TWI414755B - 用於試料圖案檢查裝置之ｘｙ座標補正裝置及方法 - Google Patents
用於試料圖案檢查裝置之ｘｙ座標補正裝置及方法 Download PDFInfo
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- TWI414755B TWI414755B TW96113900A TW96113900A TWI414755B TW I414755 B TWI414755 B TW I414755B TW 96113900 A TW96113900 A TW 96113900A TW 96113900 A TW96113900 A TW 96113900A TW I414755 B TWI414755 B TW I414755B
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- electron beam
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- wafer
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Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
- H01J37/3045—Object or beam position registration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
Landscapes
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006123014A JP4741408B2 (ja) | 2006-04-27 | 2006-04-27 | 試料パターン検査装置におけるｘｙ座標補正装置及び方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200745508A TW200745508A (en) | 2007-12-16 |
| TWI414755B true TWI414755B (zh) | 2013-11-11 |
Family
ID=38655464
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96113900A TWI414755B (zh) | 2006-04-27 | 2007-04-20 | 用於試料圖案檢查裝置之ｘｙ座標補正裝置及方法 |
| TW102131769A TWI495847B (zh) | 2006-04-27 | 2007-04-20 | 用於試料圖案檢查裝置之ｘｙ座標補正裝置及方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102131769A TWI495847B (zh) | 2006-04-27 | 2007-04-20 | 用於試料圖案檢查裝置之ｘｙ座標補正裝置及方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US8280664B2 (enExample) |
| JP (1) | JP4741408B2 (enExample) |
| TW (2) | TWI414755B (enExample) |
| WO (1) | WO2007125938A1 (enExample) |
Families Citing this family (54)
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| JP5095364B2 (ja) * | 2007-11-26 | 2012-12-12 | 株式会社ニューフレアテクノロジー | トラッキング制御方法および電子ビーム描画システム |
| CN101911276B (zh) * | 2007-12-27 | 2012-04-25 | 朗姆研究公司 | 使用至少一个光源校准末端执行器对准的系统和方法 |
| JP2009277648A (ja) * | 2008-04-17 | 2009-11-26 | Hitachi High-Technologies Corp | 検査装置、および、検査方法 |
| WO2011066551A1 (en) * | 2009-11-30 | 2011-06-03 | Ionwerks, Inc. | Time-of-flight spectrometry and spectroscopy of surfaces |
| US8486726B2 (en) * | 2009-12-02 | 2013-07-16 | Veeco Instruments Inc. | Method for improving performance of a substrate carrier |
| KR101790534B1 (ko) * | 2011-05-13 | 2017-10-27 | 한국표준과학연구원 | 초고속 멀티 모드 질량 분석을 위한 비행시간 기반 질량 현미경 시스템 |
| JP2013033809A (ja) * | 2011-08-01 | 2013-02-14 | Tokyo Electron Ltd | ウエハ搬送装置 |
| JP5826566B2 (ja) * | 2011-09-01 | 2015-12-02 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法 |
| SG11201402475YA (en) * | 2011-11-29 | 2014-06-27 | Kla Tencor Corp | Systems and methods for preparation of samples for sub-surface defect review |
| EP2823361B1 (en) | 2012-03-08 | 2022-03-02 | ASML Netherlands B.V. | Lithography system and method for processing a target, such as a wafer |
| PT2891174T (pt) * | 2012-08-31 | 2019-11-20 | Semiconductor Tech & Instruments Pte Ltd | Sistema e método para correcção automática do desalinhamento rotational de pastilhas em molduras de filme |
| JP6128822B2 (ja) * | 2012-12-05 | 2017-05-17 | オリンパス株式会社 | 光学装置 |
| KR102006878B1 (ko) * | 2012-12-27 | 2019-08-05 | 삼성디스플레이 주식회사 | 기판 검사식각 복합장치 및 이를 구비하는 기판 처리장치 |
| US9557169B2 (en) * | 2013-03-13 | 2017-01-31 | Reticle Labs LLC | Method for tracking defects on a photomask across repeated inspections |
| JP2015035595A (ja) * | 2013-07-08 | 2015-02-19 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
| US9601305B2 (en) | 2013-11-11 | 2017-03-21 | Howard Hughes Medical Institute | Specimen sample holder for workpiece transport apparatus |
| JP6438209B2 (ja) * | 2014-04-07 | 2018-12-12 | 株式会社荏原製作所 | 検査装置において撮像装置用のタイミング信号を生成するための制御装置、撮像装置にタイミング信号を送出する方法 |
| US9645097B2 (en) * | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
| US10067222B2 (en) * | 2014-08-01 | 2018-09-04 | Funai Electric Co., Ltd. | Laser rangefinder |
| US10008364B2 (en) * | 2015-02-27 | 2018-06-26 | Kla-Tencor Corporation | Alignment of multi-beam patterning tool |
| US9597839B2 (en) | 2015-06-16 | 2017-03-21 | Xerox Corporation | System for adjusting operation of a printer during three-dimensional object printing to compensate for errors in object formation |
| US9966290B2 (en) | 2015-07-30 | 2018-05-08 | Lam Research Corporation | System and method for wafer alignment and centering with CCD camera and robot |
| JP2017032365A (ja) * | 2015-07-31 | 2017-02-09 | 株式会社日立ハイテクノロジーズ | パターンの計測方法および計測装置 |
| JP2017050181A (ja) * | 2015-09-02 | 2017-03-09 | 株式会社日立ハイテクサイエンス | 搬送装置、処理装置、真空装置および荷電粒子ビーム装置 |
| US20170067735A1 (en) * | 2015-09-09 | 2017-03-09 | Vishal Khosla | Apparatus for In-Line Test and Surface Analysis on a Mechanical Property Tester |
| US9892885B2 (en) * | 2016-03-24 | 2018-02-13 | Kla-Tencor Corporation | System and method for drift compensation on an electron beam based characterization tool |
| CN107346749A (zh) * | 2016-05-04 | 2017-11-14 | 台湾积体电路制造股份有限公司 | 半导体制程及其制程设备与控制装置 |
| US9987747B2 (en) * | 2016-05-24 | 2018-06-05 | Semes Co., Ltd. | Stocker for receiving cassettes and method of teaching a stocker robot disposed therein |
| US10024776B2 (en) * | 2016-07-20 | 2018-07-17 | Rtec-Instruments, Inc. | Apparatus for in-line testing and surface analysis on a mechanical property tester |
| JP6723131B2 (ja) | 2016-09-29 | 2020-07-15 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板搬送装置および基板搬送方法 |
| US10347460B2 (en) | 2017-03-01 | 2019-07-09 | Dongfang Jingyuan Electron Limited | Patterned substrate imaging using multiple electron beams |
| JP6869815B2 (ja) * | 2017-06-06 | 2021-05-12 | 株式会社ニューフレアテクノロジー | 検査方法および検査装置 |
| TWI667530B (zh) * | 2017-09-28 | 2019-08-01 | 日商紐富來科技股份有限公司 | Inspection method and inspection device |
| JP6688273B2 (ja) * | 2017-11-13 | 2020-04-28 | キヤノン株式会社 | リソグラフィ装置、リソグラフィ方法、決定方法及び物品の製造方法 |
| JP2019120654A (ja) * | 2018-01-11 | 2019-07-22 | 株式会社ニューフレアテクノロジー | 検査方法 |
| CN108398728A (zh) * | 2018-05-07 | 2018-08-14 | 广东工业大学 | 一种设备之间配合误差的辅助标记装置 |
| KR102765307B1 (ko) * | 2018-11-12 | 2025-02-07 | 삼성전자주식회사 | 마스크 검사 장치와 방법, 및 그 검사 방법을 포함한 마스크 제조방법 |
| US10955369B2 (en) * | 2018-11-12 | 2021-03-23 | Samsung Electronics Co., Ltd. | Mask inspection apparatuses and methods, and methods of fabricating masks including mask inspection methods |
| KR102697291B1 (ko) | 2018-12-31 | 2024-08-22 | 에이에스엠엘 네델란즈 비.브이. | 멀티 빔을 갖는 인-렌즈 웨이퍼 사전-충전 및 검사 |
| DE102019200696B4 (de) * | 2019-01-21 | 2022-02-10 | Carl Zeiss Smt Gmbh | Vorrichtung, Verfahren und Computerprogram zum Bestimmen einer Position eines Elements auf einer fotolithographischen Maske |
| CN111065912A (zh) * | 2019-12-04 | 2020-04-24 | 长江存储科技有限责任公司 | 半导体器件的检查系统及其相关的检查方法 |
| JP7507589B2 (ja) * | 2020-03-31 | 2024-06-28 | 株式会社ニューフレアテクノロジー | 検査装置 |
| TWI787794B (zh) * | 2020-05-28 | 2022-12-21 | 德商卡爾蔡司多重掃描電子顯微鏡有限公司 | 多重射束帶電粒子顯微鏡或系統與其操作方法 |
