JP2005007427A - Laser marking method - Google Patents
Laser marking method Download PDFInfo
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- JP2005007427A JP2005007427A JP2003174313A JP2003174313A JP2005007427A JP 2005007427 A JP2005007427 A JP 2005007427A JP 2003174313 A JP2003174313 A JP 2003174313A JP 2003174313 A JP2003174313 A JP 2003174313A JP 2005007427 A JP2005007427 A JP 2005007427A
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- JP
- Japan
- Prior art keywords
- laser marking
- scanner
- movable lens
- laser
- workpiece
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Abstract
Description
【0001】
本発明は、レーザ光を用いてマーキングする方法に関するものである。
【0002】
【従来の技術】
特開平3−124486号公報にはマーキングすべき対象物(ワーク)の内部にレーザ光を集光させる方法として集光レンズを用いた方法が開示されているが、レンズから集光点までの距離が一定であるため、図4に示すように、ワークWが平面の場合、マーキング位置が変化した場合、ワークをX−Y方向に移動しなければならない。
【0003】
従来、この問題を解決する手段として、平板のワークにレーザマーキングする場合は、X−YスキャナとワークWとの間にf・θレンズを設ける方法が採られているが、曲面のワークにレーザマーキングする方法が無かった。
【0004】
【特許文献1】
特開平3−124486号公報
【0005】
【発明が解決しようとする課題】
そこで本発明は、f・θレンズを用いずに、平面ワークは勿論のこと曲面ワークにレーザマーキングする方法を提供することを課題とするものである。
【0006】
【課題を解決するための手段】
本発明は、上記課題を解決するためになされたもので、X−Yスキャナを用いてワークの表面又は透過性ワークの内部にレーザマーキングをする方法において、レーザ装置とX−Yスキャナ間にリニアトランスレータを設け、前記X−Yスキャナの制御装置とリニアトランスレータの焦点調節用可動レンズの駆動装置間に前記ワークの形状に応じた補正テーブルを備えた駆動信号出力装置を設け、その出力信号に応じて、前記可動レンズの駆動装置により可動レンズを光軸方向に移動させてレーザ光の集光点を変化させることを特徴とするレーザマーキング方法である。
【0007】
すなわち、X−Yスキャナを用いたレーザマーキング方法では、X、Yミラーの走査時に走査角の大きい部分で集光点のずれが発生し、そのずれ量は計算により求まる値であるから、本発明では予めXミラーとYミラーの走査各位置に補正量分だけ焦点調節用の可動レンズを移動して集光点を補正する補正テーブルを用意し、その補正テーブルに従った補正信号Δfを可動レンズの駆動装置に与えて、所期のレーザマーキング位置にレーザマーキングが行われるようにしたものである。
【0008】
【発明の実施の形態】
図1は、本発明を実施するための装置の模式図で、1はレーザ装置、2はX−Yスキャナ、3はX−Yスキャナ制御装置、4は前記レーザ装置1とX−Yスキャナ2間に設けた固定レンズA,B及び可動レンズCから成るリニアトランスレータ、5は可動レンズCの駆動装置、6はワークWの形状(平面、曲面等)に対応した補正信号作成用補正テーブルを記憶させた補正用駆動信号出力装置である。
【0009】
補正用駆動信号出力装置6に記憶させる補正テーブルは、レーザマーキング位置とその位置のステージからワークWのZ軸方向のレーザマーキング位置例えば、図2ではL0、図3ではL0,L1,L2,L3…を計算又は測定により求めて作る。
【0010】
従って、実施例装置で図2に示すようなガラスや透明プラスチック板等の平面ワークW内のL0の位置にレーザマーキングする場合、レーザマーキング位置が変化すると、それに応じてリニアトランスレータ4の可動レンズCを光軸方向に移動して固定レンズAから集光点までのレーザ光の距離が変化し、従来のようにf・θレンズを設けなくともレーザマーキングが行われる。
【0011】
又、図3に示すような曲面板ワークW’内のL0の位置にレーザマーキングする場合は、その形状に応じた補正テーブルを補正用駆動信号出力装置6に記憶させておくことにより、レーザマーキングすることができる。
【0012】
【発明の効果】
以上、本発明によればレーザマーキングの対象物(ワーク)の形状が平面の場合は勿論のこと異なる場合でも容易にレーザマーキングすることができる。
【図面の簡単な説明】
【図1】本発明を実施するための装置の構成を示す模式図。
【図2】本発明の実施例装置により、平板にレーザマーキングする場合のレーザ光の集光状態を示す説明図。
【図3】本発明の実施例装置により曲面にレーザマーキングする場合のレーザ光の集光状態を示す説明図。
【図4】f・θレンズを使用しないで、X−Yスキャナでレーザマーキングした場合のレーザ光の集光状態を示す説明図。
【符号の説明】
W ワーク
1 レーザ装置
2 X−Yスキャナ
3 X−Yスキャナ制御装置
4 リニアトランスレータ
5 可動レンズの駆動装置
6 補正用駆動信号出力装置
7 ステージ[0001]
The present invention relates to a marking method using laser light.
[0002]
[Prior art]
Japanese Patent Laid-Open No. 3-124486 discloses a method using a condensing lens as a method of condensing laser light inside an object (work) to be marked, but the distance from the lens to the condensing point. Therefore, as shown in FIG. 4, when the workpiece W is a flat surface, when the marking position is changed, the workpiece must be moved in the XY direction.
