TWI410292B - Laser processing device - Google Patents
Laser processing device Download PDFInfo
- Publication number
- TWI410292B TWI410292B TW097134538A TW97134538A TWI410292B TW I410292 B TWI410292 B TW I410292B TW 097134538 A TW097134538 A TW 097134538A TW 97134538 A TW97134538 A TW 97134538A TW I410292 B TWI410292 B TW I410292B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser beam
- axis direction
- laser
- chuck
- repetition frequency
- Prior art date
Links
- 238000003754 machining Methods 0.000 claims abstract description 28
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 230000007246 mechanism Effects 0.000 claims description 127
- 238000005286 illumination Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 230000010355 oscillation Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 43
- 238000000034 method Methods 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 8
- 238000007790 scraping Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007286032A JP5192213B2 (ja) | 2007-11-02 | 2007-11-02 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200920533A TW200920533A (en) | 2009-05-16 |
TWI410292B true TWI410292B (zh) | 2013-10-01 |
Family
ID=40514650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097134538A TWI410292B (zh) | 2007-11-02 | 2008-09-09 | Laser processing device |
Country Status (5)
Country | Link |
---|---|
US (1) | US8704126B2 (de) |
JP (1) | JP5192213B2 (de) |
CN (1) | CN101422849B (de) |
DE (1) | DE102008054157B4 (de) |
TW (1) | TWI410292B (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5340808B2 (ja) * | 2009-05-21 | 2013-11-13 | 株式会社ディスコ | 半導体ウエーハのレーザ加工方法 |
JP5431831B2 (ja) * | 2009-08-21 | 2014-03-05 | 株式会社ディスコ | レーザー加工装置 |
AU2010306593B2 (en) | 2009-10-15 | 2015-09-10 | Crescendo Bioscience, Inc. | Biomarkers and methods for measuring and monitoring inflammatory disease activity |
JP5431989B2 (ja) * | 2010-01-29 | 2014-03-05 | 株式会社ディスコ | レーザー加工装置 |
CN101774077A (zh) * | 2010-03-19 | 2010-07-14 | 周志坚 | 数控旋转型三维超声波金丝球焊机 |
CN101774078A (zh) * | 2010-03-19 | 2010-07-14 | 周志坚 | 一种超声波金丝球焊机 |
TWI411484B (zh) * | 2010-11-17 | 2013-10-11 | Chun Hao Li | 雷射製程參數調校方法及自動參數調校之雷射加工機 |
JP5788749B2 (ja) * | 2011-09-15 | 2015-10-07 | 株式会社ディスコ | レーザー加工装置 |
JP5860272B2 (ja) * | 2011-11-24 | 2016-02-16 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
JP5902540B2 (ja) * | 2012-04-02 | 2016-04-13 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
WO2015153437A1 (en) | 2014-04-02 | 2015-10-08 | Crescendo Bioscience | Biomarkers and methods for measuring and monitoring juvenile idiopathic arthritis activity |
EP3155439A4 (de) | 2014-06-10 | 2018-03-14 | Crescendo Bioscience | Biomarker und verfahren zur messung und überwachung der axialen spondyloarthritiserkrankungsaktivität |
JP6411822B2 (ja) * | 2014-09-09 | 2018-10-24 | 株式会社ディスコ | レーザー加工装置 |
WO2017058999A2 (en) | 2015-09-29 | 2017-04-06 | Crescendo Bioscience | Biomarkers and methods for assessing response to inflammatory disease therapy withdrawal |
CA3207751A1 (en) | 2015-09-29 | 2017-04-06 | Laboratory Corporation Of America Holdings | Biomarkers and methods for assessing psoriatic arthritis disease activity |
CN105458491B (zh) * | 2015-12-25 | 2017-08-11 | 苏州智合源电子科技有限公司 | 全自动激光打标机激光定位机构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW445190B (en) * | 2000-03-02 | 2001-07-11 | Amatetsuku Kk | Laser processing method and device |
JP2004087880A (ja) * | 2002-08-28 | 2004-03-18 | Mitsubishi Materials Corp | プリント配線基板の穴あけ加工方法 |
