經濟部智慧財產局員工消費合作社印製 4451 9 Ο Α7 ____Β7_ 五、發明說明（1 ) (發明所屬之技術領域） 本發明係關於一種雷射加工方法及雷射加工裝置，特 別是關於一種最適用於液晶之後照光用面板之加工的雷射 加工方法及雷射加工裝置。 (以往之技術與課題） ‘ —般，筆記型電腦等之液晶的後照光用面板，係使用 注射成型的丙烯酸樹脂板。該丙烯酸樹脂板係必須正確地 切出縱橫之尺寸，以往，照射雷射束加以切斷。 然而，在注射成型之丙烯酸樹脂板留下成形時所發生 之內部應力|具有在雷射切斷時歪變發生在切口之問題。 特別是，在射出澆口部留下較大應力，歪變也變大。因此 ，澆口部之位置係大受限制。 本發明之目的，係在於提供一種在被注射成型的塑膠 板之切口不會發生依內部應力之歪變的雷射加工方法及雷 射加工裝置。 (發明之構成、作用及效果） 爲了達成以上之目的，本發明之雷射加工方法，其特 徵爲：作爲將雷射束之焦點對準於照射位置並切除之過程 的事先過程，係在偏離照射位置之焦點的狀態下將雷射束 照射在塑膠板，俾預熱切除部分。 又，本發明之雷射加工裝置，其特徵爲：在將雷射束 引導至塑膠板的光學系統之一部分，用以調整雷射束之焦 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ---I I----- -- 4^· — — !—·!.^· — ! — —!*^· (請先閱讀背面之注意事項再填寫本頁) -4 - 4 4 5 19 0 a? B7 五、發明說明（2 ) (請先閱讀背面之注意事項再填寫本頁) 點而設置可移動之光學構件，在偏離雷射束之焦點之位置 移動光學構件俾進行預備加熱，在切除過程時移動光學構 件使雷射束之焦點對準在照射位置。 在本發明中，將焦點偏離之雷射束照射在塑膠板之切 除部分，即可使被照射部分軟化，俾緩和注射成型時所發 生之內部應力。因此，之後對準焦點進行切除時，1在切口 不會發生歪變。特別是，注射澆口部之切除上極有效，並 可將澆口部設定在任意部位。 而且在本發明中，由於僅偏離雷射束之焦點即可進行 預備加熱，因此，加設僅移動光學構件之一部分之構成就 可以，不必設置專利之預熱機構。作爲調整焦點之光學構 件使用透鏡，即可在機械上構成最小巧精緻者。 (發明之實施形態） 以下，參照圖式說明本發明之雷射加工方法及雷射加 工裝置的實施形態。 經濟部智慧財產局員工消費合作社印製 如第1圖及第2圖所示，本發明之雷射加工裝置，係 設置豎立於基台1上的圓柱2 ，而在圓柱2安裝加工台3 者。加工台3係可將加工材料之注射成型的丙烯酸樹脂板 3 0保持成裝卸自如之狀態，並藉由未予圖示之伺服電動 機分別驅動向X軸方向、Y軸方向、Z軸方向。丙烯酸樹 脂板30之裝卸構造或X、 γ、 Z軸方向之驅動構造係眾 知，因此省略其說明。 雷射束係從設於基台1之光源單元1 〇所放射，光源 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -5- 經濟部智慧財產局員工消费合作社印製 445t9〇 A7 __B7 五、發明說明（3 ) 單元1 0係包含半導體雷射或準直儀透鏡等眾知者。.所放 射之雷射束係在反射鏡11，1 2被導至裝置之上部，而 在反射鏡1 3折回向下方。之後，雷射束係在半反射鏡 1 4被分岐，其中一方之雷射束係經由反射鏡1 5而從上 方照射丙烯酸樹脂板3 0。另一方之雷射束係經由反射鏡 1 6，1 7而從下方照射丙烯酸樹脂板3 0。記號E係表 示對於丙烯酸樹脂板3 0之照射位置。 在本發明之雷射加工裝置，設有用以調整雷射束之照 射位置E之透鏡2 1 ，2 2。透鏡2 1係將雷射束從下方 照射在丙烯酸樹脂板3 0，能將照射位置E之雷射束焦點 設定在偏離位置。透鏡2 2係將雷射束從上方照射在丙稀 酸樹脂板3 0，安裝於托架2 3，藉由伺服馬達2 4可朝 Z軸方向移動。透鏡2 2係經由朝Z軸方向移動*當設定 在第1圖、第2圖以實線所示之位置B時，能將雷射束焦 點對準在照射位置，若被設定在以虛線所示之位置B ~時 ，則偏離照射位置E之雷射束焦點。 由以上之構成所成的雷射加工裝置，係藉由圖示於第 3圖之CPU51進行控制。藉由CPU51將加工台3 朝X、Y、Z軸方向移動，同時驅動雷射光源單元10以 切斷丙烯酸樹脂板3 0之控制係基本上熟習該項技術者所 眾知。在本實施形態中，特徵部分係在於增設將透鏡2 2 朝Z軸方向移動的電動機2 4。在以下所說明之加工方法 中，CPU51係在預熱過程中，發出將透鏡22設定在 位置B >之驅動信號發送至電動機2 4，而在切除過程中 本纸張尺度適用中國國家標準（CNS>A4规格（210 X 297公釐） ί請先閱讀背面之注^^^^項再填寫本頁> 裝-------訂-----線· -6- 445彳90 . A7 __B7_ 五、發明說明（4 ) ，將透鏡2 2設定在位置B之驅動信號發送至電動機2 4 〇 以下，說明雷射加工方法。 在加工台3固定丙烯酸樹脂板30|並在CPU51 輸入移動加工台3之資料。對於丙烯酸樹脂板3 0，首先 實行預熱過程。該預熱過程係將透鏡2 2設定在位置B ~ ，將從透鏡2 1，2 2偏離焦點之雷射束照射在丙烯酸樹 脂板3 0之切除部分所進行。此時，丙烯酸樹脂板3 0係 藉由雷射束被加熱而軟化，能緩和發生在注射成型時之內 部應力。 之後，實行切除過程。該切除過程係將透鏡2 2設定 在位置B，並從透鏡2 2將焦點對準在照射位置E之雷射 束照射在丙烯酸樹脂板3 0所進行。此時，焦點偏離之雷 射束也從透鏡2 1被照射，惟並一定需要，而在適當位置 遮住來自透鏡21之雷射束。 經濟部智慧財產局員工消費合作社印製 {請先閲讀背面之沒意事項再填寫本頁》 如上所述，在本實施形態中，由於對於丙烯酸樹脂板 3 0進行預備加熱，因此事先緩和丙烯酸樹脂板3 0之切 斷部位的內部應力，而可防止在切口發生畸變。而且，預 備加熱係僅移動透鏡2 2 可實行，不需要專用之熱源， 使用簡單之構成就可以。 又，本發明之雷射加工方法及雷射加工裝置係並不被 限定於上述實施形態者，在其要旨之範圍內可做各種變更 〇 特別是，調整雷射束之焦點之手段係不僅使用透鏡 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公« ) 經濟部智慧財產局員工消費合作社印製 445 1 9 ϋ Α7 _Β7 五、發明說明（5 ) 2 2，也可使用其他之光學構成。又，雷射束之光路達成 係任意，也可以設置兩具光源單元。 (圖式之簡單說明） 第1圖係表示本發明之一實施形態之雷射加工裝置之 槪略構成的正面圖。 ' 第2圖係表示上述雷射加工裝置之槪略構成的側面圖 9 第3圖係表示上述雷射加工裝置之控制部之槪略構成 的方塊圖。 (記號之說明） 1 :基台》 3 :加工台’ 1 ◦:雷射光源單元， 2 1，2 3 :透鏡， 2 4 :電動機， 3 0 :丙烯酸樹脂板， 5 1 : C P U， E :照射位置》 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -1 ------1 I 訂------ ----- -8-Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 4451 9 Ο Α7 ____ Β7_ V. Description of the Invention (1) (Technical Field to Which the Invention belongs) The present invention relates to a laser processing method and a laser processing device, and more particularly to a most suitable Laser processing method and laser processing device for processing panel for illumination after liquid crystal. (Historical technology and problems) ‘In general, the LCD backlight panel used in notebook computers is an injection-molded acrylic resin panel. This acrylic resin sheet must be cut accurately in both the horizontal and vertical dimensions. Conventionally, a laser beam was irradiated to cut it. However, the internal stress that occurs when the acrylic resin sheet for injection molding is left behind has the problem that distortion occurs at the notch when the laser is cut. In particular, a large stress is left in the injection gate portion, and distortion is also increased. Therefore, the position of the gate portion is greatly restricted. An object of the present invention is to provide a laser processing method and a laser processing device that do not cause distortion in internal cuts in a cut of a plastic plate to be injection-molded. (Composition, Action, and Effect of the Invention) In order to achieve the above object, the laser processing method of the present invention is characterized in that it is a deviation from the prior process of aligning the focus of the laser beam on the irradiation position and cutting it off. The laser beam is irradiated on the plastic plate with the focal point of the irradiation position, and the cut-off part is preheated. In addition, the laser processing device of the present invention is characterized in that: a part of an optical system that guides a laser beam to a plastic plate is used to adjust the focal paper size of the laser beam to the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) --- I I ------4 ^ · — —! — ·!. ^ · —! — —! * ^ · (Please read the notes on the back before filling this page ) -4-4 4 5 19 0 a? B7 V. Description of the invention (2) (Please read the precautions on the back before filling in this page) Point and set the movable optical component at a position deviating from the focus of the laser beam The optical member 俾 is moved for pre-heating, and the optical member is moved during the cutting process so that the focus of the laser beam is at the irradiation position. In the present invention, by irradiating a laser beam with a defocused focus on a cut-out portion of a plastic plate, the irradiated portion can be softened, and internal stress generated during injection molding can be relaxed. Therefore, when the focus is removed afterwards, 1 will not be distorted at the incision. In particular, the removal of the injection gate portion is extremely effective, and the gate portion can be set at any position. Furthermore, in the present invention, since pre-heating can be performed only by deviating from the focal point of the laser beam, it is sufficient to add a structure that moves only a part of the optical member, and it is not necessary to provide a patented preheating mechanism. The use of a lens as an optical component for focus adjustment can mechanically constitute the smallest and finest. (Embodiment of the invention) Hereinafter, embodiments of a laser processing method and a laser processing apparatus according to the present invention will be described with reference to the drawings. As shown in Figures 1 and 2, the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs prints the laser processing device of the present invention, which is provided with a cylinder 2 standing on the abutment 1 and a processing table 3 is installed on the cylinder 2. . The processing table 3 is capable of holding the injection-molded acrylic resin sheet 30 of the processing material in a freely detachable state, and is driven in the X-axis direction, the Y-axis direction, and the Z-axis direction by servo motors (not shown). The mounting and dismounting structure of the acrylic resin plate 30 and the driving structure in the X, γ, and Z axis directions are well known, and therefore descriptions thereof are omitted. The laser beam is emitted from a light source unit 10 located on the abutment 1. The paper size of the light source is in accordance with China National Standard (CNS) A4 (210 X 297 mm). -5- Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs System 445t9〇A7 __B7 V. Description of the invention (3) Unit 10 is a well-known person including semiconductor laser or collimator lens. The emitted laser beam is guided to the upper part of the mirror 11, 12 and is folded back to the lower side of the mirror 13. Thereafter, the laser beam is divided at the half mirror 14, and one of the laser beams is irradiated to the acrylic resin plate 30 from above through the mirror 15. The laser beam on the other side irradiates the acrylic resin plate 30 from below through the mirrors 16 and 17. The symbol E indicates the irradiation position of the acrylic resin plate 30. The laser processing apparatus of the present invention is provided with lenses 2 1 and 2 2 for adjusting the irradiation position E of the laser beam. The lens 21 irradiates the laser beam onto the acrylic resin plate 30 from below, and can set the laser beam focal point of the irradiation position E to an off-position. The lens 2 2 irradiates the laser beam on the acrylic resin plate 30 from above, and is mounted on the bracket 23. The servo motor 24 can move in the Z-axis direction. The lens 2 2 is moved in the Z-axis direction. * When set to position B shown by the solid line in Figure 1 and Figure 2, the laser beam can be focused on the irradiation position. When the position B is shown, the focus of the laser beam deviated from the irradiation position E. The laser processing apparatus constructed as described above is controlled by the CPU 51 shown in FIG. 3. The control system for moving the processing table 3 in the X, Y, and Z directions by the CPU 51 and driving the laser light source unit 10 to cut off the acrylic resin plate 30 is basically well known to those skilled in the art. In this embodiment, a characteristic part is that a motor 24 is added to move the lens 2 2 in the Z-axis direction. In the processing method described below, the CPU 51 sends a drive signal to set the lens 22 at the position B > to the motor 24 during the warm-up process, and the Chinese paper standard is applied to the paper size during the removal process ( CNS > A4 specifications (210 X 297 mm) ί Please read the note on the back ^^^^ before filling out this page > Loading ------- Order ----- line · -6- 445 彳90. A7 __B7_ V. Description of the invention (4), the driving signal for setting the lens 2 2 at the position B to the motor 2 4 0 or below will be used to explain the laser processing method. The acrylic resin plate 30 | is fixed on the processing table 3 and the CPU 51 Enter the information of the mobile processing table 3. For the acrylic resin plate 30, the preheating process is performed first. This preheating process is to set the lens 22 to the position B ~, and the laser beam that will deviate from the focus of the lenses 2 1, 2 2 Irradiation is performed on the cut-out portion of the acrylic resin plate 30. At this time, the acrylic resin plate 30 is softened by being heated by a laser beam, which can alleviate internal stress occurring during injection molding. Thereafter, the cutting-out process is performed. The The cutting process is to set the lens 2 2 to the position B, and remove the lens 2 2 from the lens 2 2 The laser beam focused on the irradiation position E is irradiated on the acrylic resin plate 30. At this time, the laser beam with the out-of-focus position is also irradiated from the lens 21, but it is necessary to cover the laser beam at an appropriate position. Laser beam from lens 21. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs {Please read the unintentional matter on the back before filling in this page "As described above, in this embodiment, the The preliminary heating reduces the internal stress of the cut portion of the acrylic resin plate 30 in advance, so as to prevent distortion in the incision. Furthermore, the preliminary heating can be performed only by moving the lens 2 2, and a dedicated heat source is not required. The structure is simple to use In addition, the laser processing method and the laser processing apparatus of the present invention are not limited to those described in the above embodiment, and various changes can be made within the scope of the gist thereof. In particular, means for adjusting the focus of the laser beam Not only the lens is used. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male «) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and Consumer Cooperatives 445 1 9 Α Α7 _Β7 V. Description of the invention (5) 2 2 Other optical structures can also be used. In addition, the optical path of the laser beam can be arbitrarily set, and two light source units can also be provided. (Simplified description of the drawings) Figure 1 FIG. 2 is a front view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a side view showing a schematic configuration of the laser processing apparatus. FIG. 3 is a view showing the laser processing apparatus. Block diagram of the outline of the control unit. (Description of symbols) 1: Abutment "3: Processing table '1 ◦: Laser light source unit, 2 1, 2 3: Lens, 2 4: Motor, 3 0: Acrylic resin board, 5 1: CPU, E: Irradiation position》 This paper size applies to Chinese national standard (CNS > A4 size (210 X 297 mm) (Please read the precautions on the back before filling this page) -1- ---- 1 I order ------ ----- -8-