[0003]
Conventionally, as a means for solving this problem, when laser marking is performed on a flat workpiece, a method of providing an f · θ lens between the XY scanner and the workpiece W has been adopted. There was no way to mark.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 3-124486
[Problems to be solved by the invention]
Accordingly, an object of the present invention is to provide a method for laser marking on a curved surface workpiece as well as a planar workpiece without using an f · θ lens.
[0006]
[Means for Solving the Problems]
The present invention has been made to solve the above-described problems. In a method of laser marking on the surface of a workpiece or the inside of a transparent workpiece using an XY scanner, a linear device is provided between the laser device and the XY scanner. A translator is provided, and a drive signal output device having a correction table corresponding to the shape of the workpiece is provided between the control device of the XY scanner and the drive device of the movable lens for focus adjustment of the linear translator, and according to the output signal. Then, the laser marking method is characterized in that the converging point of the laser beam is changed by moving the movable lens in the optical axis direction by the driving device of the movable lens.
[0007]
That is, in the laser marking method using an XY scanner, the focal point shift occurs at a portion where the scanning angle is large when scanning the X and Y mirrors, and the shift amount is a value obtained by calculation. Then, a correction table for correcting the focal point by moving the movable lens for focus adjustment to the scanning position of the X mirror and the Y mirror by the correction amount in advance is prepared, and the correction signal Δf according to the correction table is sent to the movable lens. The laser marking is performed at a desired laser marking position.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic diagram of an apparatus for carrying out the present invention. 1 is a laser apparatus, 2 is an XY scanner, 3 is an XY scanner control apparatus, 4 is the
[0009]
The correction table stored in the correction drive signal output device 6 is a laser marking position and a laser marking position in the Z-axis direction of the workpiece W from the stage at that position. For example, L0 in FIG. 2, L0, L1, L2, L3 in FIG. ... is obtained by calculation or measurement.
[0010]
Accordingly, when laser marking is performed at the position L0 in the planar work W such as glass or transparent plastic plate as shown in FIG. 2 with the embodiment apparatus, if the laser marking position changes, the movable lens C of the linear translator 4 is accordingly changed. Is moved in the optical axis direction to change the distance of the laser light from the fixed lens A to the condensing point, and laser marking is performed without providing an f · θ lens as in the prior art.
[0011]
When laser marking is performed at the position L0 in the curved plate workpiece W ′ as shown in FIG. 3, a correction table corresponding to the shape is stored in the correction drive signal output device 6 so that the laser marking is performed. can do.
[0012]
【The invention's effect】
As described above, according to the present invention, laser marking can be easily performed even when the shape of an object (workpiece) for laser marking is different from a flat shape.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing the configuration of an apparatus for carrying out the present invention.
FIG. 2 is an explanatory view showing a condensing state of laser light when laser marking is performed on a flat plate by an apparatus according to an embodiment of the present invention.
FIG. 3 is an explanatory diagram showing a condensing state of laser light when laser marking is performed on a curved surface by the embodiment apparatus of the present invention.
FIG. 4 is an explanatory diagram illustrating a laser beam condensing state when laser marking is performed with an XY scanner without using an f · θ lens.
[Explanation of symbols]
W Work 1 Laser device 2
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003174313A JP2005007427A (en) | 2003-06-19 | 2003-06-19 | Laser marking method |
Applications Claiming Priority (1)
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JP2003174313A JP2005007427A (en) | 2003-06-19 | 2003-06-19 | Laser marking method |
Publications (1)
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JP2005007427A true JP2005007427A (en) | 2005-01-13 |
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JP2003174313A Pending JP2005007427A (en) | 2003-06-19 | 2003-06-19 | Laser marking method |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006305586A (en) * | 2005-04-27 | 2006-11-09 | Cyber Laser Kk | Method for cutting plate-shaped body, and laser beam machining device |
JP2008546540A (en) * | 2005-06-21 | 2008-12-25 | ファメッカニカ.データ エス.ピー.エイ. | Method and apparatus for laser processing articles, in particular sanitary products and components thereof, using a laser spot with a diameter of 50 to 200010-3MM |
JP2009202188A (en) * | 2008-02-27 | 2009-09-10 | Shibuya Kogyo Co Ltd | Laser beam irradiation method and its apparatus |
KR101385095B1 (en) | 2012-09-10 | 2014-04-24 | 이철희 | Laser marking method |
-
2003
- 2003-06-19 JP JP2003174313A patent/JP2005007427A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006305586A (en) * | 2005-04-27 | 2006-11-09 | Cyber Laser Kk | Method for cutting plate-shaped body, and laser beam machining device |
JP2008546540A (en) * | 2005-06-21 | 2008-12-25 | ファメッカニカ.データ エス.ピー.エイ. | Method and apparatus for laser processing articles, in particular sanitary products and components thereof, using a laser spot with a diameter of 50 to 200010-3MM |
JP2009202188A (en) * | 2008-02-27 | 2009-09-10 | Shibuya Kogyo Co Ltd | Laser beam irradiation method and its apparatus |
KR101385095B1 (en) | 2012-09-10 | 2014-04-24 | 이철희 | Laser marking method |
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