CN1785578A (zh) * | 2004-12-07 | 2006-06-14 | 株式会社迪斯科 | 激光束加工机 |
JP2007258236A (ja) * | 2006-03-20 | 2007-10-04 | Denso Corp | 半導体基板の分断方法およびその分断方法で作製された半導体チップ |
JP2007275962A (ja) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | レーザー加工装置 |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU584563B2 (en) * | 1986-01-31 | 1989-05-25 | Ciba-Geigy Ag | Laser marking of ceramic materials, glazes, glass ceramics and glasses |
US5189437A (en) * | 1987-09-19 | 1993-02-23 | Xaar Limited | Manufacture of nozzles for ink jet printers |
JPH0651913B2 (ja) * | 1988-04-22 | 1994-07-06 | 川崎製鉄株式会社 | 圧延用ロールの表面加工方法及びその装置並びに該方法により製造されるプレス加工用金属薄板とその製造方法 |
US5072091A (en) * | 1989-04-03 | 1991-12-10 | The Local Government Of Osaka Prefecture | Method and apparatus for metal surface process by laser beam |
US4932989A (en) * | 1989-04-05 | 1990-06-12 | At&T Bell Laboratories | Method and apparatus for fabricating microlenses on optical fibers |
JP2860765B2 (ja) * | 1995-03-07 | 1999-02-24 | 株式会社小松製作所 | レーザ刻印装置の制御装置 |
US6025256A (en) * | 1997-01-06 | 2000-02-15 | Electro Scientific Industries, Inc. | Laser based method and system for integrated circuit repair or reconfiguration |
US6339604B1 (en) * | 1998-06-12 | 2002-01-15 | General Scanning, Inc. | Pulse control in laser systems |
DE19840926B4 (de) * | 1998-09-08 | 2013-07-11 | Hell Gravure Systems Gmbh & Co. Kg | Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung |
US6683276B2 (en) * | 1999-04-26 | 2004-01-27 | Ethicon, Inc. | Method of forming chamfered blind holes in surgical needles using a diode pumped Nd-YAG laser |
US6418154B1 (en) * | 1999-06-07 | 2002-07-09 | Coherent, Inc. | Pulsed diode-pumped solid-state laser |
US20090168111A9 (en) * | 1999-09-01 | 2009-07-02 | Hell Gravure Systems Gmbh | Printing form processing with fine and coarse engraving tool processing tracks |
US7671295B2 (en) * | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
JP3408805B2 (ja) | 2000-09-13 | 2003-05-19 | 浜松ホトニクス株式会社 | 切断起点領域形成方法及び加工対象物切断方法 |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
JP4071476B2 (ja) * | 2001-03-21 | 2008-04-02 | 株式会社東芝 | 半導体ウェーハ及び半導体ウェーハの製造方法 |
US6701402B1 (en) * | 2001-03-30 | 2004-03-02 | Hewlett-Packard Development Company, L.P. | Selectively operating a host's device controller in a first mode or a second mode |
US6603095B2 (en) * | 2001-07-23 | 2003-08-05 | Siemens Automotive Corporation | Apparatus and method of overlapping formation of chamfers and orifices by laser light |
US6642476B2 (en) * | 2001-07-23 | 2003-11-04 | Siemens Automative Corporation | Apparatus and method of forming orifices and chamfers for uniform orifice coefficient and surface properties by laser |
JP3838064B2 (ja) * | 2001-09-28 | 2006-10-25 | 松下電器産業株式会社 | レーザ制御方法 |
US6683893B2 (en) * | 2001-10-25 | 2004-01-27 | Coherent, Inc. | Q-switching method for pulse train generation |
TW200304175A (en) * | 2001-11-12 | 2003-09-16 | Sony Corp | Laser annealing device and thin-film transistor manufacturing method |
JP2004167607A (ja) * | 2002-11-15 | 2004-06-17 | Tama Tlo Kk | マイクロ流体素子とその製造方法 |
WO2004063109A1 (ja) * | 2003-01-10 | 2004-07-29 | Nippon Sheet Glass Company, Limited | レーザ加工用ガラス |
US6740847B1 (en) * | 2003-03-10 | 2004-05-25 | Siemens Vdo Automotive Corporation | Method of forming multiple machining spots by a single laser |
US6931035B2 (en) * | 2003-04-14 | 2005-08-16 | Coherent, Inc. | Q-switching method for pulse train generation |
