TWI412884B - Photosensitive resin composition, photosensitive resin laminate, photoresist pattern forming method and manufacturing method of conductor pattern, printed wiring board, lead frame, substrate and semiconductor package - Google Patents

Photosensitive resin composition, photosensitive resin laminate, photoresist pattern forming method and manufacturing method of conductor pattern, printed wiring board, lead frame, substrate and semiconductor package Download PDF

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Publication number
TWI412884B
TWI412884B TW098129930A TW98129930A TWI412884B TW I412884 B TWI412884 B TW I412884B TW 098129930 A TW098129930 A TW 098129930A TW 98129930 A TW98129930 A TW 98129930A TW I412884 B TWI412884 B TW I412884B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
substrate
photoresist pattern
resin composition
resin laminate
Prior art date
Application number
TW098129930A
Other languages
English (en)
Chinese (zh)
Other versions
TW201019047A (en
Inventor
Yuka Kotani
Yuri Yamada
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201019047A publication Critical patent/TW201019047A/zh
Application granted granted Critical
Publication of TWI412884B publication Critical patent/TWI412884B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW098129930A 2008-09-04 2009-09-04 Photosensitive resin composition, photosensitive resin laminate, photoresist pattern forming method and manufacturing method of conductor pattern, printed wiring board, lead frame, substrate and semiconductor package TWI412884B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008227399 2008-09-04

Publications (2)

Publication Number Publication Date
TW201019047A TW201019047A (en) 2010-05-16
TWI412884B true TWI412884B (zh) 2013-10-21

Family

ID=41797225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098129930A TWI412884B (zh) 2008-09-04 2009-09-04 Photosensitive resin composition, photosensitive resin laminate, photoresist pattern forming method and manufacturing method of conductor pattern, printed wiring board, lead frame, substrate and semiconductor package

Country Status (5)

Country Link
JP (1) JP5205464B2 (ja)
KR (1) KR101328887B1 (ja)
CN (1) CN102144189B (ja)
TW (1) TWI412884B (ja)
WO (1) WO2010027061A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101751588B1 (ko) * 2012-04-04 2017-06-27 히타치가세이가부시끼가이샤 도전 패턴의 형성 방법 및 도전 패턴 기판
JP6008891B2 (ja) 2013-03-15 2016-10-19 富士フイルム株式会社 着色感放射線性組成物、着色硬化膜、カラーフィルタ、着色パターン形成方法、カラーフィルタの製造方法、固体撮像素子及び液晶表示装置
WO2016104639A1 (ja) * 2014-12-26 2016-06-30 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6650723B2 (ja) * 2015-10-16 2020-02-19 新光電気工業株式会社 リードフレーム及びその製造方法、半導体装置
WO2021036538A1 (zh) 2019-08-29 2021-03-04 浙江福斯特新材料研究院有限公司 一种感光性树脂组合物及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004219660A (ja) * 2003-01-14 2004-08-05 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物およびその用途

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3933459B2 (ja) 2001-12-14 2007-06-20 旭化成エレクトロニクス株式会社 感光性樹脂組成物及び積層体
JP4661388B2 (ja) 2004-06-21 2011-03-30 Ｊｓｒ株式会社 無機粉体含有樹脂組成物、転写フィルムおよびプラズマディスプレイパネル用部材の製造方法
CN1969232A (zh) * 2004-06-21 2007-05-23 捷时雅株式会社 含无机粉体的树脂组合物、转印膜以及等离子体显示板用构件的制造方法
JP2009003366A (ja) * 2007-06-25 2009-01-08 Jsr Corp マイクロレンズ形成に用いられる感放射線性樹脂組成物
JP5484770B2 (ja) * 2009-04-16 2014-05-07 株式会社イノアック技術研究所 ナノカーボン分散剤及び当該分散剤を含むナノカーボン分散液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004219660A (ja) * 2003-01-14 2004-08-05 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物およびその用途

Also Published As

Publication number Publication date
TW201019047A (en) 2010-05-16
KR20110044270A (ko) 2011-04-28
KR101328887B1 (ko) 2013-11-13
JP5205464B2 (ja) 2013-06-05
WO2010027061A1 (ja) 2010-03-11
JPWO2010027061A1 (ja) 2012-02-02
CN102144189A (zh) 2011-08-03
CN102144189B (zh) 2015-06-10

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