TWI415877B - Flexible optical waveguides and laminates for optical - electrical composite wiring boards - Google Patents
Flexible optical waveguides and laminates for optical - electrical composite wiring boards Download PDFInfo
- Publication number
- TWI415877B TWI415877B TW096125271A TW96125271A TWI415877B TW I415877 B TWI415877 B TW I415877B TW 096125271 A TW096125271 A TW 096125271A TW 96125271 A TW96125271 A TW 96125271A TW I415877 B TWI415877 B TW I415877B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical waveguide
- resin
- core layer
- layer
- optical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Optical Integrated Circuits (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006192538 | 2006-07-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200825123A TW200825123A (en) | 2008-06-16 |
TWI415877B true TWI415877B (zh) | 2013-11-21 |
Family
ID=38923230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096125271A TWI415877B (zh) | 2006-07-13 | 2007-07-11 | Flexible optical waveguides and laminates for optical - electrical composite wiring boards |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5235136B2 (ja) |
KR (1) | KR101423167B1 (ja) |
TW (1) | TWI415877B (ja) |
WO (1) | WO2008007673A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009258611A (ja) * | 2008-03-28 | 2009-11-05 | Hitachi Chem Co Ltd | 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール |
JP2009258612A (ja) * | 2008-03-28 | 2009-11-05 | Hitachi Chem Co Ltd | 光電気複合基板の製造方法、これによって製造される光電気複合基板、及びこれを用いた光電気複合モジュール |
JP2010091734A (ja) * | 2008-10-07 | 2010-04-22 | Hitachi Chem Co Ltd | コア部形成用樹脂組成物及びこれを用いたコア部形成用樹脂フィルム、ならびにこれらを用いた光導波路 |
JP2010091732A (ja) * | 2008-10-07 | 2010-04-22 | Hitachi Chem Co Ltd | コア部形成用樹脂組成物及びこれを用いたコア部形成用樹脂フィルム、ならびにこれらを用いた光導波路 |
TWI406020B (zh) * | 2009-01-13 | 2013-08-21 | Mutual Tek Ind Co Ltd | 光電混合線路板及其製造方法 |
JP5684460B2 (ja) * | 2009-04-06 | 2015-03-11 | 株式会社ダイセル | カチオン重合性樹脂組成物、及びその硬化物 |
WO2012093462A1 (ja) | 2011-01-07 | 2012-07-12 | パナソニック株式会社 | 光電気複合フレキシブル配線板 |
WO2015061185A1 (en) * | 2013-10-22 | 2015-04-30 | Corning Incorporated | Flexible glass optical waveguide structures |
JP7107311B2 (ja) * | 2017-06-16 | 2022-07-27 | 大日本印刷株式会社 | 積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003155342A (ja) * | 2001-11-19 | 2003-05-27 | Nippon Steel Chem Co Ltd | 脂環構造を有するポリイミド共重合体 |
TW200606590A (en) * | 2004-04-14 | 2006-02-16 | Rohm & Haas Elect Mat | Waveguide compositions and waveguides formed therefrom |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08184718A (ja) * | 1994-12-28 | 1996-07-16 | Hoechst Japan Ltd | 光導波路素子およびその製造方法 |
US5649045A (en) * | 1995-12-13 | 1997-07-15 | Amoco Corporation | Polymide optical waveguide structures |
EP0961139B1 (en) * | 1997-02-19 | 2006-12-13 | Opnext Japan, Inc. | Polymer optical waveguide, optica integrated circuit , optical module and optical communication apparatus |
GB2331303B (en) * | 1997-11-17 | 2000-04-26 | Samsung Electronics Co Ltd | Polymer composition for optical wave guides |
JP4123615B2 (ja) * | 1999-01-27 | 2008-07-23 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、パターンの製造法及び電子部品 |
JP2001337235A (ja) * | 2000-05-29 | 2001-12-07 | Kyocera Corp | 光回路 |
JP2002082240A (ja) * | 2000-06-22 | 2002-03-22 | Fujikura Ltd | 光合分波器 |
KR20030036655A (ko) * | 2000-07-28 | 2003-05-09 | 굿리치 코포레이션 | 광도파관 및 광도파관을 제조하는 방법 |
JP2003084323A (ja) * | 2001-09-14 | 2003-03-19 | Toshiba Corp | 非線形光学材料、非線型光学材料用樹脂組成物、非線形光学材料の製造方法、およびそれを用いた光デバイス |
JP2004354738A (ja) * | 2003-05-29 | 2004-12-16 | Fujikura Ltd | 平面型光導波路およびその製造方法、多層平面型光導波路、光モジュール |
JP2005227360A (ja) * | 2004-02-10 | 2005-08-25 | Hitachi Cable Ltd | 光カプラー |
-
2007
- 2007-07-10 KR KR1020097002186A patent/KR101423167B1/ko not_active IP Right Cessation
- 2007-07-10 WO PCT/JP2007/063746 patent/WO2008007673A1/ja active Search and Examination
- 2007-07-10 JP JP2008524804A patent/JP5235136B2/ja not_active Expired - Fee Related
- 2007-07-11 TW TW096125271A patent/TWI415877B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003155342A (ja) * | 2001-11-19 | 2003-05-27 | Nippon Steel Chem Co Ltd | 脂環構造を有するポリイミド共重合体 |
TW200606590A (en) * | 2004-04-14 | 2006-02-16 | Rohm & Haas Elect Mat | Waveguide compositions and waveguides formed therefrom |
Also Published As
Publication number | Publication date |
---|---|
TW200825123A (en) | 2008-06-16 |
JP5235136B2 (ja) | 2013-07-10 |
JPWO2008007673A1 (ja) | 2009-12-10 |
KR20090032106A (ko) | 2009-03-31 |
WO2008007673A1 (fr) | 2008-01-17 |
KR101423167B1 (ko) | 2014-07-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI415877B (zh) | Flexible optical waveguides and laminates for optical - electrical composite wiring boards | |
JP4199294B2 (ja) | 感光性樹脂組成物及びこれを用いた回路基板 | |
TW567198B (en) | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | |
JP7375761B2 (ja) | ネガ型感光性樹脂組成物、ネガ型感光性樹脂組成物フィルム、硬化膜、これらを用いた中空構造体、および電子部品 | |
KR100974053B1 (ko) | 감광성 수지, 수지 조성물 및 그의 경화물 | |
KR20070093056A (ko) | 불포화기 함유 폴리이미드 수지, 이를 함유하는 감광성수지 조성물 및 그의 경화물 | |
KR102277203B1 (ko) | 감광성 열경화성 수지 조성물 및 플렉시블 프린트 배선판 | |
WO2019012986A1 (ja) | 積層構造体、ドライフィルムおよびフレキシブルプリント配線板 | |
JP5644068B2 (ja) | 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション | |
JP2022169681A (ja) | 感光性樹脂組成物、その硬化物及び多層材料 | |
TWI470353B (zh) | A photosensitive resin composition and a hardening film | |
JP5179407B2 (ja) | 感光性樹脂組成物及びこれを用いた回路配線基板 | |
WO2022163335A1 (ja) | 感光性樹脂組成物、硬化膜、電子部品、アンテナ素子、半導体パッケージおよび化合物 | |
JP2008070477A (ja) | 感光性樹脂フィルムとこれを用いた回路基板の製造方法 | |
JP4772493B2 (ja) | シロキサン含有ポリアミック酸樹脂組成物及びフィルム材料並びに回路基板の製造方法 | |
JP2011202097A (ja) | 光導波路用樹脂組成物の製造方法 | |
TW202216849A (zh) | 聚醯亞胺樹脂組成物、黏著劑組成物、薄膜狀黏著材料、黏著薄片、附有樹脂的銅箔、覆銅積層板、印刷線路板及聚醯亞胺薄膜 | |
JP2002226549A (ja) | シロキサン変性アクリル樹脂、感光性樹脂組成物及び硬化物 | |
WO2023162718A1 (ja) | 樹脂組成物、樹脂組成物被膜、樹脂組成物フィルム、硬化膜、およびこれらを用いた半導体装置 | |
WO2002032966A1 (fr) | Composition de resine photosensible, et reserve de soudage comprenant cette composition, film de couverture, et carte de circuit imprime | |
JP2006316215A (ja) | 感光性共重合物、その組成物、硬化物、製造法、基材、物品及び用途。 | |
CN116847983A (zh) | 层叠结构体和柔性印刷电路板 | |
JP2010191289A (ja) | 光導波路の製造方法 | |
WO2023112849A1 (ja) | イソシアネート変性ポリイミド樹脂、該イソシアネート変性ポリイミド樹脂を含有する樹脂組成物及びその硬化物 | |
JP2010204591A (ja) | 感光性樹脂組成物及びこれを用いた回路配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |