TWI437369B - A positive type photosensitive composition and a permanent resist - Google Patents
A positive type photosensitive composition and a permanent resist Download PDFInfo
- Publication number
- TWI437369B TWI437369B TW98135477A TW98135477A TWI437369B TW I437369 B TWI437369 B TW I437369B TW 98135477 A TW98135477 A TW 98135477A TW 98135477 A TW98135477 A TW 98135477A TW I437369 B TWI437369 B TW I437369B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- compound
- decane
- carbon atoms
- photosensitive composition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Silicon Polymers (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008270972A JP4960330B2 (ja) | 2008-10-21 | 2008-10-21 | ポジ型感光性組成物及び永久レジスト |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201030468A TW201030468A (en) | 2010-08-16 |
TWI437369B true TWI437369B (zh) | 2014-05-11 |
Family
ID=42119289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW98135477A TWI437369B (zh) | 2008-10-21 | 2009-10-20 | A positive type photosensitive composition and a permanent resist |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4960330B2 (ko) |
KR (1) | KR20110084493A (ko) |
CN (1) | CN102112922B (ko) |
TW (1) | TWI437369B (ko) |
WO (1) | WO2010047248A1 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009063887A1 (ja) * | 2007-11-13 | 2009-05-22 | Adeka Corporation | ポジ型感光性組成物、ポジ型永久レジスト及びポジ型永久レジストの製造方法 |
JP5533232B2 (ja) * | 2009-06-29 | 2014-06-25 | Jsr株式会社 | ポジ型感放射線性組成物、硬化膜、層間絶縁膜、層間絶縁膜の形成方法、表示素子、及び層間絶縁膜形成用のシロキサンポリマー |
JP5479993B2 (ja) * | 2010-04-20 | 2014-04-23 | 株式会社Adeka | ポジ型感光性組成物及び永久レジスト |
JP5666266B2 (ja) * | 2010-11-25 | 2015-02-12 | 株式会社Adeka | ポジ型感光性樹脂組成物及び永久レジスト |
JP5734629B2 (ja) * | 2010-11-25 | 2015-06-17 | 株式会社Adeka | ポジ型感光性樹脂組成物及び永久レジスト |
JP5648518B2 (ja) * | 2011-02-10 | 2015-01-07 | Jsr株式会社 | ポジ型感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法 |
JP5698070B2 (ja) * | 2011-05-11 | 2015-04-08 | 株式会社Adeka | ポジ型感光性組成物及びその硬化物 |
KR20130035779A (ko) * | 2011-09-30 | 2013-04-09 | 코오롱인더스트리 주식회사 | 포지티브형 감광성 수지 조성물,이로부터 형성된 절연막 및 유기발광소자 |
EP2772505B1 (en) * | 2011-10-25 | 2017-11-15 | Adeka Corporation | Photocurable resin composition and novel siloxane compound |
US9063415B2 (en) | 2011-10-25 | 2015-06-23 | Adeka Corporation | Photocurable resin composition and novel siloxane compound |
JP2013092633A (ja) * | 2011-10-25 | 2013-05-16 | Adeka Corp | ポジ型感光性組成物 |
JP6013150B2 (ja) * | 2012-11-22 | 2016-10-25 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | ポジ型感光性シロキサン組成物の製造方法 |
JP6323225B2 (ja) | 2013-11-01 | 2018-05-16 | セントラル硝子株式会社 | ポジ型感光性樹脂組成物、それを用いた膜の製造方法および電子部品 |
KR20150068899A (ko) * | 2013-12-12 | 2015-06-22 | 제이엔씨 주식회사 | 포지티브형 감광성 조성물 |
TW201800860A (zh) * | 2015-12-17 | 2018-01-01 | 陶氏全球科技責任有限公司 | 具有高介電常數之光可成像薄膜 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61144639A (ja) * | 1984-12-19 | 1986-07-02 | Hitachi Ltd | 放射線感応性組成物及びそれを用いたパタ−ン形成法 |
JPS62239440A (ja) * | 1986-04-11 | 1987-10-20 | Hitachi Ltd | 情報記録媒体 |
JPS63239440A (ja) * | 1986-11-25 | 1988-10-05 | Nippon Telegr & Teleph Corp <Ntt> | エネルギ線感応性樹脂組成物 |
TWI300516B (ko) * | 2001-07-24 | 2008-09-01 | Jsr Corp | |
JP4382375B2 (ja) * | 2003-03-13 | 2009-12-09 | Nec液晶テクノロジー株式会社 | 薄膜トランジスタの製造方法 |
JP4494061B2 (ja) * | 2004-03-30 | 2010-06-30 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
JP4784283B2 (ja) * | 2004-11-26 | 2011-10-05 | 東レ株式会社 | ポジ型感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
JP2007304543A (ja) * | 2006-04-11 | 2007-11-22 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法、並びにプリント配線板及びその製造方法 |
JP4910646B2 (ja) * | 2006-11-07 | 2012-04-04 | 東レ株式会社 | 感光性シロキサン組成物およびその製造方法、感光性シロキサン組成物から形成された硬化膜、および硬化膜を有する素子 |
KR101428718B1 (ko) * | 2007-02-02 | 2014-09-24 | 삼성디스플레이 주식회사 | 감광성 유기물, 이의 도포 방법, 이를 이용한 유기막 패턴형성 방법, 이로써 제조되는 표시 장치 |
WO2009063887A1 (ja) * | 2007-11-13 | 2009-05-22 | Adeka Corporation | ポジ型感光性組成物、ポジ型永久レジスト及びポジ型永久レジストの製造方法 |
-
2008
- 2008-10-21 JP JP2008270972A patent/JP4960330B2/ja not_active Expired - Fee Related
-
2009
- 2009-10-13 KR KR1020117001842A patent/KR20110084493A/ko not_active Application Discontinuation
- 2009-10-13 WO PCT/JP2009/067727 patent/WO2010047248A1/ja active Application Filing
- 2009-10-13 CN CN200980130519.9A patent/CN102112922B/zh not_active Expired - Fee Related
- 2009-10-20 TW TW98135477A patent/TWI437369B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2010047248A1 (ja) | 2010-04-29 |
CN102112922B (zh) | 2012-12-26 |
JP4960330B2 (ja) | 2012-06-27 |
TW201030468A (en) | 2010-08-16 |
JP2010101957A (ja) | 2010-05-06 |
CN102112922A (zh) | 2011-06-29 |
KR20110084493A (ko) | 2011-07-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |