TWI437369B - A positive type photosensitive composition and a permanent resist - Google Patents

A positive type photosensitive composition and a permanent resist Download PDF

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Publication number
TWI437369B
TWI437369B TW98135477A TW98135477A TWI437369B TW I437369 B TWI437369 B TW I437369B TW 98135477 A TW98135477 A TW 98135477A TW 98135477 A TW98135477 A TW 98135477A TW I437369 B TWI437369 B TW I437369B
Authority
TW
Taiwan
Prior art keywords
group
compound
decane
carbon atoms
photosensitive composition
Prior art date
Application number
TW98135477A
Other languages
English (en)
Chinese (zh)
Other versions
TW201030468A (en
Inventor
Seiichi Saito
Hiroshi Morita
Hiromi Takenouchi
Atsushi Kobayashi
Jinichi Omi
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW201030468A publication Critical patent/TW201030468A/zh
Application granted granted Critical
Publication of TWI437369B publication Critical patent/TWI437369B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
TW98135477A 2008-10-21 2009-10-20 A positive type photosensitive composition and a permanent resist TWI437369B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008270972A JP4960330B2 (ja) 2008-10-21 2008-10-21 ポジ型感光性組成物及び永久レジスト

Publications (2)

Publication Number Publication Date
TW201030468A TW201030468A (en) 2010-08-16
TWI437369B true TWI437369B (zh) 2014-05-11

Family

ID=42119289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98135477A TWI437369B (zh) 2008-10-21 2009-10-20 A positive type photosensitive composition and a permanent resist

Country Status (5)

Country Link
JP (1) JP4960330B2 (ko)
KR (1) KR20110084493A (ko)
CN (1) CN102112922B (ko)
TW (1) TWI437369B (ko)
WO (1) WO2010047248A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009063887A1 (ja) * 2007-11-13 2009-05-22 Adeka Corporation ポジ型感光性組成物、ポジ型永久レジスト及びポジ型永久レジストの製造方法
JP5533232B2 (ja) * 2009-06-29 2014-06-25 Ｊｓｒ株式会社 ポジ型感放射線性組成物、硬化膜、層間絶縁膜、層間絶縁膜の形成方法、表示素子、及び層間絶縁膜形成用のシロキサンポリマー
JP5479993B2 (ja) * 2010-04-20 2014-04-23 株式会社Ａｄｅｋａ ポジ型感光性組成物及び永久レジスト
JP5666266B2 (ja) * 2010-11-25 2015-02-12 株式会社Adeka ポジ型感光性樹脂組成物及び永久レジスト
JP5734629B2 (ja) * 2010-11-25 2015-06-17 株式会社Adeka ポジ型感光性樹脂組成物及び永久レジスト
JP5648518B2 (ja) * 2011-02-10 2015-01-07 Jsr株式会社 ポジ型感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法
JP5698070B2 (ja) * 2011-05-11 2015-04-08 株式会社Adeka ポジ型感光性組成物及びその硬化物
KR20130035779A (ko) * 2011-09-30 2013-04-09 코오롱인더스트리 주식회사 포지티브형 감광성 수지 조성물，이로부터 형성된 절연막 및 유기발광소자
EP2772505B1 (en) * 2011-10-25 2017-11-15 Adeka Corporation Photocurable resin composition and novel siloxane compound
US9063415B2 (en) 2011-10-25 2015-06-23 Adeka Corporation Photocurable resin composition and novel siloxane compound
JP2013092633A (ja) * 2011-10-25 2013-05-16 Adeka Corp ポジ型感光性組成物
JP6013150B2 (ja) * 2012-11-22 2016-10-25 メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 ポジ型感光性シロキサン組成物の製造方法
JP6323225B2 (ja) 2013-11-01 2018-05-16 セントラル硝子株式会社 ポジ型感光性樹脂組成物、それを用いた膜の製造方法および電子部品
KR20150068899A (ko) * 2013-12-12 2015-06-22 제이엔씨 주식회사 포지티브형 감광성 조성물
TW201800860A (zh) * 2015-12-17 2018-01-01 陶氏全球科技責任有限公司 具有高介電常數之光可成像薄膜

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61144639A (ja) * 1984-12-19 1986-07-02 Hitachi Ltd 放射線感応性組成物及びそれを用いたパタ−ン形成法
JPS62239440A (ja) * 1986-04-11 1987-10-20 Hitachi Ltd 情報記録媒体
JPS63239440A (ja) * 1986-11-25 1988-10-05 Nippon Telegr & Teleph Corp <Ntt> エネルギ線感応性樹脂組成物
TWI300516B (ko) * 2001-07-24 2008-09-01 Jsr Corp
JP4382375B2 (ja) * 2003-03-13 2009-12-09 Ｎｅｃ液晶テクノロジー株式会社 薄膜トランジスタの製造方法
JP4494061B2 (ja) * 2004-03-30 2010-06-30 東京応化工業株式会社 ポジ型レジスト組成物
JP4784283B2 (ja) * 2004-11-26 2011-10-05 東レ株式会社 ポジ型感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
JP2007304543A (ja) * 2006-04-11 2007-11-22 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法、並びにプリント配線板及びその製造方法
JP4910646B2 (ja) * 2006-11-07 2012-04-04 東レ株式会社 感光性シロキサン組成物およびその製造方法、感光性シロキサン組成物から形成された硬化膜、および硬化膜を有する素子
KR101428718B1 (ko) * 2007-02-02 2014-09-24 삼성디스플레이 주식회사 감광성 유기물, 이의 도포 방법, 이를 이용한 유기막 패턴형성 방법, 이로써 제조되는 표시 장치
WO2009063887A1 (ja) * 2007-11-13 2009-05-22 Adeka Corporation ポジ型感光性組成物、ポジ型永久レジスト及びポジ型永久レジストの製造方法

Also Published As

Publication number Publication date
WO2010047248A1 (ja) 2010-04-29
CN102112922B (zh) 2012-12-26
JP4960330B2 (ja) 2012-06-27
TW201030468A (en) 2010-08-16
JP2010101957A (ja) 2010-05-06
CN102112922A (zh) 2011-06-29
KR20110084493A (ko) 2011-07-25

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