TWI415877B - Flexible optical waveguides and laminates for optical - electrical composite wiring boards - Google Patents

Flexible optical waveguides and laminates for optical - electrical composite wiring boards Download PDF

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Publication number
TWI415877B
TWI415877B TW096125271A TW96125271A TWI415877B TW I415877 B TWI415877 B TW I415877B TW 096125271 A TW096125271 A TW 096125271A TW 96125271 A TW96125271 A TW 96125271A TW I415877 B TWI415877 B TW I415877B
Authority
TW
Taiwan
Prior art keywords
optical waveguide
resin
core layer
layer
optical
Prior art date
Application number
TW096125271A
Other languages
English (en)
Chinese (zh)
Other versions
TW200825123A (en
Inventor
Masatoshi Yuasa
Kiwamu Tokuhisa
Koji Nakamura
Tomofumi Jin
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW200825123A publication Critical patent/TW200825123A/zh
Application granted granted Critical
Publication of TWI415877B publication Critical patent/TWI415877B/zh

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/1221Basic optical elements, e.g. light-guiding paths made from organic materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • G02B6/138Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials

Landscapes

  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Optical Integrated Circuits (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW096125271A 2006-07-13 2007-07-11 Flexible optical waveguides and laminates for optical - electrical composite wiring boards TWI415877B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006192538 2006-07-13

Publications (2)

Publication Number Publication Date
TW200825123A TW200825123A (en) 2008-06-16
TWI415877B true TWI415877B (zh) 2013-11-21

Family

ID=38923230

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096125271A TWI415877B (zh) 2006-07-13 2007-07-11 Flexible optical waveguides and laminates for optical - electrical composite wiring boards

Country Status (4)

Country Link
JP (1) JP5235136B2 (ja)
KR (1) KR101423167B1 (ja)
TW (1) TWI415877B (ja)
WO (1) WO2008007673A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009258611A (ja) * 2008-03-28 2009-11-05 Hitachi Chem Co Ltd 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール
JP2009258612A (ja) * 2008-03-28 2009-11-05 Hitachi Chem Co Ltd 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール
JP2010091734A (ja) * 2008-10-07 2010-04-22 Hitachi Chem Co Ltd コア部形成用樹脂組成物及びこれを用いたコア部形成用樹脂フィルム、ならびにこれらを用いた光導波路
JP2010091732A (ja) * 2008-10-07 2010-04-22 Hitachi Chem Co Ltd コア部形成用樹脂組成物及びこれを用いたコア部形成用樹脂フィルム、ならびにこれらを用いた光導波路
TWI406020B (zh) * 2009-01-13 2013-08-21 Mutual Tek Ind Co Ltd 光電混合線路板及其製造方法
JP5684460B2 (ja) * 2009-04-06 2015-03-11 株式会社ダイセル カチオン重合性樹脂組成物、及びその硬化物
WO2012093462A1 (ja) 2011-01-07 2012-07-12 パナソニック株式会社 光電気複合フレキシブル配線板
WO2015061185A1 (en) * 2013-10-22 2015-04-30 Corning Incorporated Flexible glass optical waveguide structures
JP7107311B2 (ja) * 2017-06-16 2022-07-27 大日本印刷株式会社 積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003155342A (ja) * 2001-11-19 2003-05-27 Nippon Steel Chem Co Ltd 脂環構造を有するポリイミド共重合体
TW200606590A (en) * 2004-04-14 2006-02-16 Rohm & Haas Elect Mat Waveguide compositions and waveguides formed therefrom

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08184718A (ja) * 1994-12-28 1996-07-16 Hoechst Japan Ltd 光導波路素子およびその製造方法
US5649045A (en) * 1995-12-13 1997-07-15 Amoco Corporation Polymide optical waveguide structures
EP0961139B1 (en) * 1997-02-19 2006-12-13 Opnext Japan, Inc. Polymer optical waveguide, optica integrated circuit , optical module and optical communication apparatus
GB2331303B (en) * 1997-11-17 2000-04-26 Samsung Electronics Co Ltd Polymer composition for optical wave guides
JP4123615B2 (ja) * 1999-01-27 2008-07-23 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターンの製造法及び電子部品
JP2001337235A (ja) * 2000-05-29 2001-12-07 Kyocera Corp 光回路
JP2002082240A (ja) * 2000-06-22 2002-03-22 Fujikura Ltd 光合分波器
KR20030036655A (ko) * 2000-07-28 2003-05-09 굿리치 코포레이션 광도파관 및 광도파관을 제조하는 방법
JP2003084323A (ja) * 2001-09-14 2003-03-19 Toshiba Corp 非線形光学材料、非線型光学材料用樹脂組成物、非線形光学材料の製造方法、およびそれを用いた光デバイス
JP2004354738A (ja) * 2003-05-29 2004-12-16 Fujikura Ltd 平面型光導波路およびその製造方法、多層平面型光導波路、光モジュール
JP2005227360A (ja) * 2004-02-10 2005-08-25 Hitachi Cable Ltd 光カプラー

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003155342A (ja) * 2001-11-19 2003-05-27 Nippon Steel Chem Co Ltd 脂環構造を有するポリイミド共重合体
TW200606590A (en) * 2004-04-14 2006-02-16 Rohm & Haas Elect Mat Waveguide compositions and waveguides formed therefrom

Also Published As

Publication number Publication date
TW200825123A (en) 2008-06-16
JP5235136B2 (ja) 2013-07-10
JPWO2008007673A1 (ja) 2009-12-10
KR20090032106A (ko) 2009-03-31
WO2008007673A1 (fr) 2008-01-17
KR101423167B1 (ko) 2014-07-25

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