (ja) 2014-10-15
WO2012056893A1 (ja) 2012-05-03
TW201242867A (en) 2012-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees