JP5606546B2 - ワーク処理装置 - Google Patents
ワーク処理装置 Download PDFInfo
- Publication number
- JP5606546B2 JP5606546B2 JP2012540766A JP2012540766A JP5606546B2 JP 5606546 B2 JP5606546 B2 JP 5606546B2 JP 2012540766 A JP2012540766 A JP 2012540766A JP 2012540766 A JP2012540766 A JP 2012540766A JP 5606546 B2 JP5606546 B2 JP 5606546B2
- Authority
- JP
- Japan
- Prior art keywords
- carry
- workpiece
- cassette
- work
- out mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Description
2−昇降機構
3−第1搬出機構
4−第2搬出機構
5−回収トレイ
10−ワーク供給装置
11−収納部
100−ワーク処理装置
110−搬送装置
111−搬入部
Claims (2)
- シート状のワークを収納する複数の収納部を上下方向に多段に積層して配置したカセットと、
ワークに対して所定の処理を施す処理部と、
ワークを回収する回収トレイと、
前記搬入位置から前記処理部まで主搬送方向に沿って前記ワークを搬送する搬送装置と、
上下方向について前記複数の収納部のそれぞれの位置が搬送面の位置に順次一致するように前記カセットを下降又は上昇させる昇降機構と、
前記カセットと前記回収トレイとの間の前記主搬送方向に平行な第1の方向に沿って配置され、前記複数の収納部のうちで上下方向の位置が前記搬送面の位置に一致する収納部に収納されているワークを底面側から前記第1の方向に沿って搬出する第1搬出機構と、
前記第1搬出機構における前記カセットと前記回収部との間の中間位置で前記第1搬出機構が搬出したワークの上面を吸着する真空チャックと、前記真空チャックを前記第1の方向に直交する第2の方向に沿って前記中間位置と前記搬入位置との間に移動させるスライド機構と、を有する第2搬出機構と、
を備えたワーク処理装置。 - 前記第1搬出機構はワークの底面に外周面が接触させる無端ベルトで構成された請求項1に記載のワーク処理装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012540766A JP5606546B2 (ja) | 2010-10-28 | 2011-10-13 | ワーク処理装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010241748 | 2010-10-28 | ||
JP2010241748 | 2010-10-28 | ||
JP2012540766A JP5606546B2 (ja) | 2010-10-28 | 2011-10-13 | ワーク処理装置 |
PCT/JP2011/073512 WO2012056893A1 (ja) | 2010-10-28 | 2011-10-13 | ワーク供給装置及びワーク処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012056893A1 JPWO2012056893A1 (ja) | 2014-03-20 |
JP5606546B2 true JP5606546B2 (ja) | 2014-10-15 |
Family
ID=45993618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012540766A Expired - Fee Related JP5606546B2 (ja) | 2010-10-28 | 2011-10-13 | ワーク処理装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5606546B2 (ja) |
TW (1) | TWI443058B (ja) |
WO (1) | WO2012056893A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6011311B2 (ja) * | 2012-12-18 | 2016-10-19 | 日本電気硝子株式会社 | ワーク搬送装置およびワーク搬送方法 |
CN109625744A (zh) * | 2019-01-29 | 2019-04-16 | 佛山市新泓达机械有限公司 | 一种玻璃仓储系统及控制方法 |
CN211034290U (zh) * | 2019-10-14 | 2020-07-17 | 苏州赛腾精密电子股份有限公司 | 一种输送装置及检测系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6331133A (ja) * | 1986-07-25 | 1988-02-09 | Nikon Corp | ウェハ搬送装置 |
JPH01321257A (ja) * | 1988-06-21 | 1989-12-27 | Nitto Denko Corp | 薄板と粘着テープの貼着方法 |
JPH09181149A (ja) * | 1997-02-07 | 1997-07-11 | Hitachi Ltd | 真空処理装置 |
JP2000012652A (ja) * | 1998-06-24 | 2000-01-14 | Sony Corp | 半導体ウェハ搬送装置 |
-
2011
- 2011-10-13 JP JP2012540766A patent/JP5606546B2/ja not_active Expired - Fee Related
- 2011-10-13 WO PCT/JP2011/073512 patent/WO2012056893A1/ja active Application Filing
- 2011-10-19 TW TW100137848A patent/TWI443058B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6331133A (ja) * | 1986-07-25 | 1988-02-09 | Nikon Corp | ウェハ搬送装置 |
JPH01321257A (ja) * | 1988-06-21 | 1989-12-27 | Nitto Denko Corp | 薄板と粘着テープの貼着方法 |
JPH09181149A (ja) * | 1997-02-07 | 1997-07-11 | Hitachi Ltd | 真空処理装置 |
JP2000012652A (ja) * | 1998-06-24 | 2000-01-14 | Sony Corp | 半導体ウェハ搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201242867A (en) | 2012-11-01 |
TWI443058B (zh) | 2014-07-01 |
JPWO2012056893A1 (ja) | 2014-03-20 |
WO2012056893A1 (ja) | 2012-05-03 |
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