TWI410292B - Laser processing device - Google Patents

Laser processing device Download PDF

Info

Publication number
TWI410292B
TWI410292B TW097134538A TW97134538A TWI410292B TW I410292 B TWI410292 B TW I410292B TW 097134538 A TW097134538 A TW 097134538A TW 97134538 A TW97134538 A TW 97134538A TW I410292 B TWI410292 B TW I410292B
Authority
TW
Taiwan
Prior art keywords
laser beam
axis direction
laser
chuck
repetition frequency
Prior art date
Application number
TW097134538A
Other languages
English (en)
Chinese (zh)
Other versions
TW200920533A (en
Inventor
Masaru Nakamura
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200920533A publication Critical patent/TW200920533A/zh
Application granted granted Critical
Publication of TWI410292B publication Critical patent/TWI410292B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW097134538A 2007-11-02 2008-09-09 Laser processing device TWI410292B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007286032A JP5192213B2 (ja) 2007-11-02 2007-11-02 レーザー加工装置

Publications (2)

Publication Number Publication Date
TW200920533A TW200920533A (en) 2009-05-16
TWI410292B true TWI410292B (zh) 2013-10-01

Family

ID=40514650

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097134538A TWI410292B (zh) 2007-11-02 2008-09-09 Laser processing device

Country Status (5)

Country Link
US (1) US8704126B2 (de)
JP (1) JP5192213B2 (de)
CN (1) CN101422849B (de)
DE (1) DE102008054157B4 (de)
TW (1) TWI410292B (de)

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* Cited by examiner, † Cited by third party
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JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5431831B2 (ja) * 2009-08-21 2014-03-05 株式会社ディスコ レーザー加工装置
WO2011047358A1 (en) 2009-10-15 2011-04-21 Crescendo Bioscience Biomarkers and methods for measuring and monitoring inflammatory disease activity
JP5431989B2 (ja) * 2010-01-29 2014-03-05 株式会社ディスコ レーザー加工装置
CN101774077A (zh) * 2010-03-19 2010-07-14 周志坚 数控旋转型三维超声波金丝球焊机
CN101774078A (zh) * 2010-03-19 2010-07-14 周志坚 一种超声波金丝球焊机
TWI411484B (zh) * 2010-11-17 2013-10-11 Chun Hao Li 雷射製程參數調校方法及自動參數調校之雷射加工機
JP5788749B2 (ja) * 2011-09-15 2015-10-07 株式会社ディスコ レーザー加工装置
JP5860272B2 (ja) * 2011-11-24 2016-02-16 株式会社ディスコ 光デバイスウエーハの加工方法
JP5902540B2 (ja) * 2012-04-02 2016-04-13 株式会社ディスコ レーザー加工方法およびレーザー加工装置
CA2943821A1 (en) 2014-04-02 2015-10-08 Crescendo Bioscience Biomarkers and methods for measuring and monitoring juvenile idiopathic arthritis activity
CA2950771A1 (en) 2014-06-10 2015-12-17 Crescendo Bioscience Biomarkers and methods for measuring and monitoring axial spondyloarthritis disease activity
JP6411822B2 (ja) * 2014-09-09 2018-10-24 株式会社ディスコ レーザー加工装置
WO2017058999A2 (en) 2015-09-29 2017-04-06 Crescendo Bioscience Biomarkers and methods for assessing response to inflammatory disease therapy withdrawal
CA3207751A1 (en) 2015-09-29 2017-04-06 Laboratory Corporation Of America Holdings Biomarkers and methods for assessing psoriatic arthritis disease activity
CN105458491B (zh) * 2015-12-25 2017-08-11 苏州智合源电子科技有限公司 全自动激光打标机激光定位机构

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Publication number Priority date Publication date Assignee Title
TW445190B (en) * 2000-03-02 2001-07-11 Amatetsuku Kk Laser processing method and device
JP2004087880A (ja) * 2002-08-28 2004-03-18 Mitsubishi Materials Corp プリント配線基板の穴あけ加工方法
CN1785578A (zh) * 2004-12-07 2006-06-14 株式会社迪斯科 激光束加工机
JP2007258236A (ja) * 2006-03-20 2007-10-04 Denso Corp 半導体基板の分断方法およびその分断方法で作製された半導体チップ
JP2007275962A (ja) * 2006-04-10 2007-10-25 Disco Abrasive Syst Ltd レーザー加工装置

Also Published As

Publication number Publication date
CN101422849A (zh) 2009-05-06
JP2009113052A (ja) 2009-05-28
US8704126B2 (en) 2014-04-22
TW200920533A (en) 2009-05-16
DE102008054157B4 (de) 2023-12-28
US20090114627A1 (en) 2009-05-07
JP5192213B2 (ja) 2013-05-08
CN101422849B (zh) 2013-08-14
DE102008054157A1 (de) 2009-05-07

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