| EP3982221A1 (en) * | 2020-10-12 | 2022-04-13 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Coupon design system for supporting quality testing of component carriers |
| JP7633014B2 (ja) * | 2020-10-26 | 2025-02-19 | 住友重機械工業株式会社 | 歪曲収差補正処理装置、歪曲収差補正方法、及びプログラム |
| DE102021200799B3 (de) * | 2021-01-29 | 2022-03-31 | Carl Zeiss Multisem Gmbh | Verfahren mit verbesserter Fokuseinstellung unter Berücksichtigung eines Bildebenenkipps in einem Vielzahl-Teilchenstrahlmikroskop |
| US11958111B2 (en) | 2021-02-22 | 2024-04-16 | General Electric Company | Gaseous ionization detectors for monitoring and controlling energy beams used to additively manufacture three-dimensional objects |
| JP7396741B2 (ja) * | 2021-11-16 | 2023-12-12 | 株式会社新川 | 実装装置、実装方法および実装制御プログラム |
| US20230211436A1 (en) * | 2021-12-30 | 2023-07-06 | Semes Co., Ltd. | Apparatus for treating substrate and method for treating a substrate |
| US12431378B2 (en) * | 2022-11-08 | 2025-09-30 | Canon Kabushiki Kaisha | Chip chuck and a method of using the same |
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| CN116110828B (zh) * | 2023-02-08 | 2025-10-31 | 杭州长川科技股份有限公司 | 位置误差补偿方法、装置、电子设备及非易失性存储介质 |
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| JP2005249745A (ja) * | 2004-03-08 | 2005-09-15 | Ebara Corp | 試料表面検査方法および検査装置 |
| KR101377106B1 (ko) * | 2005-02-17 | 2014-03-25 | 가부시키가이샤 에바라 세이사꾸쇼 | 전자선장치 |
| TW200703409A (en) * | 2005-03-03 | 2007-01-16 | Ebara Corp | Mapping projection type electron beam apparatus and defects inspection system using such apparatus |
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2006
- 2006-04-27 JP JP2006123014A patent/JP4741408B2/ja active Active
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2007
- 2007-04-20 TW TW96113900A patent/TWI414755B/zh active
- 2007-04-20 TW TW102131769A patent/TWI495847B/zh active
- 2007-04-25 WO PCT/JP2007/058912 patent/WO2007125938A1/ja not_active Ceased
- 2007-04-25 US US12/226,683 patent/US8280664B2/en active Active
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2012
- 2012-08-31 US US13/600,814 patent/US8639463B2/en active Active
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2013
- 2013-12-19 US US14/134,236 patent/US9136091B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6876946B2 (en) * | 1993-01-21 | 2005-04-05 | Nikon Corporation | Alignment method and apparatus therefor |
| US6538248B1 (en) * | 1998-09-18 | 2003-03-25 | Hitachi, Ltd. | Charged particle beam scanning type automatic inspecting apparatus |
| US6481003B1 (en) * | 1998-09-30 | 2002-11-12 | Nikon Corporation | Alignment method and method for producing device using the alignment method |
| TWI235891B (en) * | 2003-04-17 | 2005-07-11 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and computer program |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007292679A (ja) | 2007-11-08 |
| US8639463B2 (en) | 2014-01-28 |
| TWI495847B (zh) | 2015-08-11 |
| US9136091B2 (en) | 2015-09-15 |
| TW201403023A (zh) | 2014-01-16 |
| US20140107959A1 (en) | 2014-04-17 |
| WO2007125938A1 (ja) | 2007-11-08 |
| JP4741408B2 (ja) | 2011-08-03 |
| US20130056635A1 (en) | 2013-03-07 |
| US8280664B2 (en) | 2012-10-02 |
| US20100282956A1 (en) | 2010-11-11 |
| TW200745508A (en) | 2007-12-16 |
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