JP4231349B2 (ja) * | 2003-07-02 | 2009-02-25 | 株式会社ディスコ | レーザー加工方法およびレーザー加工装置 |
DE102005004827B4 (de) * | 2004-02-03 | 2011-03-31 | Disco Corp. | Wafer-Unterteilungsverfahren |
JP2005222989A (ja) * | 2004-02-03 | 2005-08-18 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
US7159436B2 (en) * | 2004-04-28 | 2007-01-09 | Siemens Vdo Automotive Corporation | Asymmetrical punch |
US7985942B2 (en) * | 2004-05-28 | 2011-07-26 | Electro Scientific Industries, Inc. | Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
US7227098B2 (en) * | 2004-08-06 | 2007-06-05 | Electro Scientific Industries, Inc. | Method and system for decreasing the effective pulse repetition frequency of a laser |
US7602822B2 (en) * | 2004-09-28 | 2009-10-13 | Hitachi Via Mechanics, Ltd | Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming of milling applications |
JP2006108459A (ja) * | 2004-10-07 | 2006-04-20 | Disco Abrasive Syst Ltd | シリコンウエーハのレーザー加工方法およびレーザー加工装置 |
JP4511903B2 (ja) * | 2004-10-20 | 2010-07-28 | 株式会社ディスコ | ウエーハの分割装置 |
JP2006128211A (ja) * | 2004-10-26 | 2006-05-18 | Disco Abrasive Syst Ltd | ウエーハの分割装置 |
JP2006135133A (ja) * | 2004-11-08 | 2006-05-25 | Disco Abrasive Syst Ltd | 窒化ガリウム基板のレーザー加工方法 |
JP4664710B2 (ja) * | 2005-03-09 | 2011-04-06 | 株式会社ディスコ | レーザー加工装置 |
JP2006269897A (ja) * | 2005-03-25 | 2006-10-05 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法 |
CA2558898C (en) * | 2005-09-07 | 2013-11-05 | Purdue Research Foundation | Laser assisted machining process with distributed lasers |
JP5036181B2 (ja) * | 2005-12-15 | 2012-09-26 | 株式会社ディスコ | レーザー加工装置 |
JP4851795B2 (ja) * | 2006-01-13 | 2012-01-11 | 株式会社ディスコ | ウエーハの分割装置 |
US7460566B2 (en) * | 2006-05-02 | 2008-12-02 | Northrop Grumman Corporation | Laser power reduction without mode change |
JP5122773B2 (ja) * | 2006-08-04 | 2013-01-16 | 株式会社ディスコ | レーザー加工機 |
JP2008060164A (ja) * | 2006-08-29 | 2008-03-13 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法 |
JP4970068B2 (ja) * | 2007-01-30 | 2012-07-04 | 株式会社ニデック | 眼科用レーザ治療装置 |
JP2008212999A (ja) * | 2007-03-06 | 2008-09-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
JP2010021398A (ja) * | 2008-07-11 | 2010-01-28 | Disco Abrasive Syst Ltd | ウェーハの処理方法 |
-
2007
- 2007-11-02 JP JP2007286032A patent/JP5192213B2/ja active Active
-
2008
- 2008-09-09 TW TW097134538A patent/TWI410292B/zh active
- 2008-10-09 US US12/248,685 patent/US8704126B2/en active Active
- 2008-10-31 DE DE102008054157.5A patent/DE102008054157B4/de active Active
- 2008-10-31 CN CN2008101749835A patent/CN101422849B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW445190B (en) * | 2000-03-02 | 2001-07-11 | Amatetsuku Kk | Laser processing method and device |
JP2004087880A (ja) * | 2002-08-28 | 2004-03-18 | Mitsubishi Materials Corp | プリント配線基板の穴あけ加工方法 |
CN1785578A (zh) * | 2004-12-07 | 2006-06-14 | 株式会社迪斯科 | 激光束加工机 |
JP2007258236A (ja) * | 2006-03-20 | 2007-10-04 | Denso Corp | 半導体基板の分断方法およびその分断方法で作製された半導体チップ |
JP2007275962A (ja) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | レーザー加工装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2009113052A (ja) | 2009-05-28 |
DE102008054157A1 (de) | 2009-05-07 |
DE102008054157B4 (de) | 2023-12-28 |
CN101422849B (zh) | 2013-08-14 |
US8704126B2 (en) | 2014-04-22 |
US20090114627A1 (en) | 2009-05-07 |
JP5192213B2 (ja) | 2013-05-08 |
TW200920533A (en) | 2009-05-16 |
CN101422849A (zh) | 2009-05-06